JPWO2023032191A1 - - Google Patents

Info

Publication number
JPWO2023032191A1
JPWO2023032191A1 JP2021568812A JP2021568812A JPWO2023032191A1 JP WO2023032191 A1 JPWO2023032191 A1 JP WO2023032191A1 JP 2021568812 A JP2021568812 A JP 2021568812A JP 2021568812 A JP2021568812 A JP 2021568812A JP WO2023032191 A1 JPWO2023032191 A1 JP WO2023032191A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021568812A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032191A1 publication Critical patent/JPWO2023032191A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
JP2021568812A 2021-09-06 2021-09-06 Pending JPWO2023032191A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/032624 WO2023032191A1 (en) 2021-09-06 2021-09-06 Plating method and plating apparatus

Publications (1)

Publication Number Publication Date
JPWO2023032191A1 true JPWO2023032191A1 (en) 2023-03-09

Family

ID=85411075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021568812A Pending JPWO2023032191A1 (en) 2021-09-06 2021-09-06

Country Status (2)

Country Link
JP (1) JPWO2023032191A1 (en)
WO (1) WO2023032191A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270399A (en) * 1985-05-23 1986-11-29 Seiko Epson Corp Method for removing water after washing
JPH0765237B2 (en) * 1986-05-28 1995-07-12 セイコーエプソン株式会社 Draining method
JPH01238093A (en) * 1988-03-18 1989-09-22 Elna Co Ltd Holding method of printed board and device therefor
JPH09236382A (en) * 1996-02-29 1997-09-09 Shimatani Giken:Kk Liquid removal device, liquid removal method and vacuum drying system
JP4719631B2 (en) * 2006-06-16 2011-07-06 三友セミコンエンジニアリング株式会社 Automatic metal film forming apparatus and method for forming metal film on wafer
JP2017095762A (en) * 2015-11-25 2017-06-01 三光製作株式会社 Metal plating processing system

Also Published As

Publication number Publication date
WO2023032191A1 (en) 2023-03-09

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