JPH0762592A - Production of thin-film magnetic head - Google Patents

Production of thin-film magnetic head

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Publication number
JPH0762592A
JPH0762592A JP23539993A JP23539993A JPH0762592A JP H0762592 A JPH0762592 A JP H0762592A JP 23539993 A JP23539993 A JP 23539993A JP 23539993 A JP23539993 A JP 23539993A JP H0762592 A JPH0762592 A JP H0762592A
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Japan
Prior art keywords
product
film
portion
magnetic
ceramic substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP23539993A
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Japanese (ja)
Inventor
Kazuhiko Tachikawa
Junichi Toyoda
一彦 立川
純一 豊田
Original Assignee
Fuji Elelctrochem Co Ltd
富士電気化学株式会社
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Application filed by Fuji Elelctrochem Co Ltd, 富士電気化学株式会社 filed Critical Fuji Elelctrochem Co Ltd
Priority to JP23539993A priority Critical patent/JPH0762592A/en
Publication of JPH0762592A publication Critical patent/JPH0762592A/en
Application status is Pending legal-status Critical

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Abstract

PURPOSE:To excellently form a magnetic film by electroplating on all the product parts on a ceramic substrate and to uniformize the film thickness distribution of each product part in the production of a thin-film magnetic head. CONSTITUTION:A conductive film is formed on a ceramic substrate, a photoresist pattern is formed thereon to form a magnetic film by electroplating, and the unnecessary magnetic film is removed by wet etching to form many magnetic pole patterns to constitute the product part. In this case, a part to be cut out as the product part 12 is formed at the part except the vicinity of the periphery of the substrate 10, and a dummy part 14 equivalent in shape to the product part is formed over the entire periphery to produce a thin-film magnetic head. Consequently, the variation of the product is suppressed, and the product yield is improved.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、薄膜磁気ヘッドの製造方法に関し、更に詳しく述べると、薄膜磁気ヘッドを製造する際に、セラミック基板上の製品部の外周にそれと同等の形状のダミー部を形成することによって、電気めっき法による磁性膜成膜の膜厚分布を良好にする方法に関するものである。 The present invention relates relates to a method of manufacturing a thin film magnetic head, More particularly, when manufacturing the thin film magnetic head, a dummy portion of its equivalent shape on the outer periphery of the product portion of the ceramic substrate by forming, to a method of improving the film thickness distribution of the magnetic film deposited by electroplating.

【0002】 [0002]

【従来の技術】ハードディスク用薄膜磁気ヘッドは、セラミック基板(ウエハー:切断分離後にスライダとなる)上に設ける上下2層の磁性膜(磁極パターン)をギャップ膜で分離し、その間に磁界発生及び誘導電流ピックアップ用のコイル膜を設ける構成となっている。 BACKGROUND OF THE INVENTION thin-film magnetic head for a hard disk, a ceramic substrate: the magnetic film of the upper and lower two layers provided on (wafer becomes slider after cleavage separating) a (magnetic pole pattern) separated by a gap layer, a magnetic field generating and inducing the meantime It has a configuration in which the coil layer for current pickups. セラミック基板には、硬度が高く、セラミックスとしては電気伝導度が高いAl 23 (酸化アルミニウム)とTi The ceramic substrate, high hardness, the ceramic electrical conductivity is high Al 2 O 3 and (aluminum oxide) Ti
C(炭化チタン)との混合セラミックスを用い、その表面にAl 23の保護層を設けたものを使用する。 A mixed ceramic of C (titanium carbide), to use those provided with a protective layer of Al 2 O 3 on the surface thereof. 磁性膜にはパーマロイ(FeNi合金)の薄膜が用いられる。 The magnetic film a thin film of permalloy (FeNi alloy) is used. 薄膜形成方法としては、スパッタリング法あるいは電気めっき法があるが、電気めっき法は室温付近の温度で成膜できる利点がある。 A thin film forming method, it is sputtering or electroplating process, electroplating method has an advantage that can be deposited at around room temperature.

【0003】電気めっき法では、次のようなウエハー処理により磁極パターンを形成する。 [0003] In the electroplating method to form a magnetic pole pattern by following wafer process. Al 23 −TiC Al 2 O 3 -TiC
基板の表面にAl 23の保護層を設けたセラミック基板上に、蒸着法によって導電膜を形成し、主要磁性膜の部分を形成すべくフォトレジストパターンを設ける。 The protective layer of Al 2 O 3 in the ceramic substrate provided on the surface of the substrate, a conductive film is formed by vapor deposition, providing a photoresist pattern to form a portion of the main magnetic layer. 次いで、電気めっき法により磁性膜(パーマロイ等)を形成する。 Then, by electroplating to form a magnetic film (permalloy). 成膜した各製品部の磁性膜は、中央に薄膜磁気ヘッドの磁極パターンとなる主要磁性膜があり、その両側に電気めっき工程でヨークの機能を果たす不要磁性膜がある形状である。 Magnetic film of each product portion was formed, there is the main magnetic film serving as a magnetic pole pattern of the thin film magnetic head in the center, a shape that is not necessary magnetic film serve yoke electroplating process on both sides. フォトレジストパターンを除去し、 Removing the photoresist pattern,
イオンミリング法(イオンビームエッチング法)により磁性膜の無い部分の導電膜を除去する。 By ion milling (ion beam etching) to remove the conductive film portion having no magnetic films. そして、主要磁性膜をフォトレジストパターンで覆って保護し、ウエットエッチング法により不要磁性膜を除去する。 Then, cover and protect the main magnetic layer with the photoresist pattern, removing the unnecessary magnetic film by wet etching. その後、 after that,
フォトレジストパターンを除去する。 To remove the photoresist pattern.

【0004】図2に示すように、このような磁極パターンを有する製品部12が、1枚のほぼ円形状のセラミック基板10上に多数(例えば千個程度)規則的に配列形成される。 [0004] As shown in FIG. 2, the product portion 12 having such a magnetic pole pattern, a large number on a single ceramic substrate 10 substantially circular (e.g. thousand or so) are regularly arranged and formed. 最終的には1行ずつダイシング・マシーンで切断し、切断したバーにスライダとしての形状加工を施した後、1個ずつに分離加工する。 Eventually cut with a dicing machine line by line, it was subjected to a shaping as a slider cut bars to separate processed one by one. そのため、切断作業及びスライダとしての形状加工作業が容易なように、図示の如く、同じ形状の大きな矩形状のブロックでまとまり、且つ切断した1本のバーに同数の製品部が存在するように製品部群を配置する。 Therefore, as is easy shaping operations as cutting work and the slider, as shown, grouped in large rectangular blocks of the same shape, and cut one product as the product of the same number is present in the bar of placing the parts group.

【0005】従来技術では、セラミック基板上で、最終的に製品部として切り出す部分のみに、磁極パターンを有する製品部を形成していた。 In the prior art, on a ceramic substrate, only a portion ultimately cut as the product portion and formed a product portion having a magnetic pole pattern. 上記のように、切断作業の効率を向上するため、同じ形状の大きな矩形状のブロックでまとまるように製品部群を配置しているので、当然、不要な部分として切り落とすそれら外周部分は、磁極パターンの無い空白領域であった。 As described above, in order to improve the efficiency of the cutting operation, since the place the product unit group as settled by the large rectangular blocks of the same shape, of course, their outer peripheral portions cut off as unnecessary portions are pole pattern It was no blank areas of.

【0006】 [0006]

【発明が解決しようとする課題】セラミック基板上に形成した磁性膜の膜厚は、各磁極パターン(各製品部)で均一にする必要がある。 Thickness of the magnetic film formed on a ceramic substrate [0005] needs to be uniform in each magnetic pole pattern (each product unit). 膜厚のばらつきは、製品部の品質(特性)に直接影響を与えるからである。 Variation in film thickness, because a direct impact on the quality of the product portion (characteristics). 非常に大きなセラミック基板に、電気めっき法によって多数の磁極パターンを形成すると、どうしても周辺部と中央部で電気めっきの条件が異なり、注意深く条件を設定しても、 Very large ceramic substrate, forming a plurality of magnetic pole patterns by electroplating, different conditions of the electroplating just at the peripheral portion and the central portion, be set carefully condition,
磁性膜の膜厚分布のばらつきを小さくするのは難しい。 It is difficult to reduce variations in the film thickness distribution of the magnetic film.

【0007】本発明の目的は、薄膜磁気ヘッドの製造において、電気めっき法による磁性膜の成膜をセラミック基板上の全ての製品部について良好に行うことができ、 An object of the present invention, in the manufacture of thin-film magnetic head, good can be performed for forming the magnetic layer by an electroplating method on all products of the ceramic substrate,
且つ各製品部の膜厚分布をより均一化できる方法を提供することである。 And to provide a method capable of more uniform thickness distribution of each product unit.

【0008】 [0008]

【課題を解決するための手段】本発明は、セラミック基板上に導電膜を形成し、その上にフォトレジストパターンを設けて電気めっき法により磁性膜を形成した後、不要磁性膜の部分をウエットエッチング法により除去して製品部となる多数の磁極パターンを配列形成する方法において、セラミック基板の外周近傍を除く部分に製品部として切り出す部分を形成し、その全外周にわたって、 The present invention SUMMARY OF] is a conductive film is formed on a ceramic substrate, after forming the magnetic film by electroplating to provide a photoresist pattern thereon, the wet part of the unnecessary magnetic film a method of removing by arranging a plurality of magnetic pole pattern comprising a product portion formed by an etching method, to form a portion to be cut out as a product at a portion excluding the vicinity of the outer circumference of the ceramic substrate, over its entire circumference,
製品部と同等の形状のダミー部を形成する薄膜磁気ヘッドの製造方法である。 A method of manufacturing a thin film magnetic head for forming a dummy portion of the product portion equivalent shape.

【0009】 [0009]

【作用】従来技術で電気めっき法により磁性膜を形成する際の膜厚分布を調べると、外周側の製品部で膜厚変動が大きいことが認められた。 [Action] When the prior art by examining the film thickness distribution at the time of forming the magnetic layer by electroplating, it was observed variations in thickness in the product portion of the outer peripheral side is large. これは隣接部分に磁性膜パターンの乱れている箇所を有する外周側の製品部と、隣接部分全てに磁性膜パターンが規則的に配列されている箇所の製品部(中央寄りの製品部)を比べると、電気めっきを行う際の電流密度が異なるためと考えられる。 This comparison and product portion of the outer peripheral side having a portion that disturbance of the magnetic film patterns on the adjacent portions, products of the portion where the magnetic film patterns to all adjacent portions are regularly arranged (product portion near the center) If the current density at the time of performing electroplating is believed to be due to different. そこで本発明のように、薄膜磁気ヘッドの製品部の外周部分にも、製品部と同等の形状の磁極パターンをダミー部として形成しておくと、このダミー部が製品部に対して緩衝機能を果たし、製品部の膜厚分布は均一化される。 Therefore, as in the present invention, also the outer peripheral portion of the product portion of the thin film magnetic head, the previously formed magnetic pole pattern of the product portion equivalent shape as a dummy portion, the dummy portion buffering function with respect to the product portion play, the film thickness distribution of the product portion is uniform.

【0010】 [0010]

【実施例】図1は、本発明に係る製品部(磁極パターン)の配列状態の一実施例を示す説明図である。 DETAILED DESCRIPTION FIG. 1 is an explanatory view showing an embodiment of arrangement of the product portion according to the present invention (magnetic pole pattern). 薄膜磁気ヘッドの製造は、基本的には従来と同様の工程で行ってよい。 Production of thin-film magnetic head is basically may be carried out in conventional manner in step. Al 23 −TiC基板の表面にAl 23の保護層を設けたセラミック基板上に、蒸着法によって導電膜を形成し、主要磁性膜の部分を形成すべくフォトレジストパターンを設ける。 Al a protective layer of Al 2 O 3 in the ceramic substrate provided on the 2 O 3 -TiC surface of the substrate, a conductive film is formed by vapor deposition, providing a photoresist pattern to form a portion of the main magnetic layer. 次いで電気めっき法により磁性膜(パーマロイ等)を形成する。 Followed by electroplating to form a magnetic film (permalloy). 成膜した各製品部の磁性膜は、中央が薄膜磁気ヘッドの磁極パターンとなる主要磁性膜であり、その両側が電気めっき工程でヨークの機能を果たす不要磁性膜となる形状である。 Magnetic film of each product portion was formed, the center is the main magnetic film serving as a magnetic pole pattern of the thin film magnetic head, a shape in which both sides becomes unnecessary magnetic film fulfilling the yoke functions in electroplating process. フォトレジストパターンを除去し、イオンミリング法(イオンビームエッチング法)によって磁性膜の無い部分の導電膜を除去する。 The photoresist pattern is removed, ion milling (ion beam etching) by removing the conductive film portion having no magnetic films. そして、主要磁性膜をフォトレジストパターンで覆って保護し、ウエットエッチング法により不要磁性膜を除去する。 Then, cover and protect the main magnetic layer with the photoresist pattern, removing the unnecessary magnetic film by wet etching. その後、フォトレジストパターンを除去する。 Thereafter, the photoresist pattern is removed.

【0011】本発明では、図1に示すように、このような磁極パターンを有する製品部12が、1枚のほぼ円形状のセラミック基板10上に多数(例えば千個程度)規則的に配列形成される。 [0011] In the present invention, as shown in FIG. 1, the product portion 12 having such a magnetic pole pattern, a large number on a single ceramic substrate 10 substantially circular (e.g. thousand or so) regularly arranged forms It is. 最終的には1行ずつダイシング・マシーンで切断し、切断したバーにスライダとしての形状加工を施した後、1個ずつに分離加工する。 Eventually cut with a dicing machine line by line, it was subjected to a shaping as a slider cut bars to separate processed one by one. そのため、切断作業及びスライダとしての形状加工作業が容易なように、同じ形状の大きな矩形状のブロックでまとまり、且つ切断した1本のバーに同数の製品部が存在するように製品部群を配置する。 Therefore, as is easy shaping operations as cutting work and the slider, unity in large rectangular blocks of the same shape, in and cut one bar as products of the same number exist place the product unit group to. ここで本発明の特徴は、その製品部12の更に外側に、その全外周にわたって、製品部と同等の形状のダミー部14を配置形成する点にある。 Wherein features of the present invention, further outside of the product portion 12, over its entire periphery, in that the placing form a dummy portion 14 of the product portion equivalent shape. ここでは、製品部12の全外周に、ダミー部14を1個ずつ並べるように設けている。 Here, the entire periphery of the product portion 12 is provided so as to align the dummy portion 14 one by one.

【0012】ダミー部14は、必ずしも完全な磁極パターンである必要はなく、セラミック基板で製品部12の外周の面積が少ない場合には、磁極パターンの一部であってもよい。 [0012] The dummy portion 14 is not necessarily a complete pole pattern, when small areas of the outer periphery of the product portion 12 in the ceramic substrate may be part of the pole pattern. また面積が広い場合には、ダミー部14を複数個並べる構成であってもよい。 Also when the area is wide, it may be configured to arrange a plurality of dummy unit 14. いずれにしても、上記のように、製品部12をできるだけ多く且つ容易に切断でき、且つ切断したバーの形状加工も容易に行えるように配置すると共に、その全外周を、できるだけ多くのダミー部14が取り囲むように配列するのが望ましい。 In any event, as mentioned above, only possible product portion 12 often can and easily cut, and also shaping the cut bar with arranged to allow easy, its entire circumference, as many dummy portion 14 to arrange so as to surround the desirable.

【0013】1枚のセラミック基板について各製品部の膜厚を測定し、その平均値、標準偏差、最大値、最小値、及びR値(最大値−最小値)を求めた結果を表1に示す。 [0013] measuring the thickness of each product unit for one of the ceramic substrate, the average value, standard deviation, maximum, minimum, and R value - the results obtained (maximum value-minimum value) in Table 1 show. 同一形状・同一寸法のセラミック基板を使用し、 Using the ceramic substrate having the same shape and the same dimensions,
同一条件で、同一個数の製品部が形成されるようにして、従来方法と本発明方法とを比較した。 Under the same conditions, as the product of the same number are formed, it was compared with the conventional method and the present invention method. 本発明方法は、製品部の全外周にダミー部を設けるものである。 The present invention is provided with a dummy portion to entire outer periphery of the product portion. なお測定箇所は、全ての製品部についてであり、合計10 Incidentally measurement locations is all about product unit, a total of 10
65箇所である。 It is a place 65.

【0014】 [0014]

【表1】 [Table 1]

【0015】この結果から、従来方法ではR/X=2 [0015] From this result, in the conventional method R / X = 2
7.8%、それに対して本発明方法ではR/X=17. 7.8%, contrast in the present invention a method R / X = 17.
4%であり、約10%の膜厚分布の改善がなされていることが認められた。 4%, it has been found that improved film thickness distribution of about 10% have been made.

【0016】 [0016]

【発明の効果】本発明は上記のように、セラミック基板の外周近傍を除く部分に製品部として切り出す部分を形成し、その全外周にわたって、製品部と同等の形状のダミー部を形成する方法であるから、電気めっきによる磁性膜成膜の際に、外周部のダミー部が製品部に対して緩衝作用をし、少なくとも各製品部は、隣接する周囲部分に同等の磁極パターンを有するため、電気めっきの電流密度のばらつきが少なくなり、膜厚分布が一定し、セラミック基板の製品部全体にわたって成膜した磁性膜の膜厚がより均一化される。 According to the present invention as described above, to form a portion cut out as a product at a portion excluding the vicinity of the outer circumference of the ceramic substrate, over its entire circumference, in a way to form a dummy portion of the product portion equivalent shape because there, when the magnetic film deposition by electroplating, and the dummy portion of the outer peripheral portion is a buffer effect on the product portion, at least each product unit, because it has an equivalent pole pattern around portion adjacent electrical variations in the current density of the plating is reduced, and the film thickness distribution is uniform, the film thickness of the formed magnetic layer over the entire product portion of the ceramic substrate is more uniform. このため、製品の特性のばらつきも抑えられ、製造の歩留りも向上する。 Therefore, variations in the characteristics of the product is suppressed, thereby improving production yield.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明方法による製品部の配列状態の説明図。 Illustration of arrangement of the product portion according to the invention; FIG method.

【図2】従来方法による製品部の配列状態の説明図。 FIG. 2 is an explanatory view of the arrangement of the product portion according to a conventional method.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 セラミック基板 12 製品部 14 ダミー部 10 ceramic substrate 12 product portion 14 dummy unit

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 セラミック基板上に導電膜を形成し、その上にフォトレジストパターンを設けて電気めっき法により磁性膜を形成した後、不要磁性膜の部分をウエットエッチング法により除去して製品部となる多数の磁極パターンを配列形成する方法において、セラミック基板の外周近傍を除く部分に製品部として切り出す部分を形成し、その全外周にわたって、製品部と同等の形状のダミー部を形成することを特徴とする薄膜磁気ヘッドの製造方法。 1. A forming a conductive film on a ceramic substrate, after forming the magnetic film by electroplating to provide a photoresist pattern thereon, the product portion by removing a portion of the unnecessary magnetic film by wet etching a method for become multiple pole pattern sequence formed, to form a portion to be cut out as a product at a portion excluding the vicinity of the outer circumference of the ceramic substrate, over its entire circumference, forming a dummy portion of the product portion equivalent shape method of manufacturing a thin film magnetic head is characterized.
JP23539993A 1993-08-27 1993-08-27 Production of thin-film magnetic head Pending JPH0762592A (en)

Priority Applications (1)

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JPH0762592A true JPH0762592A (en) 1995-03-07

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6973712B2 (en) * 2002-03-07 2005-12-13 Headway Technologies, Inc. Lead plating method for GMR head manufacture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780795A (en) * 1980-11-07 1982-05-20 Fujitsu Ltd Method of producing printed board
JPH01176089A (en) * 1987-12-28 1989-07-12 Sumitomo Metal Ind Ltd Formation of plating pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780795A (en) * 1980-11-07 1982-05-20 Fujitsu Ltd Method of producing printed board
JPH01176089A (en) * 1987-12-28 1989-07-12 Sumitomo Metal Ind Ltd Formation of plating pattern

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6973712B2 (en) * 2002-03-07 2005-12-13 Headway Technologies, Inc. Lead plating method for GMR head manufacture
US7111386B2 (en) * 2002-03-07 2006-09-26 Headway Technologies, Inc. Lead plating method for GMR head manufacture

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