JPH0520634A - Thin-film magnetic head wafer - Google Patents

Abstract

PURPOSE:To enable a nearly zero pole height quantity to be controlled with good accuracy by retreating the upper magnetic films of two pieces of pseudo thin-film head elements toward the central direction of insulating films from the position where the outer edges of lower magnetic films climb over the top of the lower magnetic films. CONSTITUTION:Plural pieces of the thin-film magnetic head elements are disposed in a matrix form on one sheet of wafer by successively laminating lower magnetic layers 6, gap films 1, lower insulating films 3, plural layers of coils 4, upper insulating films 5, and the upper magnetic films 2. This thin-film head wafer has two pieces of the pseudo thin-film head elements which are disposed on both sides of plural pieces of the thin-film magnetic head elements and have the laminated films similar to the laminated films of the thin-film magnetic head elements in the respective lines or rows. The upper magnetic films 2 of two pieces of these pseudo thin-film head elements are formed into the structure in which these films retract to the center of the insulating films from the position A where the outer edges of the lower insulating films 3 climb over the top of the lower magnetic films 6. The upper magnetic films 2 are formed smaller than the lower insulating films 3 in such a manner, by which the direct detection of the true pole height '0' from the element surface is executed. The pole height quantity which is nearly '0' to the max. possible extent is thereby controlled with the good accuracy.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to thin film magnetic head wafers, and more particularly to the structure of pseudo thin film head elements on a wafer.

[0002]

2. Description of the Related Art FIG. 5 shows the structure of a conventional thin film magnetic head. 5A is a plan view, and FIG. 5B is a sectional view taken along the line EE of FIG. In this structure, the distance to the end of the lower insulating film 3 is called the pole height, which is an important parameter that affects the efficiency of the thin film magnetic head. If the pole height is excessively large, the magnetic field leaking between the upper magnetic film 2 and the lower magnetic film 6 increases and the efficiency decreases.
For this reason, it is preferable to set the pole height to a size as small as possible. However, if the pole height is smaller than "0", the nonmagnetic gap film 1 is effectively enlarged and the resolution is lowered. Therefore, the pole height is infinitely "0"
The key point in manufacturing is to approach

In the conventional control of the pole height amount, since the true pole height "0" portion cannot be detected in a plane, the point A in FIG. 5 is processed as a temporary "0".

In FIG. 5, 4 is a coil and 5 is an upper insulating film.

[0005]

As described above, in the case of controlling the pole height of the conventional thin film magnetic head, the true pole height "0" and the temporary pole height "0" depend on the thickness shape of the upper insulating film. However, there is a drawback that the variation of the pole height amount becomes large after all.

An object of the present invention is to eliminate the drawbacks of the conventional thin-film magnetic head as described above, to see the pole height amount from the element surface, and to obtain a highly reliable thin-film magnetic head. It is to provide a thin film magnetic head wafer.

[0007]

The present invention provides a lower magnetic film,
A lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film, and an upper magnetic film are sequentially laminated, and a plurality of thin film head elements are arranged in a matrix on a single wafer, and each row or each column thereof is arranged. In a thin film magnetic head wafer having two pseudo thin film head elements having the same laminated film as the thin film head elements arranged with a plurality of the elements sandwiched therebetween, the upper magnetic properties of the two pseudo thin film head elements It is characterized in that the film is made to recede toward the center of the insulating film from the position where the outer edge portion of the lower insulating film crosses over the lower magnetic film.

The present invention also provides a lower magnetic film, a lower insulating film,
Gap films, multiple layers of coils, upper insulating films, and upper magnetic films are sequentially laminated, and a plurality of thin film head elements are arranged in a matrix on a single wafer, and a plurality of thin film head elements are arranged in each row or each column. In a thin film magnetic head wafer having two pseudo thin film head elements having the same laminated film as the above thin film head elements arranged with the elements sandwiched therebetween, the upper magnetic films of the two pseudo thin film head elements were removed. It is characterized by

The present invention also provides a lower magnetic film, a lower insulating film,
Gap films, multiple layers of coils, upper insulating films, and upper magnetic films are sequentially laminated, and a plurality of thin film head elements are arranged in a matrix on a single wafer, and a plurality of thin film head elements are arranged in each row or each column. In a thin film magnetic head wafer having two pseudo thin film head elements having the same laminated film as the above thin film head elements sandwiched between the elements, the upper magnetic film of the two pseudo thin film head elements is replaced by the lower magnetic film. It is characterized in that the outer edge portion of the insulating film is made to recede in a direction away from the lower insulating film from a position where it crosses over the lower magnetic film.

Further, according to the present invention, a lower magnetic film, a lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film and an upper magnetic film are sequentially laminated, and a plurality of thin films are formed in a matrix on a single wafer. A thin-film magnetic head wafer having two pseudo thin-film head elements, each having a head element and having a laminated film similar to the thin-film head element arranged in each row or each column with a plurality of the elements sandwiched therebetween. The upper magnetic films of the two pseudo thin film head elements are retreated to both sides from the position where the outer edge of the lower insulating film crosses over the lower magnetic film.

[0011]

According to the present invention, in the pole height monitor of the thin film magnetic head, the gap film between the upper and lower magnetic films and the insulating film are not provided with the upper magnetic film only at the pole height 0 portion.
The pole height 0 can be detected from the element surface.

To this end, in the thin film magnetic head, the upper magnetic film near 0 of the pole height monitor composed of the coil surrounded by the upper and lower magnetic films and the insulating film between the magnetic films is eliminated to eliminate the gap film and the insulating film. By exposing, the pole height 0 can be detected from the element surface.

As a result, since the position of the pole height 0 can be directly detected, the pole height can be accurately controlled.

[0014]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1A is a plan view showing a first embodiment of the present invention, and FIG. 1B is an enlarged sectional view taken along line AA.
It shows one of two pseudo thin film head elements arranged on a single wafer with a plurality of thin film head elements arranged in a matrix form being separated from each other.

That is, the lower magnetic film 6, the gap film 1,
The lower insulating film 3, the plurality of layers of coils, the upper insulating film 5, and the upper magnetic film 2 are sequentially laminated, and a plurality of thin film magnetic head elements are arranged in a matrix on one wafer, and each row or each column thereof is arranged. In a thin film head wafer having two pseudo thin film head elements having a laminated film similar to the thin film magnetic head element in which a plurality of thin film magnetic heads are arranged with the elements sandwiched therebetween, A position where the outer edge of the lower insulating film 3 crosses over the upper magnetic film 2 over the lower magnetic film 6 (see FIG. 1).
It has a structure in which it recedes from the point A (abbreviated as point A in the following) to the center of the insulating film.

Next, a method of manufacturing this pseudo thin film head element will be described.

First, in the first step, a plating conduction base film 10 is formed on a ceramic substrate such as alumina titanium carbide.
Then, the lower magnetic film 6 made of permalloy is patterned by electroplating or the like.

In the second step, about 0.4 .mu.m of alumina to be the gap film 1 is sputtered on the entire surface of the upper substrate.

In the third step, after patterning the photoresist, baking is performed at 200 ° C. or higher to sputter the lower insulating film 3 having a thickness of about 3 μ, and then the coil 4 is patterned by pattern plating.
Is formed, and an upper insulating film 5 having a thickness of about 5 μ is sequentially laminated thereon by sputtering.

Although the above steps are formed simultaneously with the thin film head element, different shapes are formed in the thin film head element and the pseudo thin film head element in the formation of the upper magnetic film 2 to be laminated next.

In this embodiment, the upper magnetic layer is formed in the same manner as the lower magnetic film 6 in the direction toward the center of the insulating film which does not cover the point A where the outer edge of the lower insulating film 3 crosses over the lower magnetic film 6. The film 2 is formed.

FIG. 2 shows a second embodiment. 2A is a plan view and FIG. 2B is a sectional view taken along line BB. In this embodiment, the thin-film magnetic head wafer of the first embodiment is
It has a structure in which the upper magnetic film 2 of the two pseudo thin film head elements is removed. As described above, in this embodiment, the point A is exposed by not forming the upper magnetic film 2 at all.

FIG. 3 shows a third embodiment. FIG. 3A is a plan view and FIG. 3B is a sectional view taken along the line CC. In this embodiment, a position (A) where the outer edge portion of the lower insulating film 3 crosses over the upper magnetic film 2 of the two pseudo thin film head elements (A
It has a structure in which it recedes from the center of the insulating film from the point).
As described above, in the present embodiment, the upper magnetic film 2 is formed only on the tip portion where the lower insulating film 3 is not formed on the lower magnetic film 6 so as not to cover the point A.

FIG. 4 shows a fourth embodiment. FIG. 4A is a plan view and FIG. 4B is a sectional view taken along the line DD. This embodiment has a structure in which the upper magnetic film 2 of the two pseudo thin film head elements is set back to both sides from the position where the outer edge of the lower insulating film 3 crosses over the lower magnetic film 6. As described above, in the present embodiment, the upper magnetic film 2 is formed in a combination of the first embodiment and the third embodiment. In the pseudo thin film head elements of the first to fourth embodiments described above, plan views are shown. In FIG. 5, it is possible to directly see the portion A which is not seen in the thin film head element of FIG.

Therefore, after that, when cutting, grinding and lapping in rows in the machining process, the pole height "0" can be directly detected at the two pseudo thin film head element portions, so that the accurate pole height can be controlled accurately. You can do it.

Even if two or several pseudo thin film head elements are arranged in one row, each slider usually has two thin film head elements, one of which is used for electromagnetic conversion. Therefore, the productivity and the yield are not reduced.

[0028]

As described above, according to the present invention, by making the upper magnetic film smaller than the lower insulating film, the true pole height "0" can be directly detected from the element surface, so that it becomes infinite "0". This has the effect of accurately controlling the close pole height amount.

[Brief description of drawings]

FIG. 1 is a plan view and a sectional view of a first embodiment of the present invention.

FIG. 2 is a plan view and a sectional view of a second embodiment of the present invention.

FIG. 3 is a plan view and a sectional view of a third embodiment of the present invention.

FIG. 4 is a plan view and a sectional view of a fourth embodiment of the present invention.

5A and 5B are a plan view and a cross-sectional view showing a conventional example.

[Explanation of symbols]

1 Gap film 2 Upper magnetic film 3 Lower insulating film 4 coils 5 Upper insulating film 6 Lower magnetic film

Claims (4)

[Claims] 1. A lower magnetic film, a lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film and an upper magnetic film are sequentially laminated to form a plurality of thin film head elements in a matrix on a single wafer. A thin-film magnetic head having two pseudo thin-film head elements having the same laminated film as the thin-film head element arranged in each row or each column with a plurality of the elements sandwiched therebetween.
In the wafer, a thin film magnetic head characterized in that the upper magnetic films of the two pseudo thin film head elements are made to recede toward the center of the insulating film from the position where the outer edge of the lower insulating film crosses over the lower magnetic film. Wafer. 2. A lower magnetic film, a lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film, and an upper magnetic film are sequentially laminated to form a plurality of thin film head elements in a matrix on one wafer. A thin-film magnetic head having two pseudo thin-film head elements having the same laminated film as the thin-film head element arranged in each row or each column with a plurality of the elements sandwiched therebetween.
A thin film magnetic head wafer, wherein the upper magnetic films of the two pseudo thin film head elements are removed from the wafer. 3. A lower magnetic film, a lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film and an upper magnetic film are sequentially laminated to form a plurality of thin film head elements in a matrix on a single wafer. A thin-film magnetic head having two pseudo-thin-film head elements, each of which has a laminated film similar to the thin-film head element arranged in each row or each column with a plurality of the elements sandwiched therebetween.
In the wafer, the upper magnetic films of the two pseudo thin film head elements are made to recede in a direction away from the lower insulating film from the position where the outer edge of the lower insulating film crosses over the lower magnetic film. Head wafer. 4. A lower magnetic film, a lower insulating film, a gap film, a plurality of layers of coils, an upper insulating film and an upper magnetic film are sequentially laminated to form a plurality of thin film head elements in a matrix on a single wafer. A thin-film magnetic head having two pseudo thin-film head elements having the same laminated film as the thin-film head element arranged in each row or each column with a plurality of the elements sandwiched therebetween.
In the wafer, a thin film magnetic head characterized in that the upper magnetic films of the two pseudo thin film head elements are receded to both sides from the position where the outer edge portion of the lower insulating film crosses over the lower magnetic film.
Wafer.