JPS6231015A - Thin-film magnetic head - Google Patents

Abstract

PURPOSE:To facilitate manufacture and improve product yield, and to obtain good mass-productivity without spoiling the film quality and magnetic characteristics of a magnetic film by forming a slanting surface which corresponds to an azimuth angle at a position on a substrate corresponding to at least a magnetic gap part. CONSTITUTION:A lower core 2 has an angle theta corresponding to the azimuth angle to the flat substrate 1. The slanting surface which has this azimuth angle thetais obtained by forming a magnetic film on the flat substrate 1 by sputtering, vapor-deposition, or plating and then performing rubbing or cutting by a cutting tool, etc. While the substrate 1 is held flat on the top surface of the lower core 2 having the slanting surface with the azimuth angle theta, a gap material 5, a coil 4, an insulating film 6, an upper core 3, etc., are laminated by repeating film formation and photoetching similar to the manufacture of an IC.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thin film head having an azimuth angle suitable for use in (1) and the like.

[Background of the invention]

In response to the increasing density of magnetic recording, efforts are being made to develop high drag magnetic recording media and to improve the precision of magnetic heads. As a high-precision magnetic head, head components such as magnetic films, gap materials, and coil conductors are laminated and patterned on a non-magnetic substrate (hereinafter simply referred to as substrate) using photolithography techniques or vacuum evaporation. A thin-film mottled head for purchase has been developed (for example, Japanese Patent Application Laid-Open No. 1981-818).
18, JP-A-58-80121, etc.).

By the way, the magnetic heads used in (1) and the like are mainly so-called azimuth-angled thin WX magnetic heads in which the magnetic gap is inclined with respect to the track direction.

This type of thin film magnetic head is known, for example, from Japanese Patent Application Laid-Open No. 57-555.
As described in Japanese Patent No. 26, after a first magnetic film (lower core) is formed on a substrate, a portion of the first magnetic film (lower core) is removed to form a magnetic gap forming surface.

At this time, the inclination angle between the magnetic gap forming surface and the normal to the surface of the substrate is set to be 5 to 25 degrees (for example, 10 degrees).

This angle corresponds to the azimuth angle. Next, a non-magnetic layer is formed on the magnetic gap forming surface and the portion where the first magnetic film has been removed to a thickness corresponding to the magnetic herad gap spacing, and a second magnetic film (upper core ) to form. Thereafter, processing such as polishing and adhesion of a protective substrate is performed to obtain a thin film magnetic head with an azimuth angle. However, the second
The magnetic film is formed on a highly inclined surface of, for example, 80 degrees, which corresponds to the azimuth angle, resulting in a decrease in film quality and magnetic properties, resulting in large product variations, and in order to perform mask sputtering, the substrate must be placed in #4. etc., the manufacturing process became complicated and problems remained in mass production.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art described above, and to provide a thin film magnetic head that does not impair the film quality or magnetic properties of the magnetic film, is easy to manufacture, has a high product yield, and is suitable for mass production.

[Summary of the Invention] In order to achieve this object, the present invention forms an inclined surface corresponding to the azimuth angle at least at a position corresponding to the magnetic gap portion of the substrate (lower core), and changes the angle of this inclined surface. There is an fF signature at a point where a magnetic gap is formed so as to be maintained.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of a thin film magnetic head according to the present invention, in which 1 is a non-magnetic flat substrate, 2 is a lower core, 5 is an upper core, 4 is a coil, and 5 is a magnetic Gap material 6 is an insulating layer emanating from the insulating material that insulates coil 4 and core 2.3.

In the figure, the lower core 2 forms an angle θ corresponding to the azimuth angle with respect to the flat substrate 1. This inclined surface with an azimuth angle θ is formed by sputtering a magnetic film onto a flat substrate 1.
After releasing the shape by a method such as vapor deposition or plating, it can be obtained by lapping or cutting with a cutting tool. While keeping the substrate 1 flat on the upper surface of the lower core 2 which has an inclined surface with an azimuth angle θ, the gap material 5. Coil 4. The insulating layer 6, the upper core 5, etc. are laminated by repeating photo-etching with a bottom film similar to IC manufacturing. Although the coil is shown as having one turn, it may have multiple turns.

In addition, since the azimuth angle is generally 5 to 25 degrees, there is no step coverage problem at all on the gently sloped surface of the lower core 2 as shown in the figure, and the magnetic film of the upper core 3 formed on the sloped surface is There is no significant difference compared to a magnetic film formed on a flat surface.

After forming the upper core 5, a protective film (not shown) is applied thereon.
A thin film magnetic head is obtained by forming a chip and shaping the chip.

FIG. 2 is a perspective view of a first example in which a large number of chips are developed on the surface of the sea urchin I in order to mass produce the thin film magnetic head according to the present invention shown in FIG. 1, in which 1 is a substrate, 2 is a lower core, 5 is an upper core, 4 is a coil, and 7 is a cutting line for forming a tegg.

In the figure, a magnetic film having a large number of inclined surfaces, which will become a lower core 2, is released on a substrate 1, and a large number of thin film magnetic RAD chips are mounted in the same manner as described above. This sea urchin... is cut along cutting line 7 by a high-speed slicer (not shown) and separated into individual head chips to obtain a large number of thin film magnetic heads.

FIG. 5 is a perspective view of a second example in which a large number of chips are developed on a wafer in order to mass-produce the thin-film magnetic head according to the present invention shown in FIG. These are formed on the core, and 1 to 4 and 7 indicate the same parts as in FIG. 2, and 21 indicates a lower core with an opposite azimuth to the lower core 2.

In this figure, the inclined surfaces corresponding to the azimuth angle and the reverse azimuth angle formed on the lower core are formed by lapping or cutting with a cutting tool after forming a magnetic film on the substrate 1 as in FIG. 2. For example, both square azimuth and square azimuth can be mass-produced on the same wafer.

FIG. 4 is a perspective view of a third example in which a large number of chips are developed on a wafer in order to mass-produce the thin-film magnetic head according to the present invention, in which 1 is a non-extractable substrate, 2 is a lower core, and 7 is a cutting line. , 8
is a non-magnetic film.

Note that the upper core, coil, etc. are omitted.

In the figure, a substrate 1 has a flat surface, and a non-magnetic layer IIa which is easily machined by cutting etc. is formed thereon. The non-magnetic film 8 is made of Cu*At*SUS, SiO,...
Tie! Or glass materials, ceramic materials, etc.
This is machined to form an inclined surface corresponding to the azimuth angle, and a magnetic film that will become the lower core 2 is formed thereon.

According to this, the azimuth angle of the nonmagnetic film 8 is transferred and maintained on the upper surface of the lower core 2, and a thin film magnetic head can be obtained by the same method as described above.

FIG. 5 is a perspective view of a fourth example in which a large number of chips are developed on a wafer in order to mass-produce the thin-film magnetic head according to the present invention, in which 2 is a lower core, 7 is a cutting part, 11 is a non-magnetic This is a board, and other components are omitted.

In the figure, the substrate 11 is made of a non-magnetic material such as the one mentioned above that is easy to machine, and is machined to have an inclined surface corresponding to the azimuth angle. It forms the According to this, the azimuth angle of the substrate 11 is transferred and maintained on the upper surface of the lower core 2 in the same manner as in the above example, and a thin film magnetic head can be obtained by the same method thereafter.

FIG. 6 is a perspective view of a fifth example in which a large number of chips are developed on a wafer in order to mass-produce the thin-film magnetic head according to the present invention, in which numerals 1 to 4 and 7 indicate the same parts as above, and 29
is the gap formation position.

In the figure, a lower core 2 formed on a flat substrate 1
At the gap formation position fI7t29, a partially inclined surface portion that contacts the azimuth angle with the glaze is machined. Since the connecting portion between this inclined surface portion and the other flat portion has an appropriate taper so as to be continuous, there is no problem in step coverage in the magnetic film forming process of the upper core 3 to be formed subsequently.

In addition, in the same figure, a partial inclined surface portion is machined at the gap forming position 29 of the lower core 2 formed on a flat surface.
A partially inclined surface portion may be formed at the gap forming position of the substrate 1.

FIG. 7 is a perspective view showing another embodiment of the thin film magnetic head according to the present invention with a large number of chips developed on a wafer;
7 is a non-magnetic substrate, 7 is a cutting line, 8 is a non-magnetic film that is easy to machine, 22 is a lower core, 52 is an upper core, and 40 is a winding hole.

In the figure, the substrate 1 has a flat surface, and the winding holes 40
is provided. On top of this, a non-magnetic lI8 made of the same material as that shown in FIG. 4 is released, and its surface is processed into an inclined surface corresponding to the azimuth angle. The lower core 22 is formed on this inclined surface, and then the upper core 52 is further formed.

The upper core 52 and the lower core 22 are patterned to surround the winding hole 40.

In addition, in the same figure, a non-magnetic r&8 formed on a flat substrate 1 is shown.
Although a sloped surface having a matching azimuth angle is formed on the substrate 1, this sloped surface may be formed on the substrate 1, or it may be formed using any of the various sloped surface forming methods described in the first embodiment. .

As a result, precision thin-film magnetic heads can be mass-produced with high yield.

〔Effect of the invention〕

As explained above, according to the present invention, the slope corresponding to the azimuth angle can be made gentle, and the core can be formed without impairing its magnetic properties, resulting in a high backing yield and good mass production. Thin gI & magnetic head can be obtained,
It is possible to solve the problems of the prior art described above and provide a thin film magnetic head with excellent functionality.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the thin film magnetic head according to the present invention, FIG. 2 is a perspective view of a third example in which a large number of chips of the thin film magnetic head according to the present invention are developed on a wafer, and FIG. A perspective view of a second example in which a large number of thin film magnetic head chips according to the present invention are deployed on a wafer together with thin film magnetic heads having opposite azimuth angles, and FIG. FIG. 5 is a perspective view of a fourth example in which a large number of chips of the thin film magnetic head according to the present invention are developed on a wafer, and FIG. 6 is a perspective view of the thin film magnetic head chips according to the present invention on a wafer. FIG. 7 is a perspective view showing another embodiment of the thin film magnetic head according to the present invention, developed in large numbers on a wafer. 1.11...Nonmagnetic substrate 2.21.22...Lower core 3.52...Upper core 4...Coil 5...Gap material No. 1 Figure 2 Figure 4'l Figure 5 Figure 6 Figure 7

Claims (2)

[Claims] (1) In a thin film magnetic head in which a lower core, a gap material, an insulating material, an upper core, etc. are sequentially laminated on a non-magnetic substrate, at least the magnetic gap forming portion of the lower core has an azimuth angle with respect to the substrate. 1. A thin film magnetic head characterized by having an inclined surface corresponding to . (2) In the thin film magnetic head according to claim (1), the thin film has an inclined surface corresponding to an azimuth angle on at least a surface of the lower core on the substrate side at least at a position where a magnetic gap is formed. magnetic head.