JPH0758487A - Printed wiring board having magnetic coating film and radio wave shielding layer and its manufacture - Google Patents
Printed wiring board having magnetic coating film and radio wave shielding layer and its manufactureInfo
- Publication number
- JPH0758487A JPH0758487A JP5227953A JP22795393A JPH0758487A JP H0758487 A JPH0758487 A JP H0758487A JP 5227953 A JP5227953 A JP 5227953A JP 22795393 A JP22795393 A JP 22795393A JP H0758487 A JPH0758487 A JP H0758487A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- wiring board
- printed wiring
- coating film
- magnetic coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、スルーホールを有する
多層プリント配線板またハイブリッドＩＣ基板およびマ
ルチチップモジュール基板等の製造方法に関し、特に、
磁界または電磁波の影響による回路間のクロストーク等
のノイズを防止したプリント配線板、およびその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board having a through hole, a hybrid IC board, a multi-chip module board, etc.
The present invention relates to a printed wiring board in which noise such as crosstalk between circuits due to the influence of a magnetic field or an electromagnetic wave is prevented, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】プリント配線板においては、その回路に
電流を流すことにより、磁界が発生し、その磁界の発生
に伴い電磁波が発生する。この磁界は隣接した回路をア
ンテナ化する作用がある。これにより磁界および電磁波
は、ともにノイズの発生源となり、機器内部の回路間に
て誤動作やクロストーク現象を生じさせるばかりでな
く、外部機器に対しても影響を及ぼす。2. Description of the Related Art In a printed wiring board, a magnetic field is generated by passing an electric current through its circuit, and an electromagnetic wave is generated with the generation of the magnetic field. This magnetic field has the effect of turning adjacent circuits into antennas. As a result, both the magnetic field and the electromagnetic wave become sources of noise, which not only causes malfunction and crosstalk between the circuits inside the device but also affects external devices.
【０００３】この電磁波の影響を防止するために、従来
は図２に示すように、絶縁基板２１の面に形成した配線
回路２２の面に対し、絶縁層２４を介して銅粉を主体と
したペーストを塗布して電磁波シールド層２５を形成さ
せ、さらにその上層にオーバーコートを形成させること
が一般に行われている。In order to prevent the influence of this electromagnetic wave, conventionally, as shown in FIG. 2, copper powder is mainly formed on the surface of the wiring circuit 22 formed on the surface of the insulating substrate 21 via the insulating layer 24. It is generally practiced to apply a paste to form the electromagnetic wave shield layer 25, and then form an overcoat on the electromagnetic wave shield layer 25.
【０００４】その他の例として、電磁波をシールするこ
とを目的として開発されたもので、特開平４−３５２４
９８号公報に開示された発明が知られている。この発明
のペーストはフェライト粉または鉄合金粉などの高透磁
率を有する軟磁性粉を含有しているものであり、このペ
ーストを用いて、基板面に形成する回路の導体を包むよ
うに施工すことにより電磁波をシールして、自己の回路
から発生する電磁波を他の機器に影響することを抑制す
るとともに、他の機器からの電磁波の影響を軽減するこ
とを目的としたものである。Another example is one developed for the purpose of sealing electromagnetic waves, and is disclosed in Japanese Patent Laid-Open No. Hei 4-3524.
The invention disclosed in Japanese Patent Publication No. 98 is known. The paste of this invention contains a soft magnetic powder having a high magnetic permeability such as a ferrite powder or an iron alloy powder, and the paste should be applied so as to wrap the conductor of the circuit formed on the substrate surface. The purpose of the present invention is to seal the electromagnetic wave by means of suppressing the influence of the electromagnetic wave generated from its own circuit on other equipment and reduce the influence of the electromagnetic wave from other equipment.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記従
来の銅粉を主体とした電磁波シールド層２４では、自己
の回路から発生する磁界を吸収することができないので
磁界の影響によるクロストークが生じやすい。また電磁
波を他の機器に影響することを防止することはできて
も、他の機器からの電磁波の影響を有効に防止すること
が困難である。However, since the conventional electromagnetic wave shield layer 24 mainly composed of copper powder cannot absorb the magnetic field generated from its own circuit, crosstalk due to the influence of the magnetic field is likely to occur. Further, although it is possible to prevent the electromagnetic waves from affecting other devices, it is difficult to effectively prevent the effects of the electromagnetic waves from other devices.
【０００６】また、特開平４−３５２４９８号公報に開
示された発明のペーストは、自己の回路から発生する電
磁波および他の機器からの電磁波の影響を抑制するもの
の、完全ではない。Further, the paste of the invention disclosed in Japanese Patent Laid-Open No. 4-352498 suppresses the effects of electromagnetic waves generated from its own circuit and electromagnetic waves from other devices, but is not perfect.
【０００７】しかも、これらの従来の電磁波シール層は
プリント配線板の表裏面の回路から発生する電磁波に対
する対策であって、表裏面に対して直角方向のスルーホ
ールから発生する磁界または電磁波に対する対策はなさ
れていないのが現状である。Moreover, these conventional electromagnetic wave sealing layers are measures against the electromagnetic waves generated from the circuits on the front and back surfaces of the printed wiring board, and are not against the magnetic fields or electromagnetic waves generated from the through holes in the direction perpendicular to the front and back surfaces. The current situation is that it has not been done.
【０００８】よって、本発明は上記従来の問題点に鑑み
てなされたものであり、プリント配線板のスルーホール
およびその他の回路から生じる磁界や電磁波をシールす
ることにより、磁界や電磁波が機器内の回路間および外
部機器間に影響を及ぼすことによるクロストーク等のノ
イズの発生を防止するプリント配線板と、その製造方法
の提供を目的とする。Therefore, the present invention has been made in view of the above-mentioned conventional problems, and by sealing the magnetic field and electromagnetic waves generated from the through holes of the printed wiring board and other circuits, the magnetic fields and electromagnetic waves are stored in the equipment. An object of the present invention is to provide a printed wiring board that prevents noise such as crosstalk caused by affecting circuits and external devices, and a manufacturing method thereof.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するた
め、本発明の磁界・電磁波シールド層を有するプリント
配線板は、所要の配線回路をスルーホールを介して電気
的に接続する両面プリント配線板において、前記プリン
ト配線板の両面に形成する信号回路および前記スルーホ
ールから発生する磁界をシールするために、前記信号回
路の面およびスルーホールの内部に磁性塗膜を形成し、
前記磁性塗膜の上層に電磁波をシールするための電磁波
シールド層を形成するとともに、前記電磁波シールド層
をアース回路に接続し、前記電磁波シールド層の上層に
オーバーコートを設けたことを特徴とする。In order to achieve the above object, a printed wiring board having a magnetic field / electromagnetic wave shield layer of the present invention is a double-sided printed wiring board for electrically connecting required wiring circuits through through holes. In, in order to seal the magnetic field generated from the signal circuit and the through hole formed on both sides of the printed wiring board, a magnetic coating film is formed on the surface of the signal circuit and inside the through hole,
An electromagnetic wave shield layer for sealing electromagnetic waves is formed on the magnetic coating layer, the electromagnetic wave shield layer is connected to a ground circuit, and an overcoat is provided on the electromagnetic wave shield layer.
【００１０】前記磁性塗膜は、初透磁率μが１０2 以
上、かつ保磁力Ｈｃ〔Ｏｅ〕が１以下の高透磁率磁性体
粉を絶縁体にて被覆した粒状体を主成分としたことを特
徴とする。The magnetic coating film is mainly composed of a granular material having an initial permeability μ of 10 2 or more and a coercive force Hc [Oe] of 1 or less, which is coated with an insulating material. Is characterized by.
【００１１】前記プリント配線板を製造方法は、高透磁
率磁性体粉を絶縁体にて被覆した粒状体を主成分とした
ペーストを、両面に形成する所要の信号回路の面に塗布
するとともにスルーホールの内部に圧入し硬化させるこ
とにより磁性塗膜を形成させ、さらに前記磁性塗膜の上
層に直接に電磁波シールド層を設けるとともに電磁波シ
ールド層をアース回路に接続し、前記電磁波シールド層
の面にオーバーコート層を形成させることを特徴とす
る。In the method for manufacturing a printed wiring board, a paste containing a granular material having a high-permeability magnetic powder coated with an insulating material as a main component is applied to both surfaces of a desired signal circuit to be formed on both sides and a through-hole is applied. A magnetic coating film is formed by press-fitting and hardening inside the hole, and further an electromagnetic wave shielding layer is directly provided on the magnetic coating film and the electromagnetic wave shielding layer is connected to a ground circuit, and on the surface of the electromagnetic wave shielding layer. It is characterized in that an overcoat layer is formed.
【００１２】[0012]
【作用】本発明の磁界・電磁波シールド層を有するプリ
ント配線板とその製造方法によれば、プリント配線板の
表裏面の信号回路およびスルーホールから発生する磁界
を吸収し、電磁波をシールすることができる。According to the printed wiring board having the magnetic field / electromagnetic wave shield layer and the method of manufacturing the same of the present invention, it is possible to absorb the magnetic fields generated from the signal circuits and the through holes on the front and back surfaces of the printed wiring board and seal the electromagnetic waves. it can.
【００１３】[0013]
【実施例】本実施例は、図１に示すように基板１の両面
に信号回路４，５及びアース回路６，７を形成し、所要
の信号回路をスルーホールメッキ３にて電気的に接続す
るスルーホール２が設けられた両面プリント配線板にお
ける、スルーホール２及び信号回路２，３から発生する
磁界および電磁波をシールしようとするものである。EXAMPLE In this example, as shown in FIG. 1, signal circuits 4 and 5 and earth circuits 6 and 7 are formed on both sides of a substrate 1, and required signal circuits are electrically connected by through hole plating 3. In the double-sided printed wiring board provided with the through hole 2, the magnetic field and the electromagnetic wave generated from the through hole 2 and the signal circuits 2 and 3 are to be sealed.
【００１４】この両面プリント配線板の信号回路４，５
から発生する磁界および電磁波をシールするために用い
られるペーストは、初透磁率μが１０2 以上、かつ保磁
力Ｈｃ〔Ｏｅ〕が１以下の高透磁率磁性体を樹脂または
セラミック等の絶縁体にて被覆することにより絶縁性を
付与した粒状体を主成分としたものである。従って、こ
のペーストには導電性がない。Signal circuits 4, 5 of this double-sided printed wiring board
The paste used to seal the magnetic field and electromagnetic waves generated from the high magnetic permeability magnetic substance having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [Oe] of 1 or less is applied to an insulator such as resin or ceramic. As a main component, the granular material is provided with an insulating property by being coated. Therefore, this paste is not conductive.
【００１５】そして、前記プリント配線板のスルーホー
ル２の内部に磁性塗膜８，９を形成させるに際しては、
プリント配線板の表裏面の信号回路４，５において磁界
をシールすべき所要の面に対して、シルク印刷にて前記
ペーストを施す時に、同時にスルーホール２内部にペー
ストをスキージの圧力によりを圧入させる。When the magnetic coating films 8 and 9 are formed inside the through holes 2 of the printed wiring board,
When the paste is applied by silk printing to the required surfaces of the signal circuits 4 and 5 on the front and back surfaces of the printed wiring board where the magnetic field is to be sealed, at the same time, the paste is pressed into the through hole 2 by the pressure of the squeegee. .
【００１６】圧入されたペーストおよび表裏面のペース
トは固化することにより磁性塗膜８，９が形成される。
なお、この場合のペーストには導電性がないので、信号
回路４，５の面及びスルーホールメッキ２に直接に接触
させても絶縁上の問題ガ生じることがない。The press-fitted paste and the paste on the front and back surfaces are solidified to form the magnetic coating films 8 and 9.
Since the paste in this case has no conductivity, no problem with insulation occurs even if it is brought into direct contact with the surfaces of the signal circuits 4 and 5 and the through-hole plating 2.
【００１７】磁性塗膜８，９の上層には直接に電磁波シ
ールド層１０，１１を形成させるとともにアース回路
６，７に接続し，さらにその上層にオーバーコート層１
２，１３を形成させることにより磁性塗膜及び電磁波シ
ールド層を有するプリント配線板を完成する。Electromagnetic wave shield layers 10 and 11 are directly formed on the magnetic coatings 8 and 9 and are connected to the ground circuits 6 and 7, and the overcoat layer 1 is formed on the electromagnetic shield layers 10 and 11.
By forming Nos. 2 and 13, a printed wiring board having a magnetic coating film and an electromagnetic wave shield layer is completed.
【００１８】これにより、磁性塗膜８，９がプリント配
線板の表裏面に形成する信号回路および表裏面に対して
直角方向に形成するスルーホール２の両者から発生する
磁界を吸収し、電磁波シールド層１０，１１がプリント
配線板全体から発生する電磁波をシールすることによ
り、プリント配線板全体から発生する磁界・電磁波のす
べてがシールされる。As a result, the magnetic coating films 8 and 9 absorb the magnetic fields generated from both the signal circuits formed on the front and back surfaces of the printed wiring board and the through holes 2 formed in the direction perpendicular to the front and back surfaces, and the electromagnetic shield. Since the layers 10 and 11 seal the electromagnetic waves generated from the entire printed wiring board, all the magnetic fields and electromagnetic waves generated from the entire printed wiring board are sealed.
【００１９】また、前記実施例１から３において用いら
れる高透磁率磁性体には特性の異なる多くの種類のもの
がある。そしてこれらの磁性体は、例えば、テレビ、オ
ーディオまたはＯＡ機器等に要求される性能に対して最
もよい効果が得られる特性を有する種類のものを選択し
なければならない。Further, there are many kinds of high magnetic permeability materials used in the first to third embodiments having different characteristics. For these magnetic materials, it is necessary to select a magnetic material having a characteristic that the best effect can be obtained with respect to the performance required for, for example, a television, an audio device or an OA device.
【００２０】これらの機器の特性において、例えば、低
周波領域ではＭｎＺｎフェライト、高周波領域ではＮｉ
Ｚｎフェライト、マイクロ波領域ではＭｎＭｇフェライ
ト等を用いることにより効果的に磁界を吸収することが
できる。The characteristics of these devices are, for example, MnZn ferrite in the low frequency region and Ni in the high frequency region.
A magnetic field can be effectively absorbed by using Zn ferrite or MnMg ferrite in the microwave region.
【００２１】特に、プリント配線板においては初透磁率
μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の高
透磁率材料を用いることが望ましい。そして、磁性体は
強磁性体ではなく低保磁力のものが適している。なお、
強磁性体の場合は保磁力が強いので、逆にクロストーク
を助長してしまう恐れがある。In particular, in a printed wiring board, it is desirable to use a high magnetic permeability material having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [0e] of 1 or less. Further, the magnetic material is not a ferromagnetic material but a low coercive force is suitable. In addition,
In the case of a ferromagnetic material, it has a strong coercive force, which may adversely affect crosstalk.
【００２２】即ち、磁界を吸収して消磁する性質のも
の、例えば、ＭｎＺｎフェライト、高純Ｆｅ、ＦｅＮｉ
Ｍｏ（パーマロイ）、センダスト等の高透磁率のものが
適している。That is, those having a property of absorbing a magnetic field and demagnetizing, for example, MnZn ferrite, high purity Fe, FeNi
Materials with high magnetic permeability such as Mo (permalloy) and sendust are suitable.
【００２３】また、磁性体の初透磁率μが１０2 以下、
かつ保磁力Ｈｃ〔０ｅ〕が１以上のものは、磁界の吸収
能力が劣り、これを使用した場合はノイズを完全に防止
することができない。The initial permeability μ of the magnetic material is 10 2 or less,
In addition, if the coercive force Hc [0e] is 1 or more, the magnetic field absorption capability is poor, and if this is used, noise cannot be completely prevented.
【００２４】[0024]
【発明の効果】本発明によれば、両面プリント配線板の
表裏面及びスルーホールから発生する磁界及び電磁波の
すべてをシールすることができる。According to the present invention, all the magnetic fields and electromagnetic waves generated from the front and back surfaces of the double-sided printed wiring board and the through holes can be sealed.
【００２５】これにより、磁界や電磁波が機器内の回路
間および外部機器間に影響を及ぼし、また外部機器から
影響されることを阻止し、クロストーク現象等のノイズ
の発生を防止することができる。As a result, it is possible to prevent the magnetic field and the electromagnetic wave from affecting the circuits in the device and the external device and from being affected by the external device, and prevent the occurrence of noise such as a crosstalk phenomenon. .
【図１】本発明の実施例を示す磁性塗膜及び電磁波シー
ルド層を有するプリント配線板の拡大断面図。FIG. 1 is an enlarged cross-sectional view of a printed wiring board having a magnetic coating film and an electromagnetic wave shield layer showing an embodiment of the present invention.
【図２】従来の電磁波シールド層を有するプリント配線
板の拡大断面図。FIG. 2 is an enlarged sectional view of a conventional printed wiring board having an electromagnetic wave shield layer.
１ 基板 ２ スルーホール ３ スルーホールメッキ ４，５ 信号回路 ６，７ アース回路 ８，９ 磁性塗膜 １０，１１ 電磁波シールド層 １２，１３ オーバーコート 1 Substrate 2 Through hole 3 Through hole plating 4,5 Signal circuit 6,7 Earth circuit 8,9 Magnetic coating film 10,11 Electromagnetic wave shield layer 12,13 Overcoat
───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 純一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 西山 宜男 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 鯉沼 祐一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Ichikawa 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture Japan CMC Co., Ltd. (72) Yoshio Nishiyama 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan Share Company (72) Inventor Yuichi Koinuma 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation
Claims (3)
電気的に接続する両面プリント配線板において、前記プ
リント配線板の両面に形成する信号回路および前記スル
ーホールから発生する磁界をシールするために、前記信
号回路の面およびスルーホールの内部に磁性塗膜を形成
し、前記磁性塗膜の上層に電磁波をシールするための電
磁波シールド層を形成するとともに、前記電磁波シール
ド層をアース回路に接続し、電磁波シールド層の上層に
オーバーコートを設けたことを特徴とする磁性塗膜及び
電磁波シールド層を有するプリント配線板。1. A double-sided printed wiring board for electrically connecting a required wiring circuit through a through hole, for sealing a signal circuit formed on both sides of the printed wiring board and a magnetic field generated from the through hole. Forming a magnetic coating film on the surface of the signal circuit and inside the through hole, forming an electromagnetic shield layer for sealing electromagnetic waves on the upper layer of the magnetic coating film, and connecting the electromagnetic shield layer to a ground circuit. A printed wiring board having a magnetic coating film and an electromagnetic wave shield layer, characterized in that an overcoat is provided on the electromagnetic wave shield layer.
上、かつ保磁力Ｈｃ〔Ｏｅ〕が１以下の高透磁率磁性体
粉を絶縁体にて被覆した粒状体を主成分としたことを特
徴とする請求項１記載の磁性塗膜及び電磁波シールド層
を有するプリント配線板。2. The main component of the magnetic coating film is a granular material obtained by coating a high-permeability magnetic substance powder having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [Oe] of 1 or less with an insulator. A printed wiring board having the magnetic coating film and the electromagnetic wave shielding layer according to claim 1.
て電気的に接続する両面プリント配線板において、高透
磁率磁性体粉を絶縁体にて被覆した粒状体を主成分とし
たペーストを、両面に形成する所要の信号回路の面に塗
布するとともにスルーホールの内部に圧入し硬化させる
ことにより磁性塗膜を形成させ、さらに前記磁性塗膜の
上層に直接に電磁波シールド層を設け、前記シールド層
の面にオーバーコート層を形成させることを特徴とする
磁界・電磁波シールド層を有するプリント配線板の製造
方法。3. A double-sided printed wiring board for electrically connecting a required wiring circuit through a through hole, wherein a paste containing a high permeability magnetic substance powder coated with an insulator as a main component, A magnetic coating film is formed by coating the surface of the required signal circuit to be formed on both sides and press-fitting it inside the through hole to cure it, and further providing an electromagnetic wave shield layer directly on the magnetic coating film. A method for manufacturing a printed wiring board having a magnetic field / electromagnetic wave shield layer, which comprises forming an overcoat layer on the surface of the layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5227953A JPH0758487A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic coating film and radio wave shielding layer and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5227953A JPH0758487A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic coating film and radio wave shielding layer and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0758487A true JPH0758487A (en) | 1995-03-03 |
Family
ID=16868857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5227953A Pending JPH0758487A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic coating film and radio wave shielding layer and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758487A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10326993A (en) * | 1997-05-23 | 1998-12-08 | Mitsubishi Electric Corp | Shield for electronic circuit |
| US6545212B1 (en) * | 1998-10-27 | 2003-04-08 | Murata Manufacturing Co., Ltd. | Radiation noise suppressing component attachment structure |
| CN100433955C (en) * | 2003-04-14 | 2008-11-12 | 索尼株式会社 | Wiring plate and circuit module |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212089A (en) * | 1985-03-18 | 1986-09-20 | 日本シイエムケイ株式会社 | Printed wiring board and manufacture thereof |
| JPS61265890A (en) * | 1985-05-20 | 1986-11-25 | 日本シイエムケイ株式会社 | Printed wiring board and shield toner |
| JPH01201985A (en) * | 1988-02-08 | 1989-08-14 | Nec Corp | Printed-wiring board |
| JPH01205599A (en) * | 1988-02-12 | 1989-08-17 | S M C:Kk | Wiring board |
| JPH0476991A (en) * | 1990-07-18 | 1992-03-11 | Cmk Corp | Manufacture of printed circuit board |
| JPH04105598U (en) * | 1991-02-26 | 1992-09-10 | 富士電気化学株式会社 | Electromagnetic shield printed wiring board |
| JPH04352498A (en) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | Insulation paste for electromagnetic shield with high permeability |
| JPH0595197A (en) * | 1991-10-01 | 1993-04-16 | Mitsui Toatsu Chem Inc | Printed wiring board and substrate used therefor |
-
1993
- 1993-08-20 JP JP5227953A patent/JPH0758487A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212089A (en) * | 1985-03-18 | 1986-09-20 | 日本シイエムケイ株式会社 | Printed wiring board and manufacture thereof |
| JPS61265890A (en) * | 1985-05-20 | 1986-11-25 | 日本シイエムケイ株式会社 | Printed wiring board and shield toner |
| JPH01201985A (en) * | 1988-02-08 | 1989-08-14 | Nec Corp | Printed-wiring board |
| JPH01205599A (en) * | 1988-02-12 | 1989-08-17 | S M C:Kk | Wiring board |
| JPH0476991A (en) * | 1990-07-18 | 1992-03-11 | Cmk Corp | Manufacture of printed circuit board |
| JPH04105598U (en) * | 1991-02-26 | 1992-09-10 | 富士電気化学株式会社 | Electromagnetic shield printed wiring board |
| JPH04352498A (en) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | Insulation paste for electromagnetic shield with high permeability |
| JPH0595197A (en) * | 1991-10-01 | 1993-04-16 | Mitsui Toatsu Chem Inc | Printed wiring board and substrate used therefor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10326993A (en) * | 1997-05-23 | 1998-12-08 | Mitsubishi Electric Corp | Shield for electronic circuit |
| US6545212B1 (en) * | 1998-10-27 | 2003-04-08 | Murata Manufacturing Co., Ltd. | Radiation noise suppressing component attachment structure |
| CN100433955C (en) * | 2003-04-14 | 2008-11-12 | 索尼株式会社 | Wiring plate and circuit module |
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