JPH0758486A - Printed wiring board having magnetic field and radio wave shielding layer and its manufacture - Google Patents

Printed wiring board having magnetic field and radio wave shielding layer and its manufacture

Info

Publication number
JPH0758486A
JPH0758486A JP22795293A JP22795293A JPH0758486A JP H0758486 A JPH0758486 A JP H0758486A JP 22795293 A JP22795293 A JP 22795293A JP 22795293 A JP22795293 A JP 22795293A JP H0758486 A JPH0758486 A JP H0758486A
Authority
JP
Japan
Prior art keywords
magnetic field
electromagnetic wave
wiring board
printed wiring
wave shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22795293A
Other languages
Japanese (ja)
Inventor
Shin Kawakami
伸 川上
Satoru Haruyama
哲 春山
Katsutomo Nikaido
勝友 二階堂
Junichi Ichikawa
純一 市川
Norio Nishiyama
宜男 西山
Yuichi Koinuma
祐一 鯉沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP22795293A priority Critical patent/JPH0758486A/en
Publication of JPH0758486A publication Critical patent/JPH0758486A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To prevent noise like crosstalk by blocking magnetic field and radio waves generated from a circuit on a printed wiring board, with a shielding layer. CONSTITUTION:On the surface of a single-sided board on which surface a signal circuit 2 is formed, a magnetic field and radio wave shielding layer 5 is formed via an insulating layer 4, and connected with an earth circuit 3. On the rear, a magnetic field and radio wave shielding layer 6 is directly formed. Overcoat layers are formed on the magnetic field and radio wave shielding layers 5, 6. The magnetic field and radio wave shielding layer contains grains wherein high permeability magnetic particles are coated with copper or silver of high conductivity, and has conductivity. As to the magnetic particles, the initial permeability mu is 10<2> or larger and the coercive force Hc [0e] is 1 or smaller.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、プリント配線板または
ハイブリッドＩＣ基板およびマルチチップモジュール基
板等の製造方法に関し、特に、磁界または電磁波の影響
による回路間のクロストーク等のノイズを防止したプリ
ント配線板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, a hybrid IC substrate, a multi-chip module substrate or the like, and more particularly to a printed wiring which prevents noise such as crosstalk between circuits due to the influence of a magnetic field or electromagnetic waves. The present invention relates to a plate and a manufacturing method thereof.

【０００２】[0002]

【従来の技術】プリント配線板においては、その回路に
電流を流すことにより、磁界の発生に伴い電磁波が発生
する。この磁界は隣接した回路をアンテナ化する作用が
ある。これにより、磁界および電磁波はともにノイズの
発生源となり、機器の内部における回路間にて誤動作や
クロストーク現象を生じさせるばかりでなく、外部機器
に対しても影響を及ぼす。2. Description of the Related Art In a printed wiring board, an electromagnetic wave is generated along with the generation of a magnetic field by passing a current through the circuit. This magnetic field has the effect of turning adjacent circuits into antennas. As a result, both the magnetic field and the electromagnetic wave become sources of noise, which not only causes malfunctions and crosstalk between the circuits inside the device, but also affects external devices.

【０００３】この電磁波の影響を防止するために、従来
は、図３に示すように、絶縁基板３１の面に形成した信
号回路３２の面に対し、絶縁層３４を介して銅粉を主体
としたペーストを塗布して電磁波シールド層３５を形成
させるとともにアース回路３３に接続し、その上層にオ
ーバーコート３６を形成させることが一般に行われてい
る。In order to prevent the influence of this electromagnetic wave, conventionally, as shown in FIG. 3, copper powder is mainly used on the surface of the signal circuit 32 formed on the surface of the insulating substrate 31 via the insulating layer 34. It is generally practiced to apply the paste described above to form the electromagnetic wave shield layer 35, connect it to the earth circuit 33, and form the overcoat 36 on the upper layer thereof.

【０００４】その他の例として、電磁波をシールするこ
とを目的として開発されたもので、特開平４−３５２４
９８号公報に開示された発明が知られている。この発明
のペーストはフェライト粉または鉄合金粉などの高透磁
率を有する軟磁性粉を含有しているものであり、このペ
ーストを用いて、基板面に形成する回路の導体を包み込
むように施工すことにより電磁波をシールして、自己の
回路から発生する電磁波を他の機器に影響することを抑
制するとともに、他の機器からの電磁波の影響を軽減す
ることを目的としたものである。Another example is one developed for the purpose of sealing electromagnetic waves, and is disclosed in Japanese Patent Laid-Open No. Hei 4-3524.
The invention disclosed in Japanese Patent Publication No. 98 is known. The paste of this invention contains a soft magnetic powder having a high magnetic permeability such as ferrite powder or iron alloy powder, and this paste is used to wrap the conductor of the circuit formed on the substrate surface. The purpose of the present invention is to seal electromagnetic waves so as to suppress the influence of electromagnetic waves generated from its own circuit on other devices and reduce the influence of electromagnetic waves from other devices.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、前記従
来の銅粉を主体とした電磁波シールド層３５では、自己
の回路から発生する磁界を吸収することができないので
磁界の影響によるクロストークが生じやすい。また電磁
波を他の機器に影響することを防止することはできて
も、他の機器からの電磁波の影響を有効に防止すること
が困難である。However, since the conventional electromagnetic wave shield layer 35 mainly made of copper powder cannot absorb the magnetic field generated from its own circuit, crosstalk due to the influence of the magnetic field is likely to occur. Further, although it is possible to prevent the electromagnetic waves from affecting other devices, it is difficult to effectively prevent the effects of the electromagnetic waves from other devices.

【０００６】また、特開平４−３５２４９８号公報に開
示された発明のペーストは、自己の回路から発生する電
磁波および他の機器からの電磁波の影響を抑制するもの
の、完全ではない。また、磁性塗膜の形成方法が導体を
包み込むようにして形成する煩雑な工程であるという問
題がある。Further, the paste of the invention disclosed in Japanese Patent Laid-Open No. 4-352498 suppresses the effects of electromagnetic waves generated from its own circuit and electromagnetic waves from other devices, but is not perfect. There is also a problem that the method of forming the magnetic coating film is a complicated process of forming the magnetic coating film so as to wrap it around the conductor.

【０００７】よって、本発明は上記従来の問題点に鑑み
てなされたものであり、プリント配線板の回路に生じた
磁界や電磁波が、機器内および外部機器に対して影響を
及ぼすことによるクロストーク等のノイズの発生を防止
したプリント配線板と、そのプリント配線板を容易に製
造する方法の提供を目的とする。Therefore, the present invention has been made in view of the above-mentioned problems of the related art, and the crosstalk due to the influence of the magnetic field or the electromagnetic wave generated in the circuit of the printed wiring board on the internal equipment and the external equipment. It is an object of the present invention to provide a printed wiring board in which noise such as noise is prevented and a method for easily manufacturing the printed wiring board.

【０００８】[0008]

【課題を解決するための手段】上記目的を達成するた
め、本発明は、プリント配線板の表裏面において、信号
回路を形成した面には絶縁層を介し、または信号回路を
形成していない面には直接にその一部または全面にノイ
ズを防止する磁界・電磁波シールド層を設けるととも
に、前記磁界・電磁波シールド層の上層にオーバーコー
ト層を設け、前記磁界・電磁波シールド層一層のみで磁
界および電磁波をシールすることを特徴とする。In order to achieve the above object, the present invention provides a front surface and a back surface of a printed wiring board, a surface on which a signal circuit is formed, an insulating layer being interposed, or a surface on which a signal circuit is not formed. Is directly provided with a magnetic field / electromagnetic wave shield layer for preventing noise on a part or the entire surface thereof, and an overcoat layer is provided on the magnetic field / electromagnetic wave shield layer. Is characterized by sealing.

【０００９】そして、前記磁界・電磁波シールド層は、
初透磁率μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１
以下の高透磁率磁性体粉を高導電性の銅または銀にて表
面被覆した粒状体を含有させてなるものである。The magnetic field / electromagnetic wave shield layer is
Initial permeability μ is 10 2 or more and coercive force Hc [0e] is 1
The following high-permeability magnetic substance powder is made to contain a granular substance whose surface is coated with highly conductive copper or silver.

【００１０】また、本発明のプリント配線板の製造に際
しては、高透磁率磁性体粉を高導電性の銅または銀にて
表面被覆した粒状体を含有させたペーストを作成し、こ
のペーストを用いてプリント配線板表裏面の所要の信号
回路の面に絶縁層を介し、または信号回路を形成してい
ない面には直接にその一部または全面に塗布し、その
後、硬化させて磁界・電磁波シールド層を形成させるこ
とを特徴とする。Further, in the production of the printed wiring board of the present invention, a paste containing a granular material whose surface is coated with high-permeability magnetic material powder with highly conductive copper or silver is prepared, and this paste is used. Apply to the required signal circuit surface on the front and back of the printed wiring board with an insulating layer in between, or directly to the surface where no signal circuit is formed, to a part or the whole surface of the printed circuit board, and then cure it to shield the magnetic and electromagnetic fields. It is characterized in that a layer is formed.

【００１１】[0011]

【作用】本発明の磁界・電磁波シールド層を有するプリ
ント配線板とその製造方法によれば、プリント配線板の
表裏面の所要の部分に磁界・電磁波シールド層を設けた
ことにより、磁界・電磁波シールド層の成分である高透
磁率磁性体が磁界を吸収し、高導電性の銅または銀が電
磁波をシールすることにより、この磁界・電磁波シール
ド層の一層にて磁界および電磁波をシールすることがで
きる。According to the printed wiring board having the magnetic field / electromagnetic wave shield layer of the present invention and the method for manufacturing the same, the magnetic field / electromagnetic wave shield layer is provided by providing the magnetic field / electromagnetic wave shield layer on required portions on the front and back surfaces of the printed wiring board. A layer of high magnetic permeability absorbs the magnetic field, and highly conductive copper or silver seals the electromagnetic wave, so that the magnetic field and electromagnetic wave can be sealed by one layer of this magnetic field / electromagnetic wave shield layer. .

【００１２】[0012]

【実施例１】図１は本発明の実施例１を示す片面プリン
ト配線板の断面図である。このプリント配線板は基板１
の面に信号回路２及びアース回路３を形成しており、そ
の信号回路２の面の所要の部分に絶縁層４を介して磁界
・電磁波シールド層５を形成するとともに磁界・電磁波
シールド層５アース回路３に電気的に接続し、また信号
回路を形成していない基板１の裏面には、その所要の部
分に磁界・電磁波シールド層６を直接に施し、さらに磁
界・電磁波シールド層５，６の上層にオーバーコート
７，８を形成したものである。Embodiment 1 FIG. 1 is a sectional view of a single-sided printed wiring board showing Embodiment 1 of the present invention. This printed wiring board is substrate 1
The signal circuit 2 and the ground circuit 3 are formed on the surface of the magnetic field, and the magnetic field / electromagnetic wave shield layer 5 is formed on a required portion of the surface of the signal circuit 2 via the insulating layer 4 and the magnetic field / electromagnetic wave shield layer 5 is grounded. On the back surface of the substrate 1 which is electrically connected to the circuit 3 and on which the signal circuit is not formed, a magnetic field / electromagnetic wave shield layer 6 is directly applied to a required portion thereof, and further, the magnetic field / electromagnetic wave shield layers 5 and 6 are formed. Overcoats 7 and 8 are formed on the upper layer.

【００１３】[0013]

【実施例２】図２は本発明の実施例２を示す両面プリン
ト配線板の断面図である。このプリント配線板は基板１
１の両面にそれぞれ信号回路１２，１３及びアース回路
１４，１５を形成し、また両面の所要の回路をスルーホ
ールメッキ１７を介して電気的に接続するスルーホール
１６が設けられている。この両面プリント配線板の信号
回路１２，１３の面の所要の部分に対して絶縁層１８，
１９を介して磁界・電磁波シールド層２０，２１を形成
するとともに磁界・電磁波シールド層２０，２１をアー
ス回路１４，１５に電気的に接続し、さらに磁界・電磁
波シールド層２０，２１の上層にオーバーコート２２，
２３を形成したものである。[Embodiment 2] FIG. 2 is a sectional view of a double-sided printed wiring board showing Embodiment 2 of the present invention. This printed wiring board is substrate 1
The signal circuits 12 and 13 and the ground circuits 14 and 15 are formed on both surfaces of 1, respectively, and through holes 16 are provided to electrically connect the required circuits on both surfaces through through hole plating 17. Insulating layer 18, for the required portion of the surface of the signal circuit 12, 13 of this double-sided printed wiring board,
The magnetic field / electromagnetic wave shield layers 20 and 21 are formed via 19 and the magnetic field / electromagnetic wave shield layers 20 and 21 are electrically connected to the earth circuits 14 and 15, and further over the magnetic field / electromagnetic wave shield layers 20 and 21. Coat 22,
23 is formed.

【００１４】前記実施例１及び２における磁界・電磁波
シールド層５，６または２０，２１は、初透磁率μが１
０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の高透磁率
磁性体粉を高導電性の銅または銀にて表面被覆した粒状
体を含有させたペーストを作成し、このペーストを用い
て所要の面に塗布した後、硬化させることにより形成し
たものであり、導電性を有するものである。The magnetic field / electromagnetic wave shield layers 5, 6 or 20, 21 in Examples 1 and 2 have an initial magnetic permeability μ of 1
0 2 or more, and to create a coercive force Hc [0e] is obtained by incorporating granules were surface-coated with 1 less high permeability magnetic powder in highly conductive copper or silver paste, by using this paste It is formed by applying it on a desired surface and then curing it, and has conductivity.

【００１５】前記高透磁率磁性体には特性の異なる多く
の種類のものがある。そしてこれらの磁性体は、例え
ば、テレビ、オーディオおよびＯＡ機器等に要求される
性能に対して最もよい効果が得られる特性を有する種類
のものを選択しなければならない。There are many kinds of high permeability magnetic materials having different characteristics. For these magnetic materials, it is necessary to select a magnetic material having a characteristic that the best effect can be obtained with respect to the performance required for, for example, televisions, audio equipment and OA equipment.

【００１６】これらの機器の特性において、例えば、低
周波領域ではＭｎＺｎフェライト、高周波領域ではＮｉ
Ｚｎフェライト、マイクロ波領域ではＭｎＭｇフェライ
ト等を用いることにより効果的に磁界を吸収することが
できる。The characteristics of these devices are, for example, MnZn ferrite in the low frequency region and Ni in the high frequency region.
A magnetic field can be effectively absorbed by using Zn ferrite or MnMg ferrite in the microwave region.

【００１７】特に、プリント配線板においては初透磁率
μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の高
透磁率材料を用いることが望ましい。そして、磁性体は
強磁性体ではなく低保磁力のものが適している。なお、
強磁性体の場合は保磁力が強いので、逆にクロストーク
を助長してしまう恐れがある。In particular, in a printed wiring board, it is desirable to use a high magnetic permeability material having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [0e] of 1 or less. Further, the magnetic material is not a ferromagnetic material but a low coercive force is suitable. In addition,
In the case of a ferromagnetic material, it has a strong coercive force, which may adversely affect crosstalk.

【００１８】即ち、磁界を吸収して消磁する性質のも
の、例えば、ＭｎＺｎフェライト、高純Ｆｅ、ＦｅＮｉ
Ｍｏ（パーマロイ）、センダスト等の高透磁率のものが
適している。That is, those having a property of absorbing a magnetic field and demagnetizing, for example, MnZn ferrite, highly pure Fe, FeNi
Materials with high magnetic permeability such as Mo (permalloy) and sendust are suitable.

【００１９】また、磁性体の初透磁率μが１０2 以下、
かつ保磁力Ｈｃ〔０ｅ〕が１以上のものは、磁界の吸収
能力が劣り、これを使用した場合はノイズを完全に防止
することができない。The initial permeability μ of the magnetic material is 10 2 or less,
In addition, if the coercive force Hc [0e] is 1 or more, the magnetic field absorption capability is poor, and if this is used, noise cannot be completely prevented.

【００２０】以上の各種特性の高透磁率材料のなかで、
本実施例１および２のプリント配線板の製造に際して
は、各機器に要求される性能毎に最も効果的に特性を発
揮するする種類の高透磁率磁性体粉を選び、この磁性体
を銅または銀にて表面被覆して粒状体とするとともに、
これを含有させたペーストを作成し、このペーストを用
いて信号回路２または１２，１３を形成した面に絶縁層
４または１８，１９を介して塗布すると同時にアース回
路３または１４，１５に電気的に接続し、また信号回路
を形成していない片面プリント配線板の裏面には直接に
塗布し、その後硬化させて磁界・電磁波シールド層５，
６または２０，２１の塗膜を形成させる。そして、磁界
・電磁波シールド層５，６または２０，２１の塗膜は導
電性を有するのでその上層にオーバーコートの層を設け
て絶縁保護する。Among the high magnetic permeability materials having the above various characteristics,
In manufacturing the printed wiring boards of Examples 1 and 2, a high-permeability magnetic substance powder of a type that most effectively exhibits the characteristics is selected for each performance required for each device, and the magnetic substance is made of copper or copper. While covering the surface with silver to make a granular body,
A paste containing this is prepared, and the paste is applied to the surface on which the signal circuit 2 or 12, 13 is formed through the insulating layer 4 or 18, 19 and at the same time electrically applied to the ground circuit 3 or 14, 15. To the back surface of the single-sided printed wiring board on which the signal circuit is not formed.
6 or 20, 21 coatings are formed. Since the coating films of the magnetic field / electromagnetic wave shield layers 5, 6 or 20, 21 are electrically conductive, an overcoat layer is provided thereon to protect the insulation.

【００２１】以上により、磁界・電磁波シールド層を形
成する高透磁率磁性体粉が磁界を吸収し、高導電性の銅
または銀が電磁波をシールするので、この磁界・電磁波
シールド層の一層を形成するだけで磁界と電磁波の両者
をシールすることができる。As described above, since the high magnetic permeability magnetic material powder forming the magnetic field / electromagnetic wave shield layer absorbs the magnetic field and the highly conductive copper or silver seals the electromagnetic wave, one layer of the magnetic field / electromagnetic wave shield layer is formed. Both the magnetic field and the electromagnetic wave can be sealed by simply doing.

【００２２】[0022]

【発明の効果】本発明の磁界・電磁波シールド層を有す
るプリント配線板およびその製造方法によれば、プリン
ト配線板の表裏面の所要の部分に磁界・電磁波シールド
層の塗膜を施すことにより、回路の導体から発生する磁
界および電磁波を、磁界・電磁波シールド層の１層だけ
でシールすることができる。According to the printed wiring board having the magnetic field / electromagnetic wave shield layer of the present invention and the method for manufacturing the same, by applying a coating film of the magnetic field / electromagnetic wave shield layer to a required portion of the front and back surfaces of the printed wiring board, The magnetic field and the electromagnetic wave generated from the conductor of the circuit can be sealed with only one magnetic field / electromagnetic wave shield layer.

【００２３】従って、磁界および電磁波のそれぞれのシ
ールド層を別々に施す必要がないために、工数を低減す
ることができる。Therefore, since it is not necessary to separately provide the shield layers for the magnetic field and the electromagnetic wave, the number of steps can be reduced.

【００２４】これにより、機器内および外部機器に対し
て磁界や電磁波が影響を及ぼすことを防止するととも
に、外部機器からの影響も防止するので、クロストーク
現象等のノイズの発生を防止することができる。As a result, it is possible to prevent the magnetic field and the electromagnetic wave from affecting the inside and the outside of the device, and also prevent the influence from the external device, so that it is possible to prevent the occurrence of noise such as a crosstalk phenomenon. it can.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例１を示す磁界・電磁波シールド
層を有する片面プリント配線板の断面図。FIG. 1 is a sectional view of a single-sided printed wiring board having a magnetic field / electromagnetic wave shield layer according to a first embodiment of the present invention.

【図２】本発明の実施例２を示す磁界・電磁波シールド
層を有する両面プリント配線板の断面図。FIG. 2 is a sectional view of a double-sided printed wiring board having a magnetic field / electromagnetic wave shield layer according to a second embodiment of the present invention.

【図３】従来のシールド層を有するプリント配線板の断
面図。FIG. 3 is a cross-sectional view of a conventional printed wiring board having a shield layer.

【符号の説明】[Explanation of symbols]

１，１１ 基板 ２，１２，１３ 信号回路 ３，１４，１５ アース回路 ４，１８，１９ 絶縁層 ５，６，２０，２１ 磁界・電磁波シールド層 ７，８，２２，２３ オーバーコート 1,11 Substrate 2,12,13 Signal circuit 3,14,15 Earth circuit 4,18,19 Insulation layer 5,6,20,21 Magnetic field / electromagnetic wave shield layer 7,8,22,23 Overcoat

───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 純一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 西山 宜男 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 鯉沼 祐一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Ichikawa 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture Japan CMC Co., Ltd. (72) Yoshio Nishiyama 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan Share Company (72) Inventor Yuichi Koinuma 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 プリント配線板の表裏面において、信号
回路を形成した面には絶縁層を介し、または信号回路を
形成していない面には直接にその一部または全面にノイ
ズを防止する磁界・電磁波シールド層を設けるととも
に、前記磁界・電磁波シールド層の上層にオーバーコー
ト層を設け、磁界・電磁波シールド層一層のみで磁界お
よび電磁波をシールすることを特徴とする磁界・電磁波
シールド層を有するプリント配線板。1. A magnetic field for preventing noise on part or all of the front and back surfaces of a printed wiring board, with an insulating layer on the surface on which the signal circuit is formed or directly on the surface on which the signal circuit is not formed. A print having a magnetic field / electromagnetic wave shield layer characterized in that an electromagnetic wave shield layer is provided, an overcoat layer is provided on the magnetic field / electromagnetic wave shield layer, and the magnetic field / electromagnetic wave shield layer is sealed by only one magnetic field / electromagnetic wave shield layer. Wiring board. 【請求項２】 前記磁界・電磁波シールド層は、初透磁
率μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の
高透磁率磁性体粉を高導電性の銅または銀にて表面被覆
した粒状体を含有させてなるものであることを特徴とす
る請求項１記載の磁界・電磁波シールド層を有するプリ
ント配線板。2. The magnetic field / electromagnetic wave shield layer has a surface made of a highly conductive copper or silver powder having a high magnetic permeability having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [0e] of 1 or less. The printed wiring board having a magnetic field / electromagnetic wave shield layer according to claim 1, wherein the printed wiring board comprises a coated granular material. 【請求項３】 高透磁率磁性体粉を高導電性の銅または
銀にて表面被覆した粒状体を含有させたペーストを作成
し、このペーストを用いてプリント配線板表裏面の所要
の信号回路の面に絶縁層を介し、または信号回路を形成
していない面には直接にその一部または全面に塗布し、
その後、硬化させて磁界・電磁波シールド層を形成させ
ることによりプリント配線板を製造することを特徴とす
る磁界・電磁波シールド層を有するプリント配線板の製
造方法。3. A paste containing a granular material, the surface of which is coated with high-permeability magnetic substance powder with highly conductive copper or silver, is prepared, and a required signal circuit on the front and back surfaces of a printed wiring board is prepared using this paste. Through the insulating layer on the surface of, or directly on the surface where the signal circuit is not formed, on a part or all of the surface,
Thereafter, the printed wiring board is manufactured by curing to form a magnetic field / electromagnetic wave shield layer, and a method for manufacturing a printed wiring board having a magnetic field / electromagnetic wave shield layer.
JP22795293A 1993-08-20 1993-08-20 Printed wiring board having magnetic field and radio wave shielding layer and its manufacture Pending JPH0758486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22795293A JPH0758486A (en) 1993-08-20 1993-08-20 Printed wiring board having magnetic field and radio wave shielding layer and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22795293A JPH0758486A (en) 1993-08-20 1993-08-20 Printed wiring board having magnetic field and radio wave shielding layer and its manufacture

Publications (1)

Publication Number Publication Date
JPH0758486A true JPH0758486A (en) 1995-03-03

Family

ID=16868844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22795293A Pending JPH0758486A (en) 1993-08-20 1993-08-20 Printed wiring board having magnetic field and radio wave shielding layer and its manufacture

Country Status (1)

Country Link
JP (1) JPH0758486A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358493A (en) * 2000-04-10 2001-12-26 Hitachi Ltd Electromagnetic-wave absorber, its manufacturing method and various applications using the same
US7218266B2 (en) 2000-04-10 2007-05-15 Hitachi, Ltd. Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358493A (en) * 2000-04-10 2001-12-26 Hitachi Ltd Electromagnetic-wave absorber, its manufacturing method and various applications using the same
US7218266B2 (en) 2000-04-10 2007-05-15 Hitachi, Ltd. Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

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