JPH0758485A - Printed wiring board having magnetic field and radio wave shielding layer and its manufacture - Google Patents
Printed wiring board having magnetic field and radio wave shielding layer and its manufactureInfo
- Publication number
- JPH0758485A JPH0758485A JP22795193A JP22795193A JPH0758485A JP H0758485 A JPH0758485 A JP H0758485A JP 22795193 A JP22795193 A JP 22795193A JP 22795193 A JP22795193 A JP 22795193A JP H0758485 A JPH0758485 A JP H0758485A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic field
- electromagnetic wave
- printed wiring
- wiring board
- wave shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板または
ハイブリッドＩＣ基板およびマルチチップモジュール基
板等の製造方法に関し、特に、磁界または電磁波の影響
による回路間のクロストーク等のノイズを防止したプリ
ント配線板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, a hybrid IC substrate, a multi-chip module substrate or the like, and more particularly to a printed wiring which prevents noise such as crosstalk between circuits due to the influence of a magnetic field or electromagnetic waves. The present invention relates to a plate and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】プリント配線板においては、その回路に
電流を流すことにより、磁界の発生に伴い電磁波が発生
する。この磁界は隣接した回路をアンテナ化する作用が
ある。これにより、磁界および電磁波はともにノイズの
発生源となり、機器の内部における回路間にて誤動作や
クロストーク現象を生じさせるばかりでなく、外部機器
に対しても影響を及ぼす。2. Description of the Related Art In a printed wiring board, an electromagnetic wave is generated along with the generation of a magnetic field by passing a current through the circuit. This magnetic field has the effect of turning adjacent circuits into antennas. As a result, both the magnetic field and the electromagnetic wave become sources of noise, which not only causes malfunctions and crosstalk between the circuits inside the device, but also affects external devices.
【０００３】この電磁波の影響を防止するために、従来
は、図３に示すように、絶縁基板３１の面に形成した信
号回路３２及びアース回路３３の面に対し、絶縁層３４
を介して銅粉を主体としたペーストを塗布して電磁波シ
ールド層３５を形成するとともにアース回路３３に接続
し、さらにその上層にオーバーコート３６を形成させる
ことが一般に行われている。In order to prevent the influence of this electromagnetic wave, conventionally, as shown in FIG. 3, an insulating layer 34 is formed on the surface of the signal circuit 32 and the ground circuit 33 formed on the surface of the insulating substrate 31.
It is generally practiced to apply a paste containing copper powder as a main component to form an electromagnetic wave shield layer 35, connect it to the earth circuit 33, and further form an overcoat 36 thereabove.
【０００４】その他の例として、電磁波をシールするこ
とを目的として開発されたもので、特開平４−３５２４
９８号公報に開示された発明が知られている。この発明
のペーストはフェライト粉または鉄合金粉などの高透磁
率を有する軟磁性粉を含有しているものであり、このペ
ーストを用いて、基板面に形成する信号回路の導体を包
むように施工すことにより電磁波をシールして、自己の
回路から発生する電磁波を他の機器に影響することを抑
制するとともに、他の機器からの電磁波の影響を軽減す
ることを目的としたものである。Another example is one developed for the purpose of sealing electromagnetic waves, and is disclosed in Japanese Patent Laid-Open No. Hei 4-3524.
The invention disclosed in Japanese Patent Publication No. 98 is known. The paste of the present invention contains a soft magnetic powder having a high magnetic permeability such as ferrite powder or iron alloy powder, and the paste is used to wrap the conductor of the signal circuit formed on the substrate surface. The purpose of the present invention is to seal electromagnetic waves so as to suppress the influence of electromagnetic waves generated from its own circuit on other devices and reduce the influence of electromagnetic waves from other devices.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記従
来の銅粉を主体とした電磁波シールド層３５では、自己
の回路から発生する磁界を吸収することができないので
磁界の影響によるクロストークが生じやすい。また電磁
波を他の機器に影響することを防止することはできて
も、他の機器からの電磁波の影響を有効に防止すること
が困難である。However, since the conventional electromagnetic wave shield layer 35 mainly made of copper powder cannot absorb the magnetic field generated from its own circuit, crosstalk due to the influence of the magnetic field is likely to occur. Further, although it is possible to prevent the electromagnetic waves from affecting other devices, it is difficult to effectively prevent the effects of the electromagnetic waves from other devices.
【０００６】また、特開平４−３５２４９８号公報に開
示された発明のペーストは、自己の回路から発生する電
磁波および他の機器からの電磁波の影響を抑制するもの
の、完全ではない。また、磁性塗膜の形成方法が導体を
包み込むようにして形成する煩雑な工程であるという問
題がある。Further, the paste of the invention disclosed in Japanese Patent Laid-Open No. 4-352498 suppresses the effects of electromagnetic waves generated from its own circuit and electromagnetic waves from other devices, but is not perfect. There is also a problem that the method of forming the magnetic coating film is a complicated process of forming the magnetic coating film so as to wrap it around the conductor.
【０００７】よって、本発明は上記従来の問題点に鑑み
てなされたものであり、プリント配線板の回路に生じた
磁界や電磁波が、機器内および外部機器に対して影響を
及ぼすことによるクロストーク等のノイズの発生を防止
したプリント配線板と、そのプリント配線板を容易に製
造する方法の提供を目的とする。Therefore, the present invention has been made in view of the above-mentioned problems of the related art, and the crosstalk due to the influence of the magnetic field or the electromagnetic wave generated in the circuit of the printed wiring board on the internal equipment and the external equipment. It is an object of the present invention to provide a printed wiring board in which noise such as noise is prevented and a method for easily manufacturing the printed wiring board.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、プリント配線板の表裏面において、信号
回路を形成した面には絶縁層を介し、または信号回路を
形成していない面には直接にその一部または全面にノイ
ズを防止する磁界・電磁波シールド層を設けたことを特
徴とする。In order to achieve the above object, the present invention provides a front surface and a back surface of a printed wiring board, a surface on which a signal circuit is formed, an insulating layer being interposed, or a surface on which a signal circuit is not formed. Is characterized in that a magnetic field / electromagnetic wave shield layer for preventing noise is directly provided on a part or the entire surface thereof.
【０００９】そして、前記磁界・電磁波シールド層は、
初透磁率μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１
以下の高透磁率磁性体粉、および高導電性の銅粉または
銀粉を適当な混合比率にて含有させたものであり、この
一層のみで磁界および電磁波をシールするものである。The magnetic field / electromagnetic wave shield layer is
Initial permeability μ is 10 2 or more and coercive force Hc [0e] is 1
The following high-permeability magnetic substance powder and highly conductive copper powder or silver powder are contained in an appropriate mixing ratio, and the magnetic field and the electromagnetic wave are sealed by only one layer.
【００１０】また、本発明のプリント配線板の製造に際
しては、高透磁率磁性体粉、および高導電性の銅粉また
は銀粉を適当な混合比率にて含有させたペーストを作成
し、このペーストを用いて信号回路を形成した面には絶
縁層を介し、また信号回路を形成していない面には直接
に塗布し硬化させることにより磁界・電磁波シールド層
の塗膜を形成させる。Further, in manufacturing the printed wiring board of the present invention, a paste containing high-permeability magnetic powder and highly conductive copper powder or silver powder in an appropriate mixing ratio is prepared, and this paste is prepared. A coating for the magnetic field / electromagnetic wave shield layer is formed by directly applying and curing the surface on which the signal circuit is formed through the insulating layer and the surface on which the signal circuit is not formed.
【００１１】[0011]
【作用】本発明の磁界・電磁波シールド層を有するプリ
ント配線板とその製造方法によれば、プリント配線板の
表裏面の所要の部分に磁界・電磁波シールド層を設けた
ことにより、磁界・電磁波シールド層の成分である高透
磁率磁性体が磁界を吸収し、高導電性の銅または銀が電
磁波をシールすることにより、この磁界・電磁波シール
ド層の一層にて磁界および電磁波をシールすることがで
きる。According to the printed wiring board having the magnetic field / electromagnetic wave shield layer of the present invention and the method for manufacturing the same, the magnetic field / electromagnetic wave shield layer is provided by providing the magnetic field / electromagnetic wave shield layer on required portions on the front and back surfaces of the printed wiring board. A layer of high magnetic permeability absorbs the magnetic field, and highly conductive copper or silver seals the electromagnetic wave, so that the magnetic field and electromagnetic wave can be sealed by one layer of this magnetic field / electromagnetic wave shield layer. .
【００１２】[0012]
【実施例１】図１は本発明の実施例１を示す片面プリン
ト配線板の断面図である。このプリント配線板は基板１
の面に信号回路２及びアース回路３を形成しており、そ
の信号回路２の所要の部分に絶縁層４を介して磁界・電
磁波シールド層５を施すとともに磁界・電磁波シールド
層５をアース回路３に接続し、また信号回路を形成して
いない基板１の裏面には、その所要の部分に磁界・電磁
波シールド層６を直接に施し、さらに磁界・電磁波シー
ルド層５，６の上層にオーバーコート層７，８を形成し
たものである。Embodiment 1 FIG. 1 is a sectional view of a single-sided printed wiring board showing Embodiment 1 of the present invention. This printed wiring board is substrate 1
The signal circuit 2 and the ground circuit 3 are formed on the surface of the signal circuit 2, and the magnetic field / electromagnetic wave shield layer 5 is applied to a required portion of the signal circuit 2 through the insulating layer 4 and the magnetic field / electromagnetic wave shield layer 5 is connected to the ground circuit 3. The magnetic field / electromagnetic wave shield layer 6 is directly applied to a required portion of the back surface of the substrate 1 which is connected to the magnetic field / electromagnetic wave shield layers 5 and 6, and an overcoat layer. 7 and 8 are formed.
【００１３】[0013]
【実施例２】図２は本発明の実施例２を示す両面プリン
ト配線板の断面図である。このプリント配線板は基板１
１の両面にそれぞれ信号回路１２，１３及びアース回路
１４，１５を形成し、また両面の所要の信号回路をスル
ーホールメッキ１７を介して電気的に接続するスルーホ
ール１６が設けられている。この両面プリント配線板の
信号回路１２，１３の面に対して絶縁層１８，１９を介
して磁界・電磁波シールド層２０，２１を形成するとと
もに磁界・電磁波シールド層２０，２１をアース回路１
４，１５に電気的に接続し、さらに磁界・電磁波シール
ド層２０，２１の上層にオーバーコート層２２，２３を
形成したものである。[Embodiment 2] FIG. 2 is a sectional view of a double-sided printed wiring board showing Embodiment 2 of the present invention. This printed wiring board is substrate 1
The signal circuits 12 and 13 and the ground circuits 14 and 15 are formed on both surfaces of 1, respectively, and through holes 16 are provided for electrically connecting the required signal circuits on both surfaces through through hole plating 17. Magnetic field / electromagnetic wave shield layers 20, 21 are formed on the surfaces of the signal circuits 12, 13 of the double-sided printed wiring board via insulating layers 18, 19 and the magnetic field / electromagnetic wave shield layers 20, 21 are connected to the ground circuit 1.
4 and 15 are electrically connected, and overcoat layers 22 and 23 are further formed on the magnetic field / electromagnetic wave shield layers 20 and 21.
【００１４】前記実施例１及び２の片面プリント配線板
または両面プリント配線板の面に形成した磁界・電磁波
シールド層５，６または２０，２１は、初透磁率μが１
０2以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の高透磁率
磁性体粉、および高導電性の銅粉または銀粉を適当な比
率にて混合したものであり、導電性を有するものであ
る。The magnetic field / electromagnetic wave shield layers 5, 6 or 20, 21 formed on the surface of the single-sided printed wiring board or the double-sided printed wiring board of Examples 1 and 2 have an initial permeability μ of 1.
0 2 or more, and are those coercive force Hc [0e] was mixed 1 following high permeability magnetic powder, and a highly conductive copper powder or silver powder in appropriate proportions, and has a conductivity .
【００１５】前記高透磁率磁性体には特性の異なる多く
の種類のものがある。そしてこれらの磁性体は、例え
ば、テレビ、オーディオおよびＯＡ機器等に要求される
性能に対して最もよい効果が得られる特性を有する種類
のものを選択しなければならない。There are many kinds of high permeability magnetic materials having different characteristics. For these magnetic materials, it is necessary to select a magnetic material having a characteristic that the best effect can be obtained with respect to the performance required for, for example, televisions, audio equipment and OA equipment.
【００１６】これらの機器の特性において、例えば、低
周波領域ではＭｎＺｎフェライト、高周波領域ではＮｉ
Ｚｎフェライト、マイクロ波領域ではＭｎＭｇフェライ
ト等を用いることにより効果的に磁界を吸収することが
できる。The characteristics of these devices are, for example, MnZn ferrite in the low frequency region and Ni in the high frequency region.
A magnetic field can be effectively absorbed by using Zn ferrite or MnMg ferrite in the microwave region.
【００１７】特に、プリント配線板においては初透磁率
μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の高
透磁率材料を用いることが望ましい。そして、磁性体は
強磁性体ではなく低保磁力のものが適している。なお、
強磁性体の場合は保磁力が強いので、逆にクロストーク
を助長してしまう恐れがある。In particular, in a printed wiring board, it is desirable to use a high magnetic permeability material having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [0e] of 1 or less. Further, the magnetic material is not a ferromagnetic material but a low coercive force is suitable. In addition,
In the case of a ferromagnetic material, it has a strong coercive force, which may adversely affect crosstalk.
【００１８】即ち、磁界を吸収して消磁する性質のも
の、例えば、ＭｎＺｎフェライト、高純Ｆｅ、ＦｅＮｉ
Ｍｏ（パーマロイ）、センダスト等の高透磁率のものが
適している。That is, those having a property of absorbing a magnetic field and demagnetizing, for example, MnZn ferrite, highly pure Fe, FeNi
Materials with high magnetic permeability such as Mo (permalloy) and sendust are suitable.
【００１９】また、磁性体の初透磁率μが１０2 以下、
かつ保磁力Ｈｃ〔０ｅ〕が１以上のものは、磁界の吸収
能力が劣り、これを使用した場合はノイズを完全に防止
することができない。The initial permeability μ of the magnetic material is 10 2 or less,
In addition, if the coercive force Hc [0e] is 1 or more, the magnetic field absorption capability is poor, and if this is used, noise cannot be completely prevented.
【００２０】以上の各種特性の高透磁率材料のなかで、
本実施例のプリント配線板の製造に際しては、各機器に
要求される性能毎に最も効果的に特性を発揮するする種
類ののものを選び、この高透磁率磁性体と銅粉または銀
粉を適当な混合比率にて含有させたペーストを作成し
て、このペーストを信号回路２または１２，１３を形成
した面のそれぞれに絶縁層４または１８，１９を介して
塗布すると同時にアース回路３または１４，１５に電気
的に接続し、また信号回路を形成していない片面プリン
ト配線板の裏面には直接に塗布し、その後硬化させて磁
界・電磁波シールド層５，６または２０，２１の塗膜を
形成させる。なお、磁界・電磁波シールド層５，６また
は２０，２１の塗膜は導電性を有するのでその上層にオ
ーバーコートの層７，８または２２，２３を設けて絶縁
保護する。Among the high magnetic permeability materials having the above various characteristics,
In the production of the printed wiring board of this embodiment, a type that exhibits the most effective characteristics for each performance required for each device is selected, and this high magnetic permeability magnetic material and copper powder or silver powder are suitable. A paste containing various mixing ratios is prepared, and the paste is applied to each of the surfaces on which the signal circuits 2 or 12, 13 are formed through the insulating layers 4 or 18, 19, and at the same time the ground circuit 3 or 14, 15 is directly connected to the back surface of a single-sided printed wiring board on which no signal circuit is formed, and then cured to form a coating film for the magnetic field / electromagnetic wave shield layers 5, 6 or 20, 21. Let Since the coating films of the magnetic field / electromagnetic wave shield layers 5, 6 or 20, 21 are conductive, an overcoat layer 7, 8 or 22, 23 is provided on the coating film for insulation protection.
【００２１】以上により、磁界・電磁波シールド層を形
成する高透磁率磁性体粉が磁界を吸収し、高導電性の銅
粉または銀粉が電磁波をシールするので、この磁界・電
磁波シールド層の一層を形成するだけで磁界と電磁波の
両者をシールすることができる。As described above, since the high permeability magnetic substance powder forming the magnetic field / electromagnetic wave shield layer absorbs the magnetic field and the highly conductive copper powder or silver powder seals the electromagnetic wave, one layer of the magnetic field / electromagnetic wave shield layer is formed. Both the magnetic field and the electromagnetic wave can be sealed simply by forming them.
【００２２】[0022]
【発明の効果】本発明の磁界・電磁波シールド層を有す
るプリント配線板およびその製造方法によれば、プリン
ト配線板の表裏面の所要の部分に磁界・電磁波シールド
層の塗膜を形成することにより、信号回路の導体から発
生する磁界および電磁波を、磁界・電磁波シールド層の
１層だけでシールすることができる。According to the printed wiring board having the magnetic field / electromagnetic wave shield layer of the present invention and the method for manufacturing the same, by forming the coating film of the magnetic field / electromagnetic wave shield layer on required portions on the front and back surfaces of the printed wiring board. The magnetic field and electromagnetic wave generated from the conductor of the signal circuit can be sealed with only one magnetic field / electromagnetic wave shield layer.
【００２３】従って、磁界および電磁波のそれぞれのシ
ールド層を別々に施す必要がないために、工数を低減す
ることができる。Therefore, since it is not necessary to separately provide the shield layers for the magnetic field and the electromagnetic wave, the number of steps can be reduced.
【００２４】これにより、機器内および外部機器に対し
て磁界や電磁波が影響を及ぼすことを防止するととも
に、外部機器からの影響も防止するので、クロストーク
現象等のノイズの発生を防止することができる。As a result, it is possible to prevent the magnetic field and the electromagnetic wave from affecting the inside and the outside of the device, and also prevent the influence from the external device, so that it is possible to prevent the occurrence of noise such as a crosstalk phenomenon. it can.
【図１】本発明の実施例１を示す磁界・電磁波シールド
層を有する片面プリント配線板の断面図。FIG. 1 is a sectional view of a single-sided printed wiring board having a magnetic field / electromagnetic wave shield layer according to a first embodiment of the present invention.
【図２】本発明の実施例２を示す磁界・電磁波シールド
層を有する両面プリント配線板の断面図。FIG. 2 is a sectional view of a double-sided printed wiring board having a magnetic field / electromagnetic wave shield layer according to a second embodiment of the present invention.
【図３】従来のシールド層を有するプリント配線板の断
面図。FIG. 3 is a cross-sectional view of a conventional printed wiring board having a shield layer.
１，１１ 基板 ２，１２，１３ 信号回路 ３，１４，１５ アース回路 ４，１８，１９ 絶縁層 ５，６，２０，２１ 磁界・電磁波シールド層 ７，８，２２，２３ オーバーコート １６ スルーホール １７ スルーホールメッキ 1, 11 Substrate 2, 12, 13 Signal circuit 3, 14, 15 Ground circuit 4, 18, 19 Insulating layer 5, 6, 20, 21 Magnetic field / electromagnetic wave shield layer 7, 8, 22, 23 Overcoat 16 Through hole 17 Through hole plating
───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 純一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 西山 宜男 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 鯉沼 祐一 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Ichikawa 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture Japan CMC Co., Ltd. (72) Yoshio Nishiyama 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK shares In-house (72) Inventor Yuichi Koinuma 1106 Fujikubo Miyoshi-cho, Iruma-gun, Saitama Japan CMK Corporation
Claims (3)
回路を形成した面には絶縁層を介し、または信号回路を
形成していない面には直接にその一部または全面にノイ
ズを防止する磁界・電磁波シールド層を設けるととも
に、前記磁界・電磁波シールド層の上層にオーバーコー
ト層を設け、前記磁界・電磁波シールド層の一層のみで
磁界および電磁波をシールすることを特徴とする磁界・
電磁波シールド層を有するプリント配線板。1. A magnetic field for preventing noise on part or all of the front and back surfaces of a printed wiring board, with an insulating layer on the surface on which the signal circuit is formed or directly on the surface on which the signal circuit is not formed. A magnetic field characterized by providing an electromagnetic wave shield layer and an overcoat layer on the magnetic field / electromagnetic wave shield layer, and sealing the magnetic field and the electromagnetic wave with only one of the magnetic field / electromagnetic wave shield layer.
A printed wiring board having an electromagnetic wave shield layer.
率μが１０2 以上、かつ保磁力Ｈｃ〔０ｅ〕が１以下の
高透磁率磁性体粉、および高導電性の銅粉または銀粉を
適当な混合比率にて含有させてなるものであることを特
徴とする請求項１記載の磁界・電磁波シールド層を有す
るプリント配線板。2. The magnetic field / electromagnetic wave shield layer is made of a high-permeability magnetic substance powder having an initial magnetic permeability μ of 10 2 or more and a coercive force Hc [0e] of 1 or less, and highly conductive copper powder or silver powder. The printed wiring board having a magnetic field / electromagnetic wave shield layer according to claim 1, characterized in that it is contained in an appropriate mixing ratio.
または銀粉を適当な混合比率にて含有させたペーストを
作成し、このペーストを用いてプリント配線板表裏面の
所要の信号回路の面に絶縁層を介し、または信号回路を
形成していない面には直接にその一部または全面に塗布
し、硬化させて磁界・電磁波シールド層を形成させ、さ
らに前記磁界・電磁波シールド層の上層にオーバーコー
ト層を設けることによりプリント配線板を製造すること
を特徴とする磁界・電磁波シールド層を有するプリント
配線板の製造方法。3. A paste containing high-permeability magnetic powder and high-conductivity copper powder or silver powder in an appropriate mixing ratio is prepared, and this paste is used to form a required signal circuit on the front and back surfaces of a printed wiring board. Through the insulating layer, or directly on the surface where the signal circuit is not formed, on a part or the whole of the surface, and cured to form a magnetic field / electromagnetic wave shield layer. A method for producing a printed wiring board having a magnetic field / electromagnetic wave shield layer, comprising producing an overcoat layer as an upper layer to produce a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22795193A JPH0758485A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic field and radio wave shielding layer and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22795193A JPH0758485A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic field and radio wave shielding layer and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0758485A true JPH0758485A (en) | 1995-03-03 |
Family
ID=16868832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22795193A Pending JPH0758485A (en) | 1993-08-20 | 1993-08-20 | Printed wiring board having magnetic field and radio wave shielding layer and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758485A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1143774A2 (en) * | 2000-04-04 | 2001-10-10 | Tokin Corporation | Wiring board comprising granular magnetic film |
| WO2021213051A1 (en) * | 2020-04-23 | 2021-10-28 | 京东方科技集团股份有限公司 | Circuit board and method for preparing same, and electronic device |
-
1993
- 1993-08-20 JP JP22795193A patent/JPH0758485A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1143774A2 (en) * | 2000-04-04 | 2001-10-10 | Tokin Corporation | Wiring board comprising granular magnetic film |
| EP1143774A3 (en) * | 2000-04-04 | 2002-02-27 | Tokin Corporation | Wiring board comprising granular magnetic film |
| US6653573B2 (en) | 2000-04-04 | 2003-11-25 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
| US6919772B2 (en) | 2000-04-04 | 2005-07-19 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
| US6953899B1 (en) | 2000-04-04 | 2005-10-11 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
| US6956173B2 (en) | 2000-04-04 | 2005-10-18 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
| CN100336423C (en) * | 2000-04-04 | 2007-09-05 | Nec东金株式会社 | Circuit board consisting of grain structure magnetic film |
| WO2021213051A1 (en) * | 2020-04-23 | 2021-10-28 | 京东方科技集团股份有限公司 | Circuit board and method for preparing same, and electronic device |
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