JPH0755825Y2 - 熱放散型ブスバーの接続部 - Google Patents
熱放散型ブスバーの接続部Info
- Publication number
- JPH0755825Y2 JPH0755825Y2 JP1987050521U JP5052187U JPH0755825Y2 JP H0755825 Y2 JPH0755825 Y2 JP H0755825Y2 JP 1987050521 U JP1987050521 U JP 1987050521U JP 5052187 U JP5052187 U JP 5052187U JP H0755825 Y2 JPH0755825 Y2 JP H0755825Y2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- heat dissipation
- connection part
- dissipation type
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 11
- 239000003973 paint Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009500 colour coating Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Installation Of Bus-Bars (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050521U JPH0755825Y2 (ja) | 1987-04-02 | 1987-04-02 | 熱放散型ブスバーの接続部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050521U JPH0755825Y2 (ja) | 1987-04-02 | 1987-04-02 | 熱放散型ブスバーの接続部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63157165U JPS63157165U (en, 2012) | 1988-10-14 |
| JPH0755825Y2 true JPH0755825Y2 (ja) | 1995-12-20 |
Family
ID=30873961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987050521U Expired - Lifetime JPH0755825Y2 (ja) | 1987-04-02 | 1987-04-02 | 熱放散型ブスバーの接続部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755825Y2 (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012038563A (ja) * | 2010-08-06 | 2012-02-23 | Auto Network Gijutsu Kenkyusho:Kk | 電気的接続構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738534U (en, 2012) * | 1980-08-14 | 1982-03-01 |
-
1987
- 1987-04-02 JP JP1987050521U patent/JPH0755825Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63157165U (en, 2012) | 1988-10-14 |
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