JPH0750821B2 - Flexible board connector - Google Patents

Flexible board connector

Info

Publication number
JPH0750821B2
JPH0750821B2 JP4254046A JP25404692A JPH0750821B2 JP H0750821 B2 JPH0750821 B2 JP H0750821B2 JP 4254046 A JP4254046 A JP 4254046A JP 25404692 A JP25404692 A JP 25404692A JP H0750821 B2 JPH0750821 B2 JP H0750821B2
Authority
JP
Japan
Prior art keywords
connector portion
film
connector
thickness
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4254046A
Other languages
Japanese (ja)
Other versions
JPH0685420A (en
Inventor
浩二 三井
伸二 水野
Original Assignee
帝国通信工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 帝国通信工業株式会社 filed Critical 帝国通信工業株式会社
Priority to JP4254046A priority Critical patent/JPH0750821B2/en
Publication of JPH0685420A publication Critical patent/JPH0685420A/en
Publication of JPH0750821B2 publication Critical patent/JPH0750821B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フレキシブル基板の端
部に設けられるコネクタ部に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector portion provided at an end portion of a flexible board.

【0002】[0002]

【従来技術】従来、フレキシブル基板を他の電子部品に
接続するには、フレキシブル基板の端部に導体パターン
を引き出してコネクタ部を形成しておき、これを他の電
子部品に取り付けられたメス側のコネクタに差し込むこ
とによって行なわれている。
2. Description of the Related Art Conventionally, in order to connect a flexible board to another electronic component, a conductor pattern is drawn out from an end of the flexible board to form a connector portion, which is then attached to another electronic component on a female side. This is done by plugging it into the connector.

【0003】図11はこの種の従来のフレキシブル基板
のコネクタ部81の部分を示す図であり、同図(a)は
斜視図、同図(b)は平面図、同図(c)は同図(b)
のa−a断面図である。
11A and 11B are views showing a portion of a connector portion 81 of a conventional flexible substrate of this type. FIG. 11A is a perspective view, FIG. 11B is a plan view, and FIG. Figure (b)
It is a sectional view taken along line aa of FIG.

【0004】同図に示すようにこのコネクタ部81は、
合成樹脂製のフイルム83上に導体パターン85を設け
るとともに、該フイルム83の裏面に、接着剤87によ
って補強板89を貼り付けて構成されている。ここでこ
の補強板89は合成樹脂製の撓みにくい板で構成されて
いる。また導体パターン85の上には、カーボン皮膜8
5aが印刷されている。
As shown in the figure, the connector 81 is
A conductive pattern 85 is provided on a synthetic resin film 83, and a reinforcing plate 89 is attached to the back surface of the film 83 with an adhesive 87. Here, the reinforcing plate 89 is made of a synthetic resin plate which is not easily bent. The carbon film 8 is formed on the conductor pattern 85.
5a is printed.

【0005】ここで補強板89を貼り付けるのは、フイ
ルム83は薄くて撓み易いため、補強板89を貼り付け
ないままでは、このコネクタ部81をメス側のコネクタ
にうまく接続できないからである。このためフレキシブ
ル基板のコネクタ部81には補強板89が必ず必要であ
る。
The reinforcing plate 89 is attached here because the film 83 is thin and easily bent, so that the connector portion 81 cannot be successfully connected to the female connector without attaching the reinforcing plate 89. For this reason, the connector 81 of the flexible substrate always requires the reinforcing plate 89.

【0006】また図12は前記従来のコネクタ部81を
製造する方法を示す図である。同図に示すように、コネ
クタ部81を製造するには、大きなフイルム83上に多
数組の導体パターン85とカーボン皮膜85aを印刷し
ておき、フイルム83の下面に接着剤を介して長尺の補
強板89を貼り付け、これをプレスカットして前記コネ
クタ部81の外形を打ち抜く。
FIG. 12 is a diagram showing a method of manufacturing the conventional connector portion 81. As shown in the figure, in order to manufacture the connector portion 81, a large number of sets of conductor patterns 85 and a carbon film 85a are printed on a large film 83, and a long surface is formed on the lower surface of the film 83 with an adhesive. A reinforcing plate 89 is attached, and this is press cut to punch out the outer shape of the connector portion 81.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記従来
のコネクタ部81においては、接着剤87の外周がフイ
ルム83と補強板89の間から外に露出しているため、
該接着剤87の露出した部分cにゴミが付着し易い。そ
してゴミが付着したままのコネクタ部81をメス側のコ
ネクタに挿入した場合、該ゴミが接点部等に付着し、こ
のため両者間に接続不良が生じてしまう恐れがあった。
However, in the above-mentioned conventional connector portion 81, since the outer periphery of the adhesive 87 is exposed outside between the film 83 and the reinforcing plate 89,
Dust tends to adhere to the exposed portion c of the adhesive 87. Then, when the connector portion 81 with the dust adhered thereto is inserted into the female connector, the dust adheres to the contact portion or the like, which may cause a connection failure between the two.

【0008】また図12に示す方法でプレスカットした
場合、該プレスカット用の歯に接着剤が付着し、たえず
これをふき取る手間がかかり、製造コストのアップにも
つながる。
Further, when press-cutting is performed by the method shown in FIG. 12, an adhesive agent adheres to the press-cutting teeth, and it takes time and effort to wipe it off, leading to an increase in manufacturing cost.

【0009】本発明は上述の点に鑑みてなされたもので
あり、その目的は、接着剤を用いなくてもコネクタ部の
補強ができるフレキシブル基板のコネクタ部を提供する
ことにある。
The present invention has been made in view of the above points, and an object thereof is to provide a connector portion of a flexible substrate which can reinforce the connector portion without using an adhesive.

【0010】[0010]

【課題を解決するための手段】上記問題点を解決するた
め本発明は、合成樹脂製のフイルム上に導体パターンを
形成し、該フイルムの端部又は端部近傍にまで導体パタ
ーンの一部を引き出してコネクタ部を形成した構造のフ
レキシブル基板のコネクタ部において、前記コネクタ部
を構成するフイルムの裏面の所定範囲に、紫外線硬化型
塗料を少なくとも2層以上塗布して硬化せしめ、且つ最
上層の紫外線硬化型塗料は、他の層の紫外線硬化型塗料
に比べてその厚みを薄くすることとした。
In order to solve the above-mentioned problems, the present invention forms a conductor pattern on a film made of synthetic resin, and forms a part of the conductor pattern up to or near the end of the film. In a connector portion of a flexible substrate having a structure in which a connector portion is drawn out to form a connector portion , an ultraviolet-curing type is provided in a predetermined range on the back surface of the film forming the connector portion.
Apply at least two layers of paint to cure and
The UV curable paint for the upper layer is the UV curable paint for the other layers.
We decided to make the thickness thinner than that of.

【0011】[0011]

【作用】前記紫外線硬化型塗料は、コネクタ部を構成す
るフイルムの裏面に厚く塗布され硬化されるので、フレ
キシブル基板のコネクタ部の補強が図れる。しかも塗布
・硬化された紫外線硬化型塗料は何ら接着性を有さない
ので、これにゴミが付着することはない。また紫外線硬
化型塗料は、他の通常の塗料と異なり、溶剤で溶かされ
ていないので、その厚塗りが容易に行える。従って少な
い層でも十分な厚みが得られ、その分製造時間の短縮が
図れる。 さらに最上層の紫外線硬化型塗料の厚みを、他
の層の紫外線硬化型塗料の厚みに比べて薄くしたので、
たとえ厚塗りするために最上層以外の紫外線硬化型塗料
の粘度を大きくしてその表面を荒くしても、最上層の紫
外線硬化型塗料の粘度を小さくできその表面を容易に滑
らかにすることができる。
The ultraviolet-curable coating material is thickly applied to the back surface of the film forming the connector portion and cured, so that the connector portion of the flexible substrate can be reinforced. Moreover, since the applied and cured UV-curable paint has no adhesiveness, dust does not adhere to it. UV hard
Unlike other normal paints, chemical type paints are dissolved in a solvent.
Since it is not, the thick coating can be done easily. Therefore few
Sufficient thickness can be obtained even with a thick layer, which shortens the manufacturing time accordingly.
Can be achieved. In addition, change the thickness of the UV curable coating on the top layer to
Since it was made thinner than the thickness of the UV curable paint of the layer,
UV-curable paint other than the top layer for thick coating
Even if the surface of the surface is roughened by increasing the viscosity of
The viscosity of the external-curable coating can be reduced and the surface can be easily slipped.
You can make it easy.

【0012】[0012]

【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。図1乃至図5は、本発明の第1実施例にか
かるフレキシブル基板のコネクタ部を製造する工程を示
す図であり、それぞれ(a)は平面図、(b)は側断面
図(図1(a)のA−A断面図)である。
Embodiments of the present invention will now be described in detail with reference to the drawings. 1 to 5 are views showing a process of manufacturing a connector portion of a flexible substrate according to a first embodiment of the present invention, in which (a) is a plan view and (b) is a side sectional view (see FIG. It is AA sectional drawing of a).

【0013】このフレキシブル基板のコネクタ部を製造
するには、まず図1に示すように、合成樹脂フイルム1
0上に7本の導体パターン11をスクリーン印刷によっ
て印刷する。ここでこのフイルム10としては、板厚1
00μmのポリエチレンテレフタレートを用いる。
In order to manufacture the connector portion of this flexible substrate, first, as shown in FIG. 1, a synthetic resin film 1 is used.
The seven conductor patterns 11 are printed on the 0 by screen printing. Here, the film thickness 1 is 1
00 μm polyethylene terephthalate is used.

【0014】なおこの図面には、導体パターン11の端
部しか示されていないが、実際にはそれ以外の部分にお
いてこの導体パターン11は図示しないフレキシブル基
板の回路を構成している。
Although only the end portion of the conductor pattern 11 is shown in this drawing, the conductor pattern 11 actually constitutes a circuit of a flexible substrate (not shown) in other portions.

【0015】次に図2に示すように、各導体パターン1
1の端部上を覆うように、カーボン皮膜13をスクリー
ン印刷する。
Next, as shown in FIG. 2, each conductor pattern 1
The carbon film 13 is screen-printed so as to cover the end portion of 1.

【0016】次に図3に示すように、7本の導体パター
ン11のカーボン皮膜13を印刷した部分の裏面側に、
1層目のUV硬化型塗料(紫外線硬化型塗料)15を約
150μm程度の厚さになるように、1回のスクリーン
印刷によって厚塗りする。なお1回のスクリーン印刷で
上記厚みが得られるように、UV硬化型塗料15の粘度
やスクリーンのメッシュサイズ等を調整する。そしてこ
のUV硬化型塗料15に紫外線を照射してこれを硬化さ
せる。なおUV硬化型塗料は、他の通常の塗料と異な
り、溶剤で溶かされていないので、その厚塗りが容易に
行え、また溶剤で溶かされた通常の塗料の場合、その硬
化時間に通常数分から数十分かかるが、UV硬化型塗料
の場合は、紫外線を照射することで通常10秒程度で硬
化するので、これらの点から製造時間の短縮化が図れ
る。
Next, as shown in FIG. 3, on the back surface side of the portion where the carbon film 13 of the seven conductor patterns 11 is printed,
The first layer of UV curable coating material (ultraviolet curable coating material) 15 is thickly applied by one screen printing so as to have a thickness of about 150 μm. The viscosity of the UV curable coating material 15, the mesh size of the screen, and the like are adjusted so that the above thickness can be obtained by one screen printing. Then, the UV curable coating material 15 is irradiated with ultraviolet rays to be cured. UV-curable paint is different from other ordinary paints.
Since it is not dissolved in a solvent, its thick coating is easy
In the case of normal paint that can be made and is dissolved in a solvent, its hardness
UV curing type coating takes a few minutes to tens of minutes
In the case of, it is usually hard for about 10 seconds by irradiating with ultraviolet rays.
From these points, it is possible to shorten the manufacturing time.
It

【0017】次に図4に示すように、前記1層目のUV
硬化型塗料15の上に2層目のUV硬化型塗料17を約
50μm程度の厚さになるように、1回のスクリーン印
刷によって厚塗りする。なおこの場合も1回のスクリー
ン印刷で上記厚みが得られるように、UV硬化型塗料1
7の粘度やスクリーンのメッシュサイズ等を調整する。
そしてこのUV硬化型塗料17に紫外線を照射してこれ
を硬化させる。これによってUV硬化型塗料の厚みを約
200μmとする。
Next, as shown in FIG. 4, the UV of the first layer is
A second layer of UV curable paint 17 is thickly applied onto the curable paint 15 by one screen printing so as to have a thickness of about 50 μm. In this case as well, the UV curable coating material 1 is used so that the above thickness can be obtained by one screen printing.
Adjust the viscosity of 7 and the mesh size of the screen.
Then, the UV curable coating material 17 is irradiated with ultraviolet rays to be cured. As a result, the thickness of the UV curable coating material is set to about 200 μm.

【0018】なお1層目と2層目のUV硬化型塗料1
5,17の厚みは同一(例えばいずれも100μm)と
してもよいが、上記実施例において1層目を厚くし、2
層目を薄くしたのは以下の理由による。
The first and second layers of UV-curable coating material 1
Although the thicknesses of 5 and 17 may be the same (for example, 100 μm in each case), the thickness of the first layer is increased in the above embodiment,
The reason for thinning the layers is as follows.

【0019】即ち、UV硬化型塗料の厚みを厚くしよう
とすると、その粘度を大きくするとともに、印刷するス
クリーンのメッシュサイズを荒くしなければならない。
しかしながらこのようにすると、その厚みは厚くできる
が、その表面は荒くなってしまう。そこで、1層目のU
V硬化型塗料15の粘度を2層目のUV硬化型塗料17
の粘度よりも大きくしてその厚みを厚くするとともに、
2層目のUV硬化型塗料17の粘度を小さくし且つスク
リーンのメッシュサイズを細かくして、これによって厚
みは薄いがその表面を滑らかにするようにしたのであ
る。
That is, if the thickness of the UV curable coating is to be increased, its viscosity must be increased and the mesh size of the screen to be printed must be increased.
However, in this way, the thickness can be increased, but the surface becomes rough. Therefore, U of the first layer
The viscosity of the V-curable paint 15 is adjusted to the second layer of the UV-curable paint 17
It is made thicker than the viscosity of to increase its thickness,
The viscosity of the UV curable coating material 17 of the second layer is made small and the mesh size of the screen is made fine so that the surface is smooth although the thickness is thin.

【0020】次に図5に示すように、フイルム10と硬
化したUV硬化型塗料15,17をプレス加工によって
カットすることによって、コネクタ部1を抜き取る。な
おこのプレス加工によって図示しない導体パターン11
の部分によって構成されるフレキシブル基板も同時にフ
イルム10から抜き取られる。
Next, as shown in FIG. 5, the film 10 and the cured UV-curable coating materials 15 and 17 are cut by pressing to remove the connector portion 1. The conductor pattern 11 (not shown) is formed by this press working.
At the same time, the flexible substrate constituted by the part is removed from the film 10.

【0021】以上のように厚塗りして硬化したUV硬化
型塗料は十分補強板としての効果を有し、上記実施例の
場合(UV硬化型塗料の厚みを200μmとし、総厚3
00μmとしたもの)は前記図6に示す従来例(補強板
89の厚みを188μmとし、総厚を330μmとした
もの)と同等の強度となることを確認した。また硬化し
たUV硬化型塗料は何ら粘着性を有しないので、これに
ゴミが付着することはない。
The UV-curable coating which is thickly applied and cured as described above has a sufficient effect as a reinforcing plate, and in the case of the above-mentioned embodiment (the thickness of the UV-curable coating is 200 μm, the total thickness is 3).
It has been confirmed that the strength of the one having a thickness of 00 μm) is the same as that of the conventional example shown in FIG. 6 (having a thickness of the reinforcing plate 89 of 188 μm and a total thickness of 330 μm). Further, since the cured UV-curable coating material has no tackiness, dust does not adhere to it.

【0022】次に図6乃至図10は、本発明の第2実施
例にかかるフレキシブル基板のコネクタ部を製造する工
程を示す図であり、それぞれ(a)は平面図、(b)は
側断面図(図6(a)のB−B断面図)である。
Next, FIGS. 6 to 10 are views showing a process of manufacturing a connector portion of a flexible board according to a second embodiment of the present invention, in which (a) is a plan view and (b) is a side sectional view. It is a figure (BB sectional drawing of Fig.6 (a)).

【0023】このフレキシブル基板のコネクタ部を製造
するには、まず図6に示すように、フイルム20上に8
本の導体パターン21をスクリーン印刷によって印刷す
ると同時に、該8本の導体パターン21の端部にこれら
導体パターン21と全て接続される大面積の導体ランド
部23を印刷する。そして導体パターン21上には絶縁
皮膜22を印刷しておく(但し以下の図において絶縁皮
膜22の記載は省略する)。
In order to manufacture the connector portion of this flexible board, first, as shown in FIG.
The conductor patterns 21 of the book are printed by screen printing, and at the same time, a large-area conductor land portion 23 connected to the conductor patterns 21 is printed on the end portions of the eight conductor patterns 21. Then, the insulating film 22 is printed on the conductor pattern 21 (however, the description of the insulating film 22 is omitted in the following figures).

【0024】次に図7に示すように、該導体ランド部2
3の上にカーボン皮膜25を印刷する。なお図面上導体
ランド部23とカーボン皮膜25の厚みをフイルム20
の厚みと略同じに示したが、実際は、フイルム20に比
べてかなり薄いものである。
Next, as shown in FIG. 7, the conductor land portion 2
A carbon film 25 is printed on the surface 3. In the drawing, the thickness of the conductor land portion 23 and the carbon film 25 is set to the film 20.
The thickness of the film 20 is substantially the same as that of the film 20, but in reality, it is considerably thinner than the film 20.

【0025】次に図8に示すように、フイルム20の下
面に、前記第1実施例と同様に、2層のUV硬化型塗料
27,28を厚塗り・硬化する。
Next, as shown in FIG. 8, two layers of UV curable coating materials 27 and 28 are thickly applied and cured on the lower surface of the film 20, as in the first embodiment.

【0026】次に図9に示すように、フイルム20と硬
化したUV硬化型塗料27,28をプレス加工によって
一点鎖線の部分でカットすることによって、図10に示
すようなコネクタ部2を抜き取る。このときカットした
コネクタ部2中には、7本のスリット29が同時にカッ
トされ、該スリット29によって各カーボン皮膜25及
びその下の導体ランド部23が8つに分離されるととも
に、分離した各カーボン皮膜25及び導体ランド部23
がそれぞれ導体パターン21に接続される。
Next, as shown in FIG. 9, the film 20 and the cured UV-curable coatings 27 and 28 are cut at the portions indicated by the alternate long and short dash line by press working to remove the connector portion 2 as shown in FIG. Seven slits 29 are cut at the same time in the connector portion 2 cut at this time. The slits 29 separate each carbon film 25 and the conductor land portion 23 therebelow into eight, and each separated carbon Film 25 and conductor land portion 23
Are respectively connected to the conductor pattern 21.

【0027】このように構成しても、このコネクタ部2
の先端部は連結部30によって連結されており、しかも
その裏面にはUV硬化型塗料27,28が厚塗り・硬化
されているので、コネクタ部2の十分な補強が図れる。
Even with this structure, the connector portion 2
The tip portions of are connected by the connecting portion 30, and the UV curable coatings 27 and 28 are thickly applied and cured on the back surface thereof, so that the connector portion 2 can be sufficiently reinforced.

【0028】またこの実施例においては、コネクタ部2
の外形と各スリット29が1度のプレスカットによって
形成されるので、その寸法精度が確実に一定であり、こ
のため分割した各スリット29間、及びコネクタ部2の
幅方向両端から各スリット29までの距離は一定であ
り、またたとえこのコネクタ部2が小型化されても、十
分これに対応できる。
Further, in this embodiment, the connector portion 2
Since the outer shape of each of the slits and each slit 29 are formed by a single press cut, the dimensional accuracy is surely constant. Therefore, between the divided slits 29 and from the widthwise both ends of the connector portion 2 to each slit 29. The distance is constant, and even if the connector portion 2 is downsized, it can sufficiently cope with it.

【0029】なおこの実施例においては上記第1実施例
と相違して、切り分けられた導体ランド部23(及びカ
ーボン皮膜25)の先端がコネクタ部2の先端まで設け
られてはいない(コネクタ部2の先端には連結部30が
ある)。ここで図13はコネクタ部2を挿入するメスコ
ネクタ50を示す図であり、同図(a)はメスコネクタ
50単独の平面図、同図(b)は同図(a)のH−H断
面図、同図(c)はメスコネクタ50にコネクタ部2を
挿入したときの断面図である。同図に示すように、メス
コネクタ50内の金属接点51は、コネクタ部2の先端
部分に接触するのではなく、該先端から所定長さ隔てた
位置hで接触する。従って、第2実施例のようにコネク
タ部2の先端まで導体ランド部23(及びカーボン皮膜
25)が設けられていなくても何ら問題ない。
In this embodiment, unlike the first embodiment, the tip end of the conductor land portion 23 (and the carbon film 25) that has been cut is not provided up to the tip end of the connector portion 2 (connector portion 2). There is a connecting portion 30 at the tip of the). Here, FIG. 13 is a view showing a female connector 50 into which the connector portion 2 is inserted. FIG. 13A is a plan view of the female connector 50 alone, and FIG. 13B is a sectional view taken along line HH of FIG. FIG. 1C is a sectional view when the connector section 2 is inserted into the female connector 50. As shown in the figure, the metal contact 51 in the female connector 50 does not contact the tip portion of the connector portion 2, but contacts at a position h separated from the tip by a predetermined length. Therefore, there is no problem even if the conductor land portion 23 (and the carbon film 25) is not provided up to the tip of the connector portion 2 as in the second embodiment.

【0030】以上本発明の実施例を詳細に説明したが、
本発明はこれらに限られるものではなく、例えば以下の
ような種々の変更が可能である。
The embodiment of the present invention has been described in detail above.
The present invention is not limited to these, and various modifications such as the following are possible.

【0031】[0031]

【0032】 上記各実施例においては絶縁塗料(UV
硬化型塗料)を2回塗布してその厚みを厚くしたが、本
発明はこれに限られず、3回以上塗布しても良い。
[0032] In each of the above embodiments, insulating paint (UV
(Curable paint) was applied twice to increase the thickness.
The invention is not limited to this,You may apply three or more times.

【0033】[0033]

【発明の効果】以上詳細に説明したように、本発明にか
かるフレキシブル基板のコネクタ部によれば、以下のよ
うな優れた効果を有する。 紫外線硬化型塗料は、他の通常の塗料と異なり、溶剤
で溶かされていないので、その厚塗りが容易に行える。
従って少ない層でも十分な厚みが得られ、その分製造時
間の短縮が図れる。 またコネクタ部を構成するフイルムの裏面に塗布・硬
化した紫外線硬化型塗料は何ら粘着性を有さないので、
これにゴミが付着することはない。 さらに最上層の紫外線硬化型塗料の厚みを、他の層の
紫外線硬化型塗料の厚みに比べて薄くしたので、たとえ
厚塗りするために最上層以外の紫外線硬化型塗料の粘度
を大きくしてその表面を荒くしても、最上層の紫外線硬
化型塗料の粘度を小さくできその表面を容易に滑らかに
することができる。
[Effect of the Invention] As described above in detail, according to the connector portion of the flexible substrate according to the present invention, the following
It has an excellent effect. Unlike other ordinary paints, UV-curable paints are solvent
Since it is not melted, thick coating can be done easily.
Therefore, sufficient thickness can be obtained even with few layers,
The time can be shortened. Also, apply and harden the back surface of the film that constitutes the connector section.
Since the UV curable coating that has been turned into has no tackiness,
No dust is attached to this. Furthermore, change the thickness of the UV curable coating on the top layer to that of other layers.
Since it is thinner than the thickness of the UV curable paint,
Viscosity of UV-curable paint other than the top layer for thick coating
Even if the surface is roughened by increasing the
The viscosity of chemical type paint can be reduced and the surface can be made smooth easily.
can do.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 1 is a diagram showing a process of manufacturing a connector portion of a flexible board according to a first embodiment of the present invention.

【図2】本発明の第1実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 2 is a diagram showing a process of manufacturing the connector portion of the flexible substrate according to the first embodiment of the present invention.

【図3】本発明の第1実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 3 is a diagram showing a process of manufacturing the connector portion of the flexible substrate according to the first embodiment of the present invention.

【図4】本発明の第1実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 4 is a diagram showing a process of manufacturing the connector portion of the flexible substrate according to the first embodiment of the present invention.

【図5】本発明の第1実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 5 is a diagram showing a process of manufacturing the connector portion of the flexible substrate according to the first embodiment of the present invention.

【図6】本発明の第2実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 6 is a diagram showing a process of manufacturing a connector portion of a flexible board according to a second embodiment of the present invention.

【図7】本発明の第2実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 7 is a diagram showing a process of manufacturing a connector portion of a flexible board according to a second embodiment of the present invention.

【図8】本発明の第2実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 8 is a diagram showing a process of manufacturing a connector portion of a flexible board according to a second embodiment of the present invention.

【図9】本発明の第2実施例にかかるフレキシブル基板
のコネクタ部を製造する工程を示す図である。
FIG. 9 is a diagram showing a process of manufacturing a connector portion of a flexible board according to a second embodiment of the present invention.

【図10】本発明の第2実施例にかかるフレキシブル基
板のコネクタ部を製造する工程を示す図である。
FIG. 10 is a diagram showing a process of manufacturing the connector portion of the flexible substrate according to the second embodiment of the present invention.

【図11】従来のフレキシブル基板のコネクタ部81の
部分を示す図である。
FIG. 11 is a diagram showing a connector portion 81 of a conventional flexible substrate.

【図12】従来のコネクタ部81を製造する方法を示す
図である。
FIG. 12 is a diagram showing a method for manufacturing a conventional connector section 81.

【図13】コネクタ部2を挿入するメスコネクタ50を
示す図である。
FIG. 13 is a view showing a female connector 50 into which the connector section 2 is inserted.

【符号の説明】[Explanation of symbols]

1,2 コネクタ部 10,20 フイルム 11,21 導体パターン 13,25 カーボン皮膜 15,17,27,28 UV硬化型塗料(絶縁塗料) 23 導体ランド部 29 スリット 1, 2 Connector part 10, 20 Film 11, 21 Conductor pattern 13, 25 Carbon film 15, 17, 27, 28 UV curable paint (insulating paint) 23 Conductor land part 29 Slit

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 合成樹脂製のフイルム上に導体パターン
を形成し、該フィルムの端部又は端部近傍にまで導体パ
ターンの一部を引き出してコネクタ部を形成した構造の
フレキシブル基板のコネクタ部において、 前記コネクタ部を構成するフイルムの裏面の所定範囲に
は、紫外線硬化型塗料を少なくとも2層以上塗布して硬
化せしめ、且つ最上層の紫外線硬化型塗料は、他の層の
紫外線硬化型塗料に比べてその厚みを薄くしたことを特
徴とするフレキシブル基板のコネクタ部。
1. A connector portion of a flexible substrate having a structure in which a conductor pattern is formed on a film made of synthetic resin, and a part of the conductor pattern is pulled out to an end portion of the film or in the vicinity of the end portion to form a connector portion . , Within a predetermined range on the back surface of the film that constitutes the connector section
Is a hard coating with at least two layers of UV curable paint
The UV-curable coating on the top layer that has been turned into
A connector part of a flexible board, which is thinner than UV curable paint .
JP4254046A 1992-08-28 1992-08-28 Flexible board connector Expired - Fee Related JPH0750821B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4254046A JPH0750821B2 (en) 1992-08-28 1992-08-28 Flexible board connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4254046A JPH0750821B2 (en) 1992-08-28 1992-08-28 Flexible board connector

Publications (2)

Publication Number Publication Date
JPH0685420A JPH0685420A (en) 1994-03-25
JPH0750821B2 true JPH0750821B2 (en) 1995-05-31

Family

ID=17259485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4254046A Expired - Fee Related JPH0750821B2 (en) 1992-08-28 1992-08-28 Flexible board connector

Country Status (1)

Country Link
JP (1) JPH0750821B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375182B2 (en) 2009-02-26 2013-12-25 富士通株式会社 Flexible printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116270U (en) * 1982-01-30 1983-08-08 日本メクトロン株式会社 flexible circuit board

Also Published As

Publication number Publication date
JPH0685420A (en) 1994-03-25

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