JPH05175618A - Wiring board and manufacture thereof - Google Patents

Abstract

PURPOSE:To simplify a manufacturing process in a large degree and to attain a consecutive processing by conducting a screen printing process and a light application process consecutively in a roll-to-roll manner. CONSTITUTION:A long wiring board material 11 let out from a rollshaped one has a structure wherein a wiring pattern 13 is formed on the lower surface of a base film 12 and a cover lay film 14 is provided on the whole of the lower surface. A screen mask 15 having resin ink 19 of a type being set with light such as an ultraviolet ray provided on the upper side is positioned and superposed on the upper surface of the base film 12 and the light-setting-type resin ink 19 is scraped off by a squeegee 18 and applied for printing on a prescribed place of the upper surface of the base film 12. When the resin ink 19 of the light-setting type is set by applying the light such as the ultraviolet ray thereto, a reinforcement film is formed in the prescribed place of the upper surface of the base film 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board and its manufacturing method.

[0002]

2. Description of the Related Art On a wiring board, as shown in FIG. 4, for example, a wiring pattern 2 is formed on the lower surface of a base film 1 made of a resin film, and the wiring pattern 2 is protected and the insulating property is secured. Therefore, there is a structure in which the cover lay film 3 made of a resin film is provided on the entire lower surface. By the way, since such a wiring board is called a flexible wiring board or the like and has flexibility,
The connector portion is weak in strength, and when an electronic component such as an IC chip is mounted, the electronic component mounting portion is also weak in strength, so that such a portion (hereinafter referred to as a portion to be reinforced) is reinforced in advance. is doing. In this case, for example, first, as shown in FIG. 5, a reinforcing film 4 having a size corresponding to the portion to be reinforced is prepared. The reinforcing film 4 is formed by forming a thermosetting adhesive 4b on the lower surface of the reinforcing film 4a made of a resin film.
Has a structure. Then, the reinforcing film 4 is placed on the upper surface of the base film 1 at the portion to be reinforced, and is temporarily pressure-bonded by the laminator. Next, when the thermosetting adhesive 4b of the reinforcing film 4 is cured by thermocompression bonding, the reinforcing film 4 is attached to a predetermined portion on the upper surface of the base film 1 as shown in FIG. The part to be reinforced is reinforced in advance.

[0003]

However, in such a conventional wiring board, since temporary bubbles are not left between the adhesive 4b and the base film 1 during the temporary pressure bonding, the temporary pressure bonding by the laminator is performed in a vacuum, and therefore, Since continuous processing by roll-to-roll is not possible, individual pieces are individually processed, that is, a long wiring board material unrolled from a roll-shaped one has a structure as shown in FIG. Punching into a shape to create a number of wiring board bodies,
A long reinforcing plate material having a structure as shown in Fig. 1 and rolled out from a roll is punched into a predetermined shape to form a large number of reinforcing membranes, and the sheets are temporarily pressure-bonded individually. There is a problem that the manufacturing process is complicated and continuous processing is difficult. An object of the present invention is to provide a wiring board that can greatly simplify the manufacturing process and can also perform continuous processing, and a manufacturing method thereof.

[0004]

The invention according to claim 1 is
It consists of a base film made of a resin film with a wiring pattern formed on one side, and a photocurable resin ink such as ultraviolet rays is printed on a predetermined part on the other side of the base film and then cured by irradiation with light such as ultraviolet rays. It is provided with a reinforcing film. The invention according to claim 2 is a photocurable type such as an ultraviolet ray at each predetermined place on the other surface of the base film of a long wiring board material provided with a base film made of a resin film having a wiring pattern formed on one surface. The resin ink is printed, the resin ink is cured by irradiation with light such as ultraviolet rays to form a reinforcing film, and then the wiring board material is punched into a predetermined shape to provide a large number of wiring boards having the reinforcing film. Is to get.

[0005]

According to the present invention, a reinforcing film is formed at a predetermined position on the other surface of the base film by printing a photocurable resin ink such as ultraviolet rays and then irradiating and curing the resin with light such as ultraviolet rays. Therefore, the printing process and the light irradiation process can be continuously performed by roll-to-roll even if the wiring board material provided with the base film is a long one that is unrolled from a roll-shaped one. Therefore, the manufacturing process can be greatly simplified, and continuous processing can be achieved.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 show respective steps of manufacturing a wiring board according to an embodiment of the present invention. Therefore, the structure of the wiring board will be described together with its manufacturing method with reference to these drawings in order.

First, as shown in FIG. 1, a long wiring board material 11 which is rolled out is prepared.
In the wiring board material 11, a wiring pattern 13 is formed on the lower surface of a base film 12 made of a resin film, and in order to protect the wiring pattern 13 and ensure insulation, a cover made of a resin film is formed on the entire lower surface. The lay film 14 is provided.

Next, as shown in FIG. 2, a screen mask 15 having a photocurable resin ink 19 such as ultraviolet rays on its upper surface is prepared. This screen mask 15 has a pattern of emulsion 17 formed on the lower surface of the screen 16, and the pattern is a pattern corresponding to the size of the reinforcing film to be formed on the upper surface of the base film 12 of the wiring board material 11. Is becoming Then, the screen mask 15 is positioned and superposed on the upper surface of the base film 12 of the wiring board material 11, and the photocurable resin ink 19 is rubbed out by the squeegee 18, and each of the upper surfaces of the base film 12 of the wiring board material 11 is scraped off. Printing is performed on the portion where the reinforcing film is to be formed. Next, the screen mask 15 is applied to the wiring board material 11
Of the base film 12 of the wiring board material 11 after the screen mask 15 is peeled off from the top surface of the base film 12 of the wiring board material 11 while being superposed on the top surface of the base film 12 of When the photocurable resin ink 19 is cured by irradiation, as shown in FIG. 3, the base film 1 of the wiring board material 11 is formed.
The reinforcing film 20 is formed at each predetermined location on the upper surface of 2. After that, when the wiring board material 11 is punched into a predetermined shape, a large number of wiring boards having the reinforcing film 20 are obtained.

As described above, in this method of manufacturing a wiring board, the photocurable resin ink 19 such as ultraviolet rays is screen-printed, and the photocurable resin ink 19 is cured by irradiation with light such as ultraviolet rays. , A base film 12 of a long wiring board material 11 unrolled from a roll
Since a reinforcing film 20 is formed at each predetermined position on the upper surface of the substrate and then the wiring board material 11 is punched into a predetermined shape, a large number of wiring boards having the reinforcing film 20 are obtained. Roll the screen printing process and the light irradiation process on the long wiring board material 11 drawn from
The two-roll process can be continuously performed, so that the manufacturing process can be greatly simplified and continuous processing can be achieved.

[0010]

As described above, according to the present invention, by printing a resin ink of a photo-curing type such as ultraviolet rays and then irradiating ultraviolet rays to cure the resin ink, a predetermined amount of the other surface of the base film can be obtained. Since a reinforcing film is formed at
Even if the wiring board material equipped with the base film is a long one that is rolled out from a roll-shaped one, the printing process and the light irradiation process can be continuously performed by roll-to-roll. It can be greatly simplified, and continuous processing can be achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a long wiring board material that is unrolled from a roll-shaped one when manufacturing a wiring board according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state in which a photocurable resin ink is printed by screen printing on a predetermined portion of the upper surface of a base film of a wiring board material when manufacturing the wiring board.

FIG. 3 is a cross-sectional view showing a state in which a photo-curing resin ink is cured to form a reinforcing film when manufacturing the wiring board.

FIG. 4 is a cross-sectional view showing a wiring board material in manufacturing a conventional wiring board.

FIG. 5 is a cross-sectional view showing a state in which a reinforcing film is temporarily pressure-bonded to a predetermined position on the upper surface of the base film of the wiring board material in the production of the conventional wiring board.

FIG. 6 is a cross-sectional view showing a state in which a reinforcing film is thermocompression-bonded to a predetermined portion of the upper surface of the base film of the wiring board material when manufacturing the conventional wiring board.

[Explanation of symbols]

 11 wiring board material 12 base film 13 wiring pattern 14 coverlay film 15 screen mask 19 photocurable resin ink 20 reinforcing film

Claims (2)

[Claims] 1. A predetermined position on the other surface of a base film made of a resin film having a wiring pattern formed on one surface,
A wiring board, characterized in that a reinforcing film is provided which is formed by printing a photocurable resin ink such as ultraviolet rays and then curing the resin ink by irradiation with light such as ultraviolet rays. 2. A photocurable resin ink such as ultraviolet light at each predetermined portion of the other surface of the base film of a long wiring board material having a base film made of a resin film having a wiring pattern formed on one surface. To form a reinforcing film by curing the resin ink by irradiation with light such as ultraviolet rays, and then punching the wiring board material into a predetermined shape to obtain a large number of wiring boards having the reinforcing film. And a method for manufacturing a wiring board.