JPH04137591A - Multilayer circuit board - Google Patents
Multilayer circuit boardInfo
- Publication number
- JPH04137591A JPH04137591A JP25837890A JP25837890A JPH04137591A JP H04137591 A JPH04137591 A JP H04137591A JP 25837890 A JP25837890 A JP 25837890A JP 25837890 A JP25837890 A JP 25837890A JP H04137591 A JPH04137591 A JP H04137591A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- conductive pattern
- film substrate
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は多層回路基板に係り、特に、折り曲部を有する
多層回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a multilayer circuit board, and particularly to a multilayer circuit board having a bent portion.
(従来の技術)
最近では、例えば電子機器の小形、軽量、薄形化により
、この電子機器に使用される制御回路装置等も小形、軽
量でかつ薄形のものが要求されている。この制御回路装
置は導電性パターンを有する基板に半導体等の電子部品
等を実装したものであるか、この小形、軽量、薄形化に
は半導体等の制御部品と基板を小形する必要がある。(Prior Art) Recently, as electronic devices have become smaller, lighter, and thinner, control circuit devices and the like used in these electronic devices have been required to be smaller, lighter, and thinner. This control circuit device is one in which electronic components such as semiconductors are mounted on a substrate having a conductive pattern, and in order to achieve miniaturization, weight, and thickness, it is necessary to downsize the control components such as semiconductors and the substrate.
この種の制御回路装置等に使用される基板としては、通
常のガラエボ基板等のプリント基板や、ポリエステル、
ポリイミド等の樹脂に導電性ペーストからなる導電層あ
るいは銅箔パターンによる導電層を形成したフレキシブ
ルプリント(F P C)基板かよく用いられている。Boards used for this type of control circuit device, etc. include printed circuit boards such as ordinary Gala Evo boards, polyester,
Flexible printed (FPC) boards are often used, in which a conductive layer made of a conductive paste or a conductive layer made of a copper foil pattern is formed on a resin such as polyimide.
しかし、ガラエポ基板は、複雑なメツキ工程か必要とな
り、また、従来のFPC基板は、単層であるため、高密
度配線か困難である等の問題かある。However, the glass epoxy board requires a complicated plating process, and since the conventional FPC board is a single layer, there are problems such as difficulty in high-density wiring.
これらの問題を解決するためにフィルム状の樹脂基板に
導電性パターンを形成し、これら基板を複数枚重ねた高
密度実装型の多層回路基板の開発も進められるようにな
ってきた。In order to solve these problems, progress has been made in the development of high-density mounting multilayer circuit boards in which conductive patterns are formed on film-like resin substrates and a plurality of these substrates are stacked.
この多層回路基板は、一般に、第4図に示すものであり
、例えば以下のような方法で製造される。This multilayer circuit board is generally shown in FIG. 4, and is manufactured, for example, by the following method.
ます、ポリカーボネート、ポリスルホン、ボリアリレー
ト等の熱可塑性の樹脂からなる熱変形性のフィルム基板
10を備え、このフィルム基板10には、適所にスルー
ホール11を形成するとともに、その表面に例えば20
μm程度の厚さに導電性ペーストを印刷して、導体パタ
ーンを形成する。First, a heat deformable film substrate 10 made of a thermoplastic resin such as polycarbonate, polysulfone, or polyarylate is provided, and through holes 11 are formed in appropriate places in the film substrate 10, and for example, 20 holes are formed on the surface of the film substrate 10.
A conductive pattern is formed by printing a conductive paste to a thickness of approximately μm.
二のフィルム基板10を複数枚重ねて、スルホール11
、導電性パターン]2の位置を調整し、熱プレスの定板
13.13の間に挿入し、これらのフィルム基板10を
定板13.13により導電性パターン12等とともに一
体的に熱圧着することにより、第5図に示すような多層
回路基板Aか製造される。A plurality of second film substrates 10 are stacked to form through-holes 11.
, conductive pattern] 2, insert it between the fixed plates 13.13 of the heat press, and thermocompress these film substrates 10 together with the conductive pattern 12 etc. by the fixed plate 13.13. As a result, a multilayer circuit board A as shown in FIG. 5 is manufactured.
この多層回路基板Aは、導電性パターンかフィルム基板
に一体的に圧着接着されるので、従来のメツキ工程等が
なくなり、複数の導電性パターンが立体的に実装される
ので、高密度化が実現できる。This multilayer circuit board A is integrally bonded to the conductive pattern or film substrate, eliminating the conventional plating process, etc., and multiple conductive patterns are mounted three-dimensionally, achieving high density. can.
なお、14、ユ4は、基板の表裏面に形成された電極で
ある。Note that 14 and 4 are electrodes formed on the front and back surfaces of the substrate.
(発明か解決しなければならない課題)ところで、この
多層回路基板Aは平板のまま用いられることもあるか、
電子機器(図示せず)等の構造によっては第3図に示す
ように直角等に曲げた多層回路基板Bとして使用しなけ
ればならないことかある。(Invention or problem to be solved) By the way, is it possible for this multilayer circuit board A to be used as a flat board?
Depending on the structure of electronic equipment (not shown), it may be necessary to use it as a multilayer circuit board B bent at a right angle, as shown in FIG.
この角形の多層回路基板Bは、平板の多層回路基板Aを
折曲して製造するものであるから、熱変形性樹脂のフィ
ルム基板は勿論のこと導電性パターンも変形させられる
。特に、折り曲部に直交する導電性パターンには大きな
曲げ応力が加わり、導電性パターンにクラックを生じた
り、最悪の場合には導電性パターンか断線してしまい製
品としての信頼性に欠けるという問題等がる。Since this rectangular multilayer circuit board B is manufactured by bending the flat multilayer circuit board A, not only the heat deformable resin film board but also the conductive pattern can be deformed. In particular, a large bending stress is applied to the conductive pattern perpendicular to the bent part, causing cracks in the conductive pattern, or in the worst case, breaking the conductive pattern, resulting in a lack of reliability as a product. etc.
本発明は上記曲げ部を有する多層回路基板において、パ
ターンにクラックや断線等が生じないようにした多層回
路基板を得ることを目的とする。An object of the present invention is to obtain a multilayer circuit board having the above-mentioned bent portions in which cracks, disconnections, etc. do not occur in the pattern.
(課題を解決するための手段)
本発明は、熱変形性樹脂からなる樹脂フィルム上に、熱
可塑性樹脂をバインダーとした導電ペーストにより導電
性パターンか形成されたフィルム基板を積層して、熱圧
着によって一体化した多層回路基板であって、前記多層
回路基板には、折曲部か形成されていると共に、前記折
曲部に形成された導電性パターンの膜厚が、折曲部以外
に形成された導電性パターンの膜厚よりも小さくしたも
のである。(Means for Solving the Problems) The present invention involves laminating a film substrate on which a conductive pattern is formed using a conductive paste using a thermoplastic resin as a binder on a resin film made of a thermoformable resin, and bonding the film by thermocompression. A multilayer circuit board integrated by a multilayer circuit board, wherein the multilayer circuit board is formed with a bent part, and the film thickness of the conductive pattern formed in the bent part is different from that formed in the part other than the bent part. The thickness of the conductive pattern is smaller than that of the conductive pattern.
また、前記多層回路基板には、折曲部が形成されている
と共に、前記折曲部のフィルム基板の厚さが折曲部以外
のフィルム基板の厚さよりも薄くしたものである。Further, the multilayer circuit board has a bent portion formed therein, and the thickness of the film substrate at the bent portion is thinner than the thickness of the film substrate other than the bent portion.
(作 用)
多層回路基板を折り曲げる時に、折り曲部の薄い導電性
パターンが折り曲げに追従してよく曲り、この導電性パ
ターンにクラックが生じたり、断線を起こすことがない
。(Function) When a multilayer circuit board is bent, the thin conductive pattern at the bent portion follows the bending and bends well, so that the conductive pattern does not crack or break.
また、多層回路基板の折り曲部を薄くしたので、折り曲
げる時におけるこの多層回路基板の変形が少なくなり、
導電性パターンに加わる応力が少なくなり、これにクラ
ックを生じたり、断線を起こすことかない。In addition, since the bending part of the multilayer circuit board is made thinner, the deformation of this multilayer circuit board when folding is reduced.
The stress applied to the conductive pattern is reduced, preventing it from cracking or breaking.
(実施例)
以下本発明多層回路基板の一実施例を図面について説明
する。(Embodiment) An embodiment of the multilayer circuit board of the present invention will be described below with reference to the drawings.
第1図に示した本発明多層回路基板Mの製造方法は第3
図、第4図に示した従来の多層回路基板の製造方法と同
様であるので詳細な説明は省略して説明する。The method for manufacturing the multilayer circuit board M of the present invention shown in FIG.
Since this method is similar to the conventional multilayer circuit board manufacturing method shown in FIGS. 4 and 4, detailed explanation will be omitted.
この多層回路基板Mも熱変形性樹脂からなるフィルム基
板上の適所にスルーホールが形成され、そのフィルム基
板の平板部20には20μm程度の厚さの導電性ペース
トが印刷され導電性バタン21か形成されている。This multilayer circuit board M also has through holes formed at appropriate locations on a film substrate made of a heat deformable resin, and a conductive paste with a thickness of about 20 μm is printed on the flat plate portion 20 of the film substrate, and a conductive batten 21 is printed on the flat plate portion 20 of the film substrate. It is formed.
このフィルム基板の折り曲げ部22に形成される導電性
ペーストの導電性パターン23は折曲部以外の箇所であ
る平板部20の導電性パターン21より薄く例えば10
μm程度の厚さに形成される。The conductive pattern 23 of the conductive paste formed on the bent portion 22 of this film substrate is thinner than the conductive pattern 21 of the flat plate portion 20 at a location other than the bent portion, for example, by 10 mm.
It is formed to a thickness of about μm.
これらフィルム基板は複数枚重ね合わされ位置調整が行
われた後、熱プレスの定板間に挿入され、一体的に圧着
成型され、さらに折り曲げ機により角形に折曲されて多
層回路基板Mが形成される。After a plurality of these film substrates are stacked and their positions adjusted, they are inserted between fixed plates of a heat press, and are integrally pressure-molded, and then bent into a square shape by a bending machine to form a multilayer circuit board M. Ru.
このようにすると、多層回路基板Mの折り曲げ部22に
位置する導電性パターン23が平板部20の導電性パタ
ーン21より薄いので熱圧着されたフィルム基板の変形
かあっても導電性パターン23かこの変形に追従し、導
電性パターン23にクラックが発生したり、断線等を起
こすことかない。そのため、高信頼性の多層回路基板M
を得ることかできる。In this way, since the conductive pattern 23 located at the folded portion 22 of the multilayer circuit board M is thinner than the conductive pattern 21 on the flat plate portion 20, even if the thermocompression-bonded film board is deformed, the conductive pattern 23 is It follows the deformation and does not cause cracks or disconnections in the conductive pattern 23. Therefore, highly reliable multilayer circuit board M
Can you get it?
第2図は、本発明の他の多層回路基板Nを示す。FIG. 2 shows another multilayer circuit board N of the present invention.
この多層回路基板Nは、基本的には第1図あるいは第3
図、第4図に示した製造方法と同様に製造される。This multilayer circuit board N is basically shown in FIG.
It is manufactured in the same manner as the manufacturing method shown in FIGS.
この多層回路基板Nの熱変形性樹脂からなるフィルム基
板の適所にスルーホールか形成され、そのフィルム基板
の表面に20μm程度の導電性パターン30かスクリー
ン印刷により形成される。Through holes are formed at appropriate locations on a film substrate made of a heat deformable resin of this multilayer circuit board N, and a conductive pattern 30 of about 20 μm is formed on the surface of the film substrate by screen printing.
このフィルム基板は複数枚が積層されて、熱圧着される
。この圧着成型された基板は折り曲げ機(図示せず)に
より折り曲げられる。A plurality of these film substrates are laminated and bonded together by thermocompression. This pressure-molded substrate is bent by a bending machine (not shown).
この折り曲げ機の成型金型は例えば折り曲げ線に沿って
延びる凸状部を有しており、そのため、フィルム基板の
折り曲げ部31か他の部分よりその厚さが薄くなるもの
である。The molding die of this bending machine has, for example, a convex portion extending along the bending line, so that the thickness of the bending portion 31 of the film substrate is thinner than that of other portions.
このようにすると、多層回路基板Nを折り曲げた場合、
折り曲げ部31の応力が小さくなり導電性パターン30
に加わる歪みが少なくなる。そのため、折曲部に位置す
る導電性パターン30の変形が少なく、この導電性パタ
ーン30にクラックか発生したり、断線等が生じことが
少ない。In this way, when the multilayer circuit board N is bent,
The stress in the bent portion 31 is reduced and the conductive pattern 30
The distortion added to the is reduced. Therefore, there is little deformation of the conductive pattern 30 located at the bent portion, and the occurrence of cracks, disconnections, etc. in the conductive pattern 30 is less likely.
本発明多層回路基板は、熱変形性樹脂からなる樹脂フィ
ルム上に、熱可塑性樹脂をバインダーとした導電ペース
トにより導電性パターンが形成されたフィルム基板を積
層して、熱圧着によって一体化した多層回路基板であっ
て、前記多層回路基板には、折曲部が形成されていると
共に、前記折曲部に形成された導電性パターンの膜厚が
、折曲部以外に形成された導電性パターンの膜厚よりも
小さくしたから、フィルム基板を折曲げた時、そのフィ
ルム基板が変形しても導電性パターンがこの変形によく
追従し、膜形の導電性パターンにクラックや断線事故の
発生をさせることがない。The multilayer circuit board of the present invention is a multilayer circuit in which a film board on which a conductive pattern is formed using a conductive paste using a thermoplastic resin as a binder is laminated on a resin film made of a thermodeformable resin and integrated by thermocompression bonding. In the substrate, the multilayer circuit board has a bent portion formed therein, and the thickness of the conductive pattern formed on the bent portion is equal to or greater than that of the conductive pattern formed outside the bent portion. Because it is smaller than the film thickness, when the film substrate is bent, even if the film substrate deforms, the conductive pattern will follow this deformation well, causing cracks and disconnection accidents in the film-shaped conductive pattern. Never.
また、前記多層回路基板には、折曲部が形成されている
と共に、前記折曲部のフィルム基板の厚さが折曲部以外
のフィルム基板の厚さよりも薄くしたから、折曲げた時
、基板の応力か少なくなり、導電性パターンに加わる歪
みが小さくなり、導電性パターンにクラックや断線事故
が発生することか防止することができる。Further, since the multilayer circuit board is formed with a bent portion and the thickness of the film substrate at the bent portion is thinner than the thickness of the film substrate other than the bent portion, when the multilayer circuit board is bent, The stress on the substrate is reduced, the strain applied to the conductive pattern is reduced, and cracks and disconnections in the conductive pattern can be prevented.
第1図は本発明による多層回路基板の主要部を示す断面
図、第2図は本発明の他の多層回路基板の主要部を示す
断面図、第3図は従来の多層回路基板の主要部を示す斜
視図、第4図は一般的な多層回路基板の製造工程を概略
を示す熱プレス部の断面図、第5図は多層回路基板の側
面図である。
]O・・・フィルム基板、11・・・スルーホール、1
2.21.30・・・導電性パターン、13・熱プレス
の定板、14・・・電極、22・・・角部、23・・薄
い導電性パターン、31・・・薄い基板。
出願人代理人 佐 藤 −雄
弗
図
乎
図
季
図FIG. 1 is a sectional view showing the main parts of a multilayer circuit board according to the present invention, FIG. 2 is a sectional view showing the main parts of another multilayer circuit board according to the invention, and FIG. 3 is a sectional view showing the main parts of a conventional multilayer circuit board. FIG. 4 is a sectional view of a heat press section schematically showing the manufacturing process of a general multilayer circuit board, and FIG. 5 is a side view of the multilayer circuit board. ]O...Film substrate, 11...Through hole, 1
2.21.30 Conductive pattern, 13 Heat press plate, 14 Electrode, 22 Corner, 23 Thin conductive pattern, 31 Thin substrate. Applicant's agent: Sato
Claims (2)
樹脂をバインダーとした導電ペーストにより導電性パタ
ーンが形成されたフィルム基板を積層して、熱圧着によ
って一体化した多層回路基板であって、前記多層回路基
板には、折曲部が形成されていると共に、前記折曲部に
形成された導電性パターンの膜厚が、折曲部以外に形成
された導電性パターンの膜厚よりも小さいことを特徴と
する多層回路基板。1. A multilayer circuit board in which a film substrate on which a conductive pattern is formed using a conductive paste using a thermoplastic resin as a binder is laminated on a resin film made of a thermodeformable resin and integrated by thermocompression bonding. A bent portion is formed on the circuit board, and the film thickness of the conductive pattern formed at the bent portion is smaller than the film thickness of the conductive pattern formed outside the bent portion. Features a multilayer circuit board.
塑性樹脂をバインダーとした導電ペーストにより導電性
パターンが形成されたフィルム基板を積層して、熱圧着
によって一体化した多層回路基板であって、前記多層回
路基板には、折曲部が形成されていると共に、前記折曲
部のフィルム基板の厚さが折曲部以外のフィルム基板の
厚さよりも薄いことを特徴とする多層回路基板。2. A multilayer circuit board in which a film substrate on which a conductive pattern is formed using a conductive paste using a thermoplastic resin as a binder is laminated on a resin film substrate made of a thermodeformable resin and integrated by thermocompression bonding. A multilayer circuit board, characterized in that the multilayer circuit board is formed with a bent portion, and the thickness of the film substrate at the bent portion is thinner than the thickness of the film substrate other than the bent portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25837890A JPH04137591A (en) | 1990-09-27 | 1990-09-27 | Multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25837890A JPH04137591A (en) | 1990-09-27 | 1990-09-27 | Multilayer circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04137591A true JPH04137591A (en) | 1992-05-12 |
Family
ID=17319414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25837890A Pending JPH04137591A (en) | 1990-09-27 | 1990-09-27 | Multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04137591A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
JP2009302343A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of manufacturing the same |
-
1990
- 1990-09-27 JP JP25837890A patent/JPH04137591A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
JP2009302343A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS63211692A (en) | Double-sided interconnection board | |
US20040070959A1 (en) | Multi-layer board, its production method, and mobile device using multi-layer board | |
US10477704B2 (en) | Multilayer board and electronic device | |
US4884170A (en) | Multilayer printed circuit board and method of producing the same | |
US5659153A (en) | Thermoformed three dimensional wiring module | |
JPH08125342A (en) | Flexible multilayered wiring board and its manufacture | |
CN104768318B (en) | Rigid-flexible circuit board and preparation method thereof | |
EP0477981A2 (en) | Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof | |
JPH06268348A (en) | Composite flexible printed board | |
JP3226959B2 (en) | Manufacturing method of multilayer flexible printed circuit board | |
JPH04336486A (en) | Printed-circuit board | |
JPH04137591A (en) | Multilayer circuit board | |
JP2005064059A (en) | Method of manufacturing flexible multilayer printed circuit board in different number of structural layers | |
JP4198245B2 (en) | Electronic circuit board, electronic circuit and manufacturing method thereof | |
CN102422729B (en) | Circuit board and method for manufacturing same | |
JPH04137592A (en) | Multilayer circuit board | |
JPH04137590A (en) | Multilayer circuit board | |
JP2008311553A (en) | Method for manufacturing compound multilayer printed-wiring board | |
JPH01310589A (en) | Front-rear continuity structure of laminated board | |
KR100222754B1 (en) | Fabrication method of rigid-flexible laminate elevation of surface confidence | |
JPH0955564A (en) | Printed wiring board | |
JPH02277286A (en) | Multilayer printed board | |
JPH07179088A (en) | Ic card and its manufacture | |
JPH03283586A (en) | Resin board | |
JPH04139792A (en) | Multilayer resin board |