JPH06196845A - Manufacture of simple printed board - Google Patents

Manufacture of simple printed board

Info

Publication number
JPH06196845A
JPH06196845A JP26907093A JP26907093A JPH06196845A JP H06196845 A JPH06196845 A JP H06196845A JP 26907093 A JP26907093 A JP 26907093A JP 26907093 A JP26907093 A JP 26907093A JP H06196845 A JPH06196845 A JP H06196845A
Authority
JP
Japan
Prior art keywords
pattern
conductive
circuit board
printed circuit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26907093A
Other languages
Japanese (ja)
Inventor
Naoki Suhara
直樹 栖原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Group Corp
Original Assignee
Aiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiwa Co Ltd filed Critical Aiwa Co Ltd
Priority to JP26907093A priority Critical patent/JPH06196845A/en
Publication of JPH06196845A publication Critical patent/JPH06196845A/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To simply form a substrate having a desired conductive pattern by spraying conductive paint over a masking member stuck on a substrate. CONSTITUTION:A pattern film 12 of a desired size and thickness is prepared. The film 12 is cut out in a pattern corresponding to a conductive pattern to form a plurality of cutouts 14 (14a, 14b,...). The pattern film 12 cut out in the required pattern is then stuck to a substrate 16. Thereafter, conductive paint 18 is sprayed on the cutouts 14 from the pattern film 12 side through a spray nozzle. After the conductive paint has been cured to some degree with the lapse of a specified time, the pattern film 12 is stripped. This obtains a printed board 10 having a specified conductive pattern composed of conductive sections 20 (20a, 20b,...).

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、実験用プリント基板
などに適用して好適な簡易型プリント基板の製法に関
し、特に非常に簡単に所望の導電パターンを有するプリ
ント基板を作ることができるようにしたものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a simple printed circuit board which is suitable for application to an experimental printed circuit board, etc., and particularly to a printed circuit board having a desired conductive pattern very easily. It was done.

【0002】[0002]

【従来の技術】例えば、実験室などにおいてはその実験
に特定な、その実験にしか使用できなかったり、あるい
は試作機に搭載したりするため、特殊な導電パターンを
有するプリント基板を使用したい場合が多い。
2. Description of the Related Art For example, in a laboratory or the like, there is a case where it is desired to use a printed circuit board having a special conductive pattern which is specific to the experiment and can be used only for the experiment or is mounted on a prototype machine. Many.

【0003】このような目的のもとにプリント基板を作
成する場合でも、通常のプリント基板を作成するのと同
様な工程を経て作成しているのが現状である。
Even when a printed circuit board is manufactured for such a purpose, the current state is that the printed circuit board is manufactured through the same steps as those for manufacturing a normal printed circuit board.

【0004】つまり、紙フェノール、ガラス布、エポキ
シなどの基板を用意し、その上面に銅箔を貼着する。そ
の後、銅箔の不要部分を塩化第二鉄などでエッチング処
理をして、所定の導電パターンを有するプリント基板を
形成している。
That is, a substrate made of paper phenol, glass cloth, epoxy or the like is prepared, and a copper foil is attached to the upper surface thereof. After that, an unnecessary portion of the copper foil is etched with ferric chloride or the like to form a printed board having a predetermined conductive pattern.

【0005】[0005]

【発明が解決しようとする課題】そのため、従来のプリ
ント基板の製法では、特に実験用や試作機用を問わず、 1.基板に銅箔を貼合せる 2.銅箔の必要部分をマスキングする 3.塩化第二鉄でエッチング処理をする 4.塩化第二鉄を洗浄する 5.必要とする銅箔部分に施したマスキングを剥離する などの多数の工程を経ないと、目的のプリント基板を作
成できなかった。
Therefore, in the conventional method of manufacturing a printed circuit board, regardless of whether it is for an experiment or a prototype, 1. Laminate the copper foil on the board 1. 2. Mask the required part of the copper foil. 3. Etching with ferric chloride 4. Wash the ferric chloride The desired printed circuit board could not be created without going through a number of steps such as removing the masking applied to the required copper foil.

【0006】そのため、実験用や試作機用などの簡易
で、あまり精度が要求されないプリント基板であって
も、その作成に当たっては、簡単にプリント基板を作成
するのが困難で、作成のための設備も大掛りなものとな
ってしまう欠点があった。
Therefore, even if a printed circuit board for experiments, prototypes, etc., which is simple and does not require high accuracy, it is difficult to easily prepare the printed circuit board, and the equipment for the production is required. However, there was a drawback that it became a big one.

【0007】また、使用できる基板も制限されてしま
う。
Further, the substrates that can be used are also limited.

【0008】そこで、この発明ではこのような従来の課
題を解決したものであって、特に所望の導電パターンを
有するプリント基板を、プラモデルなどを組み立てるの
と同じような感覚で、簡単に作成できるようにした簡易
型プリント基板の製法を提案するものである。
In view of the above, the present invention has solved such a conventional problem, and in particular, enables a printed circuit board having a desired conductive pattern to be easily created with the same feeling as when assembling a plastic model or the like. It proposes a manufacturing method of the simplified printed circuit board.

【0009】[0009]

【課題を解決するための手段】上述の課題を解決するた
め、この発明においては、基板上に剥離可能なパターン
化したマスキング部材を貼着し、マスキング部材を貼着
したあとで、このマスキング部材側より導電塗料を噴霧
状にして塗布し、塗布した導電塗料の硬化後に上記マス
キング部材を剥離して所定の導電パターンを有するプリ
ント基板を製造するようにしたものである。
In order to solve the above-mentioned problems, according to the present invention, a peelable patterned masking member is attached to a substrate, and after the masking member is attached, the masking member is attached. The conductive coating material is applied in a spray form from the side, and after the applied conductive coating material is cured, the masking member is peeled off to produce a printed circuit board having a predetermined conductive pattern.

【0010】[0010]

【作用】以下のような工程を経て簡易型プリント基板が
作成される。
The simple printed circuit board is manufactured through the following steps.

【0011】まず、所定パターンに切り抜かれたパター
ンフィルム12を作成する。
First, the pattern film 12 cut into a predetermined pattern is prepared.

【0012】このパターンフィルム12を基板16の上
面に被着(貼着)する。その状態でパターンフィルム1
2側より導電塗料18を噴霧状にして所定量塗布する。
そうすると、切り抜かれた部分の基板16の上面に導電
塗料18が被着される。
The pattern film 12 is adhered (attached) to the upper surface of the substrate 16. Pattern film 1 in that state
The conductive paint 18 is sprayed from the second side and applied in a predetermined amount.
Then, the conductive paint 18 is applied to the upper surface of the cut-out portion of the substrate 16.

【0013】その後パターンフィルム12を剥離する。
そうすると、基板16に残った導電部20によって所定
の導電パターンが得られる。これで、目的の導電パター
ンを有するプリント基板10が形成される。
After that, the pattern film 12 is peeled off.
Then, the conductive portion 20 remaining on the substrate 16 provides a predetermined conductive pattern. As a result, the printed circuit board 10 having the target conductive pattern is formed.

【0014】[0014]

【実施例】続いて、この発明に係る簡易型プリント基板
の一例を、図1を参照して詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an example of a simple printed circuit board according to the present invention will be described in detail with reference to FIG.

【0015】まず、図1Aに示すような、所定の大きさ
と厚みを有するパターンフィルム12を用意する。
First, a pattern film 12 having a predetermined size and thickness as shown in FIG. 1A is prepared.

【0016】このパターンフィルム12には、導電パタ
ーンとなるべき箇所が切り抜かれて、複数の切り抜き部
14(14a,14b,・・・)が形成される。フィル
ムはある程度の硬度があればよく、特にその材質が制限
されるものではない。
A plurality of cutout portions 14 (14a, 14b, ...) Are formed in the pattern film 12 by cutting out portions to be conductive patterns. The film only needs to have a certain degree of hardness, and its material is not particularly limited.

【0017】所定パターンに切り抜かれたパターンフィ
ルム12は、次に基板16上に貼着される(図1B)。
貼着は通常の接着剤を使用できる。基板16としては、
紙、フェノール、ガラス布、エポキシなどを使用でき、
特にその材質が制限されるものではない。
The pattern film 12 cut out into a predetermined pattern is then attached to the substrate 16 (FIG. 1B).
A normal adhesive can be used for sticking. As the substrate 16,
You can use paper, phenol, glass cloth, epoxy, etc.
The material is not particularly limited.

【0018】次に、パターンフィルム12側より導電塗
料18が、図1Bに示すようにスプレーのノズルを介し
て噴霧状にして特に切り抜き部上に塗布される。この塗
布量によって導電塗料の厚みが決まる。塗布の仕方によ
って導電塗料の厚みを均一にできるが、この厚みさらに
は塗布後のパターンの精度は余り要求されない。
Next, as shown in FIG. 1B, the conductive paint 18 is sprayed from the side of the pattern film 12 through a spray nozzle, and is particularly applied onto the cutout portion. The coating amount determines the thickness of the conductive paint. The thickness of the conductive paint can be made uniform depending on the application method, but this thickness and the accuracy of the pattern after application are not so required.

【0019】導電材料18としては、例えば市販されて
いる(株)シントーケミトロン社製の「ラントロンE・
15」(商品名)などを使用することができる。
The conductive material 18 is, for example, "Lantron E.
15 "(trade name) or the like can be used.

【0020】次に、所定時間経過して導電塗料がある程
度硬化したのち、パターンフィルム12を剥離する。そ
うすると、同図Cのように導電部20(20a,20
b,・・・)で構成された所定の導電パターンを有する
プリント基板10が作成される。
Next, after the conductive paint is cured to some extent after a predetermined time has passed, the pattern film 12 is peeled off. Then, as shown in FIG. 7C, the conductive portion 20 (20a, 20a
The printed circuit board 10 having a predetermined conductive pattern composed of (b, ...) Is produced.

【0021】実験用や試作機用などでプリント基板を使
用する場合には、導電パターンの形状、導電部20の厚
みなどは余り厳密には要求されないので、この程度のも
ので十分実用に供し得る。
When a printed circuit board is used for experiments or prototypes, the shape of the conductive pattern and the thickness of the conductive portion 20 are not strictly required. .

【0022】なお、上述ではマスキング部材としてパタ
ーンフィルムを使用した場合について述べたが、単にテ
ープを基板に貼着し、導電パターンとなる部分を除きマ
スキングするようにしてもよい。
Although the case where the pattern film is used as the masking member has been described above, the tape may be simply attached to the substrate and masked except for the portion which becomes the conductive pattern.

【0023】[0023]

【発明の効果】以上説明したように、この発明では、基
板をマスキング部材によりマスキングした状態でマスキ
ング部材側より導電塗料を噴霧状にして塗布し、所定の
導電パターンを基板に形成するという、極めて簡単な工
程で、所定の導電パターンを有するプリント基板を作成
することができる。
As described above, according to the present invention, in a state where the substrate is masked by the masking member, the conductive paint is sprayed and applied from the masking member side to form a predetermined conductive pattern on the substrate. A printed circuit board having a predetermined conductive pattern can be produced by a simple process.

【0024】これによれば、所望の導電パターンを有す
るプリント基板を、プラモデルなどを組み立てるのと同
じような感覚で、簡単にしかも短時間に作成できるの
で、実用に供し頗る便利である。
According to this, a printed circuit board having a desired conductive pattern can be easily produced in a short time with the same feeling as when assembling a plastic model or the like, which is convenient for practical use.

【0025】また、プリント基板を作るための設備が不
要になったり、基板の材質も特に制限されないなどの特
徴を有する。
Further, there are features such that equipment for producing a printed circuit board is not necessary and the material of the circuit board is not particularly limited.

【0026】従って、この発明によって作成された簡易
型プリント基板は、実験用や試作機用のように余り精度
を要求しないところで使用されるプリント基板などに使
用して極めて好適である。
Therefore, the simple printed circuit board produced according to the present invention is very suitable for use as a printed circuit board used in places where precision is not required, such as for experiments and prototypes.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明に係る簡易型プリント基板の製法の一
例を示す工程図である。
FIG. 1 is a process drawing showing an example of a method for manufacturing a simplified printed circuit board according to the present invention.

【符号の説明】[Explanation of symbols]

10 プリント基板 12 パターンフィルム 14 切り抜き部 18 導電塗料 20 導電部 10 Printed Circuit Board 12 Pattern Film 14 Cutout Part 18 Conductive Paint 20 Conductive Part

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基板上に剥離可能なパターン化したマス
キング部材を貼着し、 マスキング部材を貼着したあとで、このマスキング部材
側より導電塗料を噴霧状にして塗布し、 塗布した導電塗料の硬化後に上記マスキング部材を剥離
して所定の導電パターンを有するプリント基板を製造す
るようにしたことを特徴とする簡易型プリント基板の製
法。
1. A peelable patterned masking member is adhered onto a substrate, and after the masking member is adhered, the conductive paint is applied in a spray form from the masking member side. A method for producing a simple printed circuit board, characterized in that the masking member is peeled off after curing to produce a printed circuit board having a predetermined conductive pattern.
JP26907093A 1993-10-01 1993-10-27 Manufacture of simple printed board Pending JPH06196845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26907093A JPH06196845A (en) 1993-10-01 1993-10-27 Manufacture of simple printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26907093A JPH06196845A (en) 1993-10-01 1993-10-27 Manufacture of simple printed board

Publications (1)

Publication Number Publication Date
JPH06196845A true JPH06196845A (en) 1994-07-15

Family

ID=17467244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26907093A Pending JPH06196845A (en) 1993-10-01 1993-10-27 Manufacture of simple printed board

Country Status (1)

Country Link
JP (1) JPH06196845A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826329A (en) * 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
GB2376569A (en) * 2001-03-29 2002-12-18 Lear Corp Inc A method of forming an electric circuit on a substrate
JP2007012321A (en) * 2005-06-28 2007-01-18 Matsushita Electric Ind Co Ltd Backlight unit, and liquid crystal display having the backlight unit
JP2008511953A (en) * 2004-08-31 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Proximity sensor for X-ray equipment
WO2014010884A1 (en) * 2012-07-11 2014-01-16 주식회사 엘지화학 Method for forming bezel pattern on display substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928854A (en) * 1972-07-14 1974-03-14
JPS605417A (en) * 1983-10-12 1985-01-12 Fuji Photo Film Co Ltd Magnetic recording medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928854A (en) * 1972-07-14 1974-03-14
JPS605417A (en) * 1983-10-12 1985-01-12 Fuji Photo Film Co Ltd Magnetic recording medium

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826329A (en) * 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
GB2376569A (en) * 2001-03-29 2002-12-18 Lear Corp Inc A method of forming an electric circuit on a substrate
GB2376569B (en) * 2001-03-29 2004-08-11 Lear Corp Inc Method of forming an electrical circuit on a substrate
JP2008511953A (en) * 2004-08-31 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Proximity sensor for X-ray equipment
JP4774055B2 (en) * 2004-08-31 2011-09-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Proximity sensor for X-ray equipment
JP2007012321A (en) * 2005-06-28 2007-01-18 Matsushita Electric Ind Co Ltd Backlight unit, and liquid crystal display having the backlight unit
JP4584051B2 (en) * 2005-06-28 2010-11-17 パナソニック株式会社 Backlight unit and liquid crystal display device having the backlight unit
WO2014010884A1 (en) * 2012-07-11 2014-01-16 주식회사 엘지화학 Method for forming bezel pattern on display substrate
CN104040614A (en) * 2012-07-11 2014-09-10 Lg化学株式会社 Method for forming bezel pattern on display substrate
KR101468814B1 (en) * 2012-07-11 2014-12-08 주식회사 엘지화학 Method for forming bezel patten of display panel
US9381534B2 (en) 2012-07-11 2016-07-05 Lg Chem, Ltd. Method for forming bezel pattern of display substrate
US9925553B2 (en) 2012-07-11 2018-03-27 Lg Chem, Ltd. Method for forming bezel pattern of display substrate

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