JPH0750674B2 - Heating device for resist coating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a heating apparatus for a resist coated body.

(Prior Art) Generally, in manufacturing a semiconductor device, a predetermined pattern is transferred onto a semiconductor wafer by using a precision photo transfer technique, but in recent years, the number of steps has significantly increased with the high integration of the semiconductor device. is doing.

That is, conventionally, it was sufficient to simply apply the resist by a resist coating device and perform solvent drying with a heating device for the resist coating object. However, for fine processing accompanying the improvement in the integration degree, a hydrophobic treatment (by HMDS) Adhesion processing)
In addition, multi-layer coating for coating the surface of the resist film by superposing a coating layer on the coating layer, CEL film (antireflection film) coating, etc. are required.

Therefore, the number of devices required to process these series of steps increases, and the device installation area tends to increase.

Therefore, as shown in FIG. 3, a conventional heating apparatus for a resist coated object, which performs solvent drying on a substrate coated with a resist by a resist coating apparatus,
For example, a semiconductor wafer 1 coated with a resist is placed, and heating plates 2 for heating the semiconductor wafer 1 are vertically stacked at predetermined intervals and a plurality of stages are provided to reduce the installation area. ing.

(Problems to be Solved by the Invention) However, a semiconductor manufacturing process is generally performed in a clean room, and a downflow is formed from the upper side to the lower side in the clean room. Therefore, in the conventional heating apparatus for the resist coating object shown in FIG. 3, the heat of the heating plate 2 arranged above by the downflow is transferred to the peripheral process equipment such as the resist coating apparatus 3 or the like. For example, there is a problem that the ambient temperature around the resist coating device 3 rises and adversely affects processes such as resist coating. Further, in the heating apparatus for the resist coated object, it is necessary to keep the processing temperature constant with an accuracy of about ± 0.5 ° C., but the heat of the heating plate 2 arranged above is arranged below due to the downflow described above. Since it is carried around the heating plate 2, there is a difference in thermal condition between the heating plate 2 arranged below and the heating plate 2 arranged above, and there is a problem that the temperature accuracy is lowered. .

The present invention has been made in response to such conventional circumstances, and it is possible to improve the processing temperature accuracy as compared with the prior art, and compare the influence of the heat of the heating plate with other peripheral processes as compared with the conventional art. An object of the present invention is to provide a heating device for a resist coated object that can be significantly reduced.

[Structure of the Invention] (Means for Solving the Problems) That is, according to the present invention, a heating plate provided with a resist-coated object is surrounded by a heat insulating material layer,
The heat insulating material layer is surrounded by a casing having an intake port and an exhaust port connected to an exhaust unit.

(Operation) In the heating apparatus for the resist coating object of the present invention having the above-mentioned configuration,
The periphery of each of the heating plates provided in a plurality of stages in the vertical direction is surrounded by a heat insulating material layer, and the circumference of each of these heat insulating material layers is surrounded by a housing having an intake port and an exhaust port connected to an exhaust means. Has been.

Therefore, it is possible to prevent the heat of the heating plate arranged above from being transferred to the peripheral equipment such as the resist coating device and the periphery of the heating plate arranged below due to the downflow formed in the clean room. The processing temperature accuracy can be improved as compared with the conventional case, and the influence of the heat of the heating plate on the peripheral equipment can be significantly reduced as compared with the conventional case.

(Embodiment) An embodiment of a heating apparatus for a resist coating object of the present invention will be described below with reference to the drawings.

The resist is applied to the semiconductor wafer 1 by the resist coating device in the previous process.
Then, the semiconductor wafer 1 is transferred and placed on a disk-shaped heating plate 2. A heater 4 is arranged on the bottom surface of the heating plate 2. The periphery of the heating plate 2 is covered with a heat insulating material layer 5 made of, for example, a low dust emission material. That is, this heat insulating material layer 5 is a heat insulating material layer 5a in which disk-shaped and annular blocks are stacked so as to cover the lower portion and the side portion of the heating plate 2.
And a bottomed cylindrical heat insulating material layer 5b which is formed separately from the heat insulating material layer 5a and covers the upper part of the heating plate 2.

The heat insulating material layer 5a is connected to a drive mechanism, for example, an air cylinder 6, and is configured to be vertically movable together with the heating plate 2 and the heater 4. A plurality of, for example, three through holes H are formed in the same portion of the heat insulating material layer 5a, the heater 4, and the heating plate 2, and pins 7 are inserted into these through holes H. Then, due to the vertical movement of the heating plate 2 by the air cylinder 6, the heating plate 2 is in the lowered position and the pin 7 is moved to the heating plate 2.
It is configured to project to the upper surface and support the semiconductor wafer 1 by the pins 7.

On the other hand, the heat insulating material layer 5b is fixed to the supporting member 8, and an exhaust pipe 9 for leading out a solvent vaporized from the resist applied to the semiconductor wafer 1 due to heating to the outside at a substantially central portion thereof. Are connected.

Further, the heat insulating material layer 5, the air cylinder 6, and the supporting member 8
The casing 10 is arranged so as to surround the above. A plurality of circular holes 11, for example, are formed as intake holes in the upper and side portions of the housing 10. For example, an exhaust hole is formed below the side portion, and an exhaust device (not shown) is formed in the exhaust hole. The connected exhaust pipe 12 is connected. In addition, a loading / unloading port 13 formed of a slit-shaped opening having a width wider than the diameter of the semiconductor wafer 1 is formed on a side portion of the housing 10.

Then, as shown in FIG. 2, a plurality of housings 10 for accommodating the heating plate 2, the heat insulating material layer 5, the air cylinders 6, the support members 8 and the like are stacked at intervals in the vertical direction as described above, A heating device for the resist coated body is configured. It should be noted that these housings 10 are connected to a drive device (not shown) and are configured to be vertically movable.

In the heating apparatus for the resist coating object of this embodiment having the above-described configuration, the heating plate 2 is heated in advance to a predetermined temperature by the heater 4, and the exhaust pipe 12 exhausts the air from the inside of the housing 10 to make the air cylinder 6 Thus, the heat insulating material layer 5a and the heating plate 2 are lowered, a gap is provided between the heat insulating material layer 5a and the heat insulating material layer 5b, and the pins 7 stand by in a state of protruding above the heating plate 2.

Then, the semiconductor wafer 1 coated with the resist by the resist coating device 3 is carried by a carrying device (not shown), inserted into the housing 10 through the carry-in / out port 13, and arranged on the pins 7. At this time, the housing 10 into which the semiconductor wafer 1 is loaded is placed at a predetermined height position corresponding to the height of the transfer device by a driving device (not shown).

After that, the air cylinder 6 is driven to raise the heat insulating material layer 5a and the heating plate 2 to move the semiconductor wafer 1 to the pin 7
The semiconductor wafer 1 is transferred from above to the heating plate 2 and exhausted through the exhaust pipes 9 and 12 while the gap between the heat insulating material layer 5a and the heat insulating material layer 5b is closed, the semiconductor wafer 1 is heated for a predetermined time, and the resist The solvent is dried.

When the solvent drying of the resist for the above-mentioned predetermined time is completed, the air cylinder 6 is driven to lower the heat insulating material layer 5a and the heating plate 2 so that a space is provided between the heat insulating material layer 5a and the heat insulating material layer 5b. The semiconductor wafer 1 is transferred from the heating plate 2 onto the pins 7 and provided from the carry-in / out port 13 by the carrying device.

That is, in the heating apparatus for the resist coated body according to this embodiment described above, the periphery of the heating plate 2 is covered with the heat insulating material layer 5, and the heating plate 2 and the heat insulating material layer 5 are provided in the housing 10. The inside of the housing 10 is housed in the exhaust pipe 12
Always exhausted by. Therefore, in the housing 10,
An air flow is formed as shown by the arrow in FIG.
Are cooled by this air flow. Therefore, even if the heating plate 2 and the heater 4 reach a high temperature, this heat is hard to be transmitted to the housing 10, and it is possible to prevent the heat from being transferred to the outside atmosphere via the housing 10. Further, the air that has passed through the inside of the housing 10 and has increased in temperature is discharged to the outside of the system by the exhaust pipe 12, so that this air may adversely affect other devices and the heating plate 2 arranged in the lower stage. Absent. Further, even if the heat of the heating plate 2 and the heater 4 leaks to some extent through the heat insulating material layer 5, the air flow in the housing 10 as described above guides the heat to the outside of the system. The height can be reduced, the height of the entire device can be reduced, or the number of stacked layers can be increased.

[Effects of the Invention] As described above, in the heating apparatus for a resist coated object of the present invention, the processing temperature accuracy can be improved as compared with the conventional one, and the influence of the heat of the heating plate on the peripheral equipment is conventionally improved. It can be significantly reduced compared to.

[Brief description of drawings]

FIG. 1 is a sectional view showing a main part of a heating apparatus for a resist coating object according to an embodiment of the present invention, and FIG. 2 is a diagram showing an overall configuration of a heating apparatus for a resist coating object in FIG. FIG. 1 is a diagram showing the overall configuration of a conventional heating apparatus for a resist coated body. 1 ... Semiconductor wafer, 2 ... Heating plate, 3 ... Resist coating device, 4 ... Heater, 5 ... Heat insulating material layer, 6 ... Air cylinder, 7 ... Pin, 8 ... Support member, 9 ... …Exhaust pipe,
10 …… Case, 11 …… Circular hole (intake hole), 12 …… Exhaust pipe, 13
…… The entrance / exit.

Claims (1)

[Claims] 1. A casing having a heat insulating material layer surrounding a heating plate on which a resist-coated body on which a resist is coated is provided, and an exhaust port connected to an intake port and an exhaust means around the heat insulating material layer. A device for heating a resist-coated object, which is surrounded by a body.