JPH0750144Y2 - ハブ付き極薄刃砥石 - Google Patents

ハブ付き極薄刃砥石

Info

Publication number
JPH0750144Y2
JPH0750144Y2 JP1988057780U JP5778088U JPH0750144Y2 JP H0750144 Y2 JPH0750144 Y2 JP H0750144Y2 JP 1988057780 U JP1988057780 U JP 1988057780U JP 5778088 U JP5778088 U JP 5778088U JP H0750144 Y2 JPH0750144 Y2 JP H0750144Y2
Authority
JP
Japan
Prior art keywords
hub
abrasive grain
grain layer
grindstone
ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988057780U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01163063U (US20100056889A1-20100304-C00004.png
Inventor
務 高橋
信夫 須田
尚登 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP1988057780U priority Critical patent/JPH0750144Y2/ja
Publication of JPH01163063U publication Critical patent/JPH01163063U/ja
Application granted granted Critical
Publication of JPH0750144Y2 publication Critical patent/JPH0750144Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
JP1988057780U 1988-04-28 1988-04-28 ハブ付き極薄刃砥石 Expired - Lifetime JPH0750144Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988057780U JPH0750144Y2 (ja) 1988-04-28 1988-04-28 ハブ付き極薄刃砥石

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988057780U JPH0750144Y2 (ja) 1988-04-28 1988-04-28 ハブ付き極薄刃砥石

Publications (2)

Publication Number Publication Date
JPH01163063U JPH01163063U (US20100056889A1-20100304-C00004.png) 1989-11-14
JPH0750144Y2 true JPH0750144Y2 (ja) 1995-11-15

Family

ID=31283622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988057780U Expired - Lifetime JPH0750144Y2 (ja) 1988-04-28 1988-04-28 ハブ付き極薄刃砥石

Country Status (1)

Country Link
JP (1) JPH0750144Y2 (US20100056889A1-20100304-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12043571B2 (en) 2022-12-01 2024-07-23 Apple Inc. Electronic device having selectively strengthened glass

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825292A (US20100056889A1-20100304-C00004.png) * 1971-08-05 1973-04-02
JPS6016098A (ja) * 1983-07-07 1985-01-26 Foster Denki Kk スピ−カ用振動板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12043571B2 (en) 2022-12-01 2024-07-23 Apple Inc. Electronic device having selectively strengthened glass

Also Published As

Publication number Publication date
JPH01163063U (US20100056889A1-20100304-C00004.png) 1989-11-14

Similar Documents

Publication Publication Date Title
US20070155294A1 (en) Chemical mechanical polishing system
JP2004319951A (ja) エッジ研磨した窒化物半導体基板とエッジ研磨したＧａＮ自立基板及び窒化物半導体基板のエッジ加工方法
WO1999009588A1 (en) Method of processing semiconductor wafers
JP2001510739A (ja) ラップ仕上げ、ホーニング、およびポリッシングの間に加工部品を保持するための装置
JPH08126953A (ja) ワイヤソー及びワイヤの製造方法
JP2001054850A (ja) 固定砥粒ワイヤーソーによる硬脆材料の切断加工法
JPS6113952B2 (US20100056889A1-20100304-C00004.png)
JPH0750144Y2 (ja) ハブ付き極薄刃砥石
US5984765A (en) Ultrasonic vibration composite grinding tool
JP3083483B2 (ja) 研削砥石
US5993300A (en) Ultrasonic vibration composite processing tool
JPS6224956A (ja) 玉軸受の軌道溝の超仕上げ方法
JP2003048164A (ja) 研磨ホイール
JP3434801B2 (ja) シリコンウエハ外周部加工用ベベリングホイールの製造方法
JP2002192469A (ja) 超砥粒薄刃切断砥石
JP2001007064A (ja) 半導体ウエーハの研削方法
JP3816014B2 (ja) 円筒研削型砥石車
JP4020811B2 (ja) 研磨工具
EP3409422A1 (en) Abrasive tool
JPH0596471A (ja) 高速回転用超砥粒砥石
JPH0513492Y2 (US20100056889A1-20100304-C00004.png)
JP2516937Y2 (ja) 内周刃砥石
JPH0822508B2 (ja) 極薄刃砥石
JPS62157778A (ja) 研削砥石
JP2003332276A (ja) 半導体装置の製造法