JPH0749806Y2 - イメージセンサの実装構造 - Google Patents

イメージセンサの実装構造

Info

Publication number
JPH0749806Y2
JPH0749806Y2 JP1985082044U JP8204485U JPH0749806Y2 JP H0749806 Y2 JPH0749806 Y2 JP H0749806Y2 JP 1985082044 U JP1985082044 U JP 1985082044U JP 8204485 U JP8204485 U JP 8204485U JP H0749806 Y2 JPH0749806 Y2 JP H0749806Y2
Authority
JP
Japan
Prior art keywords
photoelectric conversion
glass substrate
image sensor
conversion element
transparent insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985082044U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61199059U (US06623731-20030923-C00012.png
Inventor
尊文 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1985082044U priority Critical patent/JPH0749806Y2/ja
Publication of JPS61199059U publication Critical patent/JPS61199059U/ja
Application granted granted Critical
Publication of JPH0749806Y2 publication Critical patent/JPH0749806Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Die Bonding (AREA)
JP1985082044U 1985-05-31 1985-05-31 イメージセンサの実装構造 Expired - Lifetime JPH0749806Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Publications (2)

Publication Number Publication Date
JPS61199059U JPS61199059U (US06623731-20030923-C00012.png) 1986-12-12
JPH0749806Y2 true JPH0749806Y2 (ja) 1995-11-13

Family

ID=30629404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082044U Expired - Lifetime JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Country Status (1)

Country Link
JP (1) JPH0749806Y2 (US06623731-20030923-C00012.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2558639B2 (ja) * 1986-06-27 1996-11-27 松下電器産業株式会社 密着形光電変換素子ユニツト
JP4720120B2 (ja) * 2004-07-14 2011-07-13 ソニー株式会社 半導体イメージセンサ・モジュール
JP2011077553A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077554A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077555A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948954A (ja) * 1982-09-13 1984-03-21 Kyocera Corp 密着型読み取り装置
JPS6037194A (ja) * 1983-08-09 1985-02-26 株式会社東芝 ハイブリツド集積回路装置

Also Published As

Publication number Publication date
JPS61199059U (US06623731-20030923-C00012.png) 1986-12-12

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