JPH0748401B2 - Polymer thick film resistor - Google Patents
Polymer thick film resistorInfo
- Publication number
- JPH0748401B2 JPH0748401B2 JP63106317A JP10631788A JPH0748401B2 JP H0748401 B2 JPH0748401 B2 JP H0748401B2 JP 63106317 A JP63106317 A JP 63106317A JP 10631788 A JP10631788 A JP 10631788A JP H0748401 B2 JPH0748401 B2 JP H0748401B2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- resin
- polymer thick
- resistor
- film resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はポリマー厚膜抵抗体の耐熱性の改良に関するも
のである。Description: FIELD OF THE INVENTION The present invention relates to improving the heat resistance of polymer thick film resistors.
従来の技術 昨今、厚膜（印刷）抵抗体は実装密度と生産性が高いた
め用途が拡大している。従来の厚膜抵抗体の主流は酸化
ルテニウムとガラスフリットを主成分とするグレーズ抵
抗体であった。この抵抗体は以下のような欠点を持って
いる。2. Description of the Related Art Recently, thick film (printed) resistors have high mounting density and high productivity, and their applications are expanding. The mainstream of the conventional thick film resistor has been a glaze resistor mainly composed of ruthenium oxide and glass frit. This resistor has the following drawbacks.
（１）酸化ルテニウムの材料コストが高い。(1) The material cost of ruthenium oxide is high.
（２）高温焼成をするためプロセスコストが高い。(2) Since high temperature firing is performed, the process cost is high.
（３）セラミック基板等の耐熱性の著しく高い基板に実
装が限定される。(3) Mounting is limited to a substrate having extremely high heat resistance such as a ceramic substrate.
（４）その結果、プリント基板の軽量化、低コスト化の
障害になる。(4) As a result, there are obstacles to weight reduction and cost reduction of the printed circuit board.
これに対しポリマー厚膜抵抗体はカーボンと樹脂バイン
ダーを主成分とし、以下のようなグレース抵抗体の欠点
を補う長所を有する。On the other hand, the polymer thick film resistor contains carbon and a resin binder as main components, and has an advantage of compensating for the following defects of the grace resistor.
（１）材料コストが安い。(1) Material cost is low.
（２）低温焼成（硬化）ができる−プロセスコストが安
い （３）安価で軽量な紙フェノールやガラスエポキシ等の
樹脂基板に実装可能である。(2) It can be baked (cured) at a low temperature-the process cost is low. (3) It can be mounted on a cheap and lightweight resin substrate such as paper phenol or glass epoxy.
（４）その結果プリント基板の軽量化、低コスト化が可
能である。(4) As a result, it is possible to reduce the weight and cost of the printed circuit board.
このため特に軽量化、低コスト化を求められる一部の用
途に使われている。For this reason, it is used in some applications where weight reduction and cost reduction are required.
発明が解決しようとする課題 しかし、ポリマー厚膜抵抗体は抵抗体のバインダーとし
て樹脂（一般にフェノール樹脂やメラミンエポキシ樹
脂）を使用しているため耐熱性、特にハンダプロセスに
おける信頼性がグレース抵抗体に比べ劣る欠点を有す
る。However, since the polymer thick film resistor uses a resin (generally a phenolic resin or a melamine epoxy resin) as a binder of the resistor, the heat resistance, particularly the reliability in the soldering process, can be improved to the grace resistor. It has an inferior drawback.
このためポリマー厚膜抵抗体の耐熱性向上を試みる検討
がいくつか行われている。この例の多くは抵抗体の樹脂
バインダーをより耐熱性の高いイミド樹脂や高分子化フ
ェノール樹脂等に変えているものである。しかしこれら
の改良では抵抗体の焼成（硬化）時間が長くなること
や、特殊な溶剤（窒素含有極性溶剤）を使用するため実
装上の問題（例えば印刷用スクリーンマスクのレジスト
を侵すことや印刷された抵抗体が吸湿によってゲル化す
る等）があることで、安価で生産性が高いポリマー厚膜
抵抗体の長所を消失させてしまっているのが現状であ
る。For this reason, several studies have been conducted to try to improve the heat resistance of the polymer thick film resistor. In most of the examples, the resin binder of the resistor is replaced with an imide resin having a higher heat resistance, a polymerized phenol resin, or the like. However, with these improvements, the baking (curing) time of the resistor becomes long, and because a special solvent (nitrogen-containing polar solvent) is used, there are mounting problems (for example, the resist of the printing screen mask is damaged or the printing is not performed). The present situation is that the advantages of the polymer thick film resistor, which is inexpensive and has high productivity, are lost due to the fact that the resistor gels due to moisture absorption.
耐熱性があり実用性が高いポリマー厚膜抵抗体を作るに
は、印刷用スクリーンマスクンのレジストを侵す溶剤
（ジメチルホルムアミド、Ｎ−メチル−２−ピロリドン
といった窒素含有極性溶剤）以外の通常のスクリーン印
刷に使用される溶剤（例；アルコール系、ケトン系、エ
ステル系等）に容易に溶解し、かつ短時間焼成（硬化）
が可能であるという範囲で樹脂バインダーの耐熱性を上
げることが不可欠である。In order to make a polymer thick film resistor that is heat resistant and highly practical, a normal screen other than a solvent (a nitrogen-containing polar solvent such as dimethylformamide or N-methyl-2-pyrrolidone) that attacks the resist of the screen mask for printing is used. Easily soluble in solvents used for printing (eg alcohol-based, ketone-based, ester-based, etc.) and baked (cured) for a short time
It is essential to increase the heat resistance of the resin binder to the extent that it is possible.
課題を解決するための手段 本発明は抵抗体の樹脂バインダーとして、エポキシ樹脂
をベースとし、これに窒素含有極性溶剤以外の汎用溶剤
に可溶である熱硬化性イミド樹脂を５〜50％付与したも
のを用いる。Means for Solving the Problems The present invention is based on an epoxy resin as a resin binder of a resistor, to which 5 to 50% of a thermosetting imide resin soluble in a general-purpose solvent other than a nitrogen-containing polar solvent is added. Use one.
作用 本発明にかかる抵抗体は、エポキシ樹脂をバインダーの
ベースにすることで短時間焼成（硬化）を可能にしかつ
実装される基板に対する抵抗体の密着性を確保してい
る。また熱硬化性イミド樹脂を構成成分として含有する
ことではんだ浸漬にも耐え得る耐熱性を実現している。
さらに一般のイミド樹脂では溶剤として窒素含有極性溶
剤の使用が不可避であるが、本発明においては窒素含有
極性溶剤以外の汎用溶剤にも可溶であるイミド樹脂を使
用することで抵抗体の印刷実装時に特別な配慮（窒素含
有極性溶剤に侵されない特殊な印刷機器・治具を用意す
る必要が生じることや印刷された抵抗体が吸湿してゲル
化するのを防止するため印刷工程雰囲気の湿度コントロ
ールをシビアにすること）が不要になる。Function The resistor according to the present invention enables the baking (curing) for a short time by using the epoxy resin as the base of the binder, and secures the adhesiveness of the resistor to the mounted substrate. Further, by containing a thermosetting imide resin as a constituent component, heat resistance capable of withstanding solder immersion is realized.
Further, in general imide resins, it is inevitable to use a nitrogen-containing polar solvent as a solvent, but in the present invention, by using an imide resin that is also soluble in general-purpose solvents other than nitrogen-containing polar solvents, it is possible to print-mount resistors. Sometimes special consideration (to prevent the need to prepare special printing equipment and jigs that are not affected by polar solvents containing nitrogen and to prevent the printed resistors from absorbing moisture and gelling, control the humidity of the printing process atmosphere. Severely) becomes unnecessary.
実施例 本発明のポリマー厚膜抵抗体はバインダー樹脂、導電物
粉体、溶剤およびその他添加剤よりなる。Example The polymer thick film resistor of the present invention comprises a binder resin, a conductive material powder, a solvent and other additives.
バインダー樹脂の主成分はエポキシ樹脂とイミド樹脂で
あるが、ここで用いられるエポキシ樹脂は一般に知られ
ているものであれば特に制約はない。例えばビスフェノ
ールＡ型、ビスフェノールＦ型、フェノールノボラック
型エポキシ樹脂、水添ビスフェノールＡ型エポキシ樹
脂、グリセリントリグリシジルエーテル等のポリグリシ
ジルエーテル系樹脂、脂環型エポキシ樹脂、ジグリシジ
ルフタレートや重合脂肪酸ポリグリシジルエステル等の
グリシジルエステル系樹脂、N,N−ジグリシジルアニリ
ン等のグリシジルアミン系樹脂、およびヒダントイン型
エポキシ樹脂やトリグリシジルイソシアヌレート等の複
素環式エポキシ樹脂が挙げられる。The main components of the binder resin are an epoxy resin and an imide resin, but the epoxy resin used here is not particularly limited as long as it is generally known. For example, bisphenol A type, bisphenol F type, phenol novolac type epoxy resin, hydrogenated bisphenol A type epoxy resin, polyglycidyl ether resin such as glycerin triglycidyl ether, alicyclic epoxy resin, diglycidyl phthalate, and polymerized fatty acid polyglycidyl ester. And the like, glycidyl amine-based resins such as N, N-diglycidyl aniline, and heterocyclic epoxy resins such as hydantoin-type epoxy resins and triglycidyl isocyanurate.
本発明においては、上記したエポキシ樹脂から成る群よ
り選ばれた一個もしくは二個以上のものが使用される。In the present invention, one or two or more selected from the group consisting of the above epoxy resins is used.
本発明におけるポリマー厚膜抵抗体バインダー樹脂の一
方の成分であるイミド樹脂は高速反応が可能な熱硬化性
樹脂でかつエポキシ樹脂と相溶性が良く、さらに窒素含
有極性溶剤（ジメチルホルムアミド、Ｎ−メチル−２−
ピロリドン等） 以外の汎用溶剤にも可溶なものが使われる。例えば図に
示すように分子末端にマレイミド基を有する型のイミド
樹脂は高速反応が可能でかつ耐熱性が高い熱硬化性樹脂
となる。さらにエポキシ樹脂や汎用溶剤との相溶性を高
くするためイミド樹脂の分子が非対称構造をとるように
アルキル基を導入したものが用いられる。The imide resin, which is one component of the polymer thick film resistor binder resin in the present invention, is a thermosetting resin capable of high-speed reaction and has good compatibility with an epoxy resin, and further contains a nitrogen-containing polar solvent (dimethylformamide, N-methyl). -2-
It is also soluble in general-purpose solvents other than pyrrolidone). For example, as shown in the figure, an imide resin of a type having a maleimide group at the molecular end is a thermosetting resin that can react at high speed and has high heat resistance. Further, in order to enhance the compatibility with epoxy resins and general-purpose solvents, imide resin having an alkyl group introduced so that the molecule has an asymmetric structure is used.
本発明におけるポリマー厚膜抵抗体のバインダーは、上
記のエポキシ樹脂とイミド樹脂の混合物、またはイミド
樹脂で部分的にエポキシ樹脂を変成したものが使用され
る。As the binder of the polymer thick film resistor in the present invention, a mixture of the above-mentioned epoxy resin and imide resin, or a resin obtained by partially modifying the epoxy resin with an imide resin is used.
エポキシ樹脂とイミド樹脂の混合比または変成率は、エ
ポキシ樹脂：イミド樹脂＝95〜50wt％:5〜50wt％が望ま
しい。The mixing ratio or transformation ratio of the epoxy resin and the imide resin is preferably epoxy resin: imide resin = 95 to 50 wt%: 5 to 50 wt%.
本発明のポリマー厚膜抵抗体に使われる導電物粉体は一
般の厚膜抵抗体に使用されているものと同じものが使用
できる。例えばカーボンブラック、グラファイト、銀、
銅、ニッケルなどの金属、RuO2,SnO2等の金属酸化物等
が使われる。The conductive material powder used in the polymer thick film resistor of the present invention may be the same as that used in a general thick film resistor. For example, carbon black, graphite, silver,
Metals such as copper and nickel, metal oxides such as RuO 2 and SnO 2 are used.
本発明のポリマー厚膜抵抗体に使われる溶剤はスクリー
ンレジストを侵す溶剤（ジメチルホルムアミド、Ｎ−メ
チルピロリドンといった窒素含有極性溶剤）以外、例え
ばアルコール系、ケトン系、エステル系等が使用され
る。As the solvent used for the polymer thick film resistor of the present invention, for example, alcohol-based, ketone-based, ester-based, etc. are used in addition to the solvents that attack the screen resist (nitrogen-containing polar solvents such as dimethylformamide and N-methylpyrrolidone).
その他の添加剤については実装に適した厚膜ペーストの
レオロジーを調節するためのフィラー、さらに導電物粉
体やフィラーなどの分散性を向上させるための分散剤、
粉体表面処理剤等が用いられる。For other additives, a filler for adjusting the rheology of the thick film paste suitable for mounting, a dispersant for improving the dispersibility of the conductive powder or filler,
A powder surface treatment agent or the like is used.
以上の組成物を混練して仕上げたポリマー厚膜ペースト
をプリント基板上で硬化させ所定の抵抗体を得る。The polymer thick film paste finished by kneading the above composition is cured on a printed board to obtain a predetermined resistor.
［具体例］ エポキシ樹脂（分子量380、エポキシ当量189）とイミド
樹脂（分子量880、イミド基当量210）を3:1の割合で溶
融混合し、これにジシアンジアミド８部、ｐ−クロロフ
ェニルジメチルウレア２部、カーボンブラック15部、溶
融シリカ80部および酢酸カルビトール45部を加え三本ロ
ールで混練してポリマー厚膜ペーストを仕上げる。これ
をポリマー厚膜抵抗体ペーストＡとする。[Specific Example] Epoxy resin (molecular weight: 380, epoxy equivalent: 189) and imide resin (molecular weight: 880, imide group equivalent: 210) were melt mixed at a ratio of 3: 1, and 8 parts of dicyandiamide and 2 parts of p-chlorophenyldimethylurea were mixed therein. , 15 parts of carbon black, 80 parts of fused silica and 45 parts of carbitol acetate are added and kneaded with a three-roll to finish a polymer thick film paste. This is designated as polymer thick film resistor paste A.
現在市場に出ているポリマー厚膜抵抗体と比較するため
同一基板上で同一条件で抵抗体ペーストを焼成（硬化）
させ抵抗体としての耐熱性テストの評価を行った。結果
を次表に示す。To compare with polymer thick film resistors currently on the market, fire (cure) resistor paste under the same conditions on the same substrate.
Then, the heat resistance test as a resistor was evaluated. The results are shown in the table below.
試験条件； 硬化温度 180℃ 基板 ガラス−エポキシ基板 ハンダ耐熱 260℃ ５秒 短時間過負荷 定格電圧×2.5 ５秒 （定格電力 30mW/mm2） 耐熱寿命 85℃ 500時間 発明の効果 以上に示すとおり、本発明により作成されたポリマー厚
膜抵抗体は、従来の抵抗体材料と比較して耐熱性の向上
と焼成（硬化）時間の短縮化ができるため、汎用の樹脂
基板の使用が可能でかつ短時間プロセスで高耐熱性のポ
リマー厚膜抵抗体が実現できる。さらに、従来の抵抗体
材料と異なり汎用溶剤を使用できるため通常の印刷設備
の流用ができ雰囲気制御も不要であるため安価で高生産
性のポリマー厚膜抵抗体が得られる。 Test conditions: Curing temperature 180 ℃ Substrate glass-epoxy board Solder heat resistance 260 ℃ 5 seconds Short-time overload Rated voltage × 2.5 5 seconds (rated power 30mW / mm 2 ) Heat resistance life 85 ℃ 500 hours Effect of the invention As shown above, The polymer thick film resistor made according to the present invention can improve heat resistance and shorten firing (curing) time as compared with the conventional resistor material, so that a general-purpose resin substrate can be used and can be used in a short time. High temperature resistant polymer thick film resistor can be realized by time process. Further, unlike the conventional resistor material, since a general-purpose solvent can be used, ordinary printing equipment can be used and atmosphere control is unnecessary, so that an inexpensive and highly productive polymer thick film resistor can be obtained.
図はイミド樹脂の分子構造図である。 The figure is a molecular structure diagram of an imide resin.
Claims (1)
須成分であるバインダーを主成分とするポリマー厚膜抵
抗体であって、 前記熱硬化性イミド樹脂は、組成比として前記バインダ
ーの５〜50％であり、かつ、窒素含有極性溶剤以外の汎
用溶剤にも可溶である ポリマー厚膜抵抗体。1. A polymer thick film resistor comprising a binder, which is an essential component of an epoxy resin and a thermosetting imide resin, wherein the thermosetting imide resin has a composition ratio of 5 to 5% of that of the binder. A polymer thick film resistor that is 50% and is soluble in general-purpose solvents other than nitrogen-containing polar solvents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63106317A JPH0748401B2 (en) | 1988-04-28 | 1988-04-28 | Polymer thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63106317A JPH0748401B2 (en) | 1988-04-28 | 1988-04-28 | Polymer thick film resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01276702A JPH01276702A (en) | 1989-11-07 |
| JPH0748401B2 true JPH0748401B2 (en) | 1995-05-24 |
Family
ID=14430587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63106317A Expired - Fee Related JPH0748401B2 (en) | 1988-04-28 | 1988-04-28 | Polymer thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0748401B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141705A (en) * | 1979-04-20 | 1980-11-05 | Matsushita Electric Ind Co Ltd | Film resistor |
| JPS59228749A (en) * | 1983-06-10 | 1984-12-22 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
-
1988
- 1988-04-28 JP JP63106317A patent/JPH0748401B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01276702A (en) | 1989-11-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |