JPH0746452Y2 - Surface polishing equipment - Google Patents

Description

[Detailed description of the device]

[0001]

[Industrial application] The surface polishing apparatus according to the present invention is
For example, it is used for chamfering the edge of a liquid crystal panel, or for polishing the surface of a round bar made of glass or metal.

[0002]

2. Description of the Related Art For example, when a liquid crystal panel used for various display devices is manufactured, a liquid crystal panel having a large area is divided (cut) to form a small liquid crystal panel having a desired size. The edge of the liquid crystal panel 1 is shown in FIG.
As shown in (A), the corners are sharp. When the liquid crystal panel 1 having sharp corners is used, the liquid crystal panel 1
Is not preferable because the corners are likely to fall off (chip) with the conveyance of the above, which may cause the generation of glass dust, or the worker is easily injured.

Therefore, conventionally, as shown in FIG.
The chamfers 2 and 2 are performed on the divided edge portions of the liquid crystal panel 1. A device for performing such chamfers 2 and 2 has been disclosed in Japanese Patent Laid-Open No. 62-17674.
The structure described in Japanese Patent Publication No. 6 is known and is actually used.

As shown in FIGS. 3 to 4, this conventionally known surface polishing apparatus uses a plurality of annular grinding plates 3 and 4 which rotate in opposite directions to each other to form an edge of the liquid crystal panel 1. The surface of the glass material such as the edges is polished. That is, each of the ring-shaped grinding plates 3 and 4 is in a state in which a gap is provided between the adjacent ring-shaped grinding plates 3 and 4 around the pair of drive shafts 5 and 6 arranged in parallel with each other. It is fixed at. Then, the ring-shaped grinding plates 3 and 3 fixed around the one drive shaft 5 and the ring-shaped grinding plates 4 and 4 fixed to the other drive shaft 6 are positioned alternately, and one ring-shaped grinding plate The outer peripheral portions of the plates 3 and 3 are between the outer peripheral portions of the other ring-shaped grinding plates 4 and 4, and the outer peripheral portions of the other ring-shaped grinding plates 4 and 4 are the outer periphery of the one ring-shaped grinding plates 3 and 3. It is designed so that it can be inserted between the parts.

Further, the outer peripheral surfaces of the circular ring-shaped grinding plates 3 and 3 fixed to one drive shaft 5 are located on a single cylindrical surface, and the outer peripheral surfaces of the respective circular ring-shaped grinding plates 3 and 3 are made of glass. The material has a polished surface that can be polished. Similarly, the outer peripheral surfaces of the circular ring-shaped grinding plates 4 and 4 fixed to the other drive shaft 6 are positioned on a single cylindrical surface, and the outer peripheral surface of each circular ring-shaped grinding plate 4 and 4 is made of a glass material. It has a freely polished surface.

On the other hand, between the pair of drive shafts 5 and 6,
Roller conveyors 7a and 7b for transferring the liquid crystal panel 1 which is a workpiece along both drive shafts 5 and 6 are provided with the plurality of annular grinding plates 3 and 4 sandwiched therebetween. Further, the pair of drive shafts 5 and 6 are connected to belts 8 and 8 respectively.
In this way, as shown by arrows a and b in FIGS.

By the conventional surface polishing apparatus configured as described above, chamfers 2 and 2 as shown in FIG. 2B are applied to the edge of the liquid crystal panel 1 as shown in FIG. 2A. In this case, the liquid crystal panel 1 is placed on the roller conveyor 7a existing on one side (right side in FIG. 3) of the plurality of circular ring-shaped grinding plates 3 and 4, and the liquid crystal panel 1 is placed on the other side (in FIG. 3). Left)
It is sent in the direction indicated by arrow c in FIG.

While the liquid crystal panel 1 is being fed from the one roller conveyer 7a to the other roller conveyer 7b, the edge (lower edge) of the liquid crystal panel 1 has a plurality of edges as shown in FIG. Grinding is performed by the polishing surface formed on the outer peripheral surfaces of the ring-shaped grinding plates 3 and 4, and the chamfers 2 and 2 as shown in FIG.

When the thickness t of the liquid crystal panel 1 to be chamfered 2 and 2 is different, the distance d between the pair of drive shafts 5 and 6 is changed and one of the ring-shaped grinding plates 3 is changed. 3 and the other circular ring-shaped grinding plates 4 and 4 are changed, and the height positions of the roller conveyors 7a and 7b are adjusted.

[0010]

However, the conventional surface polishing apparatus, which is constructed and operates as described above, has the following problems.

That is, the polishing surfaces formed on the outer peripheral surfaces of the plurality of circular ring-shaped grinding plates 3 and 4 are discontinuous in the axial direction, that is, in the feed direction of the liquid crystal panel 1, and the liquid crystal panel 1 is Since the liquid is fed in the continuous direction, chipping occurs at the edge of the liquid crystal panel 1 where it abrades the polishing surface (chamfered portion).

When chipping occurs,
The liquid crystal panel 1 becomes defective and adversely affects the pattern shape of the lead-out electrode portion attached to the liquid crystal panel 1, so that the tab cannot be pressure-bonded to the lead-out electrode portion with high precision, or glass thinning caused by chipping occurs. The pieces may adhere to the surface of the liquid crystal panel 1 and damage the surface of the liquid crystal panel 1.

The surface polishing apparatus of the present invention was devised to eliminate the above-mentioned inconvenience.

[0014]

The surface polishing apparatus of the present invention, like the above-described conventional surface polishing apparatus, has a pair of members arranged in parallel with each other and rotating in opposite directions, as shown in FIG. It has drive shafts 5 and 6. However, in the case of the surface polishing apparatus of the present invention, the drive shafts 5 and 6 are replaced with the pair of grinding cylinders 9 and 10 as shown in FIG. Fixed, and the pair of grinding cylinders 9, 10
Are rotated together with the drive shafts 5 and 6 in opposite directions.

As shown in FIG. 1, each of the grinding cylinders 9 and 10 is
Helical (screw-shaped) recessed grooves 11 and 12 in opposite directions are formed at the same pitch on each outer peripheral surface.
The spiral groove 1 is thus formed on the outer peripheral surface of each grinding cylinder 9, 10.
By forming 1 and 12, the shape of the outer peripheral surface of each of the grinding cylinders 9 and 10 is formed such that the grooves 11 and 12 and the ridges 1 are formed in the axial direction.
The shape is such that 3 and 14 are present alternately.

Further, the outer peripheral surfaces of the protrusions 13 and 14 of the grinding cylinders 9 and 10 are present on a single cylindrical surface coaxial with the grinding cylinders 9 and 10. The width of the concave grooves 11, 12 on the outer peripheral surface of each grinding cylinder 9, 10 is equal to that of the ridge 1 on the outer peripheral surface of each grinding cylinder 9, 10.
The width of each of the grinding cylinders 9 and 10 is made larger than that of each of the grinding cylinders 9 and 10, and the outer peripheral ends of the ridges 14 and 13 on the outer surfaces of the other grinding cylinders 10 and 9 can freely enter the concave grooves 11 and 12 of the grinding cylinders 9 and 10. I am trying.

The outer peripheral surface of each of the ridges 13 and 14 is used as a polishing surface for polishing the surface of a material to be polished such as a glass material.

[0018]

When chamfering the edges of the liquid crystal panel 1 (FIGS. 2 to 4) by the surface polishing apparatus of the present invention configured as described above, these edges are used for the pair of grinding cylinders 9, 10
As shown in FIG. 4 (from the direction perpendicular to the paper surface in FIG. 1), the outer peripheral surfaces are pressed at the intersections thereof. However, the liquid crystal panel 1 is moved in the axial direction of the drive shafts 5 and 6 (see FIG.
There is no need to move it to the left or right). Further, the pressing force is sufficient only by the pressing force of the material to be polished such as the liquid crystal panel 1.

As described above, while the end edge of the liquid crystal panel 1 is pressed against the intersection of the outer peripheral surfaces of the grinding cylinders 9 and 10, the end edge and the drive shafts 5 and 6 are kept parallel to each other, and the pair of grindings are performed. When the cylinders 9 and 10 are rotated in opposite directions, the edge of the liquid crystal panel 1 is chamfered 2 and 2 as shown in FIG. 2B. That is, the protrusions 13 and 14 formed in a spiral shape on the outer peripheral surfaces of the grinding cylinders 9 and 10 are not only continuous in the circumferential direction but also in the axial direction of the grinding cylinders 9 and 10. Since it continues even if it goes over, it is possible to chamfer the edges 2 of the liquid crystal panel 1 without moving the liquid crystal panel 1.

In this case, since continuous force is applied to the edge of the liquid crystal panel 1, chipping does not occur at this edge.

It should be noted that a material to be polished such as a glass material can be polished without moving the material to be polished in the axial direction of the drive shafts 5 and 6, but when polishing a long material to be polished. For example, it is free to move the material to be polished in the axial direction. In this case, the material to be polished is brought into contact with the polishing cylinders 9 and 10 having spiral ridges 13 and 14 formed on the outer peripheral surfaces thereof.
When 0 is rotated, a force for feeding the polishing material in one direction acts due to the frictional force acting between the outer peripheral surface of each of the ridges 13 and 14 and the polishing material. Therefore, even when polishing a long material to be polished, it is not necessary to provide a feeding device.

When polishing the outer peripheral surface of the round bar, the friction coefficients of the outer peripheral surfaces of the protrusions 13 and 14 are slightly different, so that the rods contacting both protrusions 13 and 14 are , Is sent in the axial direction while rotating. Therefore, the outer peripheral surface of the round bar can be processed into an accurate cylindrical surface.

[0023]

Since the surface polishing apparatus of the present invention is constructed and operates as described above, it has great practical effects such as providing a good quality liquid crystal panel without causing chipping in the processed portion. .

[Brief description of drawings]

FIG. 1 is a plan view of a main part of a surface polishing apparatus of the present invention.

FIG. 2 is a cross-sectional view showing an edge of the liquid crystal panel immediately after division and a state in which the edge is chamfered.

FIG. 3 is a perspective view of a conventional surface polishing apparatus.

FIG. 4 is an AA view of FIG.

[Explanation of symbols]

 1 Liquid crystal panel 2 Chamfering 3 Circle wheel grinding plate 4 Circle wheel grinding plate 5 Drive shaft 6 Drive shaft 7a Roller conveyor 7b Roller conveyor 8 Belt 9 Grinding cylinder 10 Grinding cylinder 11 Recessed groove 12 Recessed groove 13 Recessed ridge 14

Claims (1)

[Scope of utility model registration request] 1. A pair of drive shafts arranged parallel to each other and rotating in mutually opposite directions, and a pair of grinding cylinders fixed to each drive shaft and rotating in opposite directions together with each drive shaft, Each grinding cylinder, by forming spiral concave grooves in mutually opposite directions on the respective outer peripheral surfaces at the same pitch as each other,
The outer peripheral surface of each grinding cylinder has a shape in which concave grooves and ridges are present alternately in the axial direction, and the outer peripheral surface of the ridge of each grinding cylinder is present on a single cylindrical surface. In addition, the surface polishing device in which the outer peripheral end portion of the protrusion on the outer peripheral surface of the other grinding cylinder can freely enter into the concave groove on the outer peripheral surface of each grinding cylinder.