JPH0744200B2 - Inner lead bonder - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an inner lead bonder for bonding inner leads formed on a carrier tape to terminals of a semiconductor chip.

[Prior Art] Conventionally, regarding an inner lead bonder for bonding an inner lead formed on a carrier tape to a terminal (electrode) of a semiconductor chip, the carrier tape is transferred to a bonding position and locked, and the locked reference side 2. Description of the Related Art A so-called tape reference type bonder has been known in which terminals of a semiconductor chip are positioned and aligned with an inner lead formed on the carrier tape to bond them.

For example, in JP-A-58-165335, the position pattern of the inner leads formed on the carrier tape is detected from above the carrier tape which is transferred to the bonding position and locked, and the inner lead is moved to the chip supply position. A camera for detecting the position pattern of the semiconductor chip from above the semiconductor chip supplied on the bonding stage, and a bonding sage supplied with the semiconductor chip moved to the chip supply position to the bonding position. At the same time, the position of the bonding stage is corrected based on the correction value obtained by comparing the position pattern of the inner lead detected by the camera with the position pattern of the semiconductor chip, and the terminals of the semiconductor chip are positioned and aligned with the inner lead. (Precision positioning) A stage movement controller that moves from above the carrier tape is locked down,
An inner lead bonder including an inner lead that is positioned and aligned with each other and a bonding tool that bonds a terminal of a semiconductor chip is disclosed.

[Problems to be Solved by the Invention] However, this known bonder is mounted on a bonding stage which is moved to a chip supply position on a side of a locked carrier tape (a position where the carrier tape does not interfere). When trying to detect the position pattern of the supplied semiconductor chip, move the camera from the position that detects the position pattern of the inner leads formed on the locked carrier tape to the chip supply position, that is, mutually. Since two position patterns at different positions are detected by a common camera, the camera has to be moved each time they are detected, and therefore the speed of position pattern detection is poor. At the same time, the bonding stage reciprocates between the bonding position and the chip supply position. Since it was carried out via the XY table which was also used for precision positioning, its quickness was inferior.

In addition, since the stage movement control device is composed of a rotary stage and an XY stage mounted on a rotary table so that the bonding stage can be reciprocated in the horizontal direction, a semiconductor chip-supplied bonding When the stage is moved from the chip supply position to the bonding position and its position is corrected to align and align the semiconductor chip terminals with the inner leads, compare the upper inner leads and the lower semiconductor chip terminals. A large gap is formed, and as it is,
When the bossing tool is moved downward from above the carrier tape to bond them, the carrier tape is locally pushed downward and deformed into a V shape, so that precise bonding is difficult.

The present invention pays attention to such drawbacks of the prior art, and as a result of intensive studies to improve such drawbacks, as a result, a tape position detection camera for detecting the position pattern of the inner leads, and a semiconductor chip supplied on the bonding stage. Two cameras, a chip position detection camera that detects the position pattern, and a stage movement control device are mounted on the XY table so as to extend in the direction connecting the bonding position and the chip supply position. Slide table mounted so that it can be reciprocated by being guided by a rail,
A cylinder mounted on the XY table so that the slide table can reciprocate, and a stage mounted on the rotary table so that the rotary table mounted on the slide table and the bonding stage can be moved up and down while keeping horizontal. By configuring with the lifting cam mechanism,
It has been found that the bonding accuracy and the bonding cycle can be further improved.

[Means for Solving the Problems] That is, the inner lead bonder according to the present invention detects the position pattern of the inner lead formed on the carrier tape from above the carrier tape which is transported to the bonding position and locked. A tape position detection camera, a chip position detection camera for detecting the position pattern of the semiconductor chip from above the semiconductor chip supplied on the bonding stage being moved to the chip supply position, the bonding position and the chip The bonding is performed based on a correction value obtained by moving the bonding stage between the supply positions and comparing the position pattern detected by the tape position detection camera with the position pattern detected by the chip position detection camera. Stage position A stage movement control device that performs a correction to position and align the terminals of the semiconductor chip with respect to the inner lead, and an inner lead and a semiconductor chip that move from above the carrier tape to below and are aligned and aligned with each other. Equipped with a boding tool for bonding with terminals,
And, the stage movement control device, a slide table mounted so as to be guided and moved by a rail mounted on an XY table so as to be extended in a direction connecting the bonding position and the chip supply position, A cylinder mounted on the XY table so as to reciprocate the slide table, a rotary table mounted on the slide table, and the rotation so that the bonding stage can be moved up and down while being kept horizontal. It is characterized in that it is composed of a stage lifting cam mechanism mounted on a table.

[Operation] In FIG. 1, the carrier tape 9 delivered by the rotation of the supply reel 8 of the tape supply device 1 is suspended and stored in a U-shape by the first tape loosening device 11, and
From here, it is intermittently transferred to the bonding position A by the tape transfer device 3 and locked by a tape lock device (not shown). Then, the tape position detection camera 6 (first
The position pattern of the inner leads formed on the carrier tape 9 is detected by the right side view of FIG. 2).

On the other hand, as shown in FIG. 2, when a semiconductor chip is supplied by the chip supply device 5 onto the bonding stage 4 which has been moved to the chip supply position B on the left side of the carrier tape 9, the chip position is detected. The position pattern of the semiconductor chip is detected by the camera 7 for use, and then
The bonding stage 4 is moved to the bonding position A and positioned below the carrier tape 9 by the stage movement control device 25 (see FIG. 3).

Then, the position of the bonding stage 4 is corrected based on the correction value obtained by comparing the position pattern detected by the tape position detecting camera 6 with the position pattern detected by the chip position detecting camera 7. The terminals (electrodes) of the chip are positioned and aligned with the inner leads, and the bonding stage 4 is moved upward to lightly contact the terminals of the semiconductor chip with the inner leads of the carrier tape 9.

Then, the boding tool 19 moved from the standby position to the boding position A moves downward to perform thermocompression bonding, that is, bonding between the inner lead and the terminal of the semiconductor chip, and when completed, returns to the original standby position. Will be returned. Then, the lock of the carrier tape 9 by the tape lock device is released, and the carrier tape 9 is intermittently transferred by the tape transfer device 3. The carrier tape 9 that has been bonded one after another in this manner is
The tape is taken up by rotating the take-up reel 10 of the tape take-up device 2 via the second tape loosening device 14.

[Embodiment] An embodiment of the present invention will be described below. In FIG. 1 which is a front view of an inner lead bonder and FIG. 2 which is a right side view of FIG. 1, this bonder is a tape feeding device. 1, a tape transfer device 3, a bonding stage 4, a chip supply device 5, a tape position detection camera 6 and a chip position detection camera 7 between the tape winding device 1 and the tape winding device 2.
And the like are arranged.

First, the tape supply device 1 will be described. The device 1 includes a supply reel 8 rotated by an electric motor (not shown), and a carrier tape 9 to be bonded is delivered from the reel 8. On the other hand, the tape winding device 2 includes a winding reel 10 rotated by an electric motor (not shown), and winds the carrier tape 9 that has been bonded onto the reel 10.

The carrier tape 9 sent from the supply reel 8
Is transported through the first tape loosening device 11, which is equipped with a pair of tape guide rollers 12a, 12b and first and second tape detectors 13a, 13b and is delivered from the supply reel 8. The carrier tape 9 is suspended in a U shape and can be stored.

Further, the carrier tape 9 which has been wound on the take-up reel 10 and which has been bonded is transported through the second tape loosening device 14, which is loosened by a pair of tape guide rollers 15a and 15b and a third tape loosening device. The four tape detectors 16a and 16b are provided so that the carrier tape 9 transferred from the bonding position A side can be suspended and stored in a U-shape.

The first tape detector 13a of the first tape loosening device 11 and the third tape detector 16a of the second tape loosening device 14 are provided to prevent the tape storage length from becoming less than the specified value. Second tape detector 13b and fourth tape detector 1
6b is provided to prevent it from exceeding the regulation.

Next, as shown in FIG. 1, the tape transfer device 3 has a first tape gripper 1 mounted between the bonding position A and one tape guide roller 12b.
7a, bonding position A and the other tape guide roller
A second tape gripper 17b is mounted between 15a, and grips the carrier tape 9 with both grippers 17a and 17b and moves them together for a predetermined distance to move the carrier tape 9 to the tape guide roller 12b side. To the bonding position A, and the tape transfer is performed intermittently.

Both grippers 17a, 17b are provided in an open / close chuck type, and therefore can be returned together to the original position when the carrier tape 9 is released. At that time, the carrier tape 9 is locked by the first and second return tape locking devices 18a and 18b.
In addition, although not shown, a tape lock device for bonding is mounted at the bonding position A.

The tape lock device for this bonding is designed for both grippers 17
When a and 17b are returned to their original positions together (returned to the state shown in FIG. 1), the carrier tape 9 is locked. Then, the lock by the return first and second tape lock devices 18a and 18b is released. When both grippers 17a and 17b grip the carrier tape 9 at the position shown in FIG. 1 and move to the right, the tape locking device for bonding releases the lock.

Thus, the first and second tape lock devices 18 for return
The a, 18b and the tape lock device for bonding are mounted so as to be controlled in a predetermined relationship with the reciprocating movements of the two grippers 17a, 17b. Therefore, the carrier tape 9 to be bonded is intermittently mounted. By transferring, the inner lead portion formed on the carrier tape 9 can be positioned at the bonding position A and locked in that state.

Further, the tape locking device for bonding mounted at the bonding position A has a hindrance for the bonding tool 19 (see FIG. 2) to move toward the locked lower carrier tape 9 for bonding. The bonding tool 19
Is a bonding position when the tape position detecting camera 6 detects the position pattern of the inner leads formed on the locked carrier tape 9 mounted so as to be movable in the left-right direction in FIG. When it is moved to the right of A to stand by and is bonded, it is moved to the bonding position A.

The bonding tool 19 is
The inner leads formed on the carrier tape 9 are
A heater such as a sheath heater is attached to press the semiconductor chip terminals (electrodes) at a predetermined temperature, and a heat insulating material is attached to prevent heating of the parts other than the tip. ing. Also, the bonding position A
The vertical movement is performed by a cam mechanism or the like.

Next, as shown in FIG. 2, the chip supply device 5 attracts the semiconductor chips mounted on the tray 20 and supplies the semiconductor chips onto the bonding stage 4.
Each time the bonding stage 4 is moved to the left side of the locked carrier tape 9, the movable arm 21 is swung at a predetermined angle with the axis 22 as a fulcrum so that the semiconductor chip is mounted on the bonding stage 4. Reprint.

The bonding stage 4 is mounted on the stage movement control device 25, as shown in FIG.
The movement control device 25 horizontally reciprocates between the bonding position A and the chip supply position B, but is positioned below the carrier tape 9 at the bonding position A. Therefore, from the bonding position A to the chip supply position B
A semiconductor chip is supplied by the chip supply device 5 onto the bonding stage 4 which has been moved to, and then the stage 4 is moved to the bonding position A, whereby the semiconductor chip can be transferred below the carrier tape 9. .

Further, the stage movement control device 25 controls the bonding position A
XY so that it is extended in the direction that connects the
A slide table 28 mounted so as to be guided and moved by a rail 27 mounted on the table 26, a cylinder 29 mounted on the XY table 26 so as to reciprocate the table 28, and a slide table 28. The rotary table 30 is mounted on the rotary table 30, and the stage elevating cam mechanism 31 is mounted on the rotary table 30 so that the bonding stage 4 can be moved up and down horizontally.

The stage lifting cam mechanism 31 includes a bracket 32 attached to the rotary table 30, a rail 33 attached to the bracket 32, a cylinder 34, and a guide bracket 35.
A cam plate 36 that is attached to the tip of the piston rod of the cylinder 34 and that is slidably engaged with the rail 33, and a spring 37 that has a lower end locked to the bracket 32 and an upper end locked to the bonding stage 4. Consists of, in addition,
A roller 38 is mounted so that the bonding stage 4 is guided by a guide bracket 35 so as to be able to move up and down and is urged downward by a spring 37 so as to be rotatable at its lower end side. It is pressed against the cam surface of the plate 36.

Therefore, by operating the cylinder 34 and moving the cam plate 36, the bonding stage 4 can be moved up and down with high accuracy while keeping it horizontal, so that the semiconductor lead with respect to the inner lead formed on the carrier tape 9 above can be moved. The terminals of the chip can be precisely positioned in the vertical direction.

Further, by operating the cylinder 29 and moving the slide table 28, the bonding stage 4 can be quickly moved between the bonding position A and the chip supply position B, so that the bonding cycle can be shortened. it can.

Further, in a state where the semiconductor chips are transferred below the carrier tape 9 (a state where the semiconductor chips are transferred from the chip supply position B to the bonding position A), the XY table 26 and the rotary table 30 are driven to form the carrier tape 9. Since it is possible to perform positioning alignment (precision positioning) of the terminals of the semiconductor chip with respect to the formed inner leads, it is possible to perform bonding with high accuracy.

Note that such positioning alignment (precision positioning) is performed by using the position pattern detected by the tape position detection camera 6,
Although it is performed based on the correction value obtained by comparing with the position pattern detected by the chip position detection camera 7,
Both cameras 6 and 7 are mounted on a bracket 40. In FIG. 1, both cameras 6 and 7 have a bonding position A.
2 in the front-back direction, that is, as shown in FIG. 2, the chip position detection camera 7 is arranged at the chip supply position B on the left side of the tape position detection camera 6 arranged at the bonding position A. Has been done.

Further, FIGS. 4 to 7 show the manner of detecting the position pattern by these cameras. 4 and 5 show the manner of detecting the position pattern by the tape position detecting camera 6, and FIGS. 6 and 7 show that by the chip position detecting camera 7.

In FIG. 4, a plurality of alignment marks 42 are formed on the inner lead portion 41 formed on the carrier tape 9, but the tape position detecting camera 6 is shown enlarged in FIG. , A pair of alignment marks placed on the diagonal connecting each corner
42 is detected (hatched portion is detected). Similarly, as shown in FIG. 6, a plurality of alignment marks 44 are formed on the semiconductor chip 43, but the chip position detection camera 7 is shown enlarged in FIG. Then, a pair of alignment marks 44 arranged on a diagonal line connecting the respective corners is detected (hatched portions are detected).

Thereafter, these detected position patterns are subjected to image processing to obtain a correction value, and based on this, the positioning alignment (precision positioning) is performed by the stage movement control device 25 as described above. Prior to the detection of this position pattern, the tape position detection camera 6 detects the entire appearance of the inner lead portion 41 and compares it with a set reference pattern to determine whether it is good or bad, and at the same time, a chip position detection camera. The whole appearance of the semiconductor chip 43 is detected by 7, and the same judgment is made.

Then, by the detection by the tape position detection camera 6,
When it is determined that the carrier tape 9 is defective, the carrier tape 9 is unlocked, the tape is transferred by the tape transfer device 3, and the next inner lead portion 41 is transferred to the bonding position A and locked. When the chip position detection camera 7 detects that the semiconductor chip 43 is defective, the semiconductor chip 43 on the bonding stage 4 is adsorbed by the chip supply device 5 and accommodated in an appropriate recovery tray (not shown). .

On the other hand, if all are judged to be good, they are bonded. That is, the bonding stage 4 that has been moved to the chip supply position B and supplied with the semiconductor chip 43 is quickly moved to the bonding position A by the operation of the cylinder 29 of the stage movement control device 25, and the carrier tape 9 is locked. Is moved below
By driving the XY table 26 and the rotary table 30 based on the correction values, the terminals of the semiconductor chip 43 are aligned and aligned (precision positioning) with respect to the inner leads formed on the carrier tape 9, and the cylinder 34 is operated. The terminals of the semiconductor chip 43 are vertically positioned with respect to the inner leads formed on the upper carrier tape 9 while being kept horizontal.

Subsequently, the bonding tool 19 is moved from the standby position to the bonding position A, and then moved downward to perform bonding. Further, when the bonding is completed in this way, the bonding tool 19 is moved to the original standby position, then the bonding stage 4 is lowered, and subsequently, the bonding position A is moved from the bonding position A to the chip supply position B. After the lock is released and the carrier tape 9 is transferred, thereafter, the same steps can be performed to perform the bonding one after another.

Thus, the tape position detection camera 6 for detecting the position pattern of the inner leads formed on the locked carrier tape 9 and the chip for detecting the position pattern of the semiconductor chip 43 supplied on the bonding stage 4. Two cameras, a position detection camera 7 and a position pattern detected by the tape position detection camera 6 and chip position detection are performed while the bonding stage 4 is moved between the bonding position A and the chip supply position B. A stage movement control device 25 for performing position correction of the bonding stage 4 based on a correction value obtained by comparing with the position pattern detected by the camera 7 for positioning and aligning the terminals of the semiconductor chip 43 with the inner leads. , In the direction connecting the bonding position A and the chip supply position B A slide table 28 that is mounted so as to reciprocate while being guided by rails 27 mounted on an XY table 26 as long, the slide table 28
Cylinder 27 mounted on XY table 26 so as to reciprocate, and rotary table 30 mounted on slide table 28 and bonding stage 4 on rotary table 30 so that they can be moved up and down while being kept horizontal. Since it is configured with the mounted stage lifting cam mechanism 31, it is possible to further improve the bonding accuracy and the bonding cycle. In FIG. 1, reference numeral 45 denotes a monitor, on which the images detected by the cameras 6 and 7 are projected.

EFFECTS OF THE INVENTION As described above, according to the present invention, the tape carrier is transferred to the bonding position and locked, and the terminals of the semiconductor chip are connected to the inner leads formed on the locked reference side tape carrier ( Regarding a so-called tape reference type inner lead bonder in which electrodes are positioned and aligned and bonded to each other, it is possible to obtain an inner lead bonder capable of further improving the bonding accuracy and the bonding cycle.

[Brief description of drawings]

FIG. 1 is a front view of an inner lead bonder, FIG. 2 is a right side view of FIG. 1, FIG. 3 is a front view showing a mounting mode of a bonding stage, and FIG. 4 is a plan view of a carrier tape.
FIG. 5 is a plan view showing a detection mode of an alignment mark formed on a carrier tape, FIG. 6 is a plan view of a semiconductor chip, and FIG. 7 is a plan view showing a detection mode of an alignment mark formed on a semiconductor chip. It is a figure. A ... Bonding position B ... Chip supply position 4 ... Bonding stage 6 ... Tape position detection camera 7 ... Chip position detection camera 9 ... Carrier tape 19 ... Bonding tool 25 ... Stage movement controller 26 ...... XY table 27 …… Rail 28 …… Slide table 29 …… Cylinder 30 …… Rotary table 31 …… Stage lifting cam mechanism 43 …… Semiconductor chip

Claims (1)

[Claims] 1. A tape position detection camera for detecting a position pattern of inner leads formed on the carrier tape from above the carrier tape which is transferred to a bonding position and locked, and is moved to a chip supply position. A chip position detection camera for detecting the position pattern of the semiconductor chip from above the semiconductor chip supplied onto the bonding stage, and moving the bonding stage between the bonding position and the chip supply position and detecting the tape position. The position of the bonding stage based on a correction value obtained by comparing the position pattern detected by the camera for position detection with the position pattern detected by the camera for detecting the chip position, and the terminal of the semiconductor chip Rank against lead And a stage movement control device for determining and aligning the carrier tape, and a boarding tool that moves the carrier tape from above to below and bonds the inner leads and the terminals of the semiconductor chip which are aligned and aligned with each other, and the stage A slide table mounted so that the movement control device can be guided and moved by a rail mounted on an XY table so as to be extended in a direction connecting the bonding position and the chip supply position, and the slide table. Cylinder mounted on the XY table so as to be able to reciprocate, a rotary table mounted on the slide table, and mounted on the rotary table so that the bonding stage can be moved up and down while keeping it horizontal. And a stage lifting cam mechanism Over lead bonder.