JPH0744024Y2 - 半導体セラミック・パッケージ用窓枠状ろう材付き封着板 - Google Patents
半導体セラミック・パッケージ用窓枠状ろう材付き封着板Info
- Publication number
- JPH0744024Y2 JPH0744024Y2 JP1987047978U JP4797887U JPH0744024Y2 JP H0744024 Y2 JPH0744024 Y2 JP H0744024Y2 JP 1987047978 U JP1987047978 U JP 1987047978U JP 4797887 U JP4797887 U JP 4797887U JP H0744024 Y2 JPH0744024 Y2 JP H0744024Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing plate
- window frame
- brazing material
- alloy
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims description 33
- 238000005219 brazing Methods 0.000 title claims description 31
- 239000000463 material Substances 0.000 title claims description 22
- 239000000919 ceramic Substances 0.000 title claims description 18
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 238000004080 punching Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 229910015363 Au—Sn Inorganic materials 0.000 claims description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910017709 Ni Co Inorganic materials 0.000 claims description 3
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 239000000945 filler Substances 0.000 description 8
- 229910000531 Co alloy Inorganic materials 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987047978U JPH0744024Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体セラミック・パッケージ用窓枠状ろう材付き封着板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987047978U JPH0744024Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体セラミック・パッケージ用窓枠状ろう材付き封着板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63155642U JPS63155642U (enrdf_load_stackoverflow) | 1988-10-12 |
| JPH0744024Y2 true JPH0744024Y2 (ja) | 1995-10-09 |
Family
ID=30869085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987047978U Expired - Lifetime JPH0744024Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体セラミック・パッケージ用窓枠状ろう材付き封着板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744024Y2 (enrdf_load_stackoverflow) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS626693Y2 (enrdf_load_stackoverflow) * | 1981-06-23 | 1987-02-16 | ||
| JPS61191480A (ja) * | 1985-02-20 | 1986-08-26 | 本田技研工業株式会社 | 動力起立スタンド |
| JPS61239648A (ja) * | 1985-04-16 | 1986-10-24 | Mitsubishi Metal Corp | 半導体パッケ−ジ用窓枠状ろう材付封着板 |
| JPS61183471U (enrdf_load_stackoverflow) * | 1985-05-07 | 1986-11-15 |
-
1987
- 1987-03-31 JP JP1987047978U patent/JPH0744024Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63155642U (enrdf_load_stackoverflow) | 1988-10-12 |