JPH0738026A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPH0738026A JPH0738026A JP17908193A JP17908193A JPH0738026A JP H0738026 A JPH0738026 A JP H0738026A JP 17908193 A JP17908193 A JP 17908193A JP 17908193 A JP17908193 A JP 17908193A JP H0738026 A JPH0738026 A JP H0738026A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- electronic component
- soft copper
- tip end
- glass pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ガラス管、セラミック
管等の中空部材中に電子部品素子を封入してなる電子部
品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component in which an electronic component element is enclosed in a hollow member such as a glass tube or a ceramic tube.
【０００２】[0002]
【従来の技術】例えば、ダイオードにおいて、その成形
品は一般にパッケージの種類によりガラス封止型と樹脂
封止型とに大別される。上記ガラス封止型のダイオード
は、樹脂封止型のものに比して、耐湿性に優れるという
特性上のメリットと構造上容易に且つ低コストで製造で
きるという製造上のメリットがある。2. Description of the Related Art For example, in a diode, its molded product is generally classified into a glass sealing type and a resin sealing type according to the type of package. The glass-sealed diode has a characteristic merit that it is excellent in moisture resistance and a manufacturing merit that it can be manufactured easily and at low cost in comparison with a resin-sealed diode.
【０００３】このようなガラス封止型のダイオードは、
例えば、図４に示すように、凸部と該凸部を支持する鍔
部を有する硬質の金属性リード線１１ａ，１１ｂを、そ
の凸部の先端がガラス管１２中のダイオード素子１３と
接続するように上記ガラス管１２の両端開口部より挿入
し、これを高温処理（例えば約６８０℃）してガラス管
１２とリード線１１ａ，１１ｂとを融着させ上記ダイオ
ード素子１３をガラス管１２中に気密封止して製造され
ている。Such a glass-sealed diode is
For example, as shown in FIG. 4, hard metallic lead wires 11a and 11b having a convex portion and a collar portion supporting the convex portion are connected to the diode element 13 in the glass tube 12 at the tip of the convex portion. As described above, the glass tube 12 is inserted through the openings at both ends thereof, and the glass tube 12 and the lead wires 11a and 11b are fused to each other by subjecting the glass tube 12 to a high temperature treatment (for example, at about 680 ° C.) so that the diode element 13 is inserted into the glass tube 12. It is manufactured by hermetically sealing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記ダ
イオード素子には、例えばショットキーバリアダイオー
ド素子において漏れ電流を低減する等の特性向上のため
にモリブデンをバリアメタルに用いたもの等、高温に供
すことにより特性が変化したり劣化したりするものや、
素子構成材料として低融点物質が用いられているものが
あり、このようなダイオード素子は、高温処理の工程が
必要とされるガラス封止型には適用できず、専ら樹脂封
止型として用いられている。However, the diode element should be exposed to high temperature, for example, a Schottky barrier diode element using molybdenum as a barrier metal in order to improve characteristics such as reduction of leakage current. The characteristics may change or deteriorate due to
Some element materials use low melting point substances, and such diode elements cannot be applied to the glass-sealed type, which requires a high temperature treatment step, and are used exclusively as a resin-sealed type. ing.
【０００５】本発明は、熱処理の必要なく電子部品素子
をガラス管等の絶縁性の中空材料に封止して電子部品を
製造する方法を提供するものである。The present invention provides a method for manufacturing an electronic component by sealing an electronic component element in an insulating hollow material such as a glass tube without the need for heat treatment.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記目的を
達成すべく鋭意研究を重ねた結果、中空部材の両端開口
部に軟性及び可塑性を有する導電性部材をそれぞれ圧入
して電子部品素子を中空部材に封入する際、上記各導電
性部材の表面に圧入方向にテーパ部を形成しておけば、
都合よく導電性部材と電子部品素子との接続が取れ且つ
電子部品素子の気密封止ができることを見出した。As a result of intensive studies to achieve the above object, the inventor of the present invention has made electronic component elements by press-fitting conductive members having flexibility and plasticity into openings at both ends of a hollow member. When enclosing in a hollow member, if a taper portion is formed in the press-fitting direction on the surface of each conductive member,
It has been found that the conductive member can be conveniently connected to the electronic component element and the electronic component element can be hermetically sealed.
【０００７】即ち、本発明は、絶縁性の中空部材の両端
開口部に、軟性且つ可塑性を有し且つ両端部に亘る表面
の一部乃至全部にテーパ部が形成されている導電性部材
を圧入して上記中空部材中に電子部品素子を封入するこ
とを特徴とする電子部品の製造方法に係るものである。That is, according to the present invention, a conductive member which is soft and plastic and has a tapered portion formed on a part or all of the surface extending over both ends is press-fitted into the opening at both ends of the insulating hollow member. Then, the present invention relates to a method for manufacturing an electronic component, characterized in that the electronic component element is enclosed in the hollow member.
【０００８】本発明における中空部材としては、例えば
ガラス、セラミック、樹脂等の絶縁性物質からなる透明
乃至不透明の管状のものを広く使用することができ、こ
れらの中でも硬質性のものがより好ましい。As the hollow member in the present invention, a transparent or opaque tubular member made of an insulating material such as glass, ceramics or resin can be widely used, and among these, a hard member is more preferable.
【０００９】本発明における導電性部材としては、その
両端部に亘る表面の一部乃至全部にテーパ部を有し、且
つ数ｋｇ／ｍｍ2〜数十ｋｇ／ｍｍ2程度の圧力で塑性変
形可能な軟性及び可塑性を有するものが使用でき、具体
的には、例えば汎用の極軟銅線、導電性樹脂成形体等の
金属及び樹脂が挙げられる。The conductive member according to the present invention has a tapered portion on a part or all of the surface extending over both ends thereof, and can be plastically deformed under a pressure of several kg / mm 2 to several tens kg / mm 2. Those having various softness and plasticity can be used, and specific examples thereof include metals and resins such as general-purpose extremely soft copper wires and conductive resin molded bodies.
【００１０】また、本発明に適用され得る電子部品素子
としては、二端子素子の全てを挙げることができ、より
具体的には、例えばダイオード、発光ダイオード、抵抗
器、コンデンサ、光センサ、温度センサ等を挙げること
ができる。The electronic component element applicable to the present invention includes all two-terminal elements, and more specifically, for example, a diode, a light emitting diode, a resistor, a capacitor, an optical sensor, a temperature sensor. Etc. can be mentioned.
【００１１】[0011]
【作用】このように、軟性且つ可塑性を有し且つ両端部
に亘る表面の一部乃至全部にテーパ部が形成されている
導電性部材を絶縁性の中空部材の開口部に圧入するの
で、導電性部材の先端面、即ち電子部品素子との接続部
が、中空部材に挿入され電子部品素子に接触するとき
に、導電性部材の表面に形成されたテーパ部が中空部材
の開口部に接触するようにしておけば、テーパ部が上記
開口部に接触して以後、導電性部材はその軟性及び可塑
性のために、開口部近傍乃至開口部より外方へ突出した
部分で主に塑性変形を起こすこととなるので、導電性部
材の先端部は僅かにしか中空部材中に入り込まず、上記
中空部材の開口部の周縁に密着するとともに必要以上に
電子部品素子を狭圧して素子破壊を生じさせることはな
い。As described above, since the conductive member having flexibility and plasticity and having the tapered portion formed on a part or all of the surface extending over the both ends is press-fitted into the opening of the insulating hollow member, the conductive member When the tip end surface of the conductive member, that is, the connecting portion with the electronic component element is inserted into the hollow member and contacts the electronic component element, the tapered portion formed on the surface of the conductive member contacts the opening of the hollow member. By doing so, after the tapered portion comes into contact with the opening, the conductive member mainly undergoes plastic deformation in the vicinity of the opening or a portion protruding outward from the opening due to its softness and plasticity. Therefore, the tip of the conductive member does not enter the hollow member only slightly, and the tip of the conductive member is closely attached to the peripheral edge of the opening of the hollow member and the electronic component element is compressed more than necessary to cause element destruction. There is no.
【００１２】[0012]
【実施例】以下、ガラス封止型ダイオードの製造におけ
る実施例を示し、本発明の特徴とするところをより詳細
に説明する。EXAMPLES Examples of manufacturing glass-sealed diodes will be shown below, and the features of the present invention will be described in more detail.
【００１３】図１及び図２において、符号１ａ、１ｂは
導電性部材としての極軟銅を、符号２は中空部材として
のガラス管を、符号３は電子部品素子としてのダイオー
ド素子を示す。In FIGS. 1 and 2, reference numerals 1a and 1b are ultra soft copper as a conductive member, reference numeral 2 is a glass tube as a hollow member, and reference numeral 3 is a diode element as an electronic component element.
【００１４】先ず、図１に示すように、ガラス管２の一
方端面開口部に、両端部に亘る表面に先端部より径が徐
々に大きくなるようテーパを形成した極軟銅１ａを、そ
の先端部より圧入して、該先端部と反対側の端部周面が
上記開口部周縁に密着させて固着する。そして、ガラス
管２の他方端面開口部よりダイオード素子３を装填し
て、その一方側電極と上記極軟銅１ａの先端面とが接触
するように搭載される。First, as shown in FIG. 1, at the opening of one end face of the glass tube 2, an extremely soft copper 1a taper is formed on the surface extending over both ends so that the diameter becomes gradually larger than that of the tip. It is further press-fitted so that the peripheral surface of the end portion on the side opposite to the tip portion is brought into close contact with and fixed to the peripheral edge of the opening portion. Then, the diode element 3 is loaded from the opening on the other end surface of the glass tube 2, and the diode element 3 is mounted so that the electrode on one side of the glass tube 2 and the tip surface of the extremely soft copper 1a come into contact with each other.
【００１５】次に、図２に示すように、上記ガラス管２
の他方端面開口部に極軟銅１ａと同様にしてテーパを形
成した極軟銅１ｂをその先端部より圧入し、その先端面
をダイオード素子３のもう一方側の電極と接続させると
ともに、極軟銅１ｂの先端部と反対側の端部周面を上記
ガラス管２の開口部周縁に密着させて極軟銅１ｂをガラ
ス管２に固着する。斯くして、ガラス封止型ダイオード
が得られるのである。Next, as shown in FIG. 2, the glass tube 2
An extremely soft copper 1b having a tapered shape similar to that of the extremely soft copper 1a is press-fitted into the other end face opening of the diode from its tip to connect the tip to the electrode on the other side of the diode element 3 and The extremely peripheral copper 1b is fixed to the glass tube 2 by closely contacting the peripheral surface of the end opposite to the tip to the peripheral edge of the opening of the glass tube 2. Thus, the glass-sealed diode is obtained.
【００１６】上記において極軟銅１ｂは、ガラス管２の
開口部に圧入する際、極軟銅１ｂの先端部がダイオード
素子３の電極に接触する直前もしくは接触したときに、
極軟銅１ｂの周面がそのテーパにより上記ガラス管２の
開口部周縁に当接するように形成されるのがよく、この
ようにすることで極軟銅１ｂとダイオード素子３とを確
実に接続できるのである。In the above, when the extremely soft copper 1b is press-fitted into the opening of the glass tube 2, immediately before or when the tip of the extremely soft copper 1b contacts the electrode of the diode element 3,
It is preferable that the peripheral surface of the extremely soft copper 1b is formed so as to abut on the peripheral edge of the opening of the glass tube 2 due to the taper. By doing so, the extremely soft copper 1b and the diode element 3 can be reliably connected. is there.
【００１７】上記実施例において、極軟銅１ａ，１ｂに
代え、図３に示すように、周面の一部にテーパ部を形成
した形状の極軟銅１ｃを用いれば、極軟銅１ｃ先端のダ
イオード素子３の搭載面を広くすることができるので、
ダイオード素子３がガラス管２の内周面と極軟銅１ｃと
の間に生じる隙間に入り込み傾いて接続不良を招くこと
を低減できるのでより好ましい。In the above embodiment, the extremely soft copper 1a, 1b is replaced with the extremely soft copper 1c having a tapered portion formed on a part of its peripheral surface as shown in FIG. Since the mounting surface of 3 can be widened,
It is more preferable because it is possible to reduce the possibility that the diode element 3 enters the gap formed between the inner peripheral surface of the glass tube 2 and the extremely soft copper 1c and is inclined to cause connection failure.
【００１８】また、上記極軟銅１ａ，１ｂ，１ｃは、必
要に応じて、圧入前もしくは圧入後に半田、錫等のメッ
キを施される。If necessary, the ultra-soft copper 1a, 1b, 1c is plated with solder, tin or the like before or after press-fitting.
【００１９】また、上記実施例では、リードレスタイプ
のガラス封止型ダイオードについて説明したが、本発明
の製造方法はリード付きタイプのガラス封止型ダイオー
ドにおいても好ましく適用できるものである。Although the leadless type glass-sealed diode has been described in the above embodiment, the manufacturing method of the present invention can be preferably applied to a lead-type glass-sealed diode.
【００２０】[0020]
【発明の効果】本発明によれば、熱処理の必要なく電子
部品素子を中空部材に封入できるので、製造工程が簡略
でき生産コストを低減でき、更にガラス封止型等の有す
る耐湿性を低下させることなく、高温に供すことにより
特性が変化したり劣化したり、素子構成材料として低融
点物質が用いられている電子部品素子であっても適用す
ることができる。よって、高信頼性及び高精度の電子部
品を提供できる。According to the present invention, since the electronic component element can be enclosed in the hollow member without the need for heat treatment, the manufacturing process can be simplified, the production cost can be reduced, and the moisture resistance of the glass-sealed mold can be lowered. It is possible to apply the present invention even to an electronic component element in which the characteristics are changed or deteriorated by subjecting it to a high temperature and a low melting point substance is used as an element constituent material. Therefore, a highly reliable and highly accurate electronic component can be provided.
【００２１】また、本発明によれば、同一の設備及び処
理条件において、電子部品素子、中空部材等の素材又は
材料を変更して製造することができる。Further, according to the present invention, it is possible to manufacture by changing the materials or materials of the electronic component element, the hollow member and the like under the same equipment and processing conditions.
【００２２】更に、熱処理工程が必要ないので、例えば
室温（２５℃）で本発明を実施するときは電子部品素子
の封入と同時或いは連続して得られる電子部品の特性の
測定及び選別が可能であり、製造ラインの合理化及び高
速化を図ることができる。Furthermore, since no heat treatment step is required, when the present invention is carried out at room temperature (25 ° C.), it is possible to measure and sort the characteristics of electronic parts obtained simultaneously with or consecutively with the encapsulation of electronic parts. Yes, the production line can be rationalized and speeded up.
【図１】実施例のガラス封止型ダイオードの製造プロセ
スを説明する断面図である。FIG. 1 is a cross-sectional view illustrating a manufacturing process of a glass-sealed diode according to an example.
【図２】実施例により得られるガラス封止型ダイオード
の断面図である。FIG. 2 is a sectional view of a glass-sealed diode obtained in an example.
【図３】他の実施例を示す断面図である。FIG. 3 is a sectional view showing another embodiment.
【図４】従来のガラス封止型ダイオードの断面図であ
る。FIG. 4 is a cross-sectional view of a conventional glass-sealed diode.
１ａ，１ｂ，１ｃ 極軟銅 ２ ガラス管 ３ ダイオード素子 1a, 1b, 1c Extremely soft copper 2 Glass tube 3 Diode element
Claims (1)
且つ可塑性を有し且つ両端部に亘る表面の一部乃至全部
にテーパ部が形成されている導電性部材をそれぞれ圧入
して上記中空部材中に電子部品素子を封入することを特
徴とする電子部品の製造方法。1. A conductive member which is soft and plastic and has a tapered portion formed on a part or all of a surface extending over both ends of the insulating hollow member is press-fitted into each opening. A method of manufacturing an electronic component, comprising encapsulating an electronic component element in a hollow member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17908193A JP2923414B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17908193A JP2923414B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0738026A true JPH0738026A (en) | 1995-02-07 |
| JP2923414B2 JP2923414B2 (en) | 1999-07-26 |
Family
ID=16059757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17908193A Expired - Fee Related JP2923414B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2923414B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6336662B1 (en) | 1998-03-26 | 2002-01-08 | Honda Giken Kogyo Kabushiki Kaisha | Tongue hooking mechanism for seat belt |
| CN113192902A (en) * | 2021-04-27 | 2021-07-30 | 中国振华集团永光电子有限公司（国营第八七三厂） | High-temperature metallurgical bonding glass passivation entity encapsulation surface-mounted diode and manufacturing method thereof |
-
1993
- 1993-07-20 JP JP17908193A patent/JP2923414B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6336662B1 (en) | 1998-03-26 | 2002-01-08 | Honda Giken Kogyo Kabushiki Kaisha | Tongue hooking mechanism for seat belt |
| CN113192902A (en) * | 2021-04-27 | 2021-07-30 | 中国振华集团永光电子有限公司（国营第八七三厂） | High-temperature metallurgical bonding glass passivation entity encapsulation surface-mounted diode and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2923414B2 (en) | 1999-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |