JPH0737743A - Manufacture of chip type coil - Google Patents

Abstract

PURPOSE:To enable manufacture without using a sputtering equipment, in the manufacturing method of a chip type coil used in an electronic circuit. CONSTITUTION:This manufacturing method consists of the following; a process for forming a conducting film 14 by printing conducting material. composed of metal organic material on the surface and through holes 13 of an insulating board 12 having the through holes 13 by printing technique such as screen printing and through hole printing, and baking the board, a process for forming a pair of terminal electrodes 16a, 16b, and a belt type coil conductor 17 by eliminating unnecessary parts of the conducting film 14 by an etching method, and a process for coating the surface of the insulating board 12 with an insulating film 19 so as to cover the upper surface of the coil conductor 17. Since the conducting film 14 is formed by using a printing machine and a baking furnace, the process is simplified and continuous formation is possible.

Description

Detailed Description of the Invention

[0001]

The present invention is used in electronic circuits,
The present invention relates to a method for manufacturing a chip coil in which a coil conductor is formed on a substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a chip type coil of this type, there has been a manufacturing method as disclosed in Japanese Patent Application Laid-Open No. 2-54903. The manufacturing method will be described below with reference to FIGS.
This will be described with reference to (j).

As shown in the figure, after forming an Ag conductor film 2 on the front and back of a substrate 1 made of insulating glass by a thin film technique such as vapor deposition, sputtering or ion plating, a resist film 3 is coated on the front and back surfaces. Then, the portions other than the terminal electrodes 4a and 4b and the coil conductor 5 are removed by an etching method.

Next, after the insulating film 6 made of polyimide or polyamide is coated on the surface of the substrate 1, the insulating film 6 at the inner end portions of the terminal electrodes 4a and 4b and the coil conductor 5 is removed by etching (exposure-development). To do. As a result, the through hole 7 is formed on the inner end portion 5a of the coil conductor.

Next, the lead conductor 8 extending from the inner end portion 5a of the coil conductor 5 to the one terminal electrode 4b is attached to the coil conductor 5.
It is formed by the same method as. Next, after the insulating film 9 is coated on the surface of the substrate 1 as a protective film, the insulating film 6 of the terminal electrodes 4a and 4b is removed by etching. Next, the substrate 1 is dicing-cut into a lattice shape to form a large number of substrates 1.

Next, the left and right side faces 1 of each of the cut substrates 1
Side electrodes are formed on a and 1b by a sputtering method to connect the terminal electrodes 4a and 4b on both surfaces of the substrate 1 to each other. Finally, the Ni-plated film 10 and the solder-plated film 11 were formed on the outer surface of the terminal electrode by electrolytic plating to form a chip coil.

[0007]

However, since the Ag conductor film 2 and the insulating film 6 are formed by a thin film technique such as a sputtering method in the above-described conventional method for manufacturing a chip coil, continuous processing is difficult and mass production is performed. Therefore, many sputtering devices are required, and the thin film technology and the etching method need to be performed several times, resulting in a complicated process and a high production cost.

The present invention solves the above conventional problems, and an object of the present invention is to provide a method for manufacturing a chip-type coil which can be manufactured at low cost without using a sputtering apparatus.

[0009]

In order to achieve the above object, the present invention is to screen a conductor material made of a metal organic material on the surface and the through hole of an insulating substrate made of a ceramic material having a through hole penetrating from the front surface to the back surface. A step of printing by printing and through-hole printing and baking to form a conductor film; a step of removing unnecessary portions of the conductor film by an etching method to form a pair of terminal electrodes and a strip-shaped coil conductor; And a step of coating the surface of the insulating substrate with a resin-based insulating film so as to cover the upper surface of the coil conductor.

[0010]

According to the present invention, the conductor film can be continuously formed by the printing machine and the belt type continuous firing furnace, and the etching process is performed only once, so that the manufacturing process can be simplified.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1A, reference numeral 12 is an insulating substrate having a through hole 13 before being cut,
It is made of glass, crystallized glass, alumina or the like, and after cleaning, both surfaces are mirror-polished.

Next, the upper surface and the back surface of the insulating substrate 12 and the through holes 13 are printed with a printing material such as a screen printing method and a through hole printing method using a conductive material made of a metal organic material containing Au as a main component, dried, and then dried. Only the organic component of the electrode paste consisting of organic matter was blown off, and a belt type continuous firing furnace was used to obtain a temperature of 850 ° C. (peak time 6 minutes, I
By firing with a profile of N-OUT time 45 minutes), only the metal component is baked on the insulating substrate 12 to form the conductor film 14 (see FIG. 1B).

Next, in order to remove unnecessary portions of the conductor film 14, a resist film 15 is coated on the upper surface and the back surface, and then a pair of terminal electrodes 16a and 16b, a strip-shaped coil conductor 17, a through hole 13 on the back surface and terminals. Etching is performed so as to leave the conductor 18 connecting the electrodes (FIG. 1).
(See (c) and (d)).

Next, except for the terminal electrodes 16a and 16b, an insulating film 19 made of polyimide or polyamide is screen-printed on the surface of the insulating substrate 12 so as to cover the upper surface of the coil conductor 17, and is thermally cured and coated (see FIG. 1
(See (e)).

Next, the insulating substrate 12 is diced and cut into a lattice pattern to form a large number of insulating substrates 12, and Ni side electrodes are formed on the left and right side surfaces 20a and 20b of the cut insulating substrate 12 by sputtering. , The terminal electrodes 16a and 16b on both surfaces of the insulating substrate 12 are connected to each other (see FIG. 1 (f)).

Finally, in order to prevent electrode erosion during soldering and to ensure reliability during soldering, the exposed surfaces of the terminal electrodes 16a and 16b are plated with Ni plating film 21 and Sn. -Pb plating film 22 is formed (see FIG. 1 (g)).

As described above, according to the method of manufacturing the chip type coil of this embodiment, the coil conductor 17 is formed by etching a conductive material made of a metal organic material by a screen printing technique as in the thin film technique such as sputtering. Since it is formed as described above, it is possible to form a fine pattern as in the conventional case, and since the conductor film 14 is continuously formed by a printing machine and a belt type continuous firing furnace, productivity can be improved.

In the above embodiment, the conductive material made of a metal organic material is formed on the insulating substrate 12 having the through holes 13 by a printing technique such as screen printing. However, the insulating material is not limited to the insulating substrate 12 and may be, for example, a conventional one. It goes without saying that the production efficiency of the chip-type coil can be significantly improved by applying this method even if the conductor pattern is formed by the thin film technique.

Although the firing temperature of the metal organic electrode paste is 850 ° C., the firing temperature is not limited to 850 ° C.

Further, although the metal-organic electrode paste uses a conductor material containing Au as a main component, it may be Ni-based or other noble metal-based material, and any metal-organic conductor material may be used.

[0022]

As is apparent from the above embodiments, in the method for manufacturing the chip coil of the present invention, the conductor material is printed on the surface of the insulating substrate and the through holes by screen printing and through hole printing and baked to form a conductor film. A step of forming, a step of removing an unnecessary portion of the conductor film by an etching method to form a pair of terminal electrodes and a strip-shaped coil conductor,
And a step of coating a resin-based insulating film on the surface of the insulating substrate so as to cover the upper surfaces of the terminal electrodes and the coil conductors. This manufacturing method does not use a sputtering device, but a printer and a belt-type continuous firing. A thin film conductor film can be continuously formed by a furnace, and the etching process only needs to be performed once, so that the manufacturing process can be simplified and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a process diagram showing a method for manufacturing a chip coil according to an embodiment of the present invention.

FIG. 2 is a process diagram showing a conventional method for manufacturing a chip coil.

[Explanation of symbols]

 12 Insulating Substrate 13 Through Hole 14 Conductor Film 16a, 16b Terminal Electrode 17 Coil Conductor 19 Insulating Film

Claims (1)

[Claims] 1. A conductor film is formed by printing a conductor material made of a metal organic material on the surface and a through hole of a ceramic material having a through hole penetrating from the front surface to the back surface by screen printing and through hole printing, respectively, and firing the conductive material. A step of forming, a step of removing an unnecessary portion of the conductor film by an etching method to form a pair of terminal electrodes and a strip-shaped coil conductor, and a step of forming the pair of terminal electrodes and the coil conductor so as to cover the upper surfaces of the insulating substrate. A method for manufacturing a chip coil, comprising a step of coating a resin-based insulating film on the surface.