JPH0736466B2 - Laser board external processing method - Google Patents
Laser board external processing methodInfo
- Publication number
- JPH0736466B2 JPH0736466B2 JP62150422A JP15042287A JPH0736466B2 JP H0736466 B2 JPH0736466 B2 JP H0736466B2 JP 62150422 A JP62150422 A JP 62150422A JP 15042287 A JP15042287 A JP 15042287A JP H0736466 B2 JPH0736466 B2 JP H0736466B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- substrate
- outer shape
- wiring board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、レーザーによる印刷配線板用の絶縁基板の
外形加工法に関する。Description: TECHNICAL FIELD The present invention relates to a laser processing method for an outer shape of an insulating substrate for a printed wiring board.
印刷配線板は、回路部品を接続する電気配線を、回路設
計に基いて配線図形に表現し、これをフォト・エッチン
グ法などの技術によって、絶縁基板上に導電パターンを
形成した板であり、配線と部品搭載の両機能を持ってい
るものである。A printed wiring board is a board in which electrical wiring that connects circuit components is expressed in a wiring pattern based on the circuit design, and a conductive pattern is formed on an insulating substrate by a technique such as photo etching. It has both functions of mounting and parts.
この印刷配線板の製造工程においてこの基板の外形加工
は、所定の基板材料を型抜き装置の金型により打抜いて
行っている。In the manufacturing process of this printed wiring board, the outer shape processing of this substrate is performed by punching a predetermined substrate material with a die of a die cutting device.
しかしながら、この金型による基板の外形加工では、金
型を準備しなくてはならず、その金型の製造に費用と時
間とを要し、複雑な形状の回路基板および基板樹脂の厚
み10μｍ以下の薄い基板を金型による型抜きに適用する
ことが難しく、更に、製作する必要の無くなった形状に
対する金型が不要となり、経済的ではない。However, in the outer shape processing of the board by this mold, the mold has to be prepared, the cost and time are required for the manufacture of the mold, and the thickness of the circuit board and the board resin having a complicated shape is 10 μm or less. It is difficult to apply such a thin substrate to die cutting with a die, and a die for a shape that does not need to be manufactured is unnecessary, which is not economical.
この発明は上述の背景に基づいてなされたものであり、
その目的とするところは、金型の製作に必要な費用や時
間を要せず、複雑な形状の基板の外形加工が可能であ
り、厚みが10μｍ以下の薄物をも確実に外形加工するこ
とのできる方法を提供することである。The present invention has been made based on the above background,
The purpose is to enable the external processing of substrates with complicated shapes without the expense and time required to manufacture molds, and to reliably perform external processing of thin objects with a thickness of 10 μm or less. It is to provide a possible method.
本発明者らは、上記の課題を解決するために種々の検討
を加えた結果、外形の加工にレーザーを使用すれば複雑
な形状でも、また、薄いものでも良好に切断し得るとの
知見を得た。しかしながら、レーザーによって焼き切る
ために基板樹脂の炭化物が外周に残り、この導電性の炭
化物が回路の導電性パターン間に跨り、回路を短絡させ
る恐れがある。本発明者はさらに検討して炭化物除去に
O2プラズマ処理を応用すれば、発明の目的達成に有効で
あることを見出し、この発明の完成するに至った。As a result of various studies to solve the above problems, the present inventors have found that if a laser is used for processing the outer shape, even a complicated shape and a thin one can be satisfactorily cut. Obtained. However, the carbide of the substrate resin remains on the outer periphery because it is burnt out by the laser, and this conductive carbide may extend between the conductive patterns of the circuit and short-circuit the circuit. The present inventor has further studied to remove carbides.
It was found that the application of O 2 plasma treatment is effective in achieving the object of the invention, and the present invention has been completed.
すなわち、この発明の配線基板の外形加工法は、例え
ば、フレキシブル配線板などの印刷配線板用絶縁基板材
料をレーザーにより所定の外形に切断し、外形切断され
た基板用材料をO2プラズマ処理してレーザー切断により
生じた基板樹脂の炭化物を除去することを特徴とするも
のである。That is, the wiring board outer shape processing method of the present invention is, for example, cutting an insulating substrate material for a printed wiring board such as a flexible wiring board into a predetermined outer shape by a laser, and subjecting the cut outer shape substrate material to O 2 plasma treatment. To remove the carbide of the substrate resin generated by laser cutting.
この発明の好ましい態様において、O2プラズマ処理され
る外形切断後の基板用材料を超音波洗浄処理されたもの
とすることができる。In a preferred embodiment of the present invention, the substrate material after the outer shape cutting which is subjected to O 2 plasma treatment may be subjected to ultrasonic cleaning treatment.
以下、この発明を、より詳細に説明する。The present invention will be described in more detail below.
この発明において用いられる印刷配線用絶縁基板材料の
種類としては、通常にこの材料に用いられるものであ
り、その様なものとして、例えばフェノール樹脂、エポ
キシ樹脂、塩化ビニル樹脂、ポリカーボネート樹脂、ポ
リイミド樹脂、ポリエステル樹脂などの樹脂、およびこ
れらの樹脂と紙、布、およびガラス布などの基材と積層
体などがある。The type of the printed wiring insulating substrate material used in the present invention is one normally used for this material, and as such, for example, phenol resin, epoxy resin, vinyl chloride resin, polycarbonate resin, polyimide resin, Examples include resins such as polyester resins, and substrates and laminates such as these resins and paper, cloth, and glass cloth.
この発明において、基板材料がレーザーにより外形加工
される。レーザーの種類は、加工法、被加工材料などに
応じて適宜選択することができ、その様な具体例とし
て、CO2レーザー、アルゴンイオン・レーザー、ルビー
・レーザー、YAGレーザー、エキシマレーザーなどがあ
る。In the present invention, the substrate material is contoured by a laser. The type of laser can be appropriately selected depending on the processing method, the material to be processed, etc., and specific examples thereof include CO 2 laser, argon ion laser, ruby laser, YAG laser, excimer laser, etc. .
レーザーによる加工は、種々の態様により実施すること
ができる。例えば、第２図に示すように、レーザービー
ム照射器２、自動Ｘ−Ｙ軸移動テーブル３、およびこれ
らの運転を制御する制御手段４を備えたレーザー切断装
置１を用いて加工を行うことができる。この態様では、
先ず、自動Ｘ−Ｙ軸移動テーブルに印刷配線用絶縁基板
材料５を載せ、レーザービーム６を照射しながらテーブ
ル３を動かしてその材料を所定の外形状に成形する。The laser processing can be carried out in various modes. For example, as shown in FIG. 2, machining can be performed using a laser beam irradiator 2, an automatic X-Y axis movement table 3, and a laser cutting device 1 having a control means 4 for controlling the operation of these. it can. In this aspect,
First, the printed wiring insulating substrate material 5 is placed on the automatic XY axis moving table, and the table 3 is moved while irradiating the laser beam 6 to form the material into a predetermined outer shape.
この発明はこの態様に限定されず、種々の変形態様が可
能である。例えば、３次元ロボットアームの先端にレー
ザービーム照射器を設置すればレーザーによる３次元外
形加工を行うことができる。The present invention is not limited to this aspect, and various modifications are possible. For example, if a laser beam irradiator is installed at the tip of the three-dimensional robot arm, it is possible to perform three-dimensional outer shape processing by laser.
レーザーによる外形加工でのレーザーの諸条件は、その
加工条件に応じて適宜選択する、この発明において、例
えば、第一に、ビーム径をできるだけ小さくすること、
第二にビームのエネルギー密度をできるだけ大きくして
照射時間をできるだけ短くすることなどの照射条件にす
ることにより、基板樹脂炭化物の発生を少なくするなど
の利点がある。Various conditions of the laser in the outer shape processing by the laser, appropriately selected according to the processing conditions, in the present invention, for example, first, to make the beam diameter as small as possible,
Secondly, by setting the irradiation conditions such that the energy density of the beam is made as large as possible and the irradiation time is made as short as possible, there are advantages such as generation of substrate resin carbides.
レーザーにより所定の外形に切断された基板用材料は、
次いで、O2プラズマ処理される。この発明のこの処理
で、レーザー加工で生じた基板の燃焼残留物、すなわ
ち、炭化物が除去される。このプラズマ処理は、減圧下
におけるグロー放電により材料、特に高分子材料表面を
改質する手段であり、この発明におけるプラズマ処理
は、酸素によるプラズマである。プラズマ処理の条件
は、基板樹脂の炭化物が実質的に完全に除去できるよう
に選択する。The substrate material cut into a predetermined outline by a laser is
Then, O 2 plasma treatment is performed. This process of the invention removes the burning residue, or carbide, of the substrate produced by the laser processing. This plasma treatment is a means for modifying the surface of a material, especially a polymer material, by glow discharge under reduced pressure, and the plasma treatment in the present invention is plasma with oxygen. The conditions of the plasma treatment are selected so that the carbide of the substrate resin can be removed substantially completely.
第１図Ａにこの発明による一態様の工程図を示す。FIG. 1A shows a process chart of one embodiment according to the present invention.
この発明において、プラズマ処理の前に種々の前処理を
施すことができる。例えば、加工基板に既に部品が搭載
されているとき、また、導電性パターンが形成されてい
るときなどに、それらをプラズマから保護するために保
護膜を形成しておくことができる。さらに、ある程度の
炭化物を除去するために、レーザー切断された基板を超
音波洗浄処理にかけてもよい。その超音波洗浄処理での
洗浄液、洗浄時間は、被処理物の最適のものに選択する
ことが好ましい。In the present invention, various pretreatments can be performed before the plasma treatment. For example, when components are already mounted on the processed substrate, or when a conductive pattern is formed, a protective film can be formed to protect them from plasma. In addition, the laser-cut substrate may be subjected to ultrasonic cleaning to remove some carbides. The cleaning liquid and cleaning time in the ultrasonic cleaning treatment are preferably selected to be the optimum one for the object to be treated.
第１図Ｂにこの態様の工程図を示す。FIG. 1B shows a process chart of this embodiment.
上記のように得られた基板を用いて、通常の工程を経て
印刷配線板に製造される。Using the substrate obtained as described above, a printed wiring board is manufactured through usual steps.
この発明が上記のように構成されているので、下記の作
用を有する。Since the present invention is configured as described above, it has the following effects.
レーザーの持つ特徴は、可干渉性、単光性、指向性、大
強度などである。この発明において主に指向性および大
強度を利用して、基板材料を焼き切る。基板材料は有機
物からなるので、その焼き切る際にこの有機物が炭化し
てその切断部に残る。この残留物は主に炭化物である。
O2プラズマ雰囲気では、活性気体粒子が存在し、この粒
子により炭化物が気体化されて基板から除去される。The characteristics of the laser are coherence, single light, directivity, and high intensity. In the present invention, the directivity and high strength are mainly used to burn out the substrate material. Since the substrate material is made of an organic substance, the organic substance is carbonized and remains at the cut portion when the substrate is burnt out. This residue is mainly carbide.
In the O 2 plasma atmosphere, active gas particles are present and these particles vaporize the carbides and remove them from the substrate.
この発明を、例によって具体的に説明する。 The present invention will be specifically described by way of examples.
実施例１ フレキシブル配線板用絶縁基板材料（デュポン社製、ポ
リイミド樹脂、100×50×0.025mm）を自動Ｘ−Ｙテーブ
ルに載せ、レーザー切断装置により、平均出力0.3W、移
動速度20mm/sの条件でレーザービームを照射して外形切
断した。この切断基板を、150W、26kHz、２分間の条件
で超音波処理を施して、炭化物の一部を除去した。次い
で、この基板をO2プラズマ処理装置に入れて、プラズマ
処理した。Example 1 An insulating substrate material for flexible wiring board (made by DuPont, polyimide resin, 100 × 50 × 0.025 mm) was placed on an automatic XY table, and an average output of 0.3 W and a moving speed of 20 mm / s were measured by a laser cutting device. The outer shape was cut by irradiating a laser beam under the conditions. This cut substrate was subjected to ultrasonic treatment under the conditions of 150 W, 26 kHz and 2 minutes to remove a part of the carbide. Next, this substrate was put into an O 2 plasma processing apparatus and plasma-treated.
得られた基板には、その外周にあった炭化物は、完全に
除去されていた。Carbides on the periphery of the obtained substrate were completely removed.
比較例１ O2プラズマおよび超音波処理をしなかったこと以外、実
施例１と同様に外形切断した。得られた基板の外周に
は、多数の樹脂炭化物が付着していた。Comparative Example 1 The outer shape was cut in the same manner as in Example 1 except that O 2 plasma and ultrasonic treatment were not performed. A large number of resin carbides were attached to the outer periphery of the obtained substrate.
実施例２ 超音波処理をしなかったこと以外、実施例１と同様に外
形切断した。得られた基板には、その外周にあった炭化
物がほぼ完全に除去されていた。Example 2 The outer shape was cut in the same manner as in Example 1 except that ultrasonic treatment was not performed. Carbides on the periphery of the obtained substrate were almost completely removed.
この発明の方法によつて次の効果を得ることができる。 The following effects can be obtained by the method of the present invention.
一つの形状に対して、費用と製作時間のかかる金型を一
々作成する必要がなくなり、多品種少量生産にも対応で
きる。複雑な形状についても良好に外形切断することが
できる。It eliminates the need to create molds that are expensive and time-consuming for a single shape, and can be used for high-mix low-volume production. Outer shape can be cut well even for complicated shapes.
さらに、薄い基板であっても確実に切断することができ
る。Further, even a thin substrate can be cut reliably.
第１図はこの発明の好ましい態様による工程図、第２図
はこの発明に用いることができるレーザー切断装置を示
す概略図である。 １……レーザー切断装置、２……レーザー照射器、３…
…Ｘ−Ｙテーブル、４……制御手段、５……基板材料、
６……レーザービームFIG. 1 is a process diagram according to a preferred embodiment of the present invention, and FIG. 2 is a schematic diagram showing a laser cutting device which can be used in the present invention. 1 ... Laser cutting device, 2 ... Laser irradiator, 3 ...
... XY table, 4 ... control means, 5 ... substrate material,
6 ... Laser beam
Claims (3)
り所定の外形に切断し、外形切断された基板用材料をO2
プラズマ処理してレーザー切断により生じた基板樹脂の
炭化物を除去することを特徴とするレーザーによる配線
基板の外形加工法。1. An insulating substrate material for a printed wiring board is cut into a predetermined outer shape by a laser, and the cut substrate material is O 2
A method for externally processing a wiring board by a laser, which comprises removing a carbide of a substrate resin generated by laser cutting by plasma treatment.
材料が超音波洗浄処理されたものでる、特許請求の範囲
第１項記載のレーザーによる配線基板の外形加工法。2. A method for processing an outer shape of a wiring board by a laser according to claim 1, wherein the material for the substrate after the outer shape cutting by O 2 plasma treatment is subjected to ultrasonic cleaning.
特許請求の範囲第１項記載のレーザーによる配線基板の
外形加工法。3. The printed wiring board is a flexible wiring board.
An outer shape processing method for a wiring board using a laser according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62150422A JPH0736466B2 (en) | 1987-06-17 | 1987-06-17 | Laser board external processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62150422A JPH0736466B2 (en) | 1987-06-17 | 1987-06-17 | Laser board external processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63313894A JPS63313894A (en) | 1988-12-21 |
| JPH0736466B2 true JPH0736466B2 (en) | 1995-04-19 |
Family
ID=15496593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62150422A Expired - Lifetime JPH0736466B2 (en) | 1987-06-17 | 1987-06-17 | Laser board external processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0736466B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105744745A (en) * | 2014-12-12 | 2016-07-06 | 统赢软性电路(珠海)有限公司 | Manufacture method of multilayer FPC board |
| CN105744746A (en) * | 2014-12-12 | 2016-07-06 | 统赢软性电路(珠海)有限公司 | Manufacture method of single-sided FPC board |
| JP7242166B2 (en) * | 2016-09-30 | 2023-03-20 | 住友化学株式会社 | Optical film and method for producing optical film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52147775A (en) * | 1976-06-03 | 1977-12-08 | Nippon Electric Co | Method of producing hybrid integrated circuit substrate |
| JPS5954233A (en) * | 1982-09-21 | 1984-03-29 | Nec Corp | Manufacture of hybrid integrated circuit |
| JPS60133784A (en) * | 1983-12-21 | 1985-07-16 | キヤノン株式会社 | Method of producing flexible printed board |
| JPS60164396A (en) * | 1984-02-06 | 1985-08-27 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPS60261684A (en) * | 1984-06-11 | 1985-12-24 | Matsushita Electric Works Ltd | Working method of metal-base laminated plate |
-
1987
- 1987-06-17 JP JP62150422A patent/JPH0736466B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63313894A (en) | 1988-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930002697B1 (en) | Method of holing printed board | |
| KR930004135B1 (en) | Method for forming through holes in a polyimide substrate | |
| US5609746A (en) | Printed circuit manufacture | |
| CN108811334B (en) | Processing method of graphical blind slot at bottom of printed circuit board | |
| CN108668428B (en) | Laser LDS 3D three-dimensional circuit fine circuit board manufacturing process | |
| US4898648A (en) | Method for providing a strengthened conductive circuit pattern | |
| JPH05211381A (en) | Manufacture of hybrid integrated circuit | |
| JPH1070151A (en) | Method and apparatus for arraying conductive particle | |
| JPH0736466B2 (en) | Laser board external processing method | |
| JP2983481B2 (en) | Printed circuit board manufacturing method | |
| JPH08187588A (en) | Laser beam processing method | |
| JPH07193375A (en) | Method of processing ceramic green sheet with film | |
| JPH04139786A (en) | External shape working equipment for electronic parts mounting board | |
| JP2805242B2 (en) | Drilling method for printed circuit boards | |
| JP2918347B2 (en) | Manufacturing method of wiring board | |
| JP2004527923A (en) | Method and apparatus for structuring a circuit board | |
| JP2004327830A (en) | Manufacturing method of printed circuit board, and printed circuit board | |
| KR100434072B1 (en) | Through hole forming method of pcb using laser | |
| JPH1158343A (en) | Laser processing ceramic composite material | |
| JPH11121904A (en) | Production of printed wiring board | |
| JPH0284282A (en) | Method for working groove in circuit board | |
| JPH04116887A (en) | Formation of circuit pattern | |
| JPH04356384A (en) | Laser radiating device | |
| JPH07105585B2 (en) | Laser processing method for electronic circuit board | |
| JPH10296464A (en) | Lead frame manufacturing device utilizing laser and manufacture of lead frame utilizing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080419 Year of fee payment: 13 |