JP2918347B2 - Manufacturing method of wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board, and more particularly, to a synthetic resin film having electrical insulation.
Gold, such as copper, on the conductor formation part of the desired pattern
The present invention relates to a method for manufacturing a wiring board in which conductors are formed by filling metal .

[0002]

2. Description of the Related Art In the field of semiconductor devices and the like, a thin film substrate using a synthetic resin film formed of a heat-resistant synthetic resin such as polyimide as an electric insulating layer is used. Such thin film substrate is linear synthetic resin film on the substrate
It is manufactured by forming a conductor-shaped portion having a shape and filling the conductor-formed portion with a conductive metal such as copper. By the way, recently, even in such a thin film substrate, a conductor forming portion of a synthetic resin film has been miniaturized with miniaturization and high integration of a semiconductor device and the like. As a method for forming such a fine conductor forming portion on a synthetic resin film, there is a method using laser light. As the laser light used in this method, it is preferable to use an excimer laser (ArF; 193 nm, KrF; 248 nm, XeCl; 308 nm, XeF; 351 nm) which is a laser light in the ultraviolet region. In other words, the carbon dioxide laser in the infrared region currently used industrially (wavelength 10.6 μm)
Processing using a laser or a YAG laser (wavelength: 1.06 μm) is thermal processing using energy of laser light. For this reason, when a synthetic resin film is irradiated with a carbon dioxide gas laser or a YAG laser, the peripheral portion irradiated with the laser light may be carbonized to lower the electrical insulation of the synthetic resin film. On the other hand, the energy of the excimer laser corresponds to the dissociation energy of the chemical bond of the polymer chain forming the synthetic resin film, and the chemical bond of the polymer chain can be cut by irradiation with the excimer laser. For this reason, by irradiating the synthetic resin film with the excimer laser, only the synthetic resin film portion irradiated with the laser beam can be removed, and at this time, the electrical insulation of the peripheral portion does not decrease. Such processing using an excimer laser is usually performed by a method shown in FIG. In this method, an excimer laser (hereinafter, sometimes referred to as a laser beam) 10 that has passed through holes and slits formed in a pattern mask plate 110
At 20, the synthetic resin film 130 that has been reduced and placed on the table 140 is irradiated.

[0003]

According to the above method, a conductor forming portion having a line width of about 100 μm can be formed on a synthetic resin film. However, the conventionally used metal pattern mask plate 110 forms a conductor forming portion with a fine pattern with high precision because holes and slits are formed in a thin metal plate to form a pattern of the conductor forming portion. It is difficult. For this reason, it is difficult to form a conductor forming portion having a line width of 100 μm or less on the synthetic resin film 130 with a metal pattern mask plate. Further, the present inventors have used a quartz pattern mask plate instead of a metal pattern mask plate, and can form a fine pattern conductor forming portion directly on the pattern mask plate with high precision by vapor deposition or the like, 100 μm line width on synthetic resin film 130
A conductor forming portion having a fine pattern of not more than m could be formed. However, since the scattered matter scattered from the laser light irradiated portion of the synthetic resin film 130 adheres to the quartz pattern mask plate, it has been found that the mask life is short and it is difficult to use the mask industrially.

Accordingly, an object of the present invention is to provide a method of manufacturing a wiring board that can industrially form a conductor forming portion of a fine pattern on a synthetic resin film using an excimer laser.

[0005]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that a thick resist layer formed on a synthetic resin film corresponds to the pattern of the conductor forming portion.
And remove it partially, then irradiate with excimer laser
The part of the synthetic resin film from which the resist layer was removed
It has been found that by simultaneously etching the strike layer and the conductive layer, a conductor forming portion of a fine pattern can be easily formed on a synthetic resin film without using a pattern mask plate, and the present invention has been achieved.

That is, according to the present invention, there is provided a wiring board in which a conductor forming portion of a desired pattern formed on a synthetic resin film having electrical insulation is filled with a metal such as copper to form a conductor wiring. When forming a resist layer having a thickness equal to or greater than the thickness of the synthetic resin film on the surface of the synthetic resin film, the resist layer is partially removed in accordance with the pattern of the conductor forming portion. The portion of the synthetic resin film from which is removed and the resist layer on the surface of the synthetic resin film are simultaneously etched by excimer laser irradiation, so that the synthetic resin film has a line width of 10 mm.
A method of manufacturing a wiring board, comprising forming a conductor forming portion of 0 μm or less . In the present invention having such a configuration, when a conductor forming portion of a desired pattern is formed on the synthetic resin film by irradiating an excimer laser, as a resist layer remains on the surface of the synthetic resin film,
By irradiating the excimer laser, Ru <br/> you to retain the thickness of the synthetic resin film of the wiring substrate obtained in the initial thickness. Further, the present invention provides a synthetic resin foil having electrical insulation properties.
Copper, etc., on the conductor forming part of the desired pattern formed on the film
Wiring board formed with conductive wiring formed by filling metal
When manufacturing a synthetic resin film,
After forming a strike layer on the synthetic resin film surface,
The resist layer is partially removed in accordance with the pattern of
And then remove the synthetic resin film from which the resist layer has been removed.
Film part and resist on the synthetic resin film surface
The layers are simultaneously etched by excimer laser irradiation.
Grayed, after forming the conductor forming part of the desired pattern on the synthetic resin film, a method of manufacturing a wiring board, wherein the resist layer is irradiated with excimer laser until that is completely removed <br/> There is .

[0007]

According to the present invention, the resist layer formed on the synthetic resin film is partially removed to directly correspond to the conductor forming portion .
The remaining resist layer and the resist layer
Since the removed portion of the synthetic resin film and the portion of the synthetic resin film are simultaneously etched by the excimer laser, a pattern mask plate can be omitted, and furthermore, a conductor forming portion of a fine pattern can be accurately formed on the synthetic resin film.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail with reference to the drawings.
1 to 6 are explanatory diagrams for explaining an embodiment of the present invention. In the present embodiment, as shown in FIG. 1, a polyimide film 14 (film 1 secured to the substrate 16
4) is coated with a resist layer 12. The thickness of the resist layer 12 is equal to or greater than the thickness of the film 14. The upper limit of the thickness of the resist layer 12 does not need to be particularly limited, and the resist layer 12 may be formed before the concave portion forming the conductor forming portion is formed in the film 14 by excimer laser irradiation described later. Disappears and film 1
It is sufficient that the thickness of the surface 4 is not etched. The resist for forming the resist layer 12 may be either a positive type or a negative type. In this embodiment, a positive type resist is used. Further, a pattern of a conductor forming portion to be formed on the film 14 is exposed on the resist layer 12 formed by thick coating on the film 14 (FIG. 2), and the exposed portions 18 that have been exposed are removed by chemical etching or the like. In this manner, the same pattern as the pattern of the conductor forming portion formed on the film 14 is formed on the resist layer 12 (FIG.
3). Hereinafter, the conductor forming portion 20 of the resist layer 12 or simply
It may be referred to as a conductor forming part 20.

Next, as shown in FIG.
1 having resist layer 12 on which is formed on the upper surface
4 is irradiated with an excimer laser 10. At this time, the portion of the film 14 corresponding to the resist layer 12 on the film 14 and the conductor forming portion 20 formed on the resist layer 12 is simultaneously etched by the irradiation of the excimer laser 10. However, since the resist layer 12 formed by thick coating is present on the film 14, while the resist layer 12 is being etched by the laser beam, the film corresponding to the conductor forming portion 20 formed on the resist layer 12 is formed. 1
The portion 4 is etched to form the conductor forming portion 22 (FIG. 5). In this embodiment, FIG.
As described above, the film 14 is guided by the excimer laser irradiation.
When the body forming part 22 is formed, the resist is placed on the film 14.
Excimer laser is applied so that the layer 12 remains.
You. Thereafter , the remaining resist layer 12 is chemically or physically peeled off from the film 14 (FIG. 6). According to the present embodiment, the fine conductor forming portion 2 having a line width of 100 μm or less is used.
2 could be easily formed on the film 14 with good accuracy, and the peripheral portion of the formed conductor forming portion 22 was not carbonized and the electrical insulation was good. As in the present embodiment
Excimer laser so that the resist layer 12 remains.
Irradiates the surface of the film 14 with no laser light, thereby maintaining the initial thickness of the film 14.

As shown in FIG. 7, after the conductor forming portion 22 is formed on the film 14, the excimer laser 1
By continuing the irradiation of 0, the resist layer 12 on the film 14 may be completely removed (FIG. 8). In this case, although the surface of the film 14 is etched by the excimer laser and the thickness of the film 14 is slightly smaller than the initial thickness, the step of removing the resist layer 12 can be omitted. In the embodiments described so far, the output during the processing of the excimer laser is fixed, but by adjusting the output of the excimer laser, the taper-shaped conductor forming portion 24 is formed on the film 14 as shown in FIG. Can be formed. Further, conventionally, it has been considered that a fine conductor forming portion cannot be formed accurately on a thick film. However, according to this embodiment, it is possible to easily form a fine conductor forming portion on such a thick film. it can. For this reason, it is also possible to provide a wiring board using only a thick film which has sufficient strength and on which a fine conductor forming portion is formed. In the examples, polyimide is used as the synthetic resin for forming the film 14, but polybenzimidazole, benzcyclobutene, or the like can be used.

According to the present invention, a fine conductor forming portion having a line width of 100 μm or less can be easily formed on a film, and the fine conductor forming portion of a thin film substrate accompanying miniaturization and high integration of a semiconductor device or the like can be formed. It can respond to the demand for conversion.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 2 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 3 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 4 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 5 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 6 is an explanatory diagram for explaining one process of one embodiment of the present invention.

FIG. 7 is an explanatory diagram for explaining one step of another embodiment of the present invention.

FIG. 8 is an explanatory diagram for explaining one step of another embodiment of the present invention.

FIG. 9 is an explanatory diagram for explaining one process of another embodiment of the present invention.

FIG. 10 is an explanatory diagram for explaining a conventional processing method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Excimer laser 12 Resist layer 14 Synthetic resin film 20 Conductor formation part formed in resist layer 12 22 Conductor formation part formed in synthetic resin film 14

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H05K 3/10 H01L 21/88 B

Claims (3)

(57) [Claims] 1. A wiring board in which a conductor forming portion of a desired pattern formed on a synthetic resin film having electrical insulation is filled with a metal such as copper to form a conductor wiring is manufactured. When forming a resist layer having a thickness of the synthetic resin film or more on the synthetic resin film surface, the resist layer is partially removed in accordance with the pattern of the conductor forming portion. Removed part of the synthetic resin film and the resist layer on the synthetic resin film surface,
Etch simultaneously by excimer laser irradiation,
A method for manufacturing a wiring board, comprising: forming a conductor forming portion having a line width of 100 μm or less on the synthetic resin film. 2. Excimer laser irradiation is performed such that a resist layer remains on a surface of the synthetic resin film when a conductor forming portion having a desired pattern is formed on the synthetic resin film by irradiation with the excimer laser. A method for manufacturing a wiring board according to claim 1. 3. A synthetic resin film having electrical insulation properties.
Metal such as copper is applied to the conductor forming portion of the desired pattern formed on
Manufactures a wiring board in which conductors are formed by filling
When synthesizing, a resist layer having a thickness not less than the thickness of the synthetic resin film is synthesized.
After being formed on the resin film surface, the
The resist layer is partially removed corresponding to the pattern, and then the synthetic resin film from which the resist layer has been removed.
Part and the resist layer on the synthetic resin film surface,
Etch simultaneously by excimer laser irradiation ,
After forming the conductor forming part of the desired pattern on the synthetic resin film, a manufacturing method of a wiring board, wherein the resist layer is irradiated with excimer laser until it is completely removed.