JPH073577B2 - Substrate cleaning method - Google Patents

Substrate cleaning method

Info

Publication number
JPH073577B2
JPH073577B2 JP12175185A JP12175185A JPH073577B2 JP H073577 B2 JPH073577 B2 JP H073577B2 JP 12175185 A JP12175185 A JP 12175185A JP 12175185 A JP12175185 A JP 12175185A JP H073577 B2 JPH073577 B2 JP H073577B2
Authority
JP
Japan
Prior art keywords
substrate
brush
glass substrate
rotating
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12175185A
Other languages
Japanese (ja)
Other versions
JPS61279857A (en
Inventor
和則 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP12175185A priority Critical patent/JPH073577B2/en
Publication of JPS61279857A publication Critical patent/JPS61279857A/en
Publication of JPH073577B2 publication Critical patent/JPH073577B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【発明の詳細な説明】 (発明の技術分野) 本発明は微小な凹凸段差から成るパターンが形成された
基板,特に半導体製造時のフォトリソグラフィ工程に使
用されるフォトマスク(又はレチクル)や,半導体ウェ
ハ等を洗浄する方法に関する。
Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate on which a pattern having minute unevenness steps is formed, particularly a photomask (or reticle) used in a photolithography process during semiconductor manufacturing, and a semiconductor. The present invention relates to a method for cleaning a wafer or the like.

(発明の背景) 半導体素子を製造するフォトリソグラフィ工程では,通
常光学的な露光転写装置により,フォトマスクやレチク
ル上の回路パターン像を半導体ウェハ上に焼き付けてい
る。この場合,フォトマスクやレチクル上に異物が付着
していると,転写された回路パターン上で欠陥となり,
製造された半導体素子の不良を招く。
(Background of the Invention) In a photolithography process for manufacturing a semiconductor element, a circuit pattern image on a photomask or reticle is usually printed on a semiconductor wafer by an optical exposure transfer device. In this case, if foreign matter adheres to the photomask or reticle, it becomes a defect on the transferred circuit pattern,
This causes the manufactured semiconductor device to be defective.

そこで,マスクやレチクル上の異物の有無を自動的に検
出して,異物が認められたときは,洗浄装置によってそ
の異物を除去することが行なわれている。この洗浄装置
としては,各種の方式のものが提案され,製品化されて
いるが,異物の除去能率(洗浄効率)の高い方式とし
て,ブラシ洗浄が注目されている。ブラシ洗浄とは,マ
スクやレチクル(基板)の表面に回転ブラシを押圧させ
て,摩擦により異物を除去する方式である。回転ブラシ
による洗浄には大きく分けて2種の方法があり,1つは基
板表面と平行な面内でブラシを回転させて摩擦するもの
であり,もう1つはローラ状のブラシを回転させて基板
とローラブラシとを相対移動させて基板全面を摩擦する
ものである。
Therefore, the presence or absence of foreign matter on the mask or reticle is automatically detected, and when the foreign matter is detected, the foreign matter is removed by a cleaning device. Various types of cleaning devices have been proposed and commercialized as this cleaning device, but brush cleaning has attracted attention as a system with high foreign matter removal efficiency (cleaning efficiency). Brush cleaning is a method of pressing a rotating brush against the surface of a mask or reticle (substrate) and removing foreign matter by friction. There are roughly two types of cleaning methods using a rotating brush. One is to rotate and brush the brush in a plane parallel to the substrate surface, and the other is to rotate the roller brush. The substrate and the roller brush are moved relative to each other to rub the entire surface of the substrate.

ところがいずれの方法にしろ,ブラシが基板の端部に衝
突すると,ブラシの毛から,微小なブラシ片(数ミクロ
ン以下)が発生するといった現象が見い出された。ブラ
シ洗浄ではブラシによる摩擦(ブラッシング)と同時に
洗浄液を基板に噴射して,あるいは洗浄液内に基板を浸
けて,異物を洗い流すようにしているが,ブラシ片が多
量に発生すると,これがパターンの凹凸段差のエッジ部
にひっかかり,完全に除去できない,といった欠点が生
じる。
However, in any method, when the brush collides with the edge of the substrate, a minute brush piece (a few microns or less) is generated from the bristles of the brush. In brush cleaning, the cleaning liquid is sprayed onto the substrate at the same time as friction with the brush (or brushing), or the substrate is immersed in the cleaning liquid to wash away the foreign matter. There is a defect that it is caught at the edge part of and cannot be completely removed.

(発明の目的) そこで本発明は,摩擦によって基板を洗浄する際,基板
を摩擦するスクラブ材自体から発生する異物を低減し,
洗浄効果を向上させた洗浄方法を提供することを目的と
する。
Therefore, the present invention reduces foreign matter generated from the scrubbing material itself that rubs the substrate when cleaning the substrate by friction,
An object of the present invention is to provide a cleaning method with improved cleaning effect.

(発明の概要) 本発明は,ブラシ(又はスポンジ)等のスクラブ材によ
って基板を摩擦する際,スクラブ材が基板の端面部に衝
突するのをさけるように,基板表面のスクラブ材による
洗浄面を制限することを技術的な要点をしている。
(Summary of the Invention) According to the present invention, when rubbing a substrate with a scrubbing material such as a brush (or sponge), the scrubbing material on the surface of the substrate is cleaned so as to prevent the scrubbing material from colliding with the end face portion of the substrate. It has a technical gist to limit.

(実施例) 第2図は本発明の実施例が適用される自動洗浄装置の全
体概略図である。
(Embodiment) FIG. 2 is an overall schematic view of an automatic cleaning apparatus to which an embodiment of the present invention is applied.

レチクルやマスク等のガラス基板5は収納部1に収納さ
れ,収納部1から最も離れた位置に,本発明の方法が適
用されるブラシ洗浄槽2が配置され,その隣りで収納部
1にはさまれた位置には,アルコールを用いてガラス基
板5を洗うリンス槽3が配置され,さらに,リンス槽3
と収納部1にはさまれた位置にはフレオン蒸気を用いて
ガラス基板5を乾燥する蒸気乾燥槽4が配置されてい
る。この収納部1,ブラシ洗浄槽2,リンス槽3,及び蒸気乾
燥槽4(以下,単に蒸気槽4と呼ぶ)はガラス基板5の
直線的な搬送経路6に沿って配列される。収納部1に収
納された洗浄すべきガラス基板5は,縦に保持された状
態で経路6に従って,蒸気槽4,リンス槽3を飛び越し
て,ブラシ洗浄槽2の上方に位置決めされる。ブラシ洗
浄槽2の内部には,上から順番に,ガラス基板5に純水
を噴射する純水噴出部(水洗手段)7と,アンモニア水
溶液等の洗浄液を噴出する洗浄液噴射部(洗浄液塗布手
段)8と,ガラス基板5の表面を擦るように回転するブ
ラシ(スクラブ材)11とが,各々飛散防止板9,10によっ
て区画して配置されている。またブラシ洗浄槽2の底部
12は錐体状になっており,排液の回収効率を高めてあ
る。
A glass substrate 5 such as a reticle or a mask is stored in the storage unit 1, a brush cleaning tank 2 to which the method of the present invention is applied is disposed at a position farthest from the storage unit 1, and the storage unit 1 is adjacent to the brush cleaning tank 2. A rinse tank 3 for washing the glass substrate 5 with alcohol is arranged at the sandwiched position, and the rinse tank 3 is further provided.
A vapor drying tank 4 for drying the glass substrate 5 using Freon vapor is arranged at a position sandwiched between the storage portions 1. The storage unit 1, the brush cleaning tank 2, the rinse tank 3, and the steam drying tank 4 (hereinafter, simply referred to as the steam tank 4) are arranged along a linear transfer path 6 of the glass substrate 5. The glass substrate 5 to be cleaned stored in the storage unit 1 is positioned above the brush cleaning tank 2 while jumping over the steam tank 4 and the rinse tank 3 along the path 6 while being held vertically. Inside the brush cleaning tank 2, a pure water jetting portion (water washing means) 7 for jetting pure water onto the glass substrate 5 and a washing liquid jetting portion (washing liquid applying means) for jetting a washing liquid such as an aqueous ammonia solution are sequentially provided from the top. 8 and a brush (scrubbing material) 11 that rotates so as to rub the surface of the glass substrate 5 are arranged by being divided by the shatterproof plates 9 and 10, respectively. The bottom of the brush cleaning tank 2
12 has a pyramidal shape, which improves the collection efficiency of drainage.

リンス槽3の内部には,純水をイソプロピルアルコール
液(以下,IPAとする)等に置換するために,そのIPAを
噴出するIPA噴出部13が設けられ,ガラス基板5の両面
をIPAでリンスする。また,このリンス槽3の底部14も
錐体状に形成され,排液の回収効率を高めてある。蒸気
槽4の底部にはフレオン液16が供給ライン18から所定量
ずつ供給され,ヒーター19によって加熱される。これに
よってフレオン蒸気が槽4内に満され,ガラス基板5の
蒸気乾燥が行なわれる。ガラス基板5によって凝縮して
滴下するフレオン液は,純度が低く,汚れているので,
フレオン液16と混じることのないように受皿17aで受け
て回収ライン17bを介して回収される。尚,蒸気槽4の
上方部周辺には冷却管15が設けられ,フレオン蒸気が槽
外に流出するのを防ぐ。
In order to replace pure water with isopropyl alcohol liquid (hereinafter referred to as IPA) or the like inside the rinse tank 3, there is provided an IPA jet part 13 for jetting the IPA, and both surfaces of the glass substrate 5 are rinsed with IPA. To do. Further, the bottom portion 14 of the rinse tank 3 is also formed in the shape of a cone to enhance the drainage liquid recovery efficiency. The Freon liquid 16 is supplied to the bottom of the steam tank 4 from the supply line 18 by a predetermined amount and heated by the heater 19. As a result, Freon vapor is filled in the tank 4, and the glass substrate 5 is dried by vapor. The Freon liquid condensed and dropped by the glass substrate 5 has low purity and is contaminated.
It is received by the receiving tray 17a so as not to be mixed with the Freon liquid 16 and recovered through the recovery line 17b. A cooling pipe 15 is provided around the upper part of the steam tank 4 to prevent Freon steam from flowing out of the tank.

第3図はブラシ洗浄槽2の拡大斜視図である。ガラス基
板5はアーム20によって端面部を両方から狭持されて,
縦状態でガラス基板5の表面と平行なy方向とz方向と
に搬送される。
FIG. 3 is an enlarged perspective view of the brush cleaning tank 2. The glass substrate 5 is sandwiched by the arms 20 from both ends,
In the vertical state, the glass substrate 5 is conveyed in the y direction and the z direction parallel to the surface of the glass substrate 5.

このブラシ洗浄槽2の上部は,ガラス基板5とアーム20
が進退できるだけの開口部21が設けられて,密閉されて
いる。この構造は,槽2内にほこりが進入することを防
ぐとともに,内部の各種液体のミスト(飛沫)が外部に
出ることを防ぐのに有効である。さて,純水噴射部7
は,開口部21から下方に進入してくるガラス基板5の両
面に平行して配置されたパイプ7a,7bと,このパイプ7a,
7bのそれぞれの2ヶ所に設けられた噴射パズル22,23,2
4,25とから構成される。パイプ7a,7bには一定の圧力の
純水が供給され,噴射ノズル22〜25はその圧力によって
純水を扇状の液膜にして噴出する。ノズル22〜25は,純
水がガラス基板5の表面の横方向(図ではy方向)に扇
状に広がって噴出すると共に,ガラス基板5の表面に上
下方向にはほとんど広がらないように噴出するような構
造になっている。
The upper part of this brush cleaning tank 2 has a glass substrate 5 and an arm 20.
An opening 21 is provided for advancing and retreating, and is sealed. This structure is effective in preventing dust from entering the tank 2 and preventing mist (spray) of various liquids inside from going out. Now, the pure water injection part 7
Are the pipes 7a, 7b arranged parallel to both surfaces of the glass substrate 5 coming in downward from the opening 21, and the pipes 7a, 7b.
Jet puzzles 22,23,2 provided at two locations in 7b
It consists of 4,25. Pure water having a constant pressure is supplied to the pipes 7a and 7b, and the injection nozzles 22 to 25 jet the pure water into a fan-shaped liquid film by the pressure. The nozzles 22 to 25 are arranged so that the pure water spreads out in a fan shape in the lateral direction of the surface of the glass substrate 5 (in the y direction in the figure) and at the same time, it sprays so as not to spread in the up-down direction. It has a simple structure.

さて,パイプ7a,7bの下方には各々飛散防止板9a,9bが槽
2の中央部に向けて下方に傾斜した状態で互いに対向し
て設けられている。飛散防止板9aと9bの下端部は,ガラ
ス基板5とアーム20とが通過するように適当な間隔で離
されている。この飛散防止板9a,9bは,ノズル22〜25か
らの純水,あるいは一度ガラス基板5に噴射されてはね
返った純水が再び飛沫となって上方にはね返るのを防止
するものである。
Below the pipes 7a and 7b, shatterproof plates 9a and 9b are provided facing each other in a state of being inclined downward toward the center of the tank 2. The lower ends of the shatterproof plates 9a and 9b are separated by an appropriate distance so that the glass substrate 5 and the arm 20 can pass through. The anti-scattering plates 9a, 9b prevent the pure water from the nozzles 22 to 25 or the pure water once sprayed on the glass substrate 5 from splashing again and splashing upward.

さて,ガラス基板5が飛散防止板9a,9bの間を通り,さ
らに下方に移動すると,洗浄液噴出部8に至る。洗浄液
噴出部8が純粋噴出部7と同様にガラス基板5と平行に
位置するパイプ8a,8bと,そのパイプ8a,8bの各々に設け
られた噴射ノズル26,27,28,29とから構成される。これ
らパイプ8a,8bとノズル26〜29の配置は,前述の純水噴
出部7と同様である。加圧された洗浄液,例えばアンモ
ニア水溶液はパイプ8a,8bに供給され,そのアンモニア
水溶液はノズル26〜29から,扇状にガラス基板5の両面
に噴射される。この場合,アンモニア水溶液は必ずしも
液膜状である必要はない。このパイプ8a,8bの下方に,
飛散防止板9a,9bと同様に,飛散防止板10a,10bが槽4の
中央部に向けて下方に傾斜して設けられている。この飛
散防止板10a,10bの働きも飛散防止板9a,9bと同様に,ノ
ズル26〜29からのアンモニア水溶液が上方に飛沫になっ
て散らないようにするものであるが,そればかりでな
く,その下側に配置された回転ブラシ11からの飛沫が,
上方に飛び出すのを防ぐ働きもある。
When the glass substrate 5 passes between the scattering prevention plates 9a and 9b and moves further downward, the glass substrate 5 reaches the cleaning liquid ejecting portion 8. The cleaning liquid jetting portion 8 is composed of pipes 8a, 8b positioned in parallel with the glass substrate 5 like the pure jetting portion 7, and jetting nozzles 26, 27, 28, 29 provided in each of the pipes 8a, 8b. It The arrangement of the pipes 8a and 8b and the nozzles 26 to 29 is the same as that of the pure water jetting unit 7 described above. A pressurized cleaning liquid, for example, an ammonia aqueous solution is supplied to the pipes 8a and 8b, and the ammonia aqueous solution is sprayed from the nozzles 26 to 29 on both sides of the glass substrate 5 in a fan shape. In this case, the aqueous ammonia solution does not necessarily have to be in the form of a liquid film. Below these pipes 8a, 8b,
Similar to the shatterproof plates 9a and 9b, shatterproof plates 10a and 10b are provided so as to be inclined downward toward the center of the tank 4. Like the scattering prevention plates 9a and 9b, the functions of the scattering prevention plates 10a and 10b also prevent the aqueous ammonia solution from the nozzles 26 to 29 from splashing upwards, but not only that. Splashes from the rotating brush 11 placed below it,
It also has the function of preventing jumping out.

この回転ブラシ11はガラス基板5の表面に平行に配置さ
れた回転軸O1を有する円柱状のブラシ11aと,回転軸O2
を有する円柱状のブラシ11bとからなる。そのブラシ11
a,11bはガラス基板5は飛散防止板10aと10bの間の間隙
を通って下方にきたとき,そのガラス基板5を狭み込む
ように,回転軸O1とO2との間隔35が定められている。そ
して,ブラシ11a,11bの毛は,例えばナイロン材であ
り,各回転軸O1,O2に対して半径方向に延びるように植
毛されている。ブラシ11aは第3図の矢印50aで示すよう
に回転軸O1を中心に時計回りに回転し,ブラシ11bは矢
印50bで示すように回転軸O2を中心に反時計回りに回転
する。すなわち,ブラシ11aと11bに挟み込まれたガラス
基板5は,ブラシ11a,11bの回転によって,槽4の底部1
2の方,(下方)にたくし込まれるように擦られる。こ
のため,ガラス基板5の両面に付着した異物(ゴミやシ
ミ等)は,ブラシ11a,11bの毛によって底部12の方へ擦
り落される。尚,円柱状のブラシ11a,11bの軸方向の長
さは,ガラス基板5の横幅方向にできるだけ広く接触す
るとともに,ガラス基板5の両端面部を保持するアーム
20,及びガラス基板5の垂直な左方の端面部には触れな
いような長さに定められる。これはブラシ11a,11bの毛
の磨耗,すなわち,ブラシ片の発生を防ぐために極めて
有効である。またブラシ11a,11bの噛合せ部分と,純水
噴出部7からの純水がガラス基板にあたる位置との間隔
は少なくともガラス基板の上下方向の幅(高さ)よりも
大きく定められている。
The rotating brush 11 includes a cylindrical brush 11a having a rotation axis O 1 arranged parallel to the surface of the glass substrate 5, and a rotation axis O 2
And a cylindrical brush 11b having That brush 11
a and 11b are arranged such that when the glass substrate 5 comes down through the gap between the shatterproof plates 10a and 10b, the space 35 between the rotation axes O 1 and O 2 is determined so that the glass substrate 5 is narrowed. Has been. The bristles of the brushes 11a and 11b are, for example, a nylon material, and are bristled so as to extend in the radial direction with respect to the rotation axes O 1 and O 2 . The brush 11a rotates clockwise about the rotation axis O 1 as indicated by the arrow 50a in FIG. 3, and the brush 11b rotates counterclockwise about the rotation axis O 2 as indicated by the arrow 50b. That is, the glass substrate 5 sandwiched between the brushes 11a and 11b is rotated by the brushes 11a and 11b so that the bottom portion 1 of the tank 4 is
The second side is rubbed so that it is tucked in (downward). Therefore, foreign matters (dust, stains, etc.) attached to both surfaces of the glass substrate 5 are scraped off toward the bottom 12 by the bristles of the brushes 11a and 11b. The axial lengths of the cylindrical brushes 11a and 11b are in contact with the glass substrate 5 in the lateral direction as wide as possible, and an arm that holds both end surfaces of the glass substrate 5 is provided.
The length is set so as not to touch the vertical left end face portion of the glass substrate 5 and the glass substrate 5. This is extremely effective in preventing abrasion of the bristles of the brushes 11a and 11b, that is, generation of brush pieces. Further, the interval between the meshing portions of the brushes 11a and 11b and the position where the pure water from the pure water spouting portion 7 hits the glass substrate is set to be larger than at least the vertical width (height) of the glass substrate.

尚,第3図において,ブラシ洗浄槽4はパッキングを介
した接合部34を境に,上側部と下側部とに分離可能に構
成されていて,純水噴出部7,洗浄液噴出部8及び飛散防
止板9,10は上側部に設けられて装置全体に対して固定で
あり,ブラシ11a,11bが設けられた下側部が上側部に対
して下方に取りはずせる。これはブラシ11a,11bの交換
を容易にするためである。その下側部にはブラシ11a,11
bを個別に回転させるモータが第4図にように一体に設
けられている。第4図はその下側部のみを示す平面図で
あり,ここではブラシ11aを回転させるモータ40aと,モ
ータ40aの回転をブラシ11aの回転軸O1に伝えるベルトド
ライブ機構41aのみを図示する。ブラシ11bについてもモ
ータ40b,ベルトドライブ機構41bが槽4の下側部に一体
に設けられている。
In FIG. 3, the brush cleaning tank 4 is configured to be separable into an upper side portion and a lower side portion with a joint portion 34 with packing as a boundary, and a pure water jetting portion 7, a cleaning liquid jetting portion 8 and The shatterproof plates 9 and 10 are provided on the upper side and fixed to the entire apparatus, and the lower side provided with the brushes 11a and 11b can be removed downward from the upper side. This is to facilitate replacement of the brushes 11a and 11b. Brushes 11a, 11 on the lower side
A motor for individually rotating b is integrally provided as shown in FIG. FIG. 4 is a plan view showing only the lower part thereof, and here, only the motor 40a for rotating the brush 11a and the belt drive mechanism 41a for transmitting the rotation of the motor 40a to the rotation axis O 1 of the brush 11a are shown. Also for the brush 11b, the motor 40b and the belt drive mechanism 41b are integrally provided on the lower side of the tank 4.

第5図は搬送アーム20の駆動とブラシ洗浄槽4の駆動を
制御する制御系の回路ブロック図である。装置全体は主
制御部(以下,MCUと呼ぶ)60によって統括制御される。
MCU60からの各種指令はインターフェイス回路(以下,IF
と呼ぶ)61を介して各駆動部に送られる。駆動回路62
は,MCU60の指令でパイプ7a,7bに加圧された純水を供給
するか否かを切替える電磁弁63を駆動する。駆動回路64
はMCU60の指令でパイプ8a,8bに加圧された洗浄液(アン
モニア水溶液)を供給するか否かを切替える電磁弁65を
駆動する。駆動回路66はMCU60からの指令で,ブラシ11
a,11bを回転させるモータ40a,40bを個別に駆動する。
FIG. 5 is a circuit block diagram of a control system for controlling the drive of the transfer arm 20 and the drive of the brush cleaning tank 4. The entire device is integrally controlled by a main control unit (hereinafter referred to as MCU) 60.
Various commands from the MCU60 are interface circuits (hereinafter, IF
Called 61) to each drive. Drive circuit 62
Drives a solenoid valve 63 that switches whether to supply pressurized pure water to the pipes 7a and 7b according to a command from the MCU 60. Drive circuit 64
Drives a solenoid valve 65 that switches whether to supply pressurized cleaning liquid (ammonia aqueous solution) to the pipes 8a and 8b in response to a command from the MCU 60. The drive circuit 66 receives a command from the MCU 60, and the brush 11
The motors 40a and 40b for rotating a and 11b are individually driven.

モータ等の動力源を含む駆動部(以下,ZACTと呼ぶ)67
はMCU60からの指令に応じて,アーム20を上下動(Z方
向の移動)させる。その移動量もMCU60によって指令さ
れる。同様に動力源を含む駆動部(以下,YACTと呼ぶ)6
8は,MCU60からの指令に応じて,アーム20をy方向,す
なわち,ガラス基板5の表面に沿った方向に移動させ
る。そのy方向の移動量もMCU60によって指令される。
このように,ガラス基板5を縦状態に保持して,その表
面と平行な方向に搬送させることによって,雰囲気中に
漂う微小なゴミのガラス基板5表面への付着を低減させ
る効果が得られる。
Drive unit including power sources such as motors (hereafter called ZACT) 67
Moves the arm 20 up and down (moves in the Z direction) in response to a command from the MCU 60. The amount of movement is also commanded by the MCU 60. Similarly, a drive unit including a power source (hereinafter referred to as YACT) 6
8 moves the arm 20 in the y direction, that is, the direction along the surface of the glass substrate 5, in response to a command from the MCU 60. The amount of movement in the y direction is also commanded by the MCU 60.
In this way, by holding the glass substrate 5 in a vertical state and transporting it in a direction parallel to the surface thereof, it is possible to obtain the effect of reducing the adhesion of minute dust floating in the atmosphere to the surface of the glass substrate 5.

次に本実施例のブラシ洗浄の動作を説明する。開口部21
から降下してきたガラス基板5は,第3図中に示した純
水噴出部7の位置で純水リンスされ,ガラス基板5の両
面が湿潤されるとともに,場合によっては純水の噴射圧
力で弱く付着した異物も洗い流される。次にガラス基板
5はさらに降下して,ノズル26〜29からのアンモニア水
溶液の噴射を受けつつ,回転ブラシ11によりブラッシン
グされる。このときの動作を第1図に基づき詳細に説明
する。
Next, the brush cleaning operation of this embodiment will be described. Opening 21
The glass substrate 5 descending from the surface is rinsed with pure water at the position of the pure water jetting portion 7 shown in FIG. 3 to wet both surfaces of the glass substrate 5, and in some cases weakened by the pure water spray pressure. Foreign matter that has adhered is also washed away. Next, the glass substrate 5 further descends and is brushed by the rotating brush 11 while receiving the injection of the aqueous ammonia solution from the nozzles 26 to 29. The operation at this time will be described in detail with reference to FIG.

ガラス基板5は,まず第1図に示すように,アンモニア
水溶液AQの噴射を受けないような位置aに,基板上端面
5aが位置する如く位置決めされる。位置aはブラッシン
グ時の初期位置でもある。アンモニア水溶液AQは,2つの
回転ブラシ11a,11bが接する(若しくは最接近する)位
置cの上方でノズル26(27)からの水溶液とノズル28
(29)からの水溶液とがぶつかり合うように噴射され
る。
First, as shown in FIG. 1, the glass substrate 5 is placed at a position a where the aqueous ammonia solution AQ is not injected and the upper end surface of the substrate
Positioned so that 5a is located. The position a is also the initial position during brushing. The aqueous ammonia solution AQ is supplied from the nozzle 26 (27) and the nozzle 28 above the position c where the two rotating brushes 11a and 11b are in contact (or closest to each other).
It is jetted so as to collide with the aqueous solution from (29).

さて,初期位置aにあるガラス基板5は,その上端面5a
が第1図の位置b,すなわち2つの回転ブラシ11a,11bの
下方の位置にくるまで一定速度で降下される。次のガラ
ス基板5は再び上端面5aが初期位置aにくるまで一定速
度で上昇される。以上で1回のブラッシング操作が終わ
る訳であるが,MCU60は,このブラッシング操作,すなわ
ちガラス基板5の位置a,位置b,位置aの往復動作を異物
の付着状態に応じて任意の回数だけ繰り返すように指令
する。もちろん,1回のブラッシング操作だけでもよい
し,またガラス基板5がそれ程汚れていなければ,本来
露光する必要のない周辺部まで洗浄する動作(位置a,b
間の往復)を省いても同様の効果が得られる。次にガラ
ス基板5は,その上端面5aが位置cよりも上方の位置d
に位置するまで降下し,その後再び位置aまで上昇す
る。この位置aと位置dとの間の往復動作は少なくとも
1回,若しくは複数回繰り返される。従って位置a,d間
でのブラッシング中,回転ブラシ11a,11bは上端面5aに
衝突することがなく,ブラシ片の発生はほとんど無くな
る。
Now, the glass substrate 5 in the initial position a has its upper end surface 5a
Is lowered at a constant speed until it reaches the position b in FIG. 1, that is, the position below the two rotating brushes 11a, 11b. The next glass substrate 5 is raised at a constant speed until the upper end surface 5a reaches the initial position a again. The above is the end of one brushing operation, but the MCU 60 repeats this brushing operation, that is, the reciprocating operation of the position a, the position b, and the position a of the glass substrate 5 any number of times depending on the adhered state of the foreign matter. To order. Of course, only one brushing operation is required, and if the glass substrate 5 is not so dirty, the operation of cleaning up to the peripheral portion that is not originally exposed (positions a, b
The same effect can be obtained by omitting the round trip between. Next, in the glass substrate 5, the upper end surface 5a thereof is located at a position d above the position c.
It descends until it is located at and then rises again to position a. The reciprocating operation between the position a and the position d is repeated at least once or plural times. Therefore, during brushing between the positions a and d, the rotating brushes 11a and 11b do not collide with the upper end surface 5a, and the generation of brush pieces is almost eliminated.

ここでブラシ片の発生の様子について,さらに第6図を
参照して説明する。第6図は,第1図中の位置cに上端
面5aが位置した状態を示す。このような状態は上端面5a
が位置aから位置bに降下する途中,又は位置bから位
置aに上昇する途中で起り得る。特に位置bから上昇す
る過程においては,回転ブラシ11a,11bがガラス基板5
の両面5b,5cを上から下に擦るように回転しているこ
と,及びガラス基板5が上昇していることから,ブラシ
の毛の上端面5aに最も激しく衝突することになる。ブラ
シの毛の先端が上端面5aと表面5b,5cとの成す角部に当
ると,毛の先端部は微小な片となって飛び散ることにな
る。しかしながら本実施例ではブラシが上から下に擦っ
ていること,基板5が上昇していること,及びアンモニ
ア水溶液AQが上から下に噴射していることから,発生し
たブラシ片はガラス基板5の表面5b,5cに沿って上から
下に流され,そして第1図中に示した下端面5dから槽2
の底部に洗い落とされることになる。一般にガラス基板
5の一方の表面5cは凹凸のない単なるガラス面であるた
め,ブラシ片は表面5cに残ることなく下端面5dから洗い
落とされる。ところが,他方の表面5bには,第7図に示
すようにクロム等の薄膜PTがパターニングされて蒸着さ
れるため,上端面5aと平行にy方向に伸びた薄膜PTのエ
ッジ部には,ブラシ片Brが残る可能性が高い。従って,
ガラス基板5の上端面5aが位置aと位置bとの間を往復
するようにブラッシングしただけでは,第7図に示した
ようにブラシ片Brが表面5b上に残存することになる。そ
こで本実施例のように上端面5aを位置aと位置dとの間
で往復させることにより,たとえブラシ片Brが薄膜PTの
段差エッジ部に付着したとしても,端面5aでブラシ片Br
を発生していないので個数が少なく,それは複数回のブ
ラッシングの際に洗い流されることになる。このため,
第1図に示した位置cと位置dとの間隔は,表面5b上の
薄膜PTの形成領域から上端面5aまでの間隔と同程度に定
められる。通常のマスクやレチクルではガラス基板5の
周辺までパターニングされることなく,周辺に数mm〜十
数mm程度の余白部がある。この余白部は本来の露光や検
査等に寄与する領域ではないので,ブラッシングが不十
分なための異物のわずかな残存は,それ程大きな問題と
はならない。尚,回転ブラシ11a,11bの毛先はガラス基
板5の下端面5dに衝突することも起り得るが,下端面5d
で発生したブラシ片は,回転ブラシの回転方向とアンモ
ニア水溶液AQの噴射方向とから,下方に洗い落されるの
で,表面5b上の薄膜形成領域に付着する可能性は皆無で
ある。
Here, how the brush pieces are generated will be described with reference to FIG. FIG. 6 shows a state in which the upper end surface 5a is located at the position c in FIG. In such a state, the upper end surface 5a
Can occur while descending from position a to position b or rising from position b to position a. In particular, in the process of rising from the position b, the rotating brushes 11a and 11b move the glass substrate 5
Since both sides 5b, 5c of the brush are rotated so as to rub from top to bottom, and the glass substrate 5 is raised, the uppermost surface 5a of the bristles of the brush will collide most violently. When the tips of the bristles of the brush hit the corners formed by the upper end surface 5a and the surfaces 5b, 5c, the tips of the bristles become minute pieces and scatter. However, in this embodiment, since the brush rubs from the top to the bottom, the substrate 5 rises, and the aqueous ammonia solution AQ is sprayed from the top to the bottom, the generated brush pieces are generated on the glass substrate 5. Flowed from top to bottom along the surfaces 5b and 5c, and from the bottom surface 5d shown in Fig. 1 to the tank 2
Will be washed off at the bottom. In general, one surface 5c of the glass substrate 5 is a simple glass surface having no unevenness, so that the brush pieces are washed off from the lower end surface 5d without remaining on the surface 5c. However, since a thin film PT of chromium or the like is patterned and vapor-deposited on the other surface 5b as shown in FIG. 7, a brush is attached to the edge portion of the thin film PT extending in the y direction parallel to the upper end surface 5a. There is a high possibility that a piece of Br will remain. Therefore,
If the upper end surface 5a of the glass substrate 5 is simply brushed so as to reciprocate between the position a and the position b, the brush piece Br remains on the surface 5b as shown in FIG. Therefore, by reciprocating the upper end surface 5a between the position a and the position d as in the present embodiment, even if the brush piece Br adheres to the step edge portion of the thin film PT, the brush piece Br does not contact the end surface 5a.
Since it does not occur, the number is small and it will be washed away when brushing multiple times. For this reason,
The distance between the position c and the position d shown in FIG. 1 is set to be approximately the same as the distance from the region where the thin film PT is formed on the surface 5b to the upper end surface 5a. In a normal mask or reticle, the periphery of the glass substrate 5 is not patterned, and there is a margin of several mm to several tens of mm in the periphery. Since this margin portion is not a region that contributes to the original exposure or inspection, the slight residual foreign matter due to insufficient brushing does not pose a serious problem. The tips of the rotating brushes 11a and 11b may collide with the lower end surface 5d of the glass substrate 5, but the lower end surface 5d
Since the brush piece generated in step 2 is washed off downward from the rotating direction of the rotating brush and the injection direction of the aqueous ammonia solution AQ, there is no possibility of adhering to the thin film forming region on the surface 5b.

また,ガラス基板5の表面のできるだけ広い領域を正確
に洗浄するような場合は,レチクルやマスクの周辺の余
白部の寸法情報をMCU60に入力するようにし,アーム20
の上下動の際に,その寸法情報に基づいて上端面5aがブ
ラシと衝突しないような,ぎりぎりの位置になるまでガ
ラス基板5を降下させることもできる。
In addition, in the case of accurately cleaning the surface of the glass substrate 5 as large as possible, the dimension information of the marginal area around the reticle or mask is input to the MCU 60, and the arm 20
It is also possible to lower the glass substrate 5 until it reaches a bare position such that the upper end surface 5a does not collide with the brush based on the dimensional information when the glass substrate 5 is moved up and down.

さて,位置a,d間のブラッシングが終了したら,アンモ
ニア水溶液AQの噴射が停止され,ガラス基板5は位置a
から上昇して,再び純水リンスされた後,開口部21から
槽2の上方に引き出される。
Now, when the brushing between the positions a and d is completed, the injection of the aqueous ammonia solution AQ is stopped and the glass substrate 5 is moved to the position a.
After being rinsed with pure water again, it is drawn out from the opening 21 to above the tank 2.

上記実施例では2つの回転ブラシ11a,11bの間隔35(第
2図参照)が一定であるものとしたが,その間隔が数mm
程度可変できるような構成にしておくと,基板5の上端
面5aが位置cにきたとき,間隔35を広げてブラシが上端
面5aに衝突しないようにすることができる。この場合も
基板5の洗浄面を制限する点で同様の効果が得られる。
さらに回転ブラシ11a,11bの軸O1,O2を垂直に立てて,基
板5を直立させた状態で水平に移動させるような構成に
おいても同様である。この場合は,基板5の垂直な端部
からブラシ片が発生することになる。
In the above embodiment, the gap 35 (see FIG. 2) between the two rotary brushes 11a and 11b is constant, but the gap is several mm.
With a configuration that can be varied to some extent, when the upper end surface 5a of the substrate 5 reaches the position c, the gap 35 can be widened so that the brush does not collide with the upper end surface 5a. Also in this case, the same effect can be obtained in that the cleaning surface of the substrate 5 is limited.
Further, the same applies to a configuration in which the axes O 1 and O 2 of the rotating brushes 11a and 11b are set upright and the substrate 5 is moved horizontally in an upright state. In this case, brush pieces are generated from the vertical end of the substrate 5.

尚,ガラス基板5の位置a,b間の往復によるブラッシン
グと,位置a,d間の往復によるブラッシングとを,どの
ように組み合わせるかをMCU60に予め記憶しておくとよ
い。その際,公知の異物検査装置からのゴミ付着情報も
加味することが望ましい。
It should be noted that how to combine the reciprocal brushing between the positions a and b of the glass substrate 5 and the reciprocal brushing between the positions a and d may be stored in the MCU 60 in advance. At that time, it is desirable to take into consideration the dust adhesion information from a known foreign substance inspection device.

次に本発明の第2の実施例によるブラッシング方法を第
8図に基づき説明する。本実施例では,アンモニア水溶
液AQをガラス基板5の両側からほぼ水平に表面5b,5cに
沿って噴射させるようにする。そのため装置としては,
ほとんど広がることのないようにアンモニア水溶液AQを
噴射するノズル32a,32b,33a,33bを設ける。ノズル32a,3
2bは回転ブラシ11aの上側で基板5にアンモニア水溶液A
Qが噴射されるように配置され,ノズル33a,33bは回転ブ
ラシ11aの下側で基板5にアンモニア水溶液AQが噴射さ
れるように配置されている。このように回転ブラシの回
転軸とほぼ平行に水溶液AQを噴射すると,表面5b上の段
差エッジ部に付着したブラシ片Brを洗い流す効果が向上
する。ブラシ片Brが引っかかる段差エッジは,先の説明
からも明らかな如く,ブラシの回転軸O1,O2とほぼ平行
なエッジであるため,そのエッジに沿ってブラシ片Brは
噴射圧力で押し流されることになる。
Next, a brushing method according to the second embodiment of the present invention will be described with reference to FIG. In this embodiment, the aqueous ammonia solution AQ is sprayed from both sides of the glass substrate 5 substantially horizontally along the surfaces 5b and 5c. Therefore, as a device,
Nozzles 32a, 32b, 33a, 33b for injecting the aqueous ammonia solution AQ are provided so that they hardly spread. Nozzle 32a, 3
2b is the upper side of the rotating brush 11a and the ammonia solution A on the substrate 5
The nozzles 33a and 33b are arranged so as to inject the aqueous ammonia solution AQ onto the substrate 5 below the rotary brush 11a. When the aqueous solution AQ is sprayed substantially parallel to the rotation axis of the rotating brush in this way, the effect of washing off the brush piece Br adhering to the step edge on the surface 5b is improved. As is clear from the above description, the step edge on which the brush piece Br is caught is an edge that is substantially parallel to the rotation axes O 1 and O 2 of the brush, so the brush piece Br is pushed away by the jet pressure along the edge. It will be.

以上,本発明の各実施例を説明したが,その他の実施例
として,カップ状ブラシを使う場合もある。この場合,
カップ状ブラシはガラス基板5の表面と平行な面内で回
転するので,基板上の薄膜形成領域は擦り,端面部は擦
らないように,カップ状ブラシの直径を定めておけばよ
い。またカップ状ブラシの直径が薄膜形成領域よりもか
なり小さい場合は,カップ状ブラシを回転させつつ,基
板とブラシとを相対的に2次元移動させる必要がある
が,この際カップ状ブラシが基板の端面部に衝突しない
ように,その2次元移動の範囲を制限すれば同様の効果
が得られる。
Although the respective embodiments of the present invention have been described above, a cup-shaped brush may be used as another embodiment. in this case,
Since the cup-shaped brush rotates in a plane parallel to the surface of the glass substrate 5, the diameter of the cup-shaped brush may be set so that the thin film forming region on the substrate rubs and the end face does not rub. Further, when the diameter of the cup-shaped brush is considerably smaller than the thin film forming region, it is necessary to relatively move the substrate and the brush two-dimensionally while rotating the cup-shaped brush. The same effect can be obtained by limiting the range of the two-dimensional movement so as not to collide with the end face portion.

またスクラブ材としては,ブラシ以外にスポンジ等を用
いても同様の効果が得られる。また回転ブラシの場合
は,ブラシが基板の端面に当たるような位置にきたと
き,強制的に回転を停止させても同様である。
The same effect can be obtained by using sponge or the like as the scrubbing material in addition to the brush. Further, in the case of a rotating brush, the same is true even when the rotation is forcibly stopped when the brush reaches a position where it comes into contact with the end surface of the substrate.

(発明の効果) 以上,本発明によればスクラブ材が基板の端部と衝突し
ないようにしたので,スクラブ材自体から発生する微小
な異物(ブラシ片,スポンジ片等)が極めて少なくな
り,スクラブ材自体が汚染源となることがなくなり,基
板の洗浄効率が各段に向上するといった効果が得られ
る。
(Effects of the Invention) As described above, according to the present invention, the scrubbing material is prevented from colliding with the end portion of the substrate, so that minute foreign matter (brush pieces, sponge pieces, etc.) generated from the scrubbing material itself is extremely reduced, and scrubbing The material itself does not become a pollution source, and the cleaning efficiency of the substrate is improved step by step.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の第1実施例によるブラッシング工程の
様子を説明する図,第2図は自動洗浄装置の全体の構成
を概略的に示す配置図,第3図はブラシ洗浄槽の構成を
示す斜視図,第4図は回転ブラシの駆動機構を示す平面
図,第5図は制御系の回路ブロック図,第6図は回転ブ
ラシとガラス基板の配置の一例を示す平面図,第7図は
ガラス基板の部分断面を示す断面図,第8図は本発明の
他の実施例を示す平面図である。 〔主要部分の符号の説明〕 2……ブラシ洗浄槽 5……ガラス基板, 5a,5b……端面 11a,11b……回転ブラシ(スクラブ材) PT……薄膜,Br……ブラシ片
FIG. 1 is a diagram for explaining the state of the brushing process according to the first embodiment of the present invention, FIG. 2 is a layout diagram schematically showing the overall structure of an automatic cleaning device, and FIG. 3 is a structure of a brush cleaning tank. FIG. 4 is a perspective view showing the rotary brush drive mechanism, FIG. 5 is a circuit block diagram of the control system, FIG. 6 is a plan view showing an example of the arrangement of the rotary brush and the glass substrate, and FIG. Is a sectional view showing a partial section of the glass substrate, and FIG. 8 is a plan view showing another embodiment of the present invention. [Explanation of symbols for main parts] 2 …… Brush cleaning tank 5 …… Glass substrate, 5a, 5b …… End surface 11a, 11b …… Rotating brush (scrub material) PT …… Thin film, Br …… Brush piece

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】板状の基板とスクラブ材とを相対的に移動
して摩擦によって該基板の表面を洗浄する方法におい
て, 該スクラブ材が前記相対的な移動方向に関する前記基板
の端部に衝突しないように、前記端部付近では前記スク
ラブ材を前記基板表面から離し、 前記基板表面の前記スクラブ材による洗浄面を制限した
ことを特徴とする基板の洗浄方法。
1. A method of cleaning a surface of a substrate by friction by relatively moving a plate-shaped substrate and a scrubbing member, wherein the scrubbing member collides with an end portion of the substrate in the relative moving direction. In order not to do so, the scrubbing material is separated from the surface of the substrate in the vicinity of the end portion, and the cleaning surface of the substrate surface with the scrubbing material is limited.
【請求項2】前記スクラブ材は円筒状ローラに放射状に
植毛した一対の回転ブラシであって,該一対の回転ブラ
シの間に前記基板が位置するように、前記回転ブラシと
前記基板とを相対移動させる際,前記回転ブラシが前記
基板の端部に衝突しないように,前記基板の端部付近で
は前記回転ブラシの間隔を広げることを特徴とする特許
請求の範囲第1項記載の方法。
2. The scrubbing member is a pair of rotating brushes radially planted on a cylindrical roller, and the rotating brush and the substrate are opposed to each other so that the substrate is located between the pair of rotating brushes. The method according to claim 1, wherein the distance between the rotating brushes is increased near the edge of the substrate so that the rotating brush does not collide with the edge of the substrate when moving.
【請求項3】前記回転ブラシは前記基板と掻き出す方向
に回転し、前記回転ブラシと前記基板とを相対移動させ
る際,前記回転ブラシが前記掻き出す方向に関して後ろ
側の前記基板の端部付近で、前記回転ブラシの間隔を広
げることを特徴とする特許請求の範囲第2項記載の方
法。
3. The rotating brush rotates in a scraping direction with respect to the substrate, and when the rotating brush and the substrate are relatively moved, in the vicinity of an end portion of the substrate on the rear side with respect to the scraping direction of the rotating brush, The method according to claim 2, wherein the distance between the rotating brushes is increased.
【請求項4】前記スクラブ材による摩擦の際,前記基板
表面に対して少なくとも2方向から洗浄液を噴射するこ
とを特徴とする特許請求の範囲第1項記載の方法。
4. The method according to claim 1, wherein the cleaning liquid is sprayed onto the surface of the substrate from at least two directions when the scrubbing material is rubbed.
【請求項5】前記スクラブ材は,前記基板表面と平行な
面内で回転するブラシであって,該ブラシの回転によっ
て摩擦される領域が前記基板の大きさよりも小さくなる
ように,該ブラシの大きさを制限したことを特徴とする
特許請求の範囲第1項記載の方法。
5. The scrubbing material is a brush that rotates in a plane parallel to the surface of the substrate, and the scrubbing material of the brush is adjusted so that the area rubbed by the rotation of the brush becomes smaller than the size of the substrate. Method according to claim 1, characterized in that it is of limited size.
JP12175185A 1985-06-05 1985-06-05 Substrate cleaning method Expired - Lifetime JPH073577B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12175185A JPH073577B2 (en) 1985-06-05 1985-06-05 Substrate cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12175185A JPH073577B2 (en) 1985-06-05 1985-06-05 Substrate cleaning method

Publications (2)

Publication Number Publication Date
JPS61279857A JPS61279857A (en) 1986-12-10
JPH073577B2 true JPH073577B2 (en) 1995-01-18

Family

ID=14818981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12175185A Expired - Lifetime JPH073577B2 (en) 1985-06-05 1985-06-05 Substrate cleaning method

Country Status (1)

Country Link
JP (1) JPH073577B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107411669B (en) * 2017-07-26 2021-04-20 佛山市顺德区美的洗涤电器制造有限公司 Washing control method and device of dish washing machine based on water supply of water tank and dish washing machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195652A (en) * 1983-04-21 1984-11-06 Nec Corp Method for washing light exposure mask
JPS59195653A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing photomask

Also Published As

Publication number Publication date
JPS61279857A (en) 1986-12-10

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