JPH0734520B2 - Electronic component automatic mounting device - Google Patents
Electronic component automatic mounting deviceInfo
- Publication number
- JPH0734520B2 JPH0734520B2 JP63142108A JP14210888A JPH0734520B2 JP H0734520 B2 JPH0734520 B2 JP H0734520B2 JP 63142108 A JP63142108 A JP 63142108A JP 14210888 A JP14210888 A JP 14210888A JP H0734520 B2 JPH0734520 B2 JP H0734520B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- adhesive
- point
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子機器の回路を構成する回路基板にチップ
型の電子部品を装着する電子部品自動装着装置に関する
ものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus that mounts a chip-type electronic component on a circuit board that constitutes a circuit of an electronic device.
従来の技術 従来この種の電子部品自動装着装置は第９図，第10図に
示すように、接着剤塗布と電子部品装着を同時に行う型
式であった。2. Description of the Related Art Conventionally, as shown in FIGS. 9 and 10, this type of automatic electronic component mounting apparatus has been a type in which adhesive application and electronic component mounting are performed simultaneously.
すなわち、載置された回路基板18a,18bを矢印Ｘおよび
Ｙ方向に移動して位置決めするＸ−Ｙテーブル５と、Ｘ
−Ｙテーブル５の近くに設置されＺ方向に移動可能な部
品棚１と、上記Ｘ−Ｙテーブル５と部品棚１との間に配
置され矢印Ｆ方向に回転割出しをするターンテーブル４
とその外周に設置された上下動可能な複数の装着チャッ
ク３と電子部品装着部の一定距離離れた位置に設けてい
るパターン位置検出用カメラ７と電子部品19を回路基板
18bに固定するための接着剤を塗布する接着剤塗布ヘッ
ド６から構成されている。装着チャック３がＡの位置で
電子部品19を吸着した後、ターンテーブル４がＦ方向に
回転し、Ｃの装着ポイントでＸ−Ｙテーブル５上のすで
に接着剤を塗布した回路基板18aに装着チャック３が下
降し電子部品19の装着を行う。また、同時にＤの塗布ポ
イントで、Ｘ−Ｙテーブル５上の回路基板18bに接着剤
塗布ヘッド６により接着剤の塗布を行う。第11図に示す
ように装着ポイントＣより （ベクトル量）だけ離れた位置にパターン位置検出用カ
メラ７を設ける。装着ポイントＣと装着パターン９との
ずれ量を測定するために回路基板18aをパターン位置検
出用カメラ７と装着ポイントＣの距離 だけ動かし、装着ポイントＣを だけ動かし位置をＧとする。その時のパターン位置検出
用カメラ７でとらえた映像を第12図に示す。電子部品装
着用パターン９と装着ポイントＣのずれ量 （ベクトル量）を測定することができる。そして第13図
のようにＸ−Ｙテーブル５を だけ移動させることにより電子部品装着用パターン９は
第14図のように装着ポイントＣの真下にくることにな
り、装着ポイントＣで電子部品19の装着と塗布ポイント
Ｄで接着剤塗布を同時に行う。That is, an XY table 5 for moving and positioning the placed circuit boards 18a, 18b in the directions of the arrows X and Y;
A parts shelf 1 installed near the Y table 5 and movable in the Z direction, and a turntable 4 arranged between the XY table 5 and the parts shelf 1 for rotational indexing in the arrow F direction.
And a plurality of vertically movable mounting chucks 3 installed on the outer periphery thereof, a pattern position detection camera 7 and an electronic component 19 provided at positions separated by a certain distance between the electronic component mounting portions.
It is composed of an adhesive application head 6 for applying an adhesive for fixing to 18b. After the mounting chuck 3 picks up the electronic component 19 at the position A, the turntable 4 rotates in the F direction, and at the mounting point C, the mounting chuck is mounted on the circuit board 18a already coated with the adhesive on the XY table 5. 3 descends to mount the electronic component 19. At the same time, at the application point D, the adhesive is applied to the circuit board 18b on the XY table 5 by the adhesive application head 6. From the mounting point C as shown in FIG. The pattern position detection camera 7 is provided at a position separated by (vector amount). In order to measure the amount of displacement between the mounting point C and the mounting pattern 9, the circuit board 18a is placed on the distance between the pattern position detection camera 7 and the mounting point C. Just move the attachment point C Just move it to G. FIG. 12 shows an image captured by the pattern position detecting camera 7 at that time. The amount of deviation between the electronic component mounting pattern 9 and the mounting point C (Vector quantity) can be measured. Then, as shown in FIG. 13, set the XY table 5 By moving only, the electronic component mounting pattern 9 comes directly below the mounting point C as shown in FIG. 14, and the mounting of the electronic component 19 at the mounting point C and the adhesive coating at the coating point D are performed simultaneously.
発明が解決しようとする課題 上記構成においては第13図のように塗布側の回路基板18
bの電子部品装着用パターン９と塗布ポイントとの間に （ベクトル量）のずれ量があった場合、第14図のように
塗布ポイントＤと電子部品装着用パターン９′に のずれが生じる。このため接着剤塗布不良、それに伴う
電子部品実装不良が発生し装着品質が安定しないという
問題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the above-mentioned structure, as shown in FIG.
Between the electronic component mounting pattern 9 of b and the application point When there is a deviation amount of (vector amount), as shown in FIG. 14, the coating point D and the electronic component mounting pattern 9'are Deviation occurs. For this reason, there is a problem in that the application quality of the adhesive is not stable due to defective application of the adhesive and accompanying defective electronic component mounting.
の値が大きいとき、装着品質を保つことが困難になるた
め、装着動作と塗布動作を別々に行う必要があり、設備
稼動が低下する問題があった。 When the value of is large, it becomes difficult to maintain the mounting quality, so it is necessary to separately perform the mounting operation and the coating operation, and there is a problem that the equipment operation is reduced.
本発明は以上のような従来の欠点を除去し装着品質の向
上を図った電子部品自動実装装置を提供することを目的
とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component automatic mounting apparatus that eliminates the above-mentioned conventional defects and improves the mounting quality.
課題を解決するための手段 本発明は前記課題を解決するため、塗布ヘッドを外部動
力によりＸ−Ｙ方向に指令されたデータに基づく一定量
だけ移動するように取りつけ、電子部品装着部、接着剤
塗布部の一定距離離れた位置にパターン位置検出用カメ
ラ２台設ける構成としたものである。Means for Solving the Problems In order to solve the above problems, the present invention mounts an application head so as to move by a fixed amount based on data instructed in an XY direction by external power, and mounts an electronic component mounting portion and an adhesive. In this structure, two pattern position detecting cameras are provided at positions apart from each other by a certain distance in the coating section.
作用 以上の構成とすることにより、２台のパターン位置検出
用カメラで装着ポイント、塗布ポイントと装着側、塗布
側の電子部品装着用パターンのずれ量を測定し、装着側
では装着ポイントと電子部品装着用パターンのずれ量を
Ｘ−Ｙテーブルで補正し、塗布側ではＸ−Ｙテーブルで
補正されたずれ量と塗布ポイントと塗布側の電子部品装
着用にパターンのずれ量を位置補正付接着剤塗布ヘッド
により補正することができる。Operation With the above configuration, the displacement amount of the mounting point, the coating point and the mounting side, and the coating pattern of the electronic component mounting side of the coating side is measured by the two pattern position detection cameras, and the mounting point and the electronic component are measured on the mounting side. The displacement amount of the mounting pattern is corrected by the XY table, and the displacement amount corrected by the XY table on the application side and the displacement amount of the application point and the pattern displacement amount for application of electronic components on the application side It can be corrected by the coating head.
実施例 以下、本発明の一実施例を図面に基づいて説明する。第
１図，第２図は本発明の実施例であるがこの電子部品自
動装着装置は、設置された回路基板18a,18bを矢印Ｘお
よびＹ方向に移動して位置決めするＸ−Ｙテーブル５
と、このＸ−Ｙテーブル５の近傍に設置され矢印Ｚ方向
に移動可能な部品棚１と、上記Ｘ−Ｙテーブル５と部品
棚１との間に配置され矢印Ｆ方向に回転割り出しをする
ターンテーブル４と、その外周に設置された上下動可能
な複数の装着チャック３と、電子部品装着部Ｃと接着剤
塗布ポイントＤの一定距離離れた位置にパターン位置検
出用カメラ7,7′と電子部品19を回路基板18a,18bに固定
するための位置補正付接着剤塗布ヘッド11から構成され
ている。Embodiment An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the present invention, this electronic component automatic mounting apparatus is an XY table 5 for positioning the circuit boards 18a, 18b installed by moving them in the directions X and Y.
And a parts shelf 1 installed near the XY table 5 and movable in the arrow Z direction, and a turn arranged between the XY table 5 and the parts shelf 1 for rotational indexing in the arrow F direction. The table 4, a plurality of vertically movable mounting chucks 3 installed on the outer periphery of the table 4, the pattern position detection cameras 7, 7'and electronic devices at a position separated by a certain distance between the electronic component mounting portion C and the adhesive application point D. It is composed of a position-correcting adhesive application head 11 for fixing the component 19 to the circuit boards 18a, 18b.
以下動作説明をすると、Ａの位置で部品棚１より電子部
品19を装着チャック３で吸着した後、ターンテーブル４
がＦ方向に回転し、電子部品19をＣの位置まで搬送して
いる。Ｄは塗布ポイントである。The operation will be described below. After the electronic component 19 is picked up by the mounting chuck 3 from the component shelf 1 at the position A, the turntable 4 is moved.
Rotates in the F direction and carries the electronic component 19 to the C position. D is a coating point.
第３図のように装着ポイントＣ・塗布ポイントＤより （ベクトル量）だけ離れた位置にパターン位置検出用カ
メラ7,7′を設ける。装着ポイントＣ・塗布ポイントＤ
のずれ量を測定するために回路基板18a,18bをパターン
位置検出用カメラ7,7′の下へ装着ポイントＣ・塗布ポ
イントＤの位置 だけ動かし、装着ポイントＣ・塗布ポイントＤがパター
ン位置検出用カメラ7,7′の下にくるようにする。装着
ポイントＣ・塗布ポイントＤを だけ動かした位置をＧ・Ｈとする。その時のパターン位
置検出用カメラ7,7′でとらえた映像を第４図に示す。
電子部品装着用パターンとパターン位置検出用カメラ7,
7′のＧ・Ｈとのずれ量 （ベクトル量）を測定することができる。From installation point C and application point D as shown in FIG. Pattern position detecting cameras 7 and 7'are provided at positions separated by (vector amount). Installation point C / application point D
The circuit boards 18a, 18b under the pattern position detecting cameras 7, 7'to measure the amount of deviation of Only the mounting point C and the coating point D are positioned below the pattern position detecting cameras 7 and 7 '. Installation point C and application point D The moved position is G ・ H. An image captured by the pattern position detecting cameras 7, 7'at that time is shown in FIG.
Electronic component mounting pattern and pattern position detection camera 7,
Deviation from 7'G ・ H (Vector quantity) can be measured.
第５図は接着剤塗布ポイントＤとチップ装着用パターン
９′のずれ量が補正できる位置補正付接着剤塗布ヘッド
11のΔＹ補正の構成図である。塗布ヘッドユニットが支
点35を中心に回転が可能になっており、ΔＹ用パルスモ
ータ38が回転しかつ37の曲線によりレバー36を上下動さ
せることにより先端の接着剤塗布ノズル32を移動させ、
ΔＹの補正を行う。第６図はΔＸ補正を示す。接着剤塗
布選択用パルスモータ40、タイミングベルト41、シャフ
ト43、ホルダー33が回転し、塗布ノズル32のΔＸ補正を
行う。FIG. 5 shows an adhesive application head with position correction capable of correcting the amount of deviation between the adhesive application point D and the chip mounting pattern 9 '.
It is a block diagram of (DELTA) Y correction of 11. The coating head unit is rotatable about a fulcrum 35, the ΔY pulse motor 38 is rotated and the lever 36 is moved up and down by the curve of 37 to move the adhesive coating nozzle 32 at the tip,
Correct ΔY. FIG. 6 shows ΔX correction. The pulse motor 40 for adhesive application selection, the timing belt 41, the shaft 43, and the holder 33 rotate to perform ΔX correction of the application nozzle 32.
第７図のようにＸ−Ｙテーブル５を だけ移動させることにより電子部品装着用パターン９は
装着ポイントＣの真下にくる。また、接着剤塗布ヘッド
11では だけずれてしまう。XY table 5 as shown in FIG. Only by moving the electronic component mounting pattern 9, the electronic component mounting pattern 9 is located directly below the mounting point C. Also, the adhesive application head
In 11 It just shifts.
第８図のように塗布ポイントＤを 移動させることにより電子部品装着用パターン９′の真
上にくるようにする。そして装着動作と塗布動作を同時
に行う。Apply point D as shown in Fig. 8. By moving it, it is positioned right above the electronic component mounting pattern 9 '. Then, the mounting operation and the coating operation are simultaneously performed.
発明の効果 以上のように構成された本発明における電子部品自動装
着位置には下記のような効果があり、今後広く業界で使
用されていくものと思われその産業性には大なるものが
ある。Effects of the Invention The electronic component automatic mounting position in the present invention configured as described above has the following effects, and it is considered that it will be widely used in the industry in the future, and its industriality is great. .
塗布側の塗布ポイントと電子部品装着用パターンのず
れ量を位置補正付接着剤塗布ヘッドによって補正し、電
子部品装着・接着剤塗布動作を同時に行えるため、電子
部品を電子部品装着用パターンに正確に固定でき設備稼
動の向上も図れる。The amount of deviation between the application point on the application side and the electronic component mounting pattern is corrected by the adhesive coating head with position correction, and electronic component mounting / adhesive coating operations can be performed simultaneously, so that electronic components can be accurately mounted on the electronic component mounting pattern. It can be fixed and the operation of the equipment can be improved.
Ｘ−Ｙテーブルを２つ設ける必要がなく、現状の設備
の大きさでコンパクトに対応でき、コストダウンが図れ
る。Since it is not necessary to provide two XY tables, the size of the current equipment can be made compact and the cost can be reduced.
第１図は本発明の電子部品装着装置の一実施例を示す平
面図、第２図は本発明の電子部品装着装置の一実施例を
示す斜視図、第３図はパターン位置検出用カメラのレイ
アウトを示す平面図、第４図はパターン位置検出用カメ
ラでのぞいた平面図、第５図は位置補正付接着剤塗布機
構のΔＹの動きをあらわした構成図、第６図は位置補正
付接着剤塗布機構のΔX2の動きをあらわした構成図、第
７図は本発明の電子部品装着装置で補正をかけた平面
図、第８図は本発明の電子部品装着装置で補正をかけた
斜視図、第９図は従来の電子部品装着装置の平面図、第
10図は従来の電子部品装着装置の斜視図、第11図はパタ
ーン位置検出用カメラのレイアウト図、第12図はパター
ン位置検出用カメラでのぞいた平面図、第13図は従来の
電子部品装着装置で補正をかけた平面図、第14図は従来
の電子部品装着装置で補正をかけた斜視図である。 １……部品棚、３……装着チャック、４……ターンテー
ブル、５……XYテーブル、６……接着剤塗布ヘッド、7,
7′……パターン位置検出用カメラ、9,9′……電子部品
装着用パターン、10……接着剤、11……位置補正付接着
剤塗布ヘッド、18a……接着剤を塗布した回路基板、18b
……回路基板、19……電子部品、31……接着剤タンク、
32……接着剤塗布ノズル、33……ホルダー、34……プッ
シャー、35……支点、36……レバー、37……カム、38…
…ΔＹパルスモータ、39……上部ベース、40……接着剤
塗布ノズル選択用パルスモータ、41……タイミングベル
ト、43……シャフト。1 is a plan view showing an embodiment of an electronic component mounting apparatus of the present invention, FIG. 2 is a perspective view showing an embodiment of an electronic component mounting apparatus of the present invention, and FIG. 3 is a pattern position detection camera. FIG. 4 is a plan view showing a layout, FIG. 4 is a plan view seen through a pattern position detecting camera, FIG. 5 is a configuration diagram showing the movement of ΔY of an adhesive coating mechanism with position correction, and FIG. 6 is a bonding with position correction. FIG. 7 is a configuration diagram showing the movement of ΔX 2 of the agent applying mechanism, FIG. 7 is a plan view corrected by the electronic component mounting apparatus of the present invention, and FIG. 8 is a perspective view corrected by the electronic component mounting apparatus of the present invention. FIG. 9 is a plan view of a conventional electronic component mounting apparatus, FIG.
FIG. 10 is a perspective view of a conventional electronic component mounting apparatus, FIG. 11 is a layout diagram of a pattern position detection camera, FIG. 12 is a plan view seen through a pattern position detection camera, and FIG. 13 is a conventional electronic component mounting device. FIG. 14 is a plan view corrected by the apparatus, and FIG. 14 is a perspective view corrected by the conventional electronic component mounting apparatus. 1 ... parts shelf, 3 ... mounting chuck, 4 ... turntable, 5 ... XY table, 6 ... adhesive application head, 7,
7 '... Pattern position detection camera, 9, 9' ... Electronic component mounting pattern, 10 ... Adhesive, 11 ... Position-correcting adhesive application head, 18a ... Adhesive-coated circuit board, 18b
...... Circuit board, 19 ...... Electronic parts, 31 …… Adhesive tank,
32 …… Adhesive application nozzle, 33 …… Holder, 34 …… Pusher, 35 …… Support point, 36 …… Lever, 37 …… Cam, 38…
… ΔY pulse motor, 39 …… upper base, 40 …… pulse motor for selecting adhesive application nozzle, 41 …… timing belt, 43 …… shaft.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 京谷 高義 大阪府門真市大字門真1006番地 松下電器 産業株式社内 (72)発明者 中村 光晴 大阪府門真市大字門真1006番地 松下電器 産業株式社内 (72)発明者 高橋 亨 大阪府門真市大字門真1006番地 松下電器 産業株式社内 (56)参考文献 特開 昭62−186600（ＪＰ，Ａ) 特開 昭62−166597（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Takayoshi Kyotani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Mitsuharu Nakamura 1006 Kadoma, Kadoma City, Osaka Company, Matsushita Electric Industrial Co., Ltd. (72) Inventor Toru Takahashi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 62-186600 (JP, A) JP 62-166597 (JP, A)
Claims (1)
着ヘッドを同一装置内に有し、NC制御のＸ−Ｙテーブル
上に２枚の回路基板を保持し、接着剤塗布と電子部品装
着を同時に行う構成とし、上記接着剤塗布ヘッドを外部
動力によりＸ−Ｙ方向に指令されたデータに基づく一定
量だけ移動するように取りつけ、接着剤を塗布する回路
基板と電子部品を装着する回路基板の電子部品装着用パ
ターンとそれぞれの塗布ポイントと装着ポイントとのず
れ量をパターン位置検出用カメラ２台で別々に検出し、
装着部では、装着ポイントと装着剤の電子部品装着用パ
ターンとのずれ量をＸ−Ｙテーブルで補正し、塗布側で
はＸ−Ｙテーブルで補正されたずれ量と塗布ポイントと
塗布側の電子部品装着用パターンのずれ量を位置補正付
接着剤塗布ヘッドによりＸ−Ｙ方向に動かすことにより
補正することを特徴とする電子部品自動装着装置。1. An adhesive application head for temporary fixing and an electronic component mounting head are provided in the same device, and two circuit boards are held on an NC-controlled XY table. A circuit for mounting an adhesive and a circuit board for applying an adhesive and a circuit board for applying an adhesive, in which the adhesive applying head is attached so as to move by a predetermined amount based on data instructed in the XY direction by external power. The deviation amount between the electronic part mounting pattern on the board and each coating point and mounting point is detected separately by two pattern position detection cameras,
In the mounting portion, the displacement amount between the mounting point and the electronic component mounting pattern of the mounting material is corrected by the XY table, and on the coating side, the displacement amount corrected by the XY table and the coating point and the electronic component on the coating side are corrected. An electronic component automatic mounting apparatus characterized in that the amount of displacement of a mounting pattern is corrected by moving the adhesive coating head with position correction in the XY directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63142108A JPH0734520B2 (en) | 1988-06-09 | 1988-06-09 | Electronic component automatic mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63142108A JPH0734520B2 (en) | 1988-06-09 | 1988-06-09 | Electronic component automatic mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01310600A JPH01310600A (en) | 1989-12-14 |
| JPH0734520B2 true JPH0734520B2 (en) | 1995-04-12 |
Family
ID=15307610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63142108A Expired - Fee Related JPH0734520B2 (en) | 1988-06-09 | 1988-06-09 | Electronic component automatic mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0734520B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0828564B2 (en) * | 1990-03-29 | 1996-03-21 | 三洋電機株式会社 | Coating device |
-
1988
- 1988-06-09 JP JP63142108A patent/JPH0734520B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01310600A (en) | 1989-12-14 |
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