JPH07335821A - Liquid removing apparatus for semiconductor - Google Patents
Liquid removing apparatus for semiconductorInfo
- Publication number
- JPH07335821A JPH07335821A JP6124141A JP12414194A JPH07335821A JP H07335821 A JPH07335821 A JP H07335821A JP 6124141 A JP6124141 A JP 6124141A JP 12414194 A JP12414194 A JP 12414194A JP H07335821 A JPH07335821 A JP H07335821A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- resin
- lead frame
- absorbing means
- liquid absorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 73
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000007602 hot air drying Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体用の洗浄・乾燥
工程における液体除去装置に関わり、特にリードフレー
ムに付着した液体除去に使用する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid removing device in a semiconductor cleaning / drying process, and is particularly used for removing a liquid adhering to a lead frame.
【０００２】[0002]
【従来の技術】半導体素子の組立工程には、絶縁基板に
マウントする方法などの外にリードフレームを利用する
方式も多用されている。純鉄、鉄ニッケル合金、銅更に
クラッド材料などから成り、集積度の高い半導体素子を
マウントするリードフレームは、厚さやインナーリード
の径を抑えるのが通常である。2. Description of the Related Art In the process of assembling a semiconductor device, a method of using a lead frame is often used in addition to a method of mounting on an insulating substrate. The lead frame, which is made of pure iron, iron-nickel alloy, copper, clad material, etc. and mounts highly integrated semiconductor elements, usually has a reduced thickness and inner lead diameter.
【０００３】このようなリードフレームにマウントされ
る半導体素子は、その後で外界からの影響を防止するた
めに封止樹脂を被覆し、半導体素子に電気的に接続した
リードを封止樹脂外に導出して外部の電子機器と電気的
に接続する方式が採られている。封止樹脂外に導出した
リードは名称がアウターリード、これに対応して封止樹
脂内のそれはインナーリードと記載する。A semiconductor element mounted on such a lead frame is then covered with a sealing resin in order to prevent an influence from the outside, and leads electrically connected to the semiconductor element are led out of the sealing resin. Then, a method of electrically connecting with an external electronic device is adopted. The lead lead out of the sealing resin is described as an outer lead, and correspondingly, the lead inside the sealing resin is described as an inner lead.
【０００４】表面実装用の樹脂封止型半導体装置にあっ
ては、アウターリードを特殊な形状に整形する品種もあ
るが、本発明は直線状のアウターリードを有する樹脂封
止型半導体装置に適用する。In the surface-sealed resin-sealed semiconductor device, there is a type in which the outer lead is shaped into a special shape, but the present invention is applied to the resin-sealed semiconductor device having a linear outer lead. To do.
【０００５】直線状のアウターリードを備え樹脂封止工
程を終えた樹脂封止型半導体装置は、リードフレームや
封止樹脂に付着した液体など例えばメッキ工程後のもの
を除去後、後続の工程を経て完成される。A resin-sealed semiconductor device having a linear outer lead and having completed the resin-sealing process has the following process after removing the liquid such as the liquid adhering to the lead frame and the sealing resin after the plating process. It will be completed.
【０００６】その乾燥に当っては、図６や図７に明かに
した液体除去装置が利用されている。For the drying, the liquid removing device shown in FIGS. 6 and 7 is used.
【０００７】即ち図６は洗浄処理ならびに液体除去を併
用する型であり、図７は遠心力により液体除去を行う型
である。更に熱風乾燥による方式も知られている。That is, FIG. 6 shows a mold that uses both cleaning treatment and liquid removal, and FIG. 7 shows a mold that removes liquid by centrifugal force. Further, a method using hot air drying is also known.
【０００８】樹脂により封止された半導体素子をマウン
トしたリードフレームとしては、短辺と長辺から成る平
面矩形状のリードフレーム例について図６と図７で説明
する。As a lead frame on which a semiconductor element sealed with resin is mounted, an example of a rectangular lead frame having short sides and long sides will be described with reference to FIGS. 6 and 7.
【０００９】中空の処理槽２０には、内部に向かった２
本のエアーブロ配管２１、２１′（図６参照）が設置さ
れており、樹脂封止工程を終えた被処理物である矩形リ
ードフレーム２２を保持するハンガ２３（図６参照）を
中空の処理槽２０に対応して配置する。ハンガ２３に
は、ハンド２４（図６参照）を取付けて矩形リードフレ
ーム２２を固定する。The hollow processing tank 20 has two inner surfaces.
Book air blow pipes 21 and 21 '(see FIG. 6) are installed, and a hanger 23 (see FIG. 6) holding a rectangular lead frame 22 which is an object to be processed after the resin sealing step is used as a hollow processing tank. It is arranged corresponding to 20. A hand 24 (see FIG. 6) is attached to the hanger 23 to fix the rectangular lead frame 22.
【００１０】一方樹脂（図示せず）により封止され、半
導体素子（図示せず）がマウントされた矩形リードフレ
ーム２２は、ハンド２４により固定されると共に乾燥さ
せる。On the other hand, the rectangular lead frame 22 sealed with a resin (not shown) and mounted with a semiconductor element (not shown) is fixed by a hand 24 and dried.
【００１１】このためにエアーブロ用配管２１、２１′
間を上下に移動させる外に、樹脂封止型半導体装置のリ
ードフレーム２２に相対向する方向からエアーブロを吹
付ける。For this purpose, the air blow pipes 21, 21 '
In addition to moving the space up and down, an air blow is blown from the direction opposite to the lead frame 22 of the resin-sealed semiconductor device.
【００１２】これに対して図７に示す乾燥装置では、モ
ータ２５に取付けた例えばベルト２６により回転可能な
回転軸２７を中空の処理槽２０内に設置し、これに取付
けた第１支持体２８にリードフレーム保持部２９、２
９′を固定する。その上部にも第２支持体２８′を配置
して被処理物である矩形リードフレーム２２を協同でし
っかりと保持する。On the other hand, in the drying device shown in FIG. 7, a rotary shaft 27, which can be rotated by, for example, a belt 26, which is attached to a motor 25, is installed in the hollow processing tank 20 and is attached to the first support 28. Lead frame holders 29, 2
Fix 9 '. A second support 28 'is also arranged on the upper part of the second support 28' to firmly hold the rectangular lead frame 22 which is the object to be processed.
【００１３】モータ２５の稼働に伴って回転する回転軸
２７により矩形リードフレーム２２は回転して、樹脂３
０らびにその外に導出したアウターリード表面に付着し
た液体を遠心力により飛散させる。この他に、熱風乾燥
による方式も知られている。The rectangular lead frame 22 is rotated by the rotating shaft 27 which rotates with the operation of the motor 25, and the resin 3
The liquid adhering to the outer lead surface, which is led to the outside, is scattered by centrifugal force. In addition to this, a method using hot air drying is also known.
【００１４】[0014]
【発明が解決しようとする課題】前記エアーブロ方式で
は、両側からのエアが設定通り同一の圧力にならない場
合もあり、その上矩形リードフレームの揺れが大きくな
ってエアー圧力が均等にかからず、処理結果が均一でな
い。In the air blow method, the air from both sides may not have the same pressure as set, and in addition, the rectangular lead frame is greatly shaken and the air pressure is not evenly distributed. The processing result is not uniform.
【００１５】しかもエアーブロにより、リードフレーム
などに付着した液体が周辺に飛散して雰囲気を悪化させ
る。又、液体が飛散しない程度にエアーブロすると処理
時間が長くなり、装置自体のタクト時間も長くなり生産
性が悪化する。Moreover, the air blow causes the liquid adhering to the lead frame or the like to be scattered to the surroundings to deteriorate the atmosphere. Further, if the air is blown to such an extent that the liquid does not scatter, the processing time becomes long, the takt time of the apparatus itself becomes long, and the productivity deteriorates.
【００１６】更にリードフレームなどの付着液量が多い
際には、水洗水における付着液濃度が濃くなって、廃液
処理が難しくなる。更に又、リードフレームなどに付着
した液体量が多くなると、洗浄水量が増し、ランニング
コストの上昇を招く。Further, when the amount of the adhered liquid on the lead frame or the like is large, the concentration of the adhered liquid in the washing water becomes high, which makes it difficult to treat the waste liquid. Furthermore, when the amount of liquid attached to the lead frame or the like increases, the amount of cleaning water increases, which causes an increase in running cost.
【００１７】又、遠心力により液体を除去するには、複
数のリードフレームを同時に処理するために、ある距離
が必要になって装置が大型にならざるを得ない。したが
ってコストアップになる難点がある。Further, in order to remove the liquid by the centrifugal force, a plurality of lead frames are processed at the same time, which requires a certain distance, which inevitably leads to an increase in size of the apparatus. Therefore, there is a drawback that the cost is increased.
【００１８】熱風乾燥による方式では、乾燥により残渣
が残る場合も起る。In the method using hot air drying, a residue may remain after drying.
【００１９】本発明はこのような事情により成されたも
ので、特にリードフレームに対する初期の付着液量に対
する最終の付着液量比を最小にする半導体用液体除去装
置を提供する。The present invention has been made in view of the above circumstances, and in particular, provides a semiconductor liquid removing apparatus which minimizes the ratio of the final amount of the adhered liquid to the initial amount of the adhered liquid for the lead frame.
【００２０】[0020]
【課題を解決するための手段】直線的に移送する搬送機
構と，前記搬送機構に対向して配置する液体吸収部と，
前記液体吸収部用の移動機構とに本発明に関わる半導体
用液体除去装置の特徴がある。更に、前記液体吸収部を
支持する保持体と，前記保持体に取付ける加熱源にも特
徴がある。[Means for Solving the Problems] A transport mechanism that linearly transports the liquid, and a liquid absorbing section that is arranged to face the transport mechanism,
The moving mechanism for the liquid absorbing section is characterized by the liquid removing apparatus for semiconductors according to the present invention. Furthermore, the holding body that supports the liquid absorbing portion and the heating source that is attached to the holding body are also characteristic.
【００２１】[0021]
【作用】液体が付着したアウタリードならびに封止樹脂
を、液体吸収部により挟んで、付着した液体を除去し、
更に液体吸収部は処理後の加圧により液体を絞りだし
て、吸収性を持続させる。[Function] The outer lead and the sealing resin to which the liquid adheres are sandwiched by the liquid absorbing parts to remove the adhered liquid,
Further, the liquid absorbing portion squeezes the liquid by applying pressure after the treatment to maintain the absorbability.
【００２２】[0022]
【実施例】本発明に関わる実施例を図１乃至図６を参照
して説明する。図１は半導体用液体除去装置の要部を示
す断面図、図２及び図３はそれに付属する加熱装置の平
面図と断面図、図４乃至図５は液体除去工程を示す図で
ある。Embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a sectional view showing a main part of a liquid removing apparatus for semiconductors, FIGS. 2 and 3 are plan views and sectional views of a heating apparatus attached thereto, and FIGS. 4 to 5 are views showing a liquid removing step.
【００２３】図１に明かなように本発明に関わる半導体
用液体除去装置は、処理槽１内外にプレスユニット２、
２′を設置し、その両方に取付る支持体３、３′それぞ
れに、吸収性が良く柔軟な液体吸収部４、４′例えばス
ポンジや繊維を取付ける。この液体吸収部４、４′を支
持体３、３′に取付けるには、ステンレスなどのように
硬い材料で構成する保持体５、５′に接着剤などで固着
し、場合によっては図２に示す加熱源６を保持体５、
５′に形成する。なお保持体５′に設置する例は省略す
る。As is apparent from FIG. 1, the liquid removing apparatus for semiconductors according to the present invention has a press unit 2 inside and outside a processing tank 1.
2'is installed, and the liquid absorbing portions 4 and 4'having good absorbency and flexibility, for example, sponge and fibers are attached to the supports 3 and 3'which are attached to both of them. To attach the liquid absorbing parts 4, 4'to the supports 3, 3 ', they are fixed to the holders 5, 5'made of a hard material such as stainless steel with an adhesive or the like. The heating source 6 shown in FIG.
5 '. Note that the example of installation on the holder 5'is omitted.
【００２４】プレスユニット２、２′は垂直方向に移動
可能として、液体吸収部４、４′間に搬送される樹脂封
止型半導体装置が密着できるようにする。密着時間はほ
ぼ１２秒であり、この間樹脂封止型半導体装置に圧力が
均等に加えられる。The press units 2, 2'are vertically movable so that the resin-sealed semiconductor device conveyed between the liquid absorbing parts 4, 4'can be brought into close contact with each other. The contact time is approximately 12 seconds, during which pressure is evenly applied to the resin-sealed semiconductor device.
【００２５】又支持体３には、トレイ７を設置して樹脂
封止型半導体装置の封止樹脂８とその外側に導出したア
ウターリード９に付着した液体が散逸しないようにす
る。なお封止樹脂８の外側に導出したアウターリード９
は前記のように直線状であり、封止樹脂８表面とアウタ
ーリード９の表面間には多少の段差があり、樹脂封止型
半導体装置の機種により差がある。A tray 7 is installed on the support 3 to prevent the liquid adhered to the sealing resin 8 of the resin-sealed semiconductor device and the outer lead 9 led out to the outside from being dispersed. The outer lead 9 led out of the sealing resin 8
Is linear as described above, and there is a slight step between the surface of the sealing resin 8 and the surface of the outer lead 9, which varies depending on the model of the resin-sealed semiconductor device.
【００２６】次に図３乃至図５図により本発明に関わる
半導体用液体除去装置の使用状態を説明すると、封止樹
脂８とその外側に導出したアウターリード９を備えた樹
脂封止型半導体装置は、ベルトなどから成る搬送機構１
１により処理槽１の中央部に移動する（図４参照）。搬
送機構１１は図示しないモータ（図示せず）とベルトに
より構成され、搬送機構１１に乗った樹脂封止型半導体
装置がモータの稼働により移動する。Next, the use state of the liquid removing device for a semiconductor according to the present invention will be described with reference to FIGS. 3 to 5, and a resin-sealed semiconductor device having a sealing resin 8 and an outer lead 9 led out to the outside thereof. Is a transport mechanism 1 including a belt
1 moves to the center of the processing tank 1 (see FIG. 4). The transfer mechanism 11 is composed of a motor (not shown) and a belt (not shown), and the resin-sealed semiconductor device on the transfer mechanism 11 moves by the operation of the motor.
【００２７】ここでプレスユニット２、２′が垂直方向
に移動して封止樹脂８とアウターリード９に液体吸収部
４、４′がほぼ１２秒間密着して、封止樹脂８とアウタ
ーリード９表面に付着した液体を吸収する（図５参
照）。Here, the press units 2 and 2'move in the vertical direction, and the liquid absorbing portions 4 and 4'are brought into close contact with the sealing resin 8 and the outer leads 9 for approximately 12 seconds, so that the sealing resin 8 and the outer leads 9 are made. Absorbs liquid adhering to the surface (see FIG. 5).
【００２８】その後樹脂封止型半導体装置を処理槽１外
に移動（図６参照）後、液体吸収部４、４′を強く密着
させて吸収した液体を排出し、更に必要ならば保持体
５、５′に設置した加熱源６を稼働して乾燥させる。After that, the resin-encapsulated semiconductor device is moved to the outside of the processing tank 1 (see FIG. 6), the liquid absorbing parts 4 and 4'are strongly brought into close contact with each other to discharge the absorbed liquid, and if necessary, the holder 5 The heating source 6 installed at 5'is operated to dry.
【００２９】なお液体としては水以外に薬液を含んだ液
体例えばメッキ液や活性化液（表面処理剤使用後の液
体）なども適用可能であり、その性質に応じて液体吸収
部４、４′の材質を選定する。As the liquid, a liquid containing a chemical liquid other than water, such as a plating liquid or an activating liquid (a liquid after the surface treatment agent is used), can be applied, and the liquid absorbing parts 4, 4'depending on the property. Select the material of.
【００３０】[0030]
【発明の効果】以上の半導体用液体除去装置は短時間
で、リードフレームに付着した大量の液体を液体吸収部
で吸収できるし、洗浄水に対する液体濃度が薄くなり、
廃液処理が容易になる。更に洗浄液量が大幅に削減でき
るので、ランニングコストが低減される上に、比較的簡
単な構造でこのような効果が得られる。The liquid removing apparatus for semiconductors described above can absorb a large amount of liquid adhering to the lead frame in the liquid absorbing portion in a short time, and the liquid concentration with respect to the cleaning water becomes thin.
Waste liquid processing becomes easy. Further, since the amount of cleaning liquid can be greatly reduced, running cost is reduced and such an effect can be obtained with a relatively simple structure.
【図１】本発明に関わる半導体用液体除去装置の要部を
示す図である。FIG. 1 is a diagram showing a main part of a liquid removing apparatus for semiconductors according to the present invention.
【図２】図１に付設する加熱源の上面図である。FIG. 2 is a top view of a heating source attached to FIG.
【図３】図１に付設する加熱源の断面図である。FIG. 3 is a sectional view of a heating source attached to FIG.
【図４】図１に示す装置の動作を示す図である。FIG. 4 is a diagram showing an operation of the apparatus shown in FIG.
【図５】図４に続く動作を示す図である。5 is a diagram showing an operation following FIG. 4. FIG.
【図６】従来の半導体用液体除去装置の概略を示す図で
ある。FIG. 6 is a diagram showing an outline of a conventional liquid removing device for semiconductors.
【図７】従来の他の半導体用液体除去装置の概略を示す
図である。FIG. 7 is a diagram showing an outline of another conventional liquid removing apparatus for semiconductors.
１、２０：処理槽、 ２、２′：プレスユニット、 ３、３′：支持体、 ４、４′：液体吸収剤 ５、５′：保持体、 ６：加熱源、 ７：トレイ、 ８、３０：封止樹脂、 ９：アウターリード、 １０、２２：リードフレーム、 １１：ベルト。 1, 20: treatment tank, 2, 2 ': press unit, 3, 3': support, 4, 4 ': liquid absorbent 5, 5': holding body, 6: heating source, 7: tray, 8, 30: sealing resin, 9: outer lead, 10 and 22: lead frame, 11: belt.
Claims (2)
機構に対向して配置する液体吸着部と，前記液体吸着部
用の移動機構とを具備することを特徴とする半導体用液
体除去装置1. A liquid removing apparatus for semiconductors, comprising: a transfer mechanism that linearly transfers the liquid; a liquid adsorbing section that is arranged to face the transfer mechanism; and a moving mechanism for the liquid adsorbing section.
前記保持体に取付ける加熱源とを具備することを特徴と
する請求項１記載の半導体用液体除去装置2. A holder for supporting the liquid adsorbing member,
The liquid removing apparatus for semiconductors according to claim 1, further comprising a heating source attached to the holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6124141A JPH07335821A (en) | 1994-06-07 | 1994-06-07 | Liquid removing apparatus for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6124141A JPH07335821A (en) | 1994-06-07 | 1994-06-07 | Liquid removing apparatus for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07335821A true JPH07335821A (en) | 1995-12-22 |
Family
ID=14877947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6124141A Withdrawn JPH07335821A (en) | 1994-06-07 | 1994-06-07 | Liquid removing apparatus for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07335821A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103191871A (en) * | 2013-04-03 | 2013-07-10 | 四川长虹电器股份有限公司 | Device for absorbing solar energy |
| US9774106B2 (en) | 2014-05-14 | 2017-09-26 | Abb Schweiz Ag | Grounding system |
-
1994
- 1994-06-07 JP JP6124141A patent/JPH07335821A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103191871A (en) * | 2013-04-03 | 2013-07-10 | 四川长虹电器股份有限公司 | Device for absorbing solar energy |
| US9774106B2 (en) | 2014-05-14 | 2017-09-26 | Abb Schweiz Ag | Grounding system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010904 |