JP4484982B2 - Adhesive sticking method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive material sticking method, and more particularly, to an adhesive material sticking method suitable for manufacturing an extremely thin semiconductor wafer.
[0002]
[Prior art]
For example, a semiconductor wafer such as silicon is manufactured in a large-diameter disk shape, a circuit pattern is formed on the surface thereof, and then the back surface side is cut. The thickness of the semiconductor wafer is determined according to the thickness of the semiconductor chip obtained from the semiconductor wafer, but conventionally, the thickness is generally 400 μm to 300 μm. However, in recent years, with the spread of IC cards and the like, the present situation is that there is a demand for a semiconductor chip having a thickness of about 100 μm to 50 μm, and in some cases about 30 μm.
[0003]
As a method for making the semiconductor wafer extremely thin, a hard base made of a glass plate or the like is used, and after applying wax on the upper surface side, a semiconductor wafer with the circuit surface facing the base surface side is placed, A method of cutting the back side of the semiconductor wafer is known.
[0004]
[Problems to be solved by the invention]
However, in the cutting method using the wax, it is difficult to apply the wax to a uniform thickness, and the thickness accuracy required when manufacturing an extremely thin IC chip of about 50 μm is sufficient. Inconvenience that it cannot be secured. In addition to cleaning the wafer with an organic solvent after cutting the wafer, when dicing the semiconductor wafer after cutting into semiconductor chips for each unit, after removing the wax, add a new dicing tape to the semiconductor wafer. Affixing is also necessary, and there is a disadvantage that it complicates the work process. Further, it is difficult to remove the wax from the semiconductor wafer, and there is a risk of destroying a product such as the semiconductor wafer. Therefore, even the cutting method using the wax is not necessarily suitable for the production of an ultra-thin semiconductor wafer that is required recently.
[0005]
OBJECT OF THE INVENTION
The present invention has been devised by paying attention to such inconveniences, and its main purpose is to improve the cutting accuracy of a cutting object such as a semiconductor wafer and to easily perform the work associated with the cutting. It is in providing the sticking method of the adhesive material which can be performed.
[0006]
Another object of the present invention is that the adhesive material cannot be applied to the adherend using the bending of the adhesive material, that is, for example, an adherend with low flexibility is applied to a semiconductor wafer or the like. An object of the present invention is to provide a method for sticking an adhesive material that can prevent air from being mixed even when sticking to an adhesive surface of an adhesive tape.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention employs a method of attaching a semiconductor wafer having an adhesive tape attached to an adherend in a liquid. According to such a method, the adherend is affixed to the adhesive tape in a liquid having a low air content, and in this case, air is prevented from being mixed between the adherend and the adhesive tape. And generation of air pockets between them can be suppressed.
[0008]
In the present invention, one end of the adherend is brought into contact with the adhesive surface of the adhesive tape , while the other end is separated from the adhesive surface, and the adherend is inclined with respect to the adhesive tape , the adherend, by approaching progressively the adhesive tape toward the other end from one end of the adherend, while removing the liquid between the adhesive tape and the adherend, the adhesive tape the adherend It is preferable to adopt a method of sticking to. By doing in this way, mixing of the air between a to-be-adhered body and an adhesive tape can be prevented more reliably.
[0009]
Moreover, before sticking the said adherend to an adhesive tape , the method of irradiating UV light and including the process of increasing the hydrophilicity to the said adherend can also be employ | adopted. As a result, water repellency of the adherend can be further reduced, and after adhering the adherend to the adhesive tape , it is possible to suppress residual air remaining on the adherend surface of the adherend and the adhesive surface of the adhesive material. it can.
[0010]
Further, before the adherend is affixed to the adhesive tape, the liquid may be deaerated by irradiating ultrasonic waves. According to such a method, it is possible to remove a small amount of air on the adhesion surface of the adherend and the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape in the liquid, and it is possible to more reliably suppress the air accumulation.
In addition, the present invention employs a method in which a base having an adhesive tape attached to a semiconductor wafer is attached in a liquid.
[0011]
In the present specification, “water” is used as a broad concept including normal water including pure water, as well as other aqueous solutions or liquids that do not hinder the adhesive performance.
[0012]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
[0013]
FIG. 1 shows a conceptual diagram of a sticking apparatus to which the sticking method in this embodiment is applied. In this figure, the affixing device 10 is separate from the aquarium 12, the affixing table 14 disposed on the bottom wall 12A of the aquarium 12, the ultrasonic generator 16 disposed on the side wall 12B of the aquarium 12, and the aquarium 12. And a UV generator 17 provided.
[0014]
The bottom wall 12A of the water tank 12 is provided with a water injection port 19 and a water discharge port 20, through which water W is supplied and drained from a water storage tank (not shown) to the water tank 12. Here, the water W in the water tank 12 may be replaced for each pasting operation. After the used water W is once extracted from the water tank 12, dust in the water is removed by a filter or the like. And you may perform the circulation furnace over of supplying to the water tank 12 again. Further, a semiconductor wafer 24 (hereinafter referred to as “adhesive material 25”) to which an adhesive tape 22 is attached can be installed on the upper surface side of the application table 14. Furthermore, before the ultrasonic generator 16 affixes a base 26 (adhered body) made of a hard material such as a glass plate to the adhesive 25 in the water tank 12, the ultrasonic generator 16 has a predetermined frequency in the water W in the water tank 12. Is provided so that the air attached to the base 26 and the adhesive surface 22A of the adhesive material 25 in water can be deaerated. Further, the UV generator 17 is provided so that UV light can be applied to the adhesive surface of the base 26 before the base 26 is attached to the adhesive material 25. The organic matter is decomposed and removed so that the hydrophilicity of the bonding surface of the base 26 can be increased. Here, as the adhesive tape 22, a double-sided adhesive tape having an adhesive surface formed on both sides is used, and is not particularly limited. For example, an adhesive layer is formed on both sides of a base material made of polyethylene terephthalate, polyethylene or the like. A pressure-sensitive adhesive tape formed of or a pressure-sensitive adhesive tape composed only of a pressure-sensitive adhesive having no base material is used.
[0015]
The adhesive material 25 is affixed to the base 26 by the following method using the affixing device 10 having the above configuration.
[0016]
That is, the adhesive tape 22 is pasted on the circuit forming surface of the semiconductor wafer 24 by a known method in advance, and the adhesive tape 22 located on the opposite side of the semiconductor wafer 24 forming the adhesive material 25 as shown in FIG. With the adhesive surface 22A exposed, the adhesive surface 22A is faced upward, and the adhesive material 25 is transferred and installed at a predetermined position on the upper surface side of the sticking table 14 by a transfer device (not shown). Before and after this, the ultrasonic generator 16 irradiates the water W in the water tank 12 with ultrasonic waves to perform a deaeration process. At the same time, the UV generator 17 is attached to the adhesive surface of the base 26 that is attached to the transport arm 27 and is held at a predetermined position while being held by the vacuum grid 28 that is suction controlled by a vacuum generator (not shown). Irradiate UV light to increase the hydrophilicity of the base 26. Thereafter, as shown in FIG. 2, by moving the transfer arm 27, the base 26 that is adsorbed to the vacuum grid 28 is moved to the vicinity of the adhesive material 25 previously installed in the water tank 12, One end 26A (left end in FIG. 2) of the base 26 is brought into contact with the adhesive surface 22A of the adhesive material 25 on the sticking table 14, while the right end 26B of the base 26 is separated from the adhesive surface 22A. Is inclined with respect to the adhesive tape 22. Then, the base 26 adsorbed and held by the vacuum grit 28 is gradually moved closer to the adhesive material 25 from one end 26A of the base 26 toward the other end 26B (right end in FIG. 2) by the operation of the transport arm 27. The water 26 located between the base 26 and the adhesive surface 22A of the adhesive material 25 is pressed while being expelled, and the base 26 is attached to the adhesive material 25 as shown in FIG.
[0017]
With the above operation, the adhesive material 25 to which the base 26 is bonded via the adhesive tape 22 is adsorbed and held by the vacuum grit 28 of the transfer arm 27 and taken out from the water tank 12 as shown in FIG. As shown in FIG. 5, the adhesive surface 22 </ b> A and the adhesive surface of the base 26 are drained by being further pressurized by the pair of press rollers 30. Thereafter, the pressure-sensitive adhesive material 25 to which the base 26 is bonded via the pressure-sensitive adhesive tape 22 is subjected to surface drying by a predetermined drying process, and is transferred to a cutting process for adjusting the thickness of the semiconductor wafer 24. In this embodiment, the base 26 is held by the vacuum grit 28. However, the present invention is not limited to this, and as long as the base 26 can be held, holding means having other configurations can be used. It may be adopted.
[0018]
Therefore, according to such an embodiment, the adhesive material 25 is bonded and fixed to the base 26 such as a hard and highly smooth glass plate or the like via the adhesive tape 22, so that the semiconductor wafer 24 which is a post-process work. In this cutting process, an extremely thin semiconductor wafer 24 having a thickness of 50 μm or less can be processed, and operations associated with the cutting can be easily performed. Further, since the adhesive tape 22 is applied to the base 26 having increased hydrophilicity in the deaerated water, air is not mixed between the adhesive surface of the base 26 and the adhesive surface 22A of the adhesive material 25. The adhesive material 25 can be attached to the base 26.
[0019]
In the present embodiment, the example in which the double-sided adhesive tape 22 is attached in advance to the semiconductor wafer 24 has been described. However, the adhesive tape 22 or the like may be attached in advance to the base 26 side.
[0020]
In addition, this invention is not limited to the method of the said Example, A various change is possible as long as an adhesive material is affixed on a to-be-adhered body in water.
[0021]
【The invention's effect】
As described above, according to the present invention, since the adhesive material is applied to the adherend in the liquid, it is possible to prevent air from being mixed when the adhesive material is applied, and the air between these adhesive surfaces. Generation of accumulation can be suppressed.
[0022]
In addition, one end of the adherend is brought into contact with the adhesive surface of the adhesive material, while the other end is separated from the adhesive surface, and the adherend is disposed to be inclined with respect to the adhesive material. By adhering the adherend to the adhesive material gradually from one end to the other end of the adherend, the adherend is adhered to the adhesive material while expelling the liquid between the adherend and the adhesive material. Therefore, mixing of air between the adherend and the adhesive material can be more reliably prevented.
[0023]
Furthermore, since the hydrophilicity of the adherend was increased before the adherend was affixed to the adhesive material, water repelling of the adherend could be further reduced, and the adherend was affixed to the adhesive material. It is possible to more reliably suppress the air remaining afterward.
[0024]
In addition, since the liquid is degassed by irradiating ultrasonic waves, the air present in a minute amount can be removed, and the accumulation of air can be more reliably suppressed.
[0025]
Further, unlike the conventional method in which wax is applied to an adherend and a cutting object such as a semiconductor wafer is adhered to the adherend, and then the cutting object is cut to adjust its thickness. In the invention, since the adhesive tape is attached to the adherend instead of the wax, the cutting accuracy of the cutting object can be improved, and the operation associated with the cutting can be easily performed. .
[Brief description of the drawings]
FIG. 1 is a conceptual diagram of a sticking apparatus applied to a method for sticking an adhesive material according to the present invention.
FIG. 2 is a conceptual diagram illustrating a method of attaching a base to an adhesive material installed in the attaching device of FIG.
FIG. 3 is a conceptual diagram showing a state where a base is attached to an adhesive material.
FIG. 4 is a conceptual diagram showing a state in which a semiconductor wafer having a base bonded thereto is transferred via an adhesive tape.
5 is a conceptual diagram illustrating a process of pressing a semiconductor wafer and a base transferred from the sticking apparatus of FIG.
[Explanation of symbols]
22 Adhesive Tape 22A Adhesive Surface 24 Semiconductor Wafer 25 Adhesive Material 26 Base (Substrate)
26A One end 26B The other end W Water

Claims (5)

A method for applying an adhesive material, comprising: attaching a semiconductor wafer having an adhesive tape attached to an adherend in a liquid. One end of the adherend is brought into contact with the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape , and the other end is separated from the pressure-sensitive adhesive surface, and the adherend is inclined with respect to the pressure-sensitive adhesive tape . the, by close to one end progressively the adhesive tape toward the other end from the adherend, while removing the liquid between the adhesive tape and the adherend, to affixing the adherend to the adhesive tape The method for sticking an adhesive material according to claim 1. The method for applying an adhesive material according to claim 1 or 2, further comprising a step of increasing hydrophilicity of the adherend by irradiating UV light before applying the adherend to the adhesive tape . 3. The method for sticking an adhesive material according to claim 1 , wherein a deaeration treatment is performed by irradiating the liquid with an ultrasonic wave before the adherend is attached to the adhesive tape . A sticking method for an adhesive material, comprising sticking a base having an adhesive tape attached to a semiconductor wafer in a liquid.

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