JPH0733356Y2 - Plasma display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a plasma display panel (hereinafter, referred to as a display device used as a display device of a personal computer or the like, for example.
(Referred to as PDP), and more particularly to the substrate bonding structure.

[Conventional technology]

FIG. 2 is an exploded perspective view schematically showing an AC PDP that has been conventionally used. In the figure, 11 and 12 are substrates made of glass or the like, 13 is electrodes arranged on the substrates 11 and 12, 14 is a derivative arranged so as to cover the electrodes 13 on the substrates 11 and 12, and 15 is a derivative 14 It is a protective film provided above. Further, 16 is a sealing material mounted on the substrates 11 and 12 along the outer periphery of the substrate. The sealing material 16 of the substrate 11 and the sealing material of the substrate 12 are
17 and 17 are overlapped and heated, and the sealing materials of both substrates are fused to each other to form an airtight space. Here, the encapsulants 16 and 17 are formed on the substrate 11 or 12 by a printing method or by mounting a molded encapsulant piece on the substrate.

Further, FIG. 3 is a perspective view of an essential part showing a conventional DC-type PDP substrate bonding structure. In the figure, 1 and 2 are substrates 3
Is a plurality of electrodes linearly arranged on the substrate 1. Reference numeral 4 is a sealing material such as low melting glass which is applied between the upper surface of the substrate 1 and the end piece 2a of the substrate 2 and then heat-sealed.

[Problems to be solved by the device]

However, in any of the conventional examples described above, since heat fusion such as low melting point glass is used as the sealing material, the sealing material becomes fluid when heated and may flow out to the outside, As shown by reference numeral 4a in FIG. 3, the peripheral edge of the sealing material 4 sometimes spreads toward the bottom. However,
In the PDP, a portion A near the outer periphery of the substrate 1 is a portion used as a connecting portion with a cable and as a mounting portion for a driving IC or the like. Therefore, conventionally, it is necessary to secure a large area A near the outer periphery of the substrate 1 in consideration of this flow-out, which causes a problem that the outer shape of the PDP becomes large.

Therefore, the present invention has been made in order to solve the above-mentioned problems of the conventional technology, and the purpose is to:
An object of the present invention is to provide a plasma display panel that can achieve miniaturization of the outer shape without being affected by the flow of the sealing material.

[Means for Solving the Problems]

A plasma display panel according to the present invention includes an electrode on a surface thereof, a first substrate on which a tip of the electrode extends to the vicinity of an edge of the substrate, and an electrode on the surface. It is made to face the electrode of one substrate at a predetermined interval, and the predetermined edge side faces the first substrate at a position inside the edge side near the tip of the electrode of the first substrate. A second substrate disposed on the first substrate, and a position on the surface of the first substrate on which the electrode is provided and which faces the tip end of the electrode and the predetermined edge of the second substrate. A protrusion provided in the middle and extending along the edge of the second substrate, and inside the protrusion, a predetermined edge of the second substrate and a position on the first substrate facing the edge. It is characterized by including a sealing material for sealing the space.

[Action]

In the present invention, the edge of the second substrate is provided on the surface of the first substrate on which the electrode is provided and between the tip of the electrode and the position facing the predetermined edge of the second substrate. It is configured such that a projection portion extending along the projection portion is provided, and a sealing material is provided inside the projection portion. As a result, the protrusion prevents the sealing material from flowing out during the manufacturing stage, secures the exposed portion of the electrode near the outer periphery of the first substrate, connects the cable, or mounts the drive IC. Make sure to secure the area for parts.

〔Example〕

 The present invention will be described below based on the illustrated embodiment.

FIG. 1 is a perspective view of an essential part showing an embodiment of a PDP according to the present invention.

In the figure, the same components as those in FIG. 3 are designated by the same reference numerals, and 1 and 2 are substrates such as glass (first and second substrates) and 3 are on the substrate 1. A plurality of linearly arranged electrodes are arranged such that their tips extend to the vicinity of the outer periphery 1a of the substrate 1. Although not shown in the drawing, a plurality of linear electrodes extending in the direction orthogonal to the electrodes 3 are also arranged on the lower surface of the substrate 2.

By the way, in the PDP, basically, the substrate 1 and the substrate 2 are opposed to each other so that their electrodes face each other.
It has a structure in which an airtight space is formed between the two. Then, a gas of a predetermined component including a rare gas is sealed in this space,
A voltage is applied between the electrodes of both substrates 1 and 2 to generate plasma, and in the case of a DC type, for example, light from the glow discharge section is emitted to the outside.

In addition, the present embodiment has the following configuration in order to fill the peripheral edge between the substrates 1 and 2 and form the airtight space in the state where the substrates 1 and 2 are opposed to each other. That is, as shown in FIG. 1, at a distance B from the outer periphery 1a on the substrate 1 and at a distance C outward from the outer periphery (edge) 2a of the substrate 2, the outer periphery 1a and A wall (projection) 5 extending along the outer periphery 2a is provided. Further, inside the wall 5 on the substrate 1, there is provided a sealing material 4 that fills a space between the outer periphery of the substrate 2 and a position on the surface of the substrate 1 facing it.

As described above, in this embodiment, since the wall 5 is provided on the substrate 1, the encapsulating material 4 that fills the space between the outer periphery of the substrate 2 and the position on the surface of the substrate 1 facing the outer periphery is manufactured. It does not flow out to the outside of the wall 5 at the stage, and an exposed portion of the electrode is provided outside the wall 5, and the outside of the wall 5 can be used as a connecting portion with external wiring or a mounting portion for an IC or the like. .

The above embodiment is manufactured, for example, by the following procedure. First,
A glass wall 5 having a height of several tens of μm is formed by a thick film printing method on a glass substrate 1 (thickness 1 to 3 mm) provided with electrodes 3.
To form.

Then, the substrate 2 is opposed to the substrate 1, and the outer periphery 2a of the substrate 2 is arranged inside the wall 5 of the substrate 1.
Here, the distance D between the substrate 1 and the substrate 2 is several hundreds μm, and this distance is secured by a space member (not shown). Further, the outer periphery 2a of the substrate 2 is arranged in parallel with the wall 5, and the distance C between the outer periphery 2a and the wall 5 is made approximately the same as the thickness of the glass substrate. However, this distance C is set to an appropriate value depending on the height of the wall 5, the thickness of the substrate, the distance D, and the like.

Next, the sealing material 4 such as lead glass is applied to the inside of the wall 5 on the substrate 1 so as to reach the outer periphery 2a of the substrate 2, and this is heated to fuse the substrate 1 and the substrate 2 to each other. That is, the wall 5 has a function of preventing the sealing material 4 from flowing out onto the substrate 1 at this time. Here, the lead glass may be preliminarily molded and provided on the substrate 1 without applying, or may be preliminarily molded and provided on the substrates 1 and 2.

In the above embodiment, the case where the wall 5 is provided on the substrate 1 has been described, but the present invention is not limited to this, and as shown in FIG. 2, two rectangular substrates have their long sides orthogonal to each other. When facing each other, both boards (long board side)
The wall 5 will be provided.

In addition, in the above embodiment, the wall 5 on the substrate 1 is surrounded by the outer periphery.
Although the case where it is provided so as to extend along 1a and the outer periphery 2a has been described, the present invention is not limited to this, and it may extend along at least the outer periphery (outer periphery 2a in FIG. 1) of the substrate. .

[Effect of device]

As described above, according to the present invention, since the wall, that is, the protruding portion is provided, it is possible to prevent the sealing material from flowing out and to provide the exposed portion of the electrode on the outside of this wall (the protruding portion). ,
Therefore, it is possible to reliably secure an area as a connecting portion to the external wiring or a mounting portion of the drive IC in the vicinity of the outer periphery on the substrate. Therefore, it is not necessary to make the board size larger than necessary as in the past, the board size can be reduced, and reliable connection with external wiring and reliable mounting of drive ICs can be achieved, improving the manufacturing yield. It has the effect that it can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of an embodiment of a PDP according to the present invention, FIG. 2 is an exploded perspective view schematically showing an AC type PDP which has been conventionally used, and FIG. 3 is a conventional DC. It is a principal part perspective view which shows the board | substrate adhesion structure of PDP of a type | mold. 1 ... Substrate (first substrate), 1a ... Outer periphery (edge), 2
...... Substrate (second substrate), 2a ... Outer periphery (edge), 3 ...
... electrodes, 4 ... sealing material, 5 ... walls (projections).

Front page continuation (72) Kozo Fujii 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (56) Reference JP-A-61-77647 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. A first substrate having an electrode on a surface thereof, the tip of the electrode extending to the vicinity of an edge of the substrate, and an electrode on the surface of the first substrate. The electrodes are arranged so as to be opposed to the electrodes with a predetermined gap therebetween, and the predetermined edges are opposed to the first substrate at a position inside the edges of the first substrate near the tip of the electrode. A second substrate, provided on the surface of the first substrate on which the electrode is provided, and intermediate between the tip of the electrode and a position facing the predetermined edge of the second substrate; A protrusion extending along the edge of the second substrate and a seal between the predetermined edge of the second substrate and a position on the first substrate facing the edge on the inner side of the protrusion. A plasma display panel, comprising: