JP2000002880A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JP2000002880A JP2000002880A JP18139098A JP18139098A JP2000002880A JP 2000002880 A JP2000002880 A JP 2000002880A JP 18139098 A JP18139098 A JP 18139098A JP 18139098 A JP18139098 A JP 18139098A JP 2000002880 A JP2000002880 A JP 2000002880A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- liquid crystal
- wiring
- intersect
- crystal display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、表示領域の周辺
部のセルギャップのより一層の均一化を図ることができ
る液晶表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device capable of achieving a more uniform cell gap at a peripheral portion of a display area.
【0002】[0002]
【従来の技術】図3は従来の液晶表示装置の一例の平面
図を示したものである。この液晶表示装置は、下側基板
1と上側基板2とがその間に所定の径のスペーサ(図示
せず)を介在された状態でほぼ方形枠状のシール材3を
介して貼り合わされ、シール材3の内側における両基板
1、2間に液晶(図示せず)が封入された構造となって
いる。この場合、シール材3の内側において一点鎖線で
示す領域は表示領域4となっている。また、下側基板1
の所定の2辺は上側基板2から突出され、該突出部1
a、1bの各上面には走査線駆動用半導体チップ5及び
信号線駆動用半導体チップ6が搭載されている。2. Description of the Related Art FIG. 3 is a plan view showing an example of a conventional liquid crystal display device. In this liquid crystal display device, a lower substrate 1 and an upper substrate 2 are bonded together with a spacer (not shown) having a predetermined diameter interposed therebetween via a substantially rectangular frame-shaped sealing material 3. A liquid crystal (not shown) is sealed between the two substrates 1 and 2 inside 3. In this case, a region indicated by a dashed line inside the sealing material 3 is a display region 4. Also, the lower substrate 1
Are protruded from the upper substrate 2 and the protruding portions 1
A scanning line driving semiconductor chip 5 and a signal line driving semiconductor chip 6 are mounted on the upper surfaces of a and 1b.
【0003】ところで、例えば下側基板1の上面におけ
る表示領域4の外側には各種の配線がシール材3と交差
して設けられている。例えば、突出部1a、1bの近傍
においては、図示していないが、表示領域4内に設けら
れた走査線や信号線等の引き回し線がシール材3と交差
して設けられている。また、図4に下側基板1の一部を
拡大して示すように、シール材3の角部の外側に設けら
れたクロス材接続パッド11に表示領域4から延びて接
続される引出線12がシール材3と交差して設けられて
いる。クロス材接続パッド11は、上側基板2の下面の
所定の箇所に設けられたクロス材接続パッド(図示せ
ず)に導電性ペースト等からなる円柱状のクロス材13
を介して導電接続されている。また、走査線等を陽極酸
化させるための給電線(図示せず)に表示領域4から延
びて接続される引出線14がシール材3と交差して設け
られている。なお、引出線12、14はオーバーコート
膜15によって覆われており、クロス材接続パッド11
はオーバーコート膜15によって覆われずに露出されて
いる。シール材3はオーバーコート膜15の上面に設け
られている。By the way, for example, various wirings are provided outside the display area 4 on the upper surface of the lower substrate 1 so as to intersect with the sealing material 3. For example, in the vicinity of the protruding portions 1a and 1b, lead lines such as scanning lines and signal lines provided in the display area 4 intersect with the sealing material 3, although not shown. As shown in FIG. 4 in which a part of the lower substrate 1 is enlarged, a lead wire 12 extending from the display region 4 and connected to a cross material connection pad 11 provided outside a corner of the sealing material 3. Are provided so as to intersect with the sealing material 3. The cross material connection pad 11 is formed on a cross material connection pad (not shown) provided at a predetermined location on the lower surface of the upper substrate 2 by a columnar cross material 13 made of a conductive paste or the like.
Are electrically conductively connected to each other. In addition, a lead wire 14 extending from the display area 4 and connected to a power supply line (not shown) for anodizing a scanning line or the like is provided to intersect with the sealing material 3. Note that the lead wires 12 and 14 are covered with the overcoat film 15 and the cross material connection pads 11
Are exposed without being covered by the overcoat film 15. The sealing material 3 is provided on the upper surface of the overcoat film 15.
【0004】[0004]
【発明が解決しようとする課題】このように、従来の液
晶表示装置では、例えば下側基板1の上面における表示
領域4の外側に引出線12、14等の各種の配線がシー
ル材3と交差して設けられている。したがって、シール
材3と配線とが交差する部分におけるオーバーコート膜
15の表面は、シール材3と配線とが交差しない部分に
おけるオーバーコート膜15の表面に対して、配線の厚
さの分だけ高くなっている。一方、両基板1、2を貼り
合わせる前のシール材3自体の高さはほぼ一定である。
したがって、両基板1、2をシール材3を介して貼り合
わせると、シール材3の配線と交差する部分が配線と交
差しない部分よりも強く圧縮され、この強く圧縮された
部分の反発力が他の部分よりも大きくなってしまう。こ
の結果、シール材3と配線とが交差する部分の近傍にお
けるセルギャップがシール材3と配線とが交差しない部
分の近傍におけるセルギャップよりも大きくなり、ひい
ては表示領域4の周辺部にギャップムラが発生し、表示
品位が低下するという問題があった。この発明の課題
は、表示領域の周辺部のセルギャップのより一層の均一
化を図ることである。As described above, in the conventional liquid crystal display device, for example, various wirings such as lead lines 12 and 14 intersect with the sealing material 3 outside the display area 4 on the upper surface of the lower substrate 1. It is provided. Therefore, the surface of the overcoat film 15 at the portion where the sealing material 3 and the wiring intersect is higher than the surface of the overcoat film 15 at the portion where the sealing material 3 and the wiring do not intersect by the thickness of the wiring. Has become. On the other hand, the height of the sealing material 3 itself before bonding the substrates 1 and 2 is substantially constant.
Therefore, when the substrates 1 and 2 are bonded together with the sealing material 3 interposed therebetween, the portion of the sealing material 3 that intersects with the wiring is more strongly compressed than the portion that does not intersect with the wiring, and the repulsive force of this strongly compressed portion is different. Will be larger than the part. As a result, the cell gap near the portion where the sealing material 3 intersects with the wiring is larger than the cell gap near the portion where the sealing material 3 does not intersect with the wiring. And the display quality is degraded. SUMMARY OF THE INVENTION It is an object of the present invention to further uniform the cell gap at the periphery of a display area.
【0005】[0005]
【課題を解決するための手段】この発明は、2枚の基板
がシール材を介して貼り合わされ、前記2枚の基板の相
対向する面の少なくとも一方の面の周辺部に配線が前記
シール材と交差して設けられた液晶表示装置において、
前記シール材の前記配線と交差する部分における幅を前
記配線と交差しない部分における幅よりも小さくしたも
のである。この発明によれば、シール材の配線と交差す
る部分における幅を配線と交差しない部分における幅よ
りも小さくしているので、シール材の配線と交差する部
分が配線と交差しない部分よりも強く圧縮されても、こ
の強く圧縮された部分の反発力が他の部分よりもあまり
大きくならないようにすることができ、これにより表示
領域の周辺部のセルギャップのより一層の均一化を図る
ことができる。According to the present invention, two substrates are bonded together via a sealing material, and wiring is provided around at least one of opposing surfaces of the two substrates by the sealing material. In the liquid crystal display device provided to intersect with,
The width of a portion of the sealing material that intersects with the wiring is smaller than the width of a portion that does not intersect with the wiring. According to the present invention, the width of the portion of the seal material that intersects with the wiring is made smaller than the width of the portion that does not intersect with the wiring, so that the portion of the seal material that intersects with the wiring is compressed more strongly than the portion that does not intersect with the wiring. Even so, the repulsion force of this strongly compressed portion can be made not to be much larger than that of the other portions, so that the cell gap at the peripheral portion of the display area can be made more uniform. .
【0006】[0006]
【発明の実施の形態】図1はこの発明の一実施形態にお
ける液晶表示装置の下側基板の要部の平面図を示したも
のである。この液晶表示装置は、ガラス板や樹脂フィル
ム等からなる下側基板21と上側基板(図示せず)とが
その間に所定の径のスペーサ(図示せず)を介在された
状態でほぼ方形枠状のシール材22を介して貼り合わさ
れ、シール材22の内側における両基板21間に液晶
(図示せず)が封入された構造となっている。この場合
も、シール材22の内側において一点鎖線で示す領域は
表示領域23となっている。なお、シール材22の幅は
一定ではなく、所定の箇所で小さくなっているが、これ
については後で説明する。FIG. 1 is a plan view showing a main part of a lower substrate of a liquid crystal display device according to an embodiment of the present invention. This liquid crystal display device has a substantially rectangular frame shape with a lower substrate 21 made of a glass plate, a resin film, or the like and an upper substrate (not shown) interposed with a spacer (not shown) having a predetermined diameter therebetween. And a liquid crystal (not shown) is sealed between the two substrates 21 inside the sealing material 22. Also in this case, the area indicated by the dashed line inside the sealing material 22 is the display area 23. Note that the width of the sealing material 22 is not constant but is reduced at a predetermined position, which will be described later.
【0007】下側基板21の上面における表示領域23
の外側には各種の配線がシール材22と交差して設けら
れているが、ここでは図1に示すものについて説明す
る。シール材22の角部の外側に設けられたクロス材接
続パッド24に表示領域23から延びて接続される引出
線25がシール材22と交差して設けられている。クロ
ス材接続パッド24は、上側基板の下面の所定の箇所に
設けられたクロス材接続パッド(図示せず)に導電性ペ
ースト等からなる円柱状のクロス材26を介して導電接
続されている。また、図示しない走査線等を陽極酸化さ
せるための給電線(図示せず)に表示領域23から延び
て接続される引出線27a、27b、27cがシール材
22と交差して設けられている。この場合、引出線27
aの幅は引出線25の幅よりも小さく、引出線27b、
27cの幅よりも大きくなっている。また、各1本ずつ
の引出線27a、27bは粗に配列されているが、6本
の引出線27cは密に配列されている。なお、引出線2
5、27a、27b、27cはオーバーコート膜28に
よって覆われており、クロス材接続パッド24はオーバ
ーコート膜28によって覆われずに露出されている。シ
ール材22はオーバーコート膜28の上面に設けられて
いる。The display area 23 on the upper surface of the lower substrate 21
Various wirings are provided crossing the seal member 22 outside the box. Here, those shown in FIG. 1 will be described. A lead wire 25 extending from the display area 23 and connected to the cross material connection pad 24 provided outside the corner of the seal material 22 is provided to intersect the seal material 22. The cross material connection pad 24 is conductively connected to a cross material connection pad (not shown) provided at a predetermined location on the lower surface of the upper substrate via a columnar cross material 26 made of a conductive paste or the like. In addition, lead lines 27 a, 27 b, and 27 c extending from the display area 23 and connected to power supply lines (not shown) for anodizing scanning lines and the like (not shown) are provided to intersect with the sealing material 22. In this case, the lead wire 27
The width of a is smaller than the width of the leader line 25, and the width of the leader line 27b,
It is larger than the width of 27c. Further, one lead line 27a, 27b is coarsely arranged, but six lead lines 27c are densely arranged. Leader 2
5, 27a, 27b, and 27c are covered with the overcoat film 28, and the cloth material connection pads 24 are exposed without being covered with the overcoat film 28. The sealing material 22 is provided on the upper surface of the overcoat film 28.
【0008】次に、シール材22の幅について説明す
る。シール材22の引出線25と交差する部分の内側に
は台形状の切欠部31が設けられている。シール材22
の引出線27a、27bと交差する部分の外側及び内側
には台形状の切欠部32が設けられている。シール材2
2の6本の引出線27cと交差する部分の外側及び内側
には台形状の切欠部33が連続して設けられている。こ
のように、シール材22の引出線25、27a、27
b、27cと交差する部分に切欠部31、32、33を
設けているので、シール材22の引出線25、27a、
27b、27cと交差する部分における幅は引出線2
5、27a、27b、27cと交差しない部分における
幅よりも小さくなっている。この結果、両基板21を貼
り合わせる前のシール材22自体の高さがほぼ一定であ
り、両基板21をシール材22を介して貼り合わせたと
き、シール材22の引出線25、27a、27b、27
c等の配線と交差する部分が配線と交差しない部分より
も強く圧縮されても、この強く圧縮された部分の反発力
が他の部分よりもあまり大きくならないようにすること
ができ、これにより表示領域23の周辺部のセルギャッ
プのより一層の均一化を図ることができる。Next, the width of the sealing member 22 will be described. A trapezoidal notch 31 is provided inside a portion of the sealing material 22 that intersects with the lead line 25. Seal material 22
A trapezoidal cutout portion 32 is provided outside and inside of a portion intersecting with the lead lines 27a and 27b. Seal material 2
The trapezoidal cutouts 33 are continuously provided outside and inside the portion that intersects the two six lead lines 27c. As described above, the lead lines 25, 27 a, 27
Since the notches 31, 32, and 33 are provided at portions that intersect with b and 27c, the lead lines 25, 27a,
The width at the portion that intersects 27b and 27c is represented by the lead line 2.
5, 27a, 27b, and 27c are smaller than the width at a portion that does not intersect. As a result, the height of the sealing material 22 itself before bonding the two substrates 21 is substantially constant, and when the two substrates 21 are bonded via the sealing material 22, the lead lines 25, 27a, 27b of the sealing material 22 are formed. , 27
Even if a portion that intersects with the wiring such as c is more strongly compressed than a portion that does not intersect with the wiring, it is possible to prevent the repulsion force of this strongly compressed portion from being much greater than other portions, thereby displaying The cell gap at the peripheral portion of the region 23 can be made even more uniform.
【0009】なお、シール材22の例えば引出線27a
と交差する部分における形状は図1に示す場合に限定さ
れるものではない。例えば、図2(A)に示すように、
シール材22の引出線27aと交差する部分の外側及び
内側に弓形状の切欠部32を設けてもよい。また、図2
(B)に示すように、シール材22の引出線27aと交
差する部分の外側及び内側に鈍角の二等辺三角形状の切
欠部32を設けてもよい。また、図2(C)に示すよう
に、シール材22の引出線27aと交差する部分の外側
及び内側に方形状の切欠部32を設けてもよい。さら
に、図2(D)に示すように、シール材22の引出線2
7aと交差する部分の内側のみに方形状の切欠部32を
設けてもよい。また、シール材22内にはグラスファイ
バの小片等からなるスペーサが混入されていてもよい。
この場合、シール材22の幅を小さくした分に相当する
分だけ、シール材22の引出線27a等と交差する部分
に混入されているスペーサの個数を少なくすることがで
き、表示領域23の周辺部のセルギャップのより一層の
均一化に寄与することができる。[0009] For example, the lead wire 27a of the sealing material 22
The shape at the portion that intersects with is not limited to the case shown in FIG. For example, as shown in FIG.
An arc-shaped notch 32 may be provided on the outside and inside of a portion of the sealing material 22 that intersects with the lead line 27a. FIG.
As shown in (B), an obtuse angled isosceles triangular notch 32 may be provided on the outside and inside of the portion of the sealing material 22 that intersects the lead line 27a. Further, as shown in FIG. 2 (C), a rectangular cutout 32 may be provided outside and inside a portion of the sealing material 22 that intersects with the lead line 27a. Further, as shown in FIG.
The rectangular notch 32 may be provided only inside the portion that intersects 7a. Further, a spacer made of a small piece of glass fiber or the like may be mixed in the sealing material 22.
In this case, the number of spacers mixed in a portion of the sealing material 22 that intersects with the lead-out line 27a or the like can be reduced by an amount corresponding to the reduced width of the sealing material 22. This can contribute to further uniformity of the cell gap of the portion.
【0010】[0010]
【発明の効果】以上説明したように、この発明によれ
ば、シール材の配線と交差する部分における幅を配線と
交差しない部分における幅よりも小さくしているので、
シール材の配線と交差する部分が配線と交差しない部分
よりも強く圧縮されても、この強く圧縮された部分の反
発力が他の部分よりもあまり大きくならないようにする
ことができ、これにより表示領域の周辺部のセルギャッ
プのより一層の均一化を図ることができる。As described above, according to the present invention, the width of the portion of the sealing material that intersects with the wiring is smaller than the width of the portion that does not intersect with the wiring.
Even if the part of the seal material that intersects with the wiring is compressed more strongly than the part that does not intersect with the wiring, the resilience of this strongly compressed part can be made not to be much greater than other parts, and this can be displayed. The cell gap at the peripheral portion of the region can be made even more uniform.
【図1】この発明の一実施形態における液晶表示装置の
下側基板の要部の平面図。FIG. 1 is a plan view of a main part of a lower substrate of a liquid crystal display device according to an embodiment of the present invention.
【図2】(A)〜(D)はそれぞれシール材の各変形例
を示す平面図。FIGS. 2A to 2D are plan views each showing a modification of a sealing material.
【図3】従来の液晶表示装置の一例の平面図。FIG. 3 is a plan view of an example of a conventional liquid crystal display device.
【図4】図3に示す液晶表示装置の下側基板の一部の拡
大平面図。4 is an enlarged plan view of a part of a lower substrate of the liquid crystal display device shown in FIG.
21 下側基板 22 シール材 23 表示領域 25、27a、27b、27c 引出線 31、32、33 切欠部 DESCRIPTION OF SYMBOLS 21 Lower board 22 Sealing material 23 Display area 25, 27a, 27b, 27c Leader 31, 32, 33 Notch
Claims (2)
され、前記2枚の基板の相対向する面の少なくとも一方
の面の周辺部に配線が前記シール材と交差して設けられ
た液晶表示装置において、前記シール材の前記配線と交
差する部分における幅を前記配線と交差しない部分にお
ける幅よりも小さくしたことを特徴とする液晶表示装
置。1. A liquid crystal in which two substrates are bonded together via a sealing material, and wiring is provided around at least one of opposing surfaces of the two substrates so as to intersect the sealing material. The liquid crystal display device according to claim 1, wherein a width of the sealing material at a portion that intersects with the wiring is smaller than a width at a portion that does not intersect with the wiring.
ル材内にスペーサが混入されていることを特徴とする液
晶表示装置。2. The liquid crystal display device according to claim 1, wherein a spacer is mixed in the sealing material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18139098A JP3807103B2 (en) | 1998-06-15 | 1998-06-15 | Liquid crystal display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18139098A JP3807103B2 (en) | 1998-06-15 | 1998-06-15 | Liquid crystal display |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000002880A true JP2000002880A (en) | 2000-01-07 |
JP3807103B2 JP3807103B2 (en) | 2006-08-09 |
Family
ID=16099913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18139098A Expired - Fee Related JP3807103B2 (en) | 1998-06-15 | 1998-06-15 | Liquid crystal display |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3807103B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685950B1 (en) * | 2001-12-26 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | Method For Manufacturing A Liquid Crystal Display Device |
JP2008009127A (en) * | 2006-06-29 | 2008-01-17 | Optrex Corp | Display device |
-
1998
- 1998-06-15 JP JP18139098A patent/JP3807103B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685950B1 (en) * | 2001-12-26 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | Method For Manufacturing A Liquid Crystal Display Device |
JP2008009127A (en) * | 2006-06-29 | 2008-01-17 | Optrex Corp | Display device |
Also Published As
Publication number | Publication date |
---|---|
JP3807103B2 (en) | 2006-08-09 |
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