JPH07321490A - Electric connector - Google Patents

Electric connector

Info

Publication number
JPH07321490A
JPH07321490A JP11270994A JP11270994A JPH07321490A JP H07321490 A JPH07321490 A JP H07321490A JP 11270994 A JP11270994 A JP 11270994A JP 11270994 A JP11270994 A JP 11270994A JP H07321490 A JPH07321490 A JP H07321490A
Authority
JP
Japan
Prior art keywords
elastomer layer
insulating elastomer
electromagnetic wave
electrical connector
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11270994A
Other languages
Japanese (ja)
Inventor
Kiyomichi Ihara
清道 渭原
Tsutomu Ogino
勉 荻野
Hirotaka Komatsu
博登 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Shinano Polymer Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Shinano Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd, Shinano Polymer Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP11270994A priority Critical patent/JPH07321490A/en
Publication of JPH07321490A publication Critical patent/JPH07321490A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a electric connector for connecting a surface mounted LSI stably with a circuit board while preventing intrusion of internal noise, e.g. crosstalk, and external noise effectively. CONSTITUTION:Metal wires 1, each surrounded by an insulating elastomer layer 5 while exposing one protruding end 3 and the other wire bonded end 2, are planted in parallel at a constant pitch. The metal wires 1 are surrounded by an insulating elastomer layer 6 containing an electromagnetic wave shielding material or further surrounded entirely by a frame 7 of an insulating elastomer containing an electromagnetic shielding material.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、表面実装型LSI(以
下LSIという)を、検査用または実用等のため電子回
路基板に接続する際、使用される電磁波シールド機能を
もつ電気コネクタに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric connector having an electromagnetic wave shielding function which is used when a surface mount type LSI (hereinafter referred to as LSI) is connected to an electronic circuit board for inspection or practical use.

【0002】[0002]

【従来の技術】従来LSIを検査等のため電子回路基板
に接続するには、電子回路基板の端子にLSIの端子を
押え治具を使って接続したり、または半田付けして直接
接続している。
2. Description of the Related Art Conventionally, to connect an LSI to an electronic circuit board for inspection or the like, the terminals of the LSI are connected to the terminals of the electronic circuit board by using a holding jig, or are directly connected by soldering. There is.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、LSI
の端子数の増加(多ピン化)、端子ピッチの微細化さら
に動作の高速化にともない、端子間のクロストークノイ
ズ等のそれ自身から発生するノイズまたは外部から侵入
するノイズ等による電磁波障害が問題となってきた。現
状では最適なノイズフィルタを別途回路基板に設ける等
の対策を講じているが、回路および装置が高価となるう
え、これらのノイズを完全に抑制することはできなかっ
た。
However, the LSI
With the increase in the number of terminals (increased number of pins), miniaturization of terminal pitch, and higher speed of operation, electromagnetic interference due to noise generated from itself such as crosstalk noise between terminals or noise invading from the outside, etc. Has become. At present, measures are taken such as providing an optimum noise filter separately on the circuit board, but the circuit and the device are expensive, and these noises cannot be completely suppressed.

【0004】[0004]

【課題を解決するための手段】本発明は、このような問
題点を解決する電気コネクタに関し、特に端子のピッチ
が0.5mm以下で、200ピン以上の多端子の、高周
波で使用するLSIの接続に適した電気コネクタを提供
することを目的とするもので、これは一定ピッチでたが
いに平行に立設した金属ワイヤが、その両端を露出させ
絶縁性エラストマー層中に埋設され、露出された一方の
端部が凸状に形成され、他方の端部がワイヤボンダによ
り形成されている電気コネクタにおいて、絶縁性エラス
トマー層が金属ワイヤの周囲を除き電磁波シールド材を
含んでいることを特徴とする電気コネクタを要旨とす
る。
SUMMARY OF THE INVENTION The present invention relates to an electrical connector which solves such problems, and more particularly to an LSI for use at high frequency with a multi-terminal of 200 pins or more with a terminal pitch of 0.5 mm or less. The purpose of the present invention is to provide an electrical connector suitable for connection, in which metal wires erected parallel to each other at a constant pitch are exposed by embedding them in an insulating elastomer layer with both ends exposed. An electrical connector having one end formed in a convex shape and the other end formed by a wire bonder, characterized in that the insulating elastomer layer includes an electromagnetic wave shielding material except around the metal wire. The main point is the connector.

【0005】以下図によって本発明の電気コネクタを説
明すると、図1(a),(b)に示すように、導電性を
もたせる金属ワイヤ1がエラストマー層中に一定ピッチ
で平行に埋設されている。このとき金属ワイヤ1の両端
部はエラストマー層の表面より露出しているが、一方の
端部はワイヤボンダにより形成されるためボンド端部2
となり、他方の端部はレーザー加工されるため球状端部
3となる。しかしてエラストマー層は、金属ワイヤ1の
周囲においては円筒状の絶縁性エラストマー層4である
が、さらにその周囲は電磁波シールド材を含む絶縁性エ
ラストマー層(以下シールド性エラストマー層という)
5である。
The electrical connector of the present invention will be described below with reference to the drawings. As shown in FIGS. 1A and 1B, conductive metal wires 1 are embedded in parallel in an elastomer layer at a constant pitch. . At this time, both ends of the metal wire 1 are exposed from the surface of the elastomer layer, but one end is formed by the wire bonder, so the bond end 2
Since the other end is laser-processed, it becomes a spherical end 3. Thus, the elastomer layer is the cylindrical insulating elastomer layer 4 around the metal wire 1, but the insulating layer around the metal wire 1 further includes an electromagnetic wave shielding material (hereinafter referred to as a shielding elastomer layer).
It is 5.

【0006】さらにシールド性を増すために図1(c)
に示すように、前記電気コネクタのまわりに電磁波シ
ールド材を含む絶縁性エラストマーよりなるフレーム7
を設けてもよい。しかしフレーム7によるシールド性が
十分であれば、図1(d)に示すように、シールド性エ
ラストマー層5を省略することもできる。
In order to further increase the shielding property, FIG. 1 (c)
As shown in FIG. 7, a frame 7 made of an insulating elastomer containing an electromagnetic wave shielding material around the electric connector 6.
May be provided. However, if the shielding property of the frame 7 is sufficient, the shielding elastomer layer 5 can be omitted as shown in FIG.

【0007】絶縁性エラストマーには例えばシリコーン
樹脂、コリア樹脂、エポキシ樹脂等の熱硬化性樹脂、ま
たはポリエチレン、ABS、ポリカーボネート等の熱可
塑性樹脂が挙げられるが、上記した絶縁性エラストマー
の2種以上の混合体としてもよい。これらの絶縁性エラ
ストマーには通常用いられる種々の改良添加剤例えば熱
安定剤、顔染料等が含まれてもよい。
Examples of the insulating elastomer include thermosetting resins such as silicone resin, core resin and epoxy resin, and thermoplastic resins such as polyethylene, ABS and polycarbonate. Two or more of the above-mentioned insulating elastomers can be used. It may be a mixture. These insulating elastomers may contain various commonly used improving additives such as heat stabilizers and facial dyes.

【0008】シールド性エラストマー層は絶縁性エラス
トマーに電波吸収性能をもたせるために導電性フィラー
を含ませるが、これはいわゆる導電物であればよく、特
に黄銅、アルミニウム、鉄等の短繊維状の金属ファイバ
ーやカーボンファイバーであって、比較的直径に対する
繊維の長さのアスペクト比の大きいものが用いられる。
好ましく用いられる範囲を例示すると、直径が5〜20
0μm、長さが0.1〜20mmの短繊維である。しか
して配合比は、シールド性エラストマー層の加工性、導
電性を考慮すると、絶縁性エラストマー:導電性フィラ
ー=100:10〜200(重量比)とするのが好まし
い。
The shield elastomer layer contains a conductive filler in order to make the insulating elastomer have a radio wave absorption performance, but this may be a so-called conductive material, particularly a short fiber metal such as brass, aluminum or iron. A fiber or a carbon fiber having a relatively large aspect ratio of the length of the fiber to the diameter is used.
When the range which is preferably used is illustrated, the diameter is 5 to 20.
It is a short fiber having a length of 0 μm and a length of 0.1 to 20 mm. However, considering the workability and conductivity of the shielding elastomer layer, the compounding ratio is preferably insulative elastomer: conductive filler = 100: 10 to 200 (weight ratio).

【0009】また磁性損失効果をもたせるためにはさら
にフェライトを含有させるが、本発明で用いられるフェ
ライトは、一般式MFeO3 (MはFe,Mn,Ni,
Co等の二価金属)であらわされる亜鉄酸塩の粉末で、
一般には鉄フェライトFe34 を主成分としたもので
ある。
Further, in order to have a magnetic loss effect, ferrite is further contained. The ferrite used in the present invention is represented by the general formula MFeO 3 (M is Fe, Mn, Ni,
A divalent metal powder such as Co),
Generally, the main component is iron ferrite Fe 3 C 4 .

【0010】電磁波吸収材として導電性フィラーを含ま
せると高い電波吸収性を示すが、さらにフェライトを含
ませると、高い磁性損失を生じ両者の相乗効果によりノ
イズに対する障害防止効果が顕著となる。 配合比としては、絶縁性エラストマー:フェライト:導
電性フィラー=100:20〜200:10〜200が
望ましい。この式の配合比よりフェライト、導電性フィ
ラーが少ないと、電気コネクタの電磁波シールド性が十
分でなく、多いと金属ワイヤ間の絶縁性が損なわれ、加
工性も悪く、電気コネクタとして圧縮して接続するには
好ましくない。
When a conductive filler is contained as an electromagnetic wave absorbing material, a high electromagnetic wave absorbing property is exhibited, but when ferrite is further contained, a high magnetic loss is caused, and a synergistic effect of the both causes a remarkable noise prevention effect. The compounding ratio is preferably insulating elastomer: ferrite: conductive filler = 100: 20 to 200: 10 to 200. If the amount of ferrite and conductive filler is less than the compounding ratio of this formula, the electromagnetic wave shielding property of the electrical connector is not sufficient, and if it is too large, the insulation between metal wires is impaired and the workability is poor, and the electrical connector is compressed and connected. Is not preferable to.

【0011】電気コネクタを使用する際は、安定した接
続をするために10%程度圧縮する必要があるので、シ
ールド性エラストマー層はショアA硬度を30°以上7
0°以下、望ましくは30°以上60°以下とする必要
がある。また第1図(d)に示すように、シールド性エ
ラストマー層が省略され、絶縁性エラストマー層にフレ
ームが外側に設けられているときは、フレームは圧縮さ
れることがないので、ショアA硬度を50°以上望まし
くは60°以上とするのがよい。望ましい60°以上の
ショアA硬度を得るためには、絶縁性エラストマー:フ
ェライト:導電性フィラー=100:100〜200:
60〜200の配合比とすればよい。ショアA硬度を6
0°以上とすれば、フレームに位置決め用の穴をあける
ことができ、特に他ピン化、微細化された電子回路基板
間の接続には確実な位置決め、位置合わせ、誤設置防止
にも役立たせることができる。
When an electric connector is used, it is necessary to compress it by about 10% in order to make a stable connection. Therefore, the shielding elastomer layer has a Shore A hardness of 30 ° or more.
It should be 0 ° or less, preferably 30 ° or more and 60 ° or less. Further, as shown in FIG. 1 (d), when the shield elastomer layer is omitted and the insulating elastomer layer is provided with the frame on the outer side, the frame is not compressed. It is preferably 50 ° or more, more preferably 60 ° or more. In order to obtain a desired Shore A hardness of 60 ° or more, insulating elastomer: ferrite: conductive filler = 100: 100 to 200:
The compounding ratio may be 60 to 200. Shore A hardness 6
If the angle is 0 ° or more, it is possible to make a positioning hole in the frame, and it is also useful for reliable positioning, positioning, and prevention of erroneous installation, especially for connections between other pinned and miniaturized electronic circuit boards. be able to.

【0012】[0012]

【作用】本発明の電気コネクタでは、金属ワイヤにより
導通性が維持され、そのまわりの絶縁性エラストマー層
により金属ワイヤ間の絶縁が確保される。しかしてさら
にまわりのシールド性エラストマー層は、電波吸収性能
をもたせるために、絶縁性エラストマー中に電波シール
ド材例えば短繊維状の導電性フィラーを含有させ、さら
に磁性損失効果をもたせるには、前出の導電性フィラー
と磁波シールド材例えばフェライトを含有しているの
で、優れた電磁波吸収性を示し、クロストークノイズの
発生および外部環境からのノイズの侵入を防止すること
ができる。
In the electrical connector of the present invention, the electrical continuity is maintained by the metal wires, and the insulating elastomer layer around the electrical wires ensures the insulation between the metal wires. However, in order to further improve the electromagnetic wave absorption performance, the shielding elastomer layer further around the electromagnetic wave shielding material, for example, a short fiber conductive filler, is contained in the insulating elastomer, and the magnetic loss effect can be obtained by the above-mentioned method. Since it contains the conductive filler and the magnetic wave shield material such as ferrite, it exhibits excellent electromagnetic wave absorbability and can prevent generation of crosstalk noise and intrusion of noise from the external environment.

【0013】[0013]

【実施例1】図1(a),(b)に示すように、厚さ
0.5mmの銅製の形成用基板8に、公知のワイヤボン
ダにより金属ワイヤ1(直径76μm、長さ3mmの金
ワイヤ)を一定ピッチ(1.0mmピッチ)で26mm
×26mmの範囲に立設し、ボンド端部2を得た。この
金属ワイヤ1の先端に公知のレーザー光を照射して球状
端部3を得、つぎに2液性シリコーンゴムKE−109
A/B(信越化学工業社製、商品名)のA液とB液を等
量の割合で配合した絶縁性エラストマー2kgを、ディ
ッピング法により金属ワイヤ1のまわりだけを囲み球状
端部4を露出させて200μmの厚さに配設し、円筒状
の絶縁性エラストマー層4を形成した。ついで2kgの
絶縁性エラストマーに、平均直径が60μm、長さ3m
mのアルミニウムファイバー800gを付与し、ディゾ
ルバーで混合攪拌し分散させ、これを形成用基板8の上
に、前記絶縁性エラストマー層4で囲まれた金属ワイヤ
1を倒さないように前記絶縁性エラストマー層と同じ厚
さまで注入し、30mm×30mmのシールド性エラス
トマー層5を得た。ついで銅製の形成用基板8を塩化第
二鉄によりエッチング除去して本発明の電気コネクタ
を完成した。この電気コネクタを用いて、図2に示すよ
うに、LSI9の端子10と金属ワイヤ1の球状端子
3、検査用電子回路基板11の端子12と金属ワイヤ1
のボンド端部2を接続し、LSI 9のアース端子13
と検査用回路基板11のアース端子14とをシールド性
エラストマー層5に接触させる。このLSI 9に均等
に加重し電気コネクタを10%圧縮すると、安定な接続
が得られると同時に、クロストーク等の内部に起因する
ノイズおよび外部環境からのノイズを効果的に遮蔽する
ことができた。
Example 1 As shown in FIGS. 1A and 1B, a metal wire 1 (having a diameter of 76 μm and a length of 3 mm) was formed on a copper forming substrate 8 having a thickness of 0.5 mm by a known wire bonder. ) At a constant pitch (1.0 mm pitch) of 26 mm
It was erected in a range of x26 mm to obtain a bond end portion 2. The tip of the metal wire 1 is irradiated with a known laser beam to obtain the spherical end portion 3, and then the two-component silicone rubber KE-109.
2 kg of insulative elastomer containing A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) mixed with A liquid and B liquid in equal proportions is surrounded by the dipping method only around the metal wire 1 to expose the spherical end 4. Then, the insulating elastomer layer 4 having a thickness of 200 μm was formed to form a cylindrical insulating elastomer layer 4. Then, in 2kg of insulating elastomer, average diameter is 60μm, length is 3m
800 g of aluminum fiber of m, mixed and stirred by a dissolver and dispersed, and the insulating elastomer layer so as not to fall the metal wire 1 surrounded by the insulating elastomer layer 4 on the forming substrate 8. The same thickness as above was injected to obtain a shielding elastomer layer 5 of 30 mm × 30 mm. Then, the copper forming substrate 8 is removed by etching with ferric chloride to remove the electrical connector 6 of the present invention.
Was completed. Using this electric connector, as shown in FIG. 2, the terminal 10 of the LSI 9 and the spherical terminal 3 of the metal wire 1, the terminal 12 of the inspection electronic circuit board 11 and the metal wire 1 are used.
Connect the bond end 2 of the and connect the ground terminal 13 of the LSI 9.
And the ground terminal 14 of the inspection circuit board 11 are brought into contact with the shielding elastomer layer 5. If the LSI 9 is evenly weighted and the electrical connector is compressed by 10%, stable connection can be obtained, and at the same time, noise caused by the inside such as crosstalk and noise from the external environment can be effectively shielded. .

【0014】[0014]

【実施例2】図1(c)に示すように、電磁波シールド
材を含むエラストマーのフレーム7を作製した。すなわ
ちポリプロピレン粉末(三井ノーブレンJHN、三井東
圧化学社製、商品名)3kgに、フェライト5.2kg
と平均直径60μm、長さ3mmのアルミニウムファイ
バ1.8kgを付与し、ディゾルバーで攪拌分散し、つ
ぎにスクリュー押出機で押し出してペレット状とし、つ
いで射出成形機により厚さ5.0mm、一辺50mmの
正方形の平板を得た。この平板の中央を40mm×40
mmにくりぬいてショアA硬度60°のフレーム7を得
た。このフレーム7を厚さ0.4mm、縦横それぞれ5
0mmの銅製の形成用基板8に載せ、実施例1と同様に
して絶縁性エラストマー層4とシールド性エラストマー
層5をフレーム7より0.5mm高く形成した。ついで
形成用基板8を塩化第二鉄によりエッチング除去してフ
レーム付きの本発明の電気コネクタを得たが、実施例
1と同様の検査を行ったところ実施例1と同様の効果が
得られた。
Example 2 As shown in FIG. 1C, an elastomer frame 7 containing an electromagnetic wave shielding material was produced. That is, polypropylene powder (Mitsui Noblen JHN, manufactured by Mitsui Toatsu Chemicals, Inc., trade name) 3 kg, ferrite 5.2 kg
And 1.8 kg of an aluminum fiber having an average diameter of 60 μm and a length of 3 mm are added, stirred and dispersed by a dissolver, and then extruded by a screw extruder into pellets, and then by an injection molding machine, a thickness of 5.0 mm and a side of 50 mm. A square plate was obtained. 40 mm x 40 in the center of this plate
A frame 7 having a Shore A hardness of 60 ° was obtained by hollowing out into mm. This frame 7 has a thickness of 0.4 mm, and the length and width are 5
The insulating elastomer layer 4 and the shielding elastomer layer 5 were formed 0.5 mm higher than the frame 7 in the same manner as in Example 1 by placing it on a 0 mm copper forming substrate 8. Then, the forming substrate 8 was removed by etching with ferric chloride to obtain the electrical connector 6 of the present invention with a frame. When the same inspection as in Example 1 was performed, the same effect as in Example 1 was obtained. It was

【0015】[0015]

【発明の効果】本発明の電気コネクタを使用して、LS
Iの端子と検査または実用の電子回路基板の端子を接続
した場合、容易に安定な接続ができると同時に、クロス
トーク等の内部に起因するノイズおよび外部環境から誤
動作をひきおこすノイズが電気コネクタの金属ワイヤよ
り侵入するのを効果的に防止することができた。
By using the electrical connector of the present invention, the LS
When the terminal of I and the terminal of the electronic circuit board for inspection or practical use are connected, stable connection can be easily made, and at the same time, noise caused by the inside such as crosstalk and noise that causes malfunction due to the external environment are caused by the metal of the electrical connector. It was possible to effectively prevent intrusion from the wire.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)は本発明の電気コネクタの平面図、
(b)は(a)のX−X線に沿う断面図、(c)は本発
明の他の電気コネクタの断面図、(d)は本発明のさら
に他の電気コネクタの断面図である。
FIG. 1A is a plan view of an electric connector of the present invention,
(B) is sectional drawing which follows the XX line of (a), (c) is sectional drawing of the other electrical connector of this invention, (d) is sectional drawing of another electrical connector of this invention.

【図2】この電気コネクタを使用する際の説明図であ
る。
FIG. 2 is an explanatory diagram when using this electric connector.

【符号の説明】[Explanation of symbols]

1…金属ワイヤ 2…ボンド端部 3…球状端部 4…絶縁性エラストマー層 5…シールド性エラストマー層 …電気コネクタ 7…フレーム 8…形成用基板 9…LSI 10…端子 11…検査用電子回路基板 12…端子 13…アース端子 14…アース端子DESCRIPTION OF SYMBOLS 1 ... Metal wire 2 ... Bond end 3 ... Spherical end 4 ... Insulating elastomer layer 5 ... Shielding elastomer layer 6 ... Electrical connector 7 ... Frame 8 ... Forming substrate 9 ... LSI 10 ... Terminal 11 ... Inspection electronic circuit Substrate 12 ... Terminal 13 ... Ground terminal 14 ... Ground terminal

───────────────────────────────────────────────────── フロントページの続き (72)発明者 小松 博登 埼玉県大宮市吉野町1丁目406番地1 信 越ポリマー株式会社東京工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroto Komatsu 1-406-1 Yoshino-cho, Omiya-shi, Saitama 1 Shin-Etsu Polymer Co., Ltd. Tokyo factory

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 一定ピッチでたがいに平行に立設した金
属ワイヤが、その両端を露出させ絶縁性エラストマー層
中に埋設され、露出された一方の端部が凸状に形成さ
れ、他方の端部がワイヤボンダにより形成されている電
気コネクタにおいて、絶縁性エラストマー層が金属ワイ
ヤの周囲を除き電磁波シールド材を含んでいることを特
徴とする電気コネクタ。
1. A metal wire standing upright in parallel with each other at a constant pitch is embedded in an insulating elastomer layer with its both ends exposed, and one exposed end is formed in a convex shape, and the other end is exposed. An electrical connector, the portion of which is formed by a wire bonder, wherein the insulating elastomer layer includes an electromagnetic wave shielding material except around the metal wire.
【請求項2】 電磁波シールド材が導電性フィラーまた
はフェライトから選ばれた少なくとも1種である請求項
1に記載の電気コネクタ。
2. The electrical connector according to claim 1, wherein the electromagnetic wave shielding material is at least one selected from a conductive filler and ferrite.
JP11270994A 1994-05-26 1994-05-26 Electric connector Pending JPH07321490A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11270994A JPH07321490A (en) 1994-05-26 1994-05-26 Electric connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11270994A JPH07321490A (en) 1994-05-26 1994-05-26 Electric connector

Publications (1)

Publication Number Publication Date
JPH07321490A true JPH07321490A (en) 1995-12-08

Family

ID=14593544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11270994A Pending JPH07321490A (en) 1994-05-26 1994-05-26 Electric connector

Country Status (1)

Country Link
JP (1) JPH07321490A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452406B1 (en) 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US6528984B2 (en) 1996-09-13 2003-03-04 Ibm Corporation Integrated compliant probe for wafer level test and burn-in
JP2003142624A (en) * 2001-10-31 2003-05-16 Fujitsu Ltd Method for manufacturing semiconductor device incorporating passive element, relay substrate and manufacturing method therefor
WO2004077621A1 (en) * 2003-02-28 2004-09-10 J.S.T. Mfg. Co. Ltd. Anisotropic conductive sheet
WO2004093254A1 (en) * 2003-04-16 2004-10-28 Jsr Corporation Anisotropic conductive connector and circuit-device electrical-inspection device
JP2004335450A (en) * 2003-04-16 2004-11-25 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7282945B1 (en) 1996-09-13 2007-10-16 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
JP2008098458A (en) * 2006-10-13 2008-04-24 Bridgestone Corp Closing method of penetration part of electromagnetic shield wall
US7368924B2 (en) 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
JP2012079719A (en) * 2010-09-30 2012-04-19 Chino Corp Function addition type substrate
KR102281531B1 (en) * 2020-02-21 2021-07-23 신종천 Data signal transmission connector and electrical connecting module

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7368924B2 (en) 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US6452406B1 (en) 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US6528984B2 (en) 1996-09-13 2003-03-04 Ibm Corporation Integrated compliant probe for wafer level test and burn-in
US7282945B1 (en) 1996-09-13 2007-10-16 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
US6875638B2 (en) 2001-10-31 2005-04-05 Fujitsu Limited Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
US6995044B2 (en) 2001-10-31 2006-02-07 Fujitsu Limited Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
JP2003142624A (en) * 2001-10-31 2003-05-16 Fujitsu Ltd Method for manufacturing semiconductor device incorporating passive element, relay substrate and manufacturing method therefor
WO2004077621A1 (en) * 2003-02-28 2004-09-10 J.S.T. Mfg. Co. Ltd. Anisotropic conductive sheet
JP2004335450A (en) * 2003-04-16 2004-11-25 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
WO2004093254A1 (en) * 2003-04-16 2004-10-28 Jsr Corporation Anisotropic conductive connector and circuit-device electrical-inspection device
US7255579B2 (en) 2003-04-16 2007-08-14 Jsr Corporation Anisotropic conductive connector and circuit-device electrical-inspection device
CN100449871C (en) * 2003-04-16 2009-01-07 Jsr株式会社 Anisotropic conductive connector and circuit-device electrical-inspection device
JP2008098458A (en) * 2006-10-13 2008-04-24 Bridgestone Corp Closing method of penetration part of electromagnetic shield wall
JP2012079719A (en) * 2010-09-30 2012-04-19 Chino Corp Function addition type substrate
KR102281531B1 (en) * 2020-02-21 2021-07-23 신종천 Data signal transmission connector and electrical connecting module

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