JPH07321285A - Semiconductor device and assembling method - Google Patents

Abstract

PURPOSE:To reduce the number of individual parts and enable automatic assembling by integrally molding a terminal assembling body including each terminal with an externally armored resin case and by assembling the padding part connecting terminal and conductor pattern of insulating substrate with the solder junction. CONSTITUTION:A package combining an externally armored resin case 10 to a metal base plate 1, semiconductor elements 4, 5 mounted on the metal base 1 via an insulating substrate 2, a main circuit terminal 6 and auxiliary terminal 7 for external connection and an internal connecting terminal 16 are provided. A terminal assembling body 15 including each terminal is arranged at the internal side of an external armored resin case 10 to integrally mold with the case 10. Moreover, the soldering part 16a of the internal connecting terminal 16 is soldered to a conductor pattern of the insulating substrate 2 for the assembling. Thereby, each terminal can be fixed and held with good accuracy to the predetermined position in the case 10 at a time simultaneously with formation of the external armored resin case 10. Moreover, the assembling process can be simplified and automatically done.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a power transistor (IGBT) module or the like is implemented, and an assembling method thereof.

[0002]

2. Description of the Related Art Assembling structure of a conventional semiconductor device is shown in FIGS. 8 (a) to 8 (c), taking as an example a set of two power transistor modules in which two power transistors (IGBTs) are incorporated in a package. Note that (a) is a bird's eye view of the internal structure excluding the exterior resin case and the terminal block,
(B) is a partially cutaway side view of a product in which the exterior resin case and the terminal block are combined with (a), and (c) is an equivalent circuit diagram. In the figure, 1 is a metal base plate, 2 is an insulating substrate such as a ceramic substrate mounted on the metal base plate 1 and solder-bonded thereto, 3 is a conductor pattern formed on the upper surface of the insulating substrate 2, and 4 and 5 are respectively insulated. Power transistors (IGBTs) mounted in pairs on the substrate 2, semiconductor elements of flywheel diodes, 6 is a main circuit terminal for external connection (screw terminal), 7 is an auxiliary terminal for external connection (faston terminal), 8 is Bonding wires wired between the semiconductor elements 4 and 5 and the conductor power 3 of the insulating substrate 2, 9 internal lead wires, 10 an outer resin case, 11 a terminal block holding external connection terminals in place, 12 is a silicone gel for sealing, and 13 is an epoxy resin. In addition,
(A) Symbols C1, C2E1, E2, e1, e2, shown on each terminal in the figure
G1 and G2 correspond to the terminal symbols of the collector, emitter, and gate attached to the equivalent circuit of FIG.

The semiconductor device having such a structure is manufactured and assembled as follows. First, the semiconductor elements 4 and 5 are mounted on the metal base plate 1 and wire bonding is performed between the semiconductor elements 4 and 5 and a predetermined conductor pattern 3. On the other hand, the main circuit terminals 6 and the auxiliary terminals 7 for external connection are individually stamped and lead-bent to be manufactured, and these terminals are collectively fixedly held on the terminal block 11, and the lead wire 10 for internal connection is further provided. Wire to construct a terminal assembly. Next, the terminal assembly is positioned and placed on the insulating substrate 2, and each terminal and the conductor pattern 3 are soldered by a reflow soldering method or the like. After that, the exterior resin case 10 is attached to the metal base plate 1
The semiconductor device is completed by superimposing it on top of the above and fixing with an adhesive, and further injecting and curing the silicone gel 12 and the epoxy resin 13 into the inside of the exterior resin case 10.

[0004]

The conventional semiconductor device assembly structure described above has the following problems in terms of assemblability and reliability. (1) The terminal assembly is constructed by three-dimensionally interlocking a large number of individually produced parts having different shapes. In the assembly, a step of individually inserting and fixing each terminal 6, 7 into the terminal block 11, Also, there is a step of soldering the internal connection lead wires 9, which makes it extremely difficult to automate the assembly process.

(2) When the terminal assembly is handled after assembly, disconnection of the lead wire 10 and contact between terminals of different polarity are likely to occur, and there is concern about reliability. (3) Since the terminals 6 and 7 are individually inserted and fixed to the terminal block 11 to form a terminal assembly, the flatness of the soldering portion formed at the lower end of each terminal as a whole of the terminal assembly Variations easily occur, which causes soldering failure when soldering the terminal assembly onto the insulating substrate 2, tilting of the terminal block 11, and height of the external connection terminals 6 and 7. Product defects such as unevenness occur.

(4) If the heights of the external connection terminals are not uniform, for example, when a printed wiring board such as an inverter device is directly mounted on the terminals of the semiconductor device to be connected to each other, the connection and fixing are performed. Becomes unstable. The present invention has been made in view of the above points, and an object thereof is to solve the above problems, reduce the number of individual parts, and perform automatic assembly, and a highly reliable semiconductor device that can be manufactured at low cost, and the same. It is to provide an assembling method.

[0007]

In order to achieve the above object, the semiconductor device of the present invention is mounted on an insulating substrate in a package in which an outer resin case is combined with a metal base plate and mounted on the metal base plate. In a semiconductor device having a plurality of semiconductor elements, a main circuit terminal and an auxiliary terminal for external connection, and an internal connection terminal incorporated therein, a terminal assembly including the terminals is arranged inside an exterior resin case. The case is integrally molded, and the soldering portion of the internal connection terminal is soldered to the conductor pattern of the substrate to be assembled.

Further, the semiconductor device having the above structure can be implemented in the following concrete manner. (1) Each terminal for external connection and internal connection, and a tie bar connecting between terminals of different polarities are expanded and punched on one or several conductive metal plates, and the individual terminals are subjected to lead bending processing to make terminals. Build the assembly.

(2) The outer resin case has a terminal holding portion that projects inward from the peripheral wall of the case, and each terminal of the terminal assembly is supported by the mold by the mold. (3) The auxiliary terminal for external connection pulled out from the upper surface of the exterior resin case is used as a pin terminal for connector connection. (4) In the above item (3), columnar guide pins that serve as insertion guides for the connector socket are provided on both sides of the pin terminal row.

(5) A case lid is attached to the upper open surface of the exterior resin case and fixed with an adhesive, and a main circuit terminal for external connection is drawn out through a terminal hole opened in the case lid. (6) In the above item (5), with respect to the external connection main circuit terminal that penetrates through the case lid and is drawn out upward, the protruding base portion is bent into an L shape so that the case lid is between the exterior resin case and the main circuit terminal. To be sandwiched between. Further, a peripheral groove for accumulating an adhesive agent is formed in the peripheral area of the upper end surface of the exterior resin case.

On the other hand, the semiconductor device having the above structure can be assembled by the following assembling method according to the present invention. (1) The metal base plate and the insulating substrate are soldered together, the conductor pattern of the insulating substrate and the internal terminals are soldered together, and the metal base plate and the exterior resin case are simultaneously adhered in the same step to assemble.

(2) The terminal assembly is inserted into a metal mold for forming an exterior resin case with the terminals of different polarities being connected by tie bars, and the tie bars are cut after resin molding. (3) Insert the terminal assembly into the molding die for the outer resin case with the tie bars connecting the terminals of different polarity, and simultaneously use the cutting jig installed on the die side when the die is clamped to simultaneously tighten the tie bar. To cut.

[0013]

According to the above-described structure of the semiconductor device, each terminal of the terminal assembly is not manufactured as an individual part, but a tie bar is provided between the terminals developed on the conductive metal plate in the same manner as a normal lead frame. It is constructed by press punching from a conductive metal plate and bending the leads while they are still connected. That is, many terminals can be manufactured and handled as a single component. By molding the terminal assembly integrally with the exterior resin case, the terminals are collectively and accurately fixed and held at a predetermined position in the case simultaneously with the molding of the case. Moreover, since the terminal assembly is surrounded by the peripheral frame of the outer resin case, this case functions as a protective frame, and the terminal may be deformed due to contact with objects during handling such as subsequent storage and transportation, and the flatness may be reduced. Can be satisfactorily avoided.

Further, by adopting the terminal-integrated exterior resin case, the metal base plate and the insulating substrate are soldered, the conductor pattern of the insulating substrate and the internal terminal are soldered,
Also, an assembling method of simultaneously adhering the metal base plate and the exterior resin case in the same process can be adopted, and this assembling process simplifies and automates the assembling process of the semiconductor device, thereby improving productivity. Can be achieved.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. In the drawings of each embodiment, the same members corresponding to FIG. 8 are denoted by the same reference numerals. 1 to 4 show an embodiment of the present invention. A semiconductor device is a package in which a metal base plate 1 is combined with an exterior resin case 10 and a case lid 14, and a metal base plate 1 is provided with an insulating substrate 2. The semiconductor elements 4 and 5 mounted via the external resin case 10, and the terminal assembly 15 integrally molded in the case,
And a silicone gel 12 for sealing filled in the package.

Here, the terminal assembly 15 is shown in FIGS.
As shown in (c), the main circuit terminal 6 (screw terminal) for external connection, the auxiliary terminal 7 (faston terminal), the internal connection terminal 16, the short bar 17 (internal in FIG. 8) on one or several conductor metal plates. (Corresponding to the connecting lead wire 9), the internal auxiliary terminal 18, and the tie bar 1 for connecting the terminals of different polarities.
It is three-dimensionally constructed by unfolding 9 (hatched portion) and the like, press punching, and lead bending. Reference numeral 16a denotes a soldering portion bent and formed in an L shape at the tip of the internal connection terminal 16, and the tip portion of the faston-shaped auxiliary terminal 7 is formed to a predetermined thickness by pressing or cutting.

When molding the exterior resin case 10, the terminal assembly 15 has a mold for molding the resin case in which the end surfaces (soldering portions 16a) of the internal connection terminals 16 are aligned with the tie bars 19 left. It is inserted into the inside, and in this state, the molding resin is injected into the mold to integrally mold it. For this reason, as shown in FIG.
Reference numeral 0 has a pedestal-shaped terminal holding portion 10b protruding inwardly from the peripheral frame portion 10a. The peripheral frame portion 10a and the terminal holding portion 10b embed an intermediate portion of each terminal conductor of the terminal assembly 14. I keep it in place. In addition, a groove 10c is formed on the upper end surface of the peripheral wall portion 10a along a peripheral area thereof for storing a predetermined amount of adhesive applied when the case lid 14 is adhered. The above-mentioned tie bar 19 is formed by molding the terminal assembly 14 integrally with the exterior resin case 10 and then taking out the exterior resin case 10 from the mold and punching it out with a cutting jig such as a punch or a die. Or the above-mentioned cutting jig is incorporated in the molding die side of the resin case, and the terminal assembly is inserted into the die and punched and removed at the same time when the die is clamped. The method can be adopted. Especially, if the latter method is adopted, the assembling process can be simplified.

Next, a method of assembling the semiconductor device having the above structure according to the present invention will be described. First, the metal base plate 1
Insulating substrate 2 with semiconductor elements 4 and 5 mounted in the center of
(Preliminary solder is applied to the back surface of the insulating board and the soldering points on the conductor pattern.)
Is mounted, and an adhesive agent is further applied to the joint portion with the outer resin case 10, and in this state, the outer resin case 10 integrated with the terminal assembly 15 described above is attached to the metal base plate 1
Then, the temporary assembly is carried into the heating furnace in this state, and the metal base plate 1 and the insulating substrate 2 are soldered, the conductive pattern of the insulating substrate 2 and the terminal assembly 15 (correctly Simultaneously solders the soldering portion 16a) of the internal connection terminal 16 and bonds the metal base plate 1 and the exterior resin case 10 together. In this case, as a method of removing the tie bar 19 connecting the pole terminals of the terminal assembly 15,
As described above, it is possible to take out from the mold after resin molding and cut the tie bar in a separate step, or simultaneously perform tie bar cutting using the cutting jig incorporated in the mold side when the mold is clamped. .

After that, the silicone gel 12 is injected into the exterior resin case 10 and cured, and the case lid 1 is further coated with an adhesive on the upper end surface of the exterior resin case 10.
Cover with 4 and bond. Finally, the main circuit terminal 6 for external connection pulled out to the outside through the terminal hole opened in the case lid 14.
Is bent into an L shape along the chain line xx of FIG. 1B at the protruding base portion to complete a semiconductor device product.

When the silicone gel 12 is poured into the exterior resin case 10 and cured by heat treatment, an adhesive is applied to the exterior resin case 10 while the residual heat remains, and the case lid 14 is attached. This can shorten the curing time of the adhesive. In addition, immediately after the case lid 14 is bonded, the protruding base portions of the main circuit terminals 6 are bent to prevent the case lid from coming off and being fixed, so that even if the adhesive is not completely cured, the case lid 14 will not fall off. It becomes possible to carry it to the process.

5 (a), (b) and 6 (a), (b)
1 shows an example of another type of semiconductor device in which the shape of the terminal assembly is different (a structure in which the exterior resin case and the terminal assembly are integrated), and the symbols shown in each figure are shown in FIG. It corresponds to. 7 (a) and 7 (b) show application examples of the present invention. In this embodiment, the assembly structure of the semiconductor device is basically the same as that of each of the above-mentioned embodiments, but in particular, as the auxiliary terminal for external connection, the pin terminal 7a for connecting the connector is provided on the upper surface of the exterior resin case 10. It is implanted and connected to the internal connection terminal 16. By adopting this connector pin terminal 7a, for example, a socket of a connector mounted on a printed wiring board of an inverter device can be directly inserted into the pin terminal 7a for mutual connection.
It can also support specifications specified by the user. Further, in this case, the columnar guide pins 20 which are juxtaposed with the pin terminals 7a and serve as insertion guides for the connector sockets are provided at both ends of the terminal row.
Is integrally formed with the exterior resin case 10, or is integrally molded and provided as a separate component in the resin case, which is convenient because the connector socket can be easily inserted.

[0022]

As described above, according to the structure of the present invention, the terminal assembly constructed by a large number of terminals is manufactured as a single component like the lead frame, and the terminal assembly is used as the exterior resin case. By molding integrally,
Simultaneously with the molding of the case, the terminals can be collectively fixed and accurately held at a predetermined position in the case. Moreover,
The terminal assembly is surrounded by the peripheral frame of the external resin case, so it is possible to prevent the terminals from being deformed by contact with objects during handling such as storage and transportation, and the flatness of the soldered part from being disturbed. it can.

When a semiconductor device is assembled using the terminal-integrated exterior resin case, a metal base plate is soldered to an insulating substrate, a conductor pattern of the insulating substrate is soldered to an internal terminal, and a metal base is used. By adopting an assembly method in which the board and the exterior resin case are adhered simultaneously in the same process, the semiconductor device assembly process can be simplified and automated, which is cheaper and more reliable than conventional semiconductor devices. It is possible to provide a highly efficient semiconductor device with high productivity.

[Brief description of drawings]

1A and 1B are views showing an integrated structure of an exterior resin case and a terminal assembly according to an embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a sectional view.

FIG. 2 is a structural diagram of the terminal assembly in FIG.
(A) is a plan view, (b) and (c) are side views seen from different directions.

FIG. 3 is a plan view of the exterior resin case in FIG. 1 excluding the terminal assembly.

4 is a partially cutaway side view of a semiconductor device assembled using the structure of FIG.

5A and 5B are views showing an integrated structure of an exterior resin case and a terminal assembly according to another embodiment of the present invention, in which FIG. 5A is a plan view and FIG. 5B is a sectional view.

FIG. 6 is a view showing an integrated structure of an exterior resin case and a terminal assembly according to still another embodiment of the present invention, FIG.
Is a plan view, (b) is a sectional view

FIG. 7 is a configuration diagram showing an application example of the present invention in which a connector pin terminal is adopted as an auxiliary terminal for external connection,
(A) is a side view of the semiconductor device, (b) is an end view seen from the auxiliary terminal side

FIG. 8 is a configuration diagram of a conventional semiconductor device,
(A) is a bird's eye view of the internal structure excluding the exterior resin case and the terminal block, (b) is a partially cutaway side view of the finished product,
(C) is an equivalent circuit diagram of the semiconductor device.

[Explanation of symbols]

 1 Metal Base Plate 2 Insulating Substrate 3 Conductor Pattern 4 Semiconductor Element (IGBT) 5 Semiconductor Element (Flywheel Diode) 6 Main Circuit Terminal for External Connection 7 Auxiliary Terminal for External Connection 7a Connector Pin Terminal 10 Exterior Resin Case 10a Circumference Frame block 10b Terminal holding block 10c Groove for accumulating adhesive 12 Silicone gel for sealing 14 Case lid 15 Terminal assembly 16 Internal connection terminal 17 Short bar 18 Internal auxiliary terminal 19 Tie bar 20 Guide pin

Claims (11)

[Claims] 1. A plurality of semiconductor elements mounted on an insulating substrate and mounted on a metal base plate in a package in which an exterior resin case and a metal base plate are combined, main circuit terminals and auxiliary terminals for external connection, and internal connection. In a semiconductor device configured by incorporating terminals for terminals, a terminal assembly including the terminals is arranged inside an exterior resin case and molded integrally with the case, and a soldering portion of an internal connection terminal is formed on the substrate. The semiconductor device is characterized by being assembled by soldering to the conductor pattern of. 2. The semiconductor device according to claim 1, wherein external connection terminals, internal connection terminals, and tie bars for connecting the different polarity terminals are expanded and punched on one or several conductive metal plates, and A semiconductor device in which a lead assembly is applied to each terminal to construct a terminal assembly. 3. The semiconductor device according to claim 1, wherein the exterior resin case is provided with a terminal holding part which projects inward from a peripheral wall of the case and holds each terminal of the terminal assembly at a predetermined position. Characteristic semiconductor device. 4. The semiconductor device according to claim 1, wherein auxiliary terminals for external connection, which are drawn out from the upper surface of the exterior resin case, are pin terminals for connector connection. 5. The semiconductor device according to claim 1, wherein columnar guide pins that serve as insertion guides for the connector socket are provided on both sides of the pin terminal row. 6. The semiconductor device according to claim 1, wherein a case lid is attached to the upper open surface of the exterior resin case and fixed with an adhesive, and a terminal hole opened in the case lid is penetrated for external connection. A semiconductor device in which the main circuit terminal of is pulled out. 7. The semiconductor device according to claim 6, wherein a protruding base portion is bent into an L-shape with respect to the external connection main circuit terminal penetrating through the case lid and pulled out upward, and the case lid is provided with an outer resin case. A semiconductor device characterized by being sandwiched between a circuit terminal and the circuit terminal. 8. The semiconductor device according to claim 6, wherein a peripheral groove for accumulating an adhesive is formed on the upper end surface side of the peripheral wall portion of the exterior resin case. 9. A method of soldering a metal base plate and an insulating substrate, soldering a conductor pattern of the insulating substrate and an internal terminal, and bonding a metal base plate and an exterior resin case simultaneously in the same step. The method for assembling a semiconductor device according to claim 1. 10. A terminal assembly is inserted into a mold for forming an exterior resin case with the terminals of different polarities being connected by a tie bar, and after the resin molding, the exterior resin case is taken out of the mold and the tie bar is cut. 3. The method for assembling a semiconductor device according to claim 2, wherein. 11. A tie bar with a cutting jig which is inserted into a molding die of an exterior resin case in a state where the terminals of different polarities are connected with each other by a tie bar and is incorporated in the die side when the die is clamped. 3. The cutting is performed at the same time.
A method for assembling the semiconductor device described.