JPH07321162A - Packaging method and packaged product of semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device packaging method and package thereof wherein the semiconductor device can be connected to a circuit board at a high productivity and high reliability. CONSTITUTION:Connecting electrodes 6 made of a thermoplastic resin setting type conductive material are formed on a specified area of a circuit board 4, a semiconductor device 1 is vacuum checked by a thermocompression bonding tool 7 to bringing bumps 3 of the device 1 into contact with connecting electrodes 6 of the circuit board 4, thereby thermocompression bonding them. Since the thermoplastic resin-setting type conductive material quickly hardening by cooling is used, the productivity is improved. Since the thermocompression bonding is made at a lower temp., the thermal stress caused by the thermal expansion coefficient difference between the semiconductor device and circuit board is little and the reliability is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting method and a semiconductor device mounting body, and more particularly to improvement of a technique for mounting a semiconductor device face down.

[0002]

2. Description of the Related Art Conventionally, as a method of mounting a semiconductor device on a circuit board by face down, a protruding contact made of a soldering alloy is previously formed on an electrode pad of the semiconductor device by a plating technique, and this protruding contact is used. The method of soldering to the connection electrode of the circuit board has been used, but in recent years, a method of connecting the semiconductor device to the circuit board using a conductive adhesive is being used.

As a method of mounting a semiconductor device using such a conductive adhesive, for example, US Pat. No. 4,661,192 is used.
As disclosed in the publication, there is a technique for simply connecting a semiconductor device to a circuit board by face down using a conductive adhesive. Hereinafter, a conventional mounting technique of a semiconductor device will be described with reference to the drawings.

FIG. 3 is a diagram showing a part of the mounting process of the semiconductor device, showing the process of transferring the conductive adhesive to the protruding contacts of the semiconductor device. Further, FIG. 4 is a cross-sectional view of a main part of a semiconductor device package formed by the above-described process.

In FIGS. 3 and 4, 9 is a semiconductor device, 10 is a terminal electrode formed on a predetermined portion of the semiconductor device 9, 11 is a protruding contact made of a conductive material, formed on the terminal electrode 10. Reference numeral 12 is a coating film formed by applying a conductive epoxy resin, 13 is a supporting substrate, 14 is a circuit board, 15 is a connecting electrode on the circuit board, and 16 is a transfer portion formed by transferring the conductive epoxy resin to the protruding contact 10. Is.

The outline of a conventional semiconductor device mounting method using the above-described conductive adhesive and its mounting body will be described below.

First, a conductive epoxy resin coating film 10 is formed on a support base 13, and the semiconductor device 9 is connected to the protruding contact 1 from above the support base 13 as shown in FIG.
1 is lowered and the two are brought into contact with each other.
Then, the tip of the protruding contact 11 of the semiconductor device 9 is brought into contact with the coating film 12 of the conductive epoxy resin formed on the support base 13 to transfer the conductive epoxy resin to the protruding contact 11.

After that, the semiconductor device 9 in which the transfer portion 16 of the conductive epoxy resin is attached on the protruding contact 11 is aligned with the connection electrode 15 on the circuit board 14 and stacked, and then the conductive epoxy resin is cured. As a result, as shown in FIG. 4, a mounting body of the semiconductor device 9 using the conductive epoxy resin is obtained.

[0009]

However, in the mounting method of the semiconductor device and the mounting body thereof as described above,
Since a conductive epoxy resin is used as a conductive adhesive,
There is a problem that the time required to cure the conductive epoxy resin after the semiconductor device 9 is loaded on the circuit board 14 is long, and the productivity of the package of the semiconductor device 9 is low. That is, in general, 150 is required to cure the conductive epoxy resin.
This is because heat of about ° C and time of 1 hour or more are required.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device mounting method and a semiconductor device capable of easily mounting the semiconductor device on a circuit board with high productivity. It is to provide the implementation body of.

[0011]

Means for Solving the Problems In order to achieve the above-mentioned object, the means taken by the present invention is such that a connecting electrode made of a thermoplastic resin-curable conductive material is formed on a circuit board, and a semiconductor device is projected. This is a technique of thermocompression bonding the contact to the connection electrode.

Specifically, the means taken by the invention of claim 1 is as follows.
As a semiconductor device mounting method for mounting a semiconductor device face down on a circuit board, a step of forming a protruding contact on a terminal electrode of the semiconductor device and a step of forming a semiconductor on the circuit board by using a thermoplastic resin-curable conductive material It is a method of providing a step of forming a connection electrode for device mounting and a step of bonding the semiconductor device and the circuit board by thermocompression bonding the protruding contact of the semiconductor device to the connection electrode of the circuit board.

The means taken by the invention of claim 2 is defined by claim 1.
In the invention, the step of forming the protruding contact on the terminal electrode of the semiconductor device is a method of forming the protruding contact by a plating method.

The means taken by the invention of claim 3 is the method of claim 1.
In the invention, the step of forming the protruding contact on the terminal electrode of the semiconductor device is a method of forming the protruding contact by a wire bonding method.

According to a fourth aspect of the present invention, in the first, second or third aspect of the present invention, a step of forming a wiring pattern on one portion of the circuit board using a sintered conductive material is provided. The step of forming the connection electrode on the circuit board is a method of forming the connection electrode made of a thermoplastic resin-curable conductive material on the wiring pattern formed in the step.

According to a fifth aspect of the present invention, in the means of the first, second or third aspect of the present invention, a step of forming a wiring pattern on one portion of the circuit board is provided by using a metal foil of a conductive material. The step of forming the connection electrode on the circuit board is a method of forming the connection electrode made of a thermoplastic resin-curable conductive material on the wiring pattern formed in the step.

According to a sixth aspect of the invention, in the method of the first, second, third, fourth or fifth aspect of the invention, in the step of joining the semiconductor device and the circuit board, the semiconductor device is connected to a connection electrode of the circuit board. It is a method of heating to a temperature equal to or higher than the temperature at which is plastic.

According to a seventh aspect of the invention, in the method of the first, second, third, fourth or fifth aspect of the invention, in the step of joining the semiconductor device and the circuit board, the connection electrode of the circuit board is in a plastic state. It is a method of heating to a temperature equal to or higher than that.

According to the invention of claim 8, in the invention of claim 1, 2, 3, 4, 5, 6 or 7, at least a thermoplastic resin is used as the thermoplastic resin-curable conductive material. This is a method of using a material containing a conductive filler.

The means provided by the invention of claim 9 is intended for a semiconductor device mounting body in which a semiconductor device is mounted face down on a circuit board. And a protruding contact formed of a conductive material on the terminal electrode of the semiconductor device,
A connection electrode made of a thermoplastic resin-curable conductive material formed at a predetermined portion of the circuit board is provided, and the protruding contact of the semiconductor device is fixed to the connection electrode of the circuit board by thermocompression bonding. It is a thing.

According to a tenth aspect of the present invention, in the invention of the ninth aspect, a wiring pattern made of a sintered conductive material is provided at a predetermined portion of the circuit board, and a connection electrode of the circuit board is provided. The wiring pattern is formed on the wiring pattern.

The means of implementing the invention of claim 11 is, in the invention of claim 9, provided with a wiring pattern formed of a metal foil of a conductive material, which is formed at a predetermined portion of the circuit board, and which is provided with connection electrodes of the circuit board. The wiring pattern is formed on the wiring pattern.

According to a twelfth aspect of the invention, in the invention of the ninth, tenth or eleventh aspect, the thermoplastic resin-curable conductive material constituting the connection electrode is at least a thermoplastic resin and a conductive filler. It is configured to include and.

[0024]

With the above method or apparatus, in the invention of claim 1, the protruding contact of the semiconductor device mounted face down is bonded to the connecting electrode of the circuit board made of the thermoplastic resin-curable conductive material by thermocompression bonding. Therefore, it does not require a long time for the reaction like bonding using thermosetting resin,
The thermoplastic resin is hardened only by cooling, and the mounting of the semiconductor device is completed in an extremely short time. Further, since the thermoplastic resin-curable conductive material is in a plastic state at a relatively low temperature, the thermal stress caused by the difference in thermal expansion coefficient between the semiconductor device and the circuit board can be suppressed to an extremely small level.

According to the second and third aspects of the present invention, the protruding contact of the semiconductor device is easily formed, and the adhesiveness between the protruding contact and the connection electrode of the circuit board made of the thermoplastic resin-curable conductive material becomes good. .

According to the invention of claim 4, the mounting method is suitable for a circuit board made of a material having high durability at high temperature such as ceramics, and reliability is improved.

According to the fifth aspect of the invention, the mounting method is suitable for the circuit board made of the resin material such as glass epoxy, and the manufacturing cost is reduced.

According to the sixth and seventh aspects of the invention, the thermoplastic conductive resin curable material forming the connection electrode can be easily maintained in a plastic state, and thermocompression bonding can be smoothly performed. At that time, it is possible to perform heating by using a tool for adsorbing the semiconductor device or a support member for the circuit board, and the structure of the device is simplified.

According to the invention of claim 8, the function required for the connection electrode is easily ensured by the conductive filler of the thermoplastic resin.

According to a ninth aspect of the present invention, in a semiconductor device package mounted face down, the semiconductor device is:
Since the structure is bonded to the circuit board by thermocompression bonding of the protruding contacts of the semiconductor device and the connection electrodes made of the thermoplastic resin-curable material of the circuit board, the time required for the mounting process is shortened and the productivity is improved. And the cost is reduced. Further, since the heating temperature in the mounting process is low, the thermal stress due to the difference in the coefficient of thermal expansion between the semiconductor device and the circuit board is suppressed to a very small level, and the reliability is improved.

According to the tenth aspect of the present invention, the circuit board can be made of a highly durable material such as ceramic, and the reliability of the semiconductor device package is improved.

According to the eleventh aspect of the present invention, the circuit board can be made of an inexpensive material such as glass epoxy and the manufacturing cost can be reduced.

[0033]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device mounting process according to an embodiment of the present invention and a resulting semiconductor device mounting body will be described below with reference to the drawings.

FIGS. 1A to 1C are process drawings for explaining a method of mounting a semiconductor device according to an embodiment, and FIG. 2 is a cross-sectional view of a main part of a semiconductor device mounting body manufactured by the mounting method of FIG. Is.

In FIGS. 1 and 2, 1 is a semiconductor device, 2 is a terminal electrode formed at a predetermined portion of the semiconductor device 1, 3 is a protruding contact formed on the terminal electrode 2, and 4 is a circuit board. Reference numeral 5 is a wiring pattern made of a sintered conductive material formed at a predetermined portion of the circuit board 4, 6 is a connecting electrode made of a thermoplastic resin-curable conductive material, and 7 is a thermocompression bonding tool. In this embodiment, as the thermoplastic resin-curable conductive material, a thermoplastic resin such as polyester resin containing a conductive filler such as Ag is used.

A method of mounting the semiconductor device configured as described above and a mounting body thereof will be described below with reference to the drawings.

First, as shown in FIG. 1A, a protruding contact 3 is formed on the terminal electrode 2 of the semiconductor device 1 by a known method. A plating method, a wire bonding method, or the like can be used to form the protruding contact 3. It is desirable that the protruding contact 3 has no oxide film on its surface, and Au is the most suitable material.

On the other hand, as shown in FIG. 1B, after the wiring pattern 5 is formed of the sintered conductive material on the circuit board 4 made of ceramic, the wiring pattern 5 of the sintered conductive material is formed. Then, the connection electrode 6 for mounting the semiconductor device, which is made of a thermoplastic resin-curable conductive material, is formed. A screen printing method, a transfer method, or the like can be used to form the connection electrode 6. When the circuit board 4 is made of a resin base material such as glass epoxy, the wiring pattern 5 formed on the circuit board 4 is formed by using a metal foil such as Cu,
The connection electrode 6 for mounting the semiconductor device may be formed by printing a thermoplastic resin-curable conductive material on it.

Next, as shown in FIG. 1C, the semiconductor device 1 is lowered from above the circuit board 4 while being adsorbed and held by the thermocompression bonding tool 7 from the back surface, and the protruding contacts 3 and the circuit of the semiconductor device 1 are connected. After the connection electrodes of the substrate 4 are aligned and brought into contact with each other, the semiconductor device 1 is pressed from the backside while being heated by the thermocompression bonding tool 7. At this time, by heating the resin-curable conductive material forming the connection electrode 6 to a temperature equal to or higher than a temperature at which the resin-curable conductive material is in a plastic state, the surface of the protruding contact 3 of the semiconductor device 1 is cured of the thermoplastic resin in a plastic state The mold conductive material adheres.

After that, when the thermocompression bonding tool 7 is separated from the semiconductor device 3, the thermoplastic resin-curable conductive material is cooled and hardened in a short time, and the two are joined. Then, as shown in FIG. 2, a mounting body of the semiconductor device 1 in which the protruding contacts 3 of the semiconductor device 1 and the connection electrodes 6 of the circuit board 4 made of a thermoplastic resin-curable conductive material are joined together Obtainable.

In the above embodiment, the connection electrode 6 for mounting the semiconductor device on the circuit board 4 is formed of the thermoplastic resin-curable conductive material, so that the semiconductor device 1 is mounted on the circuit board 4. At this time, unlike a thermosetting resin, it does not take a long time for the reaction, and upon cooling, the resin is rapidly cured to complete the joining. Therefore, a face-down semiconductor device package can be obtained with high productivity.

Further, in the above embodiment, since the semiconductor device 1 is mounted on the circuit board 4 by using the thermoplastic resin-curable conductive material, the difference in the thermal expansion coefficient between the semiconductor device 1 and the circuit board 4 is caused. The thermal stress generated can be suppressed to an extremely small level, and a highly reliable semiconductor device package can be obtained.

In the above embodiment, the semiconductor device 1 is heated by the thermocompression bonding tool 7 in the thermocompression bonding process when mounting the semiconductor device 1, but the present invention is not limited to this embodiment. is not. The thermocompression bonding may be performed, for example, in a state where the circuit board 4 is heated to the circuit board 4, or only the connection electrode 6 and its vicinity may be heated by irradiating infrared rays.

Further, in the above embodiment, as the thermoplastic resin-curable conductive material, a thermoplastic resin such as polyester resin containing a conductive filler such as Ag is used, but a resin-curable resin having thermoplasticity is used. Any conductive material may be used.

[0045]

As described above, according to the semiconductor device mounting method or the semiconductor device mounting body of the present invention, the protruding contacts of the semiconductor device are made of the thermoplastic resin-curable conductive material on the circuit board. Since it is bonded to the connection electrode for semiconductor mounting by thermocompression bonding, the time required for the mounting process can be shortened and the productivity of the mounted body of the semiconductor device can be improved.

Since the heating temperature for thermocompression bonding is relatively low, the thermal stress due to the difference in thermal expansion coefficient between the semiconductor device and the circuit board can be suppressed to an extremely small level.
Therefore, the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a state of a semiconductor device or the like in a mounting process of a semiconductor device according to an embodiment.

FIG. 2 is a partial cross-sectional view of a mounted body of a semiconductor device in an example.

FIG. 3 is a partial cross-sectional view showing a state when a conductive adhesive is transferred to a protruding contact of a semiconductor device in a conventional semiconductor device mounting method.

FIG. 4 is a partial cross-sectional view of a mounting body obtained by a conventional semiconductor device mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor device 2 terminal electrode 3 protruding contact 4 circuit board 5 wiring pattern 6 connection electrode 7 thermocompression bonding tool 9 semiconductor device 10 terminal electrode 11 protruding contact 12 coating film 13 supporting substrate 14 circuit board 15 connecting electrode 16 transfer part

Claims (12)

[Claims] 1. A semiconductor device mounting method for mounting a semiconductor device face down on a circuit board, comprising the steps of forming a protruding contact on a terminal electrode of the semiconductor device, and using a thermoplastic resin-curable conductive material. A step of forming a connection electrode for mounting a semiconductor device on the circuit board; and a step of bonding the semiconductor device and the circuit board by thermocompression bonding the protruding contact of the semiconductor device to the connection electrode of the circuit board. A method for mounting a semiconductor device, comprising: 2. The method for mounting a semiconductor device according to claim 1, wherein in the step of forming the protruding contact on the terminal electrode of the semiconductor device, the protruding contact is formed by a plating method. . 3. The method for mounting a semiconductor device according to claim 1, wherein in the step of forming the protruding contact on the terminal electrode of the semiconductor device, the protruding contact is formed by a wire bonding method. Method. 4. The method for mounting a semiconductor device according to claim 1, including a step of forming a wiring pattern on one portion of the circuit board by using a sintered conductive material. A method of mounting a semiconductor device, comprising: forming a connection electrode made of a thermoplastic resin-curable conductive material on the wiring pattern formed in the above step in the step of forming a connection electrode. 5. The method of mounting a semiconductor device according to claim 1, including a step of forming a wiring pattern on one portion of the circuit board by using a metal foil made of a conductive material. A method of mounting a semiconductor device, comprising: forming a connection electrode made of a thermoplastic resin-curable conductive material on the wiring pattern formed in the above step in the step of forming a connection electrode. 6. The method for mounting a semiconductor device according to claim 1, 2, 3, 4 or 5, wherein in the step of joining the semiconductor device and the circuit board, the connection electrode of the circuit board is in a plastic state. A method for mounting a semiconductor device, which comprises heating to a temperature equal to or higher than the above temperature. 7. The method for mounting a semiconductor device according to claim 1, 2, 3, 4 or 5, wherein in the step of joining the semiconductor device and the circuit board, the temperature of the circuit board is equal to or higher than a temperature at which the connection electrode is in a plastic state. A method for mounting a semiconductor device, which comprises heating the semiconductor device to the temperature of. 8. The method for mounting a semiconductor device according to claim 1, 2, 3, 4, 5, 6 or 7, wherein at least a thermoplastic resin and a conductive filler are used as the thermoplastic resin-curable conductive material. A method for mounting a semiconductor device, which comprises using a material containing: 9. A semiconductor device mounting body in which a semiconductor device is mounted face down on a circuit board, and a protruding contact made of a conductive material is formed on a terminal electrode of the semiconductor device, and a predetermined part of the circuit board. And a connecting electrode formed of a thermoplastic resin-curable conductive material, the protruding contact of the semiconductor device being fixed to the connecting electrode of the circuit board by thermocompression bonding. Implementation of. 10. The semiconductor device package according to claim 9, further comprising a wiring pattern formed at a predetermined portion of the circuit board and made of a sintered conductive material, wherein the connection electrode of the circuit board is the wiring pattern. A semiconductor device package characterized by being formed above. 11. The semiconductor device package according to claim 9, further comprising a wiring pattern formed at a predetermined portion of the circuit board and made of a metal foil of a conductive material, wherein the connection electrode of the circuit board is the wiring pattern. A semiconductor device package characterized by being formed above. 12. The semiconductor device package according to claim 9, 10 or 11, wherein the thermoplastic resin-curable conductive material forming the connection electrode includes at least a thermoplastic resin and a conductive filler. A semiconductor device package characterized by the above.