JPH07320842A - Method and structure for joining covered wire - Google Patents

Abstract

PURPOSE:To provide such a junction method that simplifies junction operation, improves mechanical strength, secures sufficient insulation performance by suppressing the range required for junction to narrow, and provides high flexibility. CONSTITUTION:Both covered wires W1, W2 are stacked at a connection part S by a junction method for two covered wires W1, W2 which are conductively connected to each other, the stacked connection part S is sandwiched by a pair of resin chips 53, 55, the covered parts 3 are melted, and conductive wire parts 1 of the both covered wires W1, W2 are conductively contacted at the connection part S by pressurization from the outside of the resin chips 53, 55. After that, a pair of resin chips 53, 55 are melted in each other so as to seal the connection part S.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining a covered electric wire and a joint structure for the covered electric wire when the covered electric wire is electrically connected to another member.

[0002]

2. Description of the Related Art As a mode of electrically connecting a covered electric wire W to another member, there are joining of the covered electric wire W and a terminal, joining of the covered electric wires W to each other, joining of the covered electric wire W and a connector, and the like.

Conventional methods for joining the covered electric wire to the terminal include crimping, pressure welding (see Japanese Utility Model Publication No. 60-37814), soldering, and ultrasonic welding (Japanese Patent Laid-Open No. 2-10609).
No. 2), etc. are known.

In the joining by crimping, as shown in FIGS. 25 and 26, the conductor caulking pieces 13 are provided upright on both sides of the connecting portion S of the terminal fitting 11 so as to face each other. 26 (a), the cover 3 is removed at the connecting portion S at the end of the covered electric wire W to expose the conductor wire portion 1 and then the conductor wire 1 is exposed as shown in FIG. The conductor crimping piece 13 is crimped as shown in b). Terminal fitting 11
The cover crimping piece 15 for increasing the mechanical connection strength.
And the conductor caulking piece 13 and the covering caulking piece 15 respectively connect the conductor wire portion 1 and the covering portion 3 to the terminal fitting 1
It is crimped to 1.

As shown in FIGS. 27 and 28, the joining by the pressure contact is performed by the pressure contact blade 19 provided at the connecting portion S of the pressure contact terminal 17.
By press-fitting the connection portion S of the covered electric wire W into the slot 21, the cover portion 3 is stripped off by the press contact blade 19, and the press contact blade 19 is brought into conductive contact with the conductor wire portion 1.

In joining by soldering or ultrasonic welding,
As shown in FIG. 29, the covering portion 3 is removed at the connecting portion S at the end of the covered electric wire W to expose the conductor wire portion 1, and the exposed conductor wire portion 1 is soldered to the connecting portion S of the terminal fitting 23. It is welded by ultrasonic welding to establish a conductive connection.

Further, as a conventional method for joining two covered electric wires W to each other, joining by a joint terminal, joining by thermocompression bonding (see Japanese Patent Laid-Open No. 3-1462), and the like are known.

In connection with a joint terminal, FIG.
As shown in (a), the covering portion 3 is covered by the connecting portion S of both covered electric wires W.
Is removed to expose the conductor wire portion 1, and as shown in FIG. 30B, the joint terminals 25 are crimped and crimped to the exposed conductor wire portions 1 to electrically connect both.

In the joining by thermocompression bonding, as shown in FIG. 30 (c), the covering portion 3 is removed at the connecting portion S of both covered electric wires W to expose the conductor wire portion 1 and the exposed conductor wire portions 1 to each other. Are overlapped and sandwiched between the electrodes 27 and 29, and the conductor wire portions 1 are thermocompression-bonded to each other by conducting current heating in a pressurized state to electrically connect them. As a method of heating the conductor wire portion 1, a method of utilizing frictional heat due to ultrasonic vibration is also known.

When the joint terminal 25 and the thermocompression bonding are used in this manner, in order to secure the insulation property at the connecting portion S, a tape or the like is provided on the outer periphery of the connecting portion S as shown in FIG. 30 (d). The insulating material 31 is wrapped around.

As a conventional method for joining the covered electric wire W and the connector, joining by ultrasonic welding is known (see Japanese Patent Application Laid-Open No. 4-61777).

In such joining, as shown in FIGS. 31 (a) and 31 (b), the lower mold 35 and the upper mold 37 which form the connector 33 are formed.
The groove 39 and the protrusion 41 that fits in the groove 39, and the connecting portion S of the covered electric wire W is superposed on the connecting portion S of the conductive connecting member 43 arranged in the groove 39 of the lower mold 35. The ridge 41 of the upper die 37 is fitted in the groove 39, and ultrasonic vibration is applied to the connecting portion S from the outside of the fitted upper and lower dies 37, 35 to melt the covering portion 3 of the covered electric wire W and to conduct the conductor. The line portion 1 and the conductive connection member 43 are brought into conductive contact with each other.

[0013]

However, the covered electric wire W
If the connection between the terminal and the terminal is performed by crimping, soldering, or ultrasonic welding, it is necessary to remove the covering portion 3 of the covered electric wire W to expose the conductor wire portion 1 in advance, which complicates the work. On the other hand, in the joining by pressure welding, the removal of the covering portion 3 is not necessary, but the mechanical strength of the connecting portion S is unavoidably lowered as compared with the crimping or soldering, which simplifies the joining work and reduces the mechanical strength. It was difficult to achieve both improvement and improvement.

Further, if the two covered electric wires W are joined by the joint terminal 25 or thermocompression bonding, the covering portion 3 needs to be removed similarly to the above, which makes the work complicated. Also,
In order to easily perform the work of caulking and thermocompression bonding of the joint terminal 25, it is necessary to set the range L for removing the covering portion 3 to a certain length, and the winding of the insulating material 31 is the range where the covering portion 3 is removed. Since it needs to be performed longer than L, the winding range of the insulating material 31 becomes larger than that of the contact portion between the conductor wire portions 1, the flexibility of the covered electric wire W is impaired, and the degree of freedom in wiring is reduced. I was afraid to end up. Further, in the thermocompression bonding, the mechanical strength of the connection portion S was unavoidably lower than that of the joint terminal 25.

When the covered electric wire W and the connector 33 are joined by ultrasonic welding shown in FIG. 31, the lower mold 3 is used.
5 and the upper mold 37, the connector 33 having a special shape in which the groove 39 and the protrusion 41 are provided is not necessarily applicable to all connectors, and the covered electric wire W and the terminal are joined or the covered electric wire. There is a disadvantage that it cannot be easily applied to joining Ws and lacks versatility.

Therefore, in consideration of the above circumstances, the present invention can achieve both simplification of the joining work and improvement of the mechanical strength, and keep the range required for the joining narrow to ensure sufficient insulation. With the object of providing a method for joining a covered electric wire and a joint structure for a covered electric wire, which can be applied to various kinds of joining such as joining of the covered electric wire and the terminal or joining of the covered electric wires, and having high versatility. To do.

[0017]

According to a first aspect of the present invention, at least one of the members that are electrically connected to each other is a covered electric wire in which the outer circumference of the conductor wire portion is covered with a resin covering portion. A method for stacking both members at a connecting portion and sandwiching the stacked connecting portion with a pair of resin chips
And the step of melting the coating portion, and after bringing the two members into conductive contact at the connection portion by pressing from the outside of the resin chip, the pair of resin chips are welded to each other to form the connection portion. And a second step of sealing.

A second aspect of the present invention is the method for joining covered electric wires according to the first aspect, wherein in the second step,
It is characterized in that a molten resin chip is filled between core wires of adjacent conductor wire portions except for the connection portion.

The invention according to claim 3 is the method for joining the covered electric wire according to claim 1 or 2, wherein
In the step of, the connecting portion is sandwiched by a pair of resin chips provided with a brazing filler metal on at least one side, and in the second step, the brazing filler metal is melted by heat generated when the resin chip melts, and the conductive contact is made. Both members are brazed at the connected portion.

A fourth aspect of the present invention is the method for joining a covered electric wire according to the third aspect, wherein the brazing material is embedded inside a resin chip.

According to a fifth aspect of the present invention, there is provided a joint structure for a covered electric wire, wherein at least one of the members electrically connected to each other is a covered electric wire in which the outer circumference of the conductor wire portion is covered with a resin covering portion. The conductor wire portion of the covered electric wire is exposed at the connecting portion where both members are overlapped to bring the both members into conductive contact,
The connection part is sealed with a resin material.

According to a sixth aspect of the present invention, there is provided a covered electric wire joining structure according to the fifth aspect, wherein a resin material is filled between core wires of adjacent conductor wire portions excluding the connection portion. To do.

The invention described in claim 7 is the joint structure of the covered electric wire according to claim 5 or 6, wherein the both members are brazed at the connecting portion which is in conductive contact. To do.

The invention according to claim 8 is the method for joining the covered electric wire according to any one of claims 1 to 4, wherein:
In the second step, the pair of resin chips are sandwiched from above and below in the stacking direction of the both members, and the connecting portion is pressed and vibrated between the horn and anvil from the outside of the resin chips,
The direction of pressurization and vibration is the stacking direction of both members.

The invention described in claim 9 is the method for joining a covered electric wire according to any one of claims 1 to 4,
In the second step, the pair of resin chips are sandwiched from above and below in the stacking direction of the both members, and the connecting portion is pressed and vibrated between the horn and anvil from the outside of the resin chips,
The pressing direction is the stacking direction of the two members, and the vibration has a vibration component in the stacking direction and a vibration component in a direction orthogonal to the stacking direction.

According to a tenth aspect of the present invention, in the joint structure of the covered electric wire according to any one of the fifth, sixth and seventh aspects, the resin material is a transparent body. Characterize.

The invention according to claim 11 is the joint structure for a covered electric wire according to any one of claims 5, 6, 7, or 10, wherein the covered electric wire is in the form of a sheet. Is a flat cable in which a plurality of conductor wire portions are arranged side by side in a resin covering portion.

[0028]

According to the invention described in claim 1, in the state where both members are overlapped at the connection portion and the overlapped connection portion is sandwiched by the pair of resin chips, the covering portion is scattered and melted, and pressure is applied from the outside of the resin chip. As a result, both members can be brought into conductive contact with each other at the connecting portion, so there is no need to remove the covering portion in advance,
Both members can be electrically connected by a simple operation.

Further, after the two members are brought into conductive contact with each other at the connection portion, the pair of resin chips are welded to each other to seal the connection portion. Therefore, the resin chip which is welded and cured has high mechanical strength at the connection portion. Is obtained.

Further, since the pair of resin chips has a size and shape capable of sandwiching a connecting portion which is in conductive contact with each other from above and below, the range required for joining can be suppressed narrow, and the connecting portion is sealed by the resin chip. Therefore, sufficient insulation can be secured.

Further, such a joining method is a relatively simple method in which the overlapped connecting portion is sandwiched by a pair of resin chips, the covering portion is melted, and pressure is applied from the outside of the resin chip. Since the shape or the like of the other member to be used is not particularly limited, it can be easily applied to various joining such as joining of the coated electric wire and the terminal or joining of the coated electric wires, and high versatility is obtained.

According to the second aspect of the invention, in addition to the effect of the first aspect of the invention, in the second step, the molten resin chips are filled between the core wires of the conductor wire portions adjacent to each other except the connecting portion. The voids formed between the core wires of the covered electric wire are blocked by the hardened resin chip, so that the water blocking effect can be obtained inside the covered electric wire.

According to the invention described in claim 3, in addition to the function of the invention described in claim 1 or 2, in the second step, a resin chip provided with a brazing material is used, and the resin chip is melted. Since the brazing material is melted by the heat generated at the time of welding and both members are brazed at the connecting portion which is in conductive contact, a particularly high brazing work is not required, and a much higher mechanical strength can be obtained at the connecting portion.

According to the invention of claim 4, claim 3
In addition to the action of the invention described, since the brazing filler metal is embedded in the resin chip, in the second step, the covering portion is scattered and melted so that both members are in conductive contact, and after the connecting portion is covered with the resin chip, The brazing material is exposed and melts inside the resin chip. Therefore, it is possible to properly braze the connecting portion that is in conductive contact, and to reliably prevent the brazing material from flowing out from the resin chip.

According to the fifth aspect of the invention, since the conductor wire portion of the covered electric wire is exposed at the connecting portion where the both members are overlapped, the both members are brought into conductive contact with each other, and the connecting portion is sealed with the resin material, the resin is cured. The resin material provides high mechanical strength at the connection.

Further, since the resin material has a size and shape capable of sealing the connection portion in conductive contact, the range required for joining can be narrowed, and the connection portion is sealed by the resin material, which is sufficient. Insulation can be secured.

Further, since such a joint structure does not particularly limit the shape or the like of the other member for conducting and connecting the covered electric wire, it can be used for various kinds of joining such as joining of the covered electric wire and terminal or joining of the covered electric wires. Can be easily applied,
High versatility can be obtained.

According to the invention of claim 6, in addition to the function of the invention of claim 5, since the resin material is filled between the core wires of the conductor wire portions adjacent to each other except the connecting portion, the resin wire is formed between the core wires of the covered electric wire. The voids are blocked by the resin material, and a waterproof effect can be obtained inside the covered electric wire.

According to the invention described in claim 7, in addition to the function of the invention described in claim 5 or 6, since the connecting portion is brazed, higher electrical performance can be obtained at the connecting portion.

According to the eighth aspect of the present invention, the pair of resin chips are sandwiched from above and below in the stacking direction of both members, and when the connection portion is pressed and vibrated between the horn and the anvil from the outside of the resin chip, the resin chip and the coating are covered. Since the parts melt, both members come into conductive contact at the connection part and the resin chips are welded together,
With such a simple method, the same operation as that of the invention according to any one of claims 1 to 4 can be obtained.

Further, since the pressing direction of the resin chip is the stacking direction of both members, the molten coating part is extruded from the center side of the resin chip toward the outside when the connecting part is pressed, and the conductor wire part is formed. A better exposure and a reliable conductive contact state can be obtained.

Further, since the direction of vibration to the connecting portion is the same as the pressurizing direction, the two members are superposed on each other, so that a good welded state of the resin chip can be obtained, and the covering portion is provided from the center side of the resin chip. The action of pushing outward is enhanced.

According to the ninth aspect of the present invention, the pair of resin chips are sandwiched from above and below in the stacking direction of both members, and when the connecting portion is pressed and vibrated between the horn and the anvil from the outside of the resin chip, the resin chip and the coating are applied. Since the parts melt, both members come into conductive contact at the connection part and the resin chips are welded together,
With such a simple method, the same operation as that of the invention according to any one of claims 1 to 4 can be obtained.

Further, since the pressing direction of the resin chip is the stacking direction of both members, the molten coating part is extruded from the center side of the resin chip toward the outside when the connecting part is pressed, and the conductor wire part is formed. A better exposure and a reliable conductive contact state can be obtained.

Further, since the vibration applied to the connecting portion has a vibration component in the stacking direction and a vibration component in the direction orthogonal to the stacking direction, the resin chip is well welded by the vibration component in the stacking direction. While the state is obtained, the action of pushing the covering portion outward from the center side of the resin chip is increased, and the vibrational component orthogonal to the stacking direction expands the metallic joining of both members at the connecting portion.

According to the tenth aspect of the invention, in addition to the effect of the fifth, sixth or seventh aspect of the invention, since the resin material is a transparent body, a conductive contact state or brazing of the conductor wire portion is possible. The state can be seen from the outside of the resin material.

In the eleventh aspect of the present invention, even when a flat cable having a plurality of conductor wire portions arranged side by side in a sheet-shaped resin coating portion is electrically connected to another member, the fifth and fifth aspects are also provided. It is possible to obtain the same effect as that of the invention of claim 6, claim 7, or claim 10, and further increase versatility.

[0048]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment according to the invention described in claim 1, claim 5, claim 8 or claim 10 will be described below with reference to the drawings.

1 and 2 are perspective views showing a means for obtaining a joint structure of a covered electric wire according to the first embodiment. FIG. 1 shows a state before the start of joining, and FIG. 2 shows a state after the start of joining. Shows. FIG. 3 is a schematic view showing a cross section of the main part as viewed from the direction A in FIG. 2, (a) shows a state immediately after the start of joining, and (b).
Indicates the state after joining.

As shown in FIG. 1, in the first embodiment, two covered electric wires W1 and W2 in which the outer circumference of the conductor wire portion 1 is covered with a resin covering portion 3 are joined at their intermediate connecting portions S. The two covered electric wires W1 and W2 are members which are electrically connected to each other.

First, the coated electric wire W1 according to the first embodiment,
A method of joining W2 will be described. Two covered electric wires W1
, W2, a pair of resin chips 53, 55 as a resin material 51 and a horn 57 for generating ultrasonic vibration.
And the covered electric wires W1 and W2 and the resin chip 53,
An anvil 59 that supports 55 is used. Anvil 59
Includes a base 61 and a support portion 63 protruding from the base 61, and the support portion 63 is formed in a substantially cylindrical shape. The support portion 63 has an inner diameter portion 65 that is open on the side opposite to the base side (upper side in the drawing), and a pair of two groove portions facing each other with the center of the inner diameter portion 65 interposed therebetween are provided on the peripheral wall 63a of the support portion 63. 67 and 69 intersect, and two sets (intersecting at about 90 °) are provided. The four groove portions 67 and 69 are opened on the same side as the inner diameter portion 65 and are formed along the protruding direction of the support portion 63, and the opposing groove portions 67 and 69 communicate with each other through the inner diameter portion 65. ing. The pair of resin chips 53, 55 are formed in a circular plate shape having an outer diameter slightly smaller than the inner diameter portion 65 of the anvil 59, and the end surface 71a of the head 71 of the horn 57 is almost the same as the resin chips 53, 55. Alternatively, it is formed in a circular shape having a slightly smaller outer diameter. The resin chips 53 and 55 are made of acrylic resin, ABS (acrylonitrile-
Examples thereof include butadiene-styrene copolymer) -based resin, PC (polycarbonate) -based resin, PVC (polyvinyl chloride) -based resin, PE (polyethylene) -based resin, and the like.

In order to join the two covered electric wires W1 and W2, the covered electric wires W1 and W2 are overlapped at the connecting portion S, and the overlapped connecting portion S is sandwiched between the pair of resin chips 53 and 55 from above and below.
Specifically, one side (lower side) of the inner diameter portion 65 of the anvil 59
Of the resin chip 55, one of the covered electric wires W1 is inserted into the groove portion 67 facing the other one from above, and the other covered electric wire W2 is inserted from above to the groove portion 69 facing the other.
, And finally the other (upper) resin chip 53 is inserted. Both of the covered electric wires W1 and W2 are arranged so that the respective connecting portions S intersect at the center of the inner diameter portion 65, whereby
As shown in FIG. 3A, the connecting portion S is sandwiched between the upper and lower resin chips 53 and 55 substantially at the center thereof from above and below in the stacking direction.

Next, the covering portion 3 of the connecting portion S is scattered and melted, and the conductor wire portions 1 of both covered electric wires W1 and W2 are conductively contacted at the connecting portion S by the pressure from the outside of the resin chips 53 and 55. After that, the pair of resin chips 53 and 55 are welded to each other to seal the connection portion S.

Specifically, the head 71 of the horn 57 is inserted from above the uppermost (other) resin chip 53 that is finally inserted, and the connecting portion S is provided from the outside of the upper and lower resin chips 53 and 55. Pressure and vibration are applied between 57 and anvil 59. The pressure applied to the connecting portion S is performed by pressing the horn 57 toward the anvil 59, and the direction of the pressure coincides with the stacking direction of both covered electric wires.

Further, when the resin materials 51 are welded together by ultrasonic vibration, it is best to apply vibration in a direction intersecting the joining surface of the resin materials 51 substantially perpendicularly to obtain a welded state. The direction of vibration to the resin chips 53,
55 is set in a direction intersecting with the surfaces 53a, 55a facing each other, that is, in a direction coinciding with the stacking direction of the covered electric wires W1, W2 (direction of arrow X in the figure), so that so-called longitudinal vibration is generated from the horn 57. Sent.

When the connecting portion S is pressurized and vibrated in such a state, the covering portion 3 is melted first, and the conductor wire portion 1 of both covered electric wires W1 and W2 is connected to the connecting portion S between the resin chips 53 and 55. To expose. At this time, since the connecting portion S is pressed from above and below, the melted covering portion 3 is extruded outward from the center side of the resin chips 53 and 55, so that the conductor wire portion 1 is better exposed. Surely makes a conductive contact. Also, the direction of vibration applied to the connecting portion S is the same as that of the pressurizing direction.
Since W2 is set in the stacking direction, the action of pushing the covering portion 3 outward from the center side of the resin chips 53, 55 is enhanced.

When the pressurization and the vibration of the connecting portion S are continued even after the covering portion 3 is melted, the resin chips 53, 55 are melted and the surfaces of the resin chips 53, 55 facing each other (the upper resin chip 53). Lower surface 53a and upper surface 55a of lower resin chip 55)
And the resin chips 53 and 55 are welded to the outer peripheral surface of the covering portion 3 adjacent to the conductor wire portion 1 in conductive contact. As a result, the area around the conductor wire portion 1 that is in conductive contact is covered with the resin chips 53 and 55.

After the resin chips 53 and 55 are melted, the pressure and vibration applied by the horn 57 are stopped, the covering portion 3 and the resin chips 53 and 55 are cured, and the joining operation is completed.

Next, the joining structure of the covered electric wire of the first embodiment obtained by the joining method will be described. FIG. 4 is a perspective view showing a joint structure of the covered electric wire according to the first embodiment,
(A) shows the external appearance, and (b) shows the internal structure.

As shown in FIG. 7A, this joint structure has a structure in which two covered electric wires W1 and W2 intersect at a connection portion S inside a resin material 51 composed of a pair of resin chips 53 and 55. At the connecting portion S, the conductor wire portions 1 of both covered electric wires W1 and W2 are exposed and are in conductive contact. The covering portion 3 adjacent to the conductor wire portion 1 in conductive contact is welded to the resin material 51, so that the circumference of the conductor wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed with the resin material 51. ing.

Next, the relationship between the material of the resin chips 53 and 55 and the conductivity will be described.

The conductivity is determined by preparing a plurality of samples having the above-mentioned junction structure for each material, determining the contact resistance (initial resistance) R for each sample, and determining the average value and the magnitude of the variation.

Regarding the conduction stability, the coated electric wires W1 and W for each sample as shown in FIG.
2 connection part S (resin material 51) is hit hard,
As shown in (b), the covered wire W1, W2 is grasped and shaken, so that the contact resistance after the covered wire W1, W2 and the connecting part S is impacted (post-impact resistance).
Ra is determined, and this value is compared with the initial resistance R.
The smaller the difference between the initial resistance R and the post-impact resistance Ra, the better the conduction stability can be judged to be. Initial resistance R and after impact resistance Ra, the following equation is calculated according to _{R = R 0 -r × (x} + y) Ra = Ra 0 -r × (x + y). R ₀ and Ra ₀ in the _equation are the actual resistance values (measured values), r, measured at the ends p and q of the covered electric wires W1 and W2 separated from the connecting portion S as shown in FIG.
Is the conductor resistance per unit length of the conductor wire used (CAVS 0.5 sg) (3.27 m per 100 mm)
Ω), x + y is the total wire length from the connection portion S to the ends p and q of the covered electric wires W1 and W2 as shown in FIG. The resin chips 53, 55 are made of acrylic resin,
Five types of PC resin, ABS resin, PE resin, and PVC resin are used.

According to these results, the acrylic resin has a low contact resistance as a whole, the variation between the samples is extremely small, and the differences before and after the impact are all extremely small and 1 mΩ or less and stable. It can be seen that the condition is good and stable.

Among the other four types, the PC resin has a good conductive state and is stable similarly to the acrylic resin. In other cases, the ABS resin is inferior to the acrylic resin and the PC resin in characteristics. The variation is the smallest, the change before and after the impact is small, and the conduction state is good and stable. Further, among the above five types, the PE-based resin has a high average value of contact resistance, a large variation, and the worst conductive state.

Comparing the melting states of the five types of resin materials, the acrylic resin is most likely to transmit ultrasonic vibrations, and the lower resin chip 55 is vibrated in the same manner as the upper resin chip 53. The resin chips 53 and 55 are crushed to almost the same extent. On the other hand, in the other three types of resins, the upper and lower resin chips 53 and 55 are not uniformly crushed, and the upper resin chip 53 is crushed more than the lower resin chip 55. Further, in the upper resin chip 53, the upper surface 53b in contact with the horn 57 is crushed more than the lower surface 53a joined to the lower resin chip 55.

PE resin is used for the upper and lower resin chips 53, 5
5, the resin material 51 crushed from between the lower surfaces 53a and 53b and the upper surface facing each other.

The ABS resin and the PVC resin are crushed by the resin material 51 protruding like a burr on the upper surface 53b of the upper resin chip 53 which comes into contact with the horn 57.

From this, it is understood that the upper and lower resin chips 53 and 55 are crushed best by the acrylic resin, and the acrylic resin is also excellent in terms of appearance and insulation.

When the above results are summed up, practicality is recognized for all resins in terms of electrical conductivity and electrical stability, but acrylic resin and PC resin are particularly suitable, including appearance and insulation. Then, it turns out that ABS resin is suitable.

Next, the relationship between the welding height and conductivity, and the relationship between the welding height and mechanical strength will be described. Here, the welding height refers to the entire height in the stacking direction of the upper and lower welded resin chips.

The conductivity is determined by preparing 20 samples each having the above-mentioned junction structure and different welding heights, determining the contact resistance for each sample, and determining the average value and the magnitude of the variation. The specific method of calculating the contact resistance is the same as the method of calculating the initial resistance R.

Similarly, the mechanical strength is determined by preparing 10 samples each having different welding heights, subjecting each sample to a rupture test to determine the adhesion strength, and judging the magnitude of the average value.

The welding height is not changed by changing the setting of the vibration time by ultrasonic vibration, but by the method of stopping the transmission of ultrasonic vibration when the prescribed welding height is reached.
2.9mm, 3.1mm, 3.3mm, 3.4mm, 3.5mm,
Eight types of samples of 3.6 mm, 3.7 mm and 3.8 mm were prepared. As other conditions, the pressure (welding pressure) for pressing the horn is 1 kg / cm ² , the resin chip is an acrylic resin, the circular plate with a diameter of 5 mm and the thickness is 2 mm, and the coated wire is C.
AVVS-0.5sq, and the line length L ₀ shown in FIG.
The wire resistance is 20 mm and the wire resistance is 2 mΩ.

FIG. 7 is a table showing the results of obtaining the fixing force for each welding height of the acrylic resin, and FIG. 8 is a graph showing the results of the average fixing force for each welding height. In addition, among the values in FIG. 7, those with a mark before the numerical value indicate that the conductor wire portion 1 is pulled out from the connecting portion S and is broken, and those with a blank before the numerical value are outside. The exposed coated wires W1 and W2 are shown to be broken. The values in the bottom column show standard deviations.

From this result, it is understood that even if the welding height is different, almost the same fixing force is obtained, the value is high, and sufficient mechanical strength is obtained.

As described above, according to the joining method of the first embodiment, the covered electric wires W1 and W2 are overlapped at the connecting portion S, and the connecting portion S is made into a pair of resin chips 53,5.
In the state of being sandwiched by 5, the covered electric wires W1 and W2 can be brought into conductive contact at the connecting portion S only by spraying and melting the covered portion 3 while applying pressure from the outside of the resin chips 53 and 55. It is not necessary to remove the covering portion 3 in advance, and the conductive connection can be obtained by a simple operation.

According to this joining method and joining structure, after the covered electric wires W1 and W2 are brought into conductive contact at the connecting portion S, the upper and lower resin chips 53 and 55 are welded to each other to seal the connecting portion S. Therefore, the resin chip 5 that was welded and hardened
Due to 3,55, high mechanical strength can be obtained in the connection portion S.

Further, since the resin chips 53 and 55 have a size and shape capable of sandwiching the connecting portion S, which is in conductive contact, from the vertical direction, the range required for joining can be narrowed, and the connecting portion S has a resin chip. Since it is sealed by 53 and 55, sufficient insulation can be secured.

Therefore, due to the high mechanical strength and sufficient insulation, the current-carrying characteristics between the covered wires W1 and W2 at the connection portion S can be stabilized.

In addition, such a joining method is performed by stacking the connecting portions S
Is sandwiched between the resin chips 53 and 55,
Is a relatively simple method of pressurizing and vibrating the connecting portion S between the horn 57 and the anvil 59 from the outside, and such a joining method and joining structure is for a counterpart to be conductively connected to one covered electric wire W1. The shape of the member (the other covered electric wire W2 in this embodiment) is not particularly limited, so that it can be easily applied to various kinds of joining such as joining of the covered electric wires W1 and W2 and terminals, and is highly versatile. Sex is obtained.

Further, the pair of resin chips 53 and 55 are sandwiched from above and below in the stacking direction of the covered electric wires W1 and W2, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from the outside of the resin chips 53 and 55. However, the pressing direction is covered wire W
Since 1 and W2 are in the stacking direction, when pressurizing the connecting part S,
The molten coating portion 3 is extruded from the center side of the resin chips 53, 55 toward the outside, so that the conductor wire portion 1 is better exposed and a reliable conductive contact state is obtained. Further, the vibration direction to the connecting portion S is also the same as the pressurizing direction in the overlapping direction of the coated electric wires W1 and W2, so that a good welding state of the resin chips 53 and 55 can be obtained and the covering portion 3 is pushed. The action to put out is increased.

Further, in the first embodiment, by making the resin material 51 a transparent body, the conductive contact state of the conductor wire portion 1 can be seen from the outside of the resin material 51, which facilitates quality control and The quality can be improved.

Next, a second embodiment according to the invention described in claim 2 or claim 6 will be described.

FIG. 9 is a cross-sectional view of an essential part showing a portion adjacent to the connection portion of the covered electric wire of the second embodiment, and FIG. 9A shows a state before joining (cross section P-P in FIG. 3). (B) shows the state after bonding (Q-Q cross section in FIG. 3). The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the second embodiment, basically, the covered electric wire is joined by substantially the same method as in the first embodiment, but as shown in FIG. 3, the connecting portion S is sandwiched between the resin chips 53 and 55. At the time of welding, in the conductor wire portions 1 adjacent to each other except the connection portion S, as shown in FIG. 9B, between the plurality of core wires 1 a forming the conductor wire portion 1, the molten resin chip 5 is formed.
3,55 are filled. As the resin chips 53 and 55, those having a relatively low viscosity at the time of melting are used so that the core wires 1a can be easily filled.

According to the second embodiment, in addition to the actions and effects of the first embodiment, as shown in FIG. 9A, the covered electric wire W1
, W2 between the coating portion 3 and the core wire 1a and between the core wire 1a, the voids C are formed of resin material 51 as shown in FIG. 9 (b).
Since it is buried and cut off, the water blocking effect can be obtained inside the covered electric wires W1 and W2. As a result, for example, one end side of the covered electric wires W1 and W2 is connected to a part requiring waterproofing (waterproof part), and the other end is connected to a part not functionally requiring waterproofing (non-waterproof part). In this case, due to the current state of the capillary tube, water or the like flows into the covered electric wires W1 and W2 from the other end side, and the covered electric wires W1
, W2, even if it flows through the inside of W2, the water-blocking effect prevents the outflow of water or the like to one end side. Therefore, it is possible to secure the waterproofness of the one end side without providing the other end side with a waterproof structure. it can. That is, when both ends of the covered electric wires W1 and W2 are connected to the waterproof part and the non-waterproof part, the waterproof property of the waterproof part is ensured by a simple and inexpensive method and structure without forming the waterproof part in the non-waterproof part. can do.

Next, a third embodiment of the invention according to claim 9 will be described.

FIG. 10 is a sectional view of an essential part showing a means for obtaining the method of joining the covered electric wires according to the third embodiment. The same parts as those in the first embodiment are designated by the same reference numerals and their description will be omitted. Omit it.

As shown in FIG. 10, the third embodiment is similar to the first embodiment in the vertical direction from the horn 57 (the arrow X direction in the drawing).
The ultrasonic vibration is transmitted to the anvil 95, and further the ultrasonic vibration is transmitted from the anvil 95 having substantially the same shape as the anvil 59 of the first embodiment (see FIG. 3) in the lateral direction (arrow Y direction in the figure). It is a thing. That is, the connecting portion S of the coated electric wires W1 and W2 has a vibration component in the longitudinal direction (X direction in the drawing) that coincides with the stacking direction of the coated electric wires W1 and W2 by the horn 57,
It is three-dimensionally excited by the vibration component in the lateral direction (Y direction in the drawing) orthogonal to the stacking direction by the anvil 95.

According to the third embodiment, the vibration component in the vertical direction makes the welded state between the resin chips 53 and 55 good as in the first embodiment, and the covering portion 3 is covered with the resin chips 53 and 55. The action of pushing out from the center side of 55 is increased.

In addition, when metals are joined together by ultrasonic vibration, it is most easy to excite them in the direction along the joint surface. The line parts 1 are joined to each other in an expanded range.
Therefore, even when the coated electric wires W1 and W2 are used in a harsh environment such as being strongly pulled, it is possible to maintain good conduction characteristics at the connection portion S.

Further, since the metallic connection of the conductor wire portion 1 is expanded, the heat generation at the connecting portion S can be suppressed to be low when the covered electric wires W1 and W2 are conducted. As a result, even when a relatively inexpensive resin material is used, the same action and effect as when an expensive resin material having excellent heat resistance is used can be obtained, and the product cost can be kept low.

FIG. 11 shows a modified example of the third embodiment. Instead of the anvil 95 (see FIG. 10) of the third embodiment, a vibration component in the vertical direction (direction of arrow X in the drawing). And an anvil 97 for transmitting vibration in an oblique direction (direction of arrow Z in the figure) composed of a vibration component in the horizontal direction (direction of arrow Y in the figure), and a function of pressing the connecting portion S without transmitting the vibration. It is provided with a horn 99 having only one. That is, the transmission of the anvil 97 causes the connecting portion S to be vibrated by the vibration component in the vertical direction and the vibration component in the horizontal direction as in the third embodiment.

According to this modification, the same operation and effect as those of the third embodiment can be obtained by transmitting only the anvil 97, and the apparatus can be simplified.

Next, a fourth embodiment of the invention according to claims 3 and 7 will be described.

FIG. 12 is a perspective view showing means for obtaining the joint structure of the covered electric wire according to the fourth embodiment. FIG. 13 is a cross-sectional view of an essential part showing the state after the start of joining in FIG. 12, (a) shows the state immediately after the start of joining, and (b) shows the state after joining. FIG. 14 (a) is a perspective view showing a partial cross section of a resin chip of the fourth embodiment, and FIG. 14 (b) is a perspective view showing a partial cross section of a joint structure of a covered electric wire of the fourth embodiment. . The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 12 and 13, in the fourth embodiment, the resin chips 51 and 53 have solder 93 as a brazing material.
When the connection portion S is sandwiched between the resin chips 51 and 53 to be joined, the conductor wire portions 1 of the two covered electric wires W1 and W2 are brazed to each other by the solder 93 inside the resin material 51.

The method of joining the covered electric wires according to the fourth embodiment is substantially the same as that of the first embodiment except that the resin chips 53 and 55 are provided with the circular plate-shaped solder 93. 14
(A) shows the lower resin chip 55, and the solder 93 has substantially the center of the upper surface 55a of the resin chip 55 so that its circular upper surface 93a is substantially flush with the upper surface 55a of the resin chip 55a. It is in a state of being fitted into.
Further, as in the upper surface 55a of the lower resin chip 55, the solder 93 is fitted in substantially the center of the lower surface 53a of the upper resin chip 53.

Specifically, similar to the first embodiment, FIG.
As shown in (a), the resin chips 53 and 55 are attached to the anvil 5.
It is inserted into the inner diameter portion 65 of 9 and the connecting portion S in which the two covered electric wires W1 and W2 are overlapped is sandwiched by the resin chips 53 and 55 from above and below. As a result, the connecting portion S is provided with the upper and lower resin chips 5
It is sandwiched between 3,55 solders 93.

Next, the connecting portion S is connected to the upper and lower resin chips 5
Pressure and vibration are applied between the horn 57 and the anvil 59 from the outside of 3,55. As a result, as shown in FIG. 13B, the conductor wire portion 1 of both covered electric wires W1 and W2 becomes the resin chip 53,
It is exposed at the connecting portion S between 55, and both are in conductive contact.

When the pressure and vibration of the connecting portion S are further continued, the resin chips 53 and 55 are melted and both resin chips 5 are melted.
3, 55 facing each other (the lower surface 5 of the upper resin chip 53)
3a and the upper surface 55a) of the lower resin chip 55 are welded together, and the outer peripheral surface of the covering portion 3 adjacent to the conductor wire portion 1 in conductive contact with the resin chips 53, 55 are welded together and in conductive contact with each other. The area around 1 is covered with the resin chips 53 and 55.

Further, the heat generated when the resin chips 53 and 55 are melted causes the solder 9 provided on the resin chips 53 and 55.
3 is melted, and the conductor wire portions 1 of the covered electric wires W1 and W2 that are in conductive contact with each other are brazed to each other at the connection portion S in the resin chips 53 and 55.

After the resin chips 53 and 55 are melted, the pressurization and vibration by the horn 57 are stopped, the covering portion 3, the resin chips 53 and 55 and the solder 93 are hardened, and the joining work is completed.

Next, the joint structure of the covered electric wire of the fourth embodiment obtained by the above joining method will be described.

As shown in FIG. 14 (b), in this joint structure, two covered electric wires W1 and W2 are crossed at a connecting portion S inside a resin material 51 consisting of a pair of resin chips 53 and 55. At the connecting portion S, the conductor wire portions 1 of both the covered electric wires W1 and W2 are exposed and brought into conductive contact, and the contact portions are brazed with solder 93. The covering portion 3 adjacent to the conductor wire portion 1 in conductive contact is welded to the resin material 51, so that the circumference of the conductor wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed with the resin material 51. ing.

According to this joining method and joining structure, in addition to the same effects as in the first embodiment, the conductor wire portions 1 of both covered wires W1 and W2 are brazed at the connection portion S, so that the connection portion It is possible to obtain much higher electrical performance in S,
The current-carrying characteristics can be further stabilized.

Also, solder 93 is attached to the resin chips 53 and 55.
Is provided and the heat generated when the resin chips 53 and 55 are fused to each other is used to braze the conductor wire portions 1 to each other. Therefore, the brazing work is not particularly required, and the resin chip 53 provided with the solder 93 is provided. , 55, the electrical performance of the connection S can be improved.

Further, by making the resin material 51 a transparent body, in addition to the conductive contact state of the conductor wire portions 1, the brazing state of the conductor wire portions 1 can be seen from the outside of the resin material 51.

Further, similar to the second embodiment (see FIG. 9), the adjacent conductor wire portions 1 except the brazed connection portion S are provided.
By filling the melted resin chips 53, 55 between the core wires 1a, it is possible to obtain a water blocking effect inside the covered electric wires W1, W2.

Next, the fifth aspect of the invention according to claim 4
Examples will be described.

FIG. 15 is a perspective view showing the resin chip of the fifth embodiment in a partial cross section, and FIGS. 16 (a) and 16 (b) are cross-sectional views of the essential parts showing a state in which the covered electric wire is being joined.

The fifth embodiment is almost the same as the fourth embodiment except that the solder 93 is embedded inside the resin chips 53 and 55 as shown in FIG. That is, solder 9
The circular upper surface 93a of the resin chip 53, 55 is covered with the circular upper surface 93a of the resin chip 53, 55.
The solder 93 is not exposed at 55a.

The joining method according to the fifth embodiment is almost the same as that of the fourth embodiment. First, the resin chips 53 and 55 are inserted into the inner diameter portion 65 of the anvil 59, and the resin chips 53 and 55 are inserted.
The connection portion S in which the two covered electric wires W1 and W2 are superposed is sandwiched from above and below (see FIG. 13A).

Next, the connecting portion S is connected to the upper and lower resin chips 5
Pressure and vibration are applied between the horn 57 and the anvil 59 from the outside of 3,55. As a result, as shown in FIG. 16A, the conductor wire portion 1 of both covered electric wires W1 and W2 becomes the resin chip 53,
It is exposed at the connecting portion S between 55, and both are in conductive contact. When the connection portion S is further pressurized and vibrated, as shown in FIG.
As shown in (b), the resin chips 53 and 55 are melted, the both resin chips 53 and 55 are welded, and the outer peripheral surface of the coating portion 3 adjacent to the conductor wire portion 1 in conductive contact with the resin chip 53 and 55 are welded, and the conductor wire portion 1 that is in conductive contact is covered with the resin chips 53 and 55. Further, in this state, the resin chips 53, 5
The solder 93 embedded in 5 is exposed and contacts the conductor wire portion 93.

The heat generated when the resin chips 53 and 55 are melted melts the solder 93,
In the connection portion S in 3, 55, the conductor wire portions 1 of the covered electric wires W1 and W2 that are in conductive contact are brazed (FIG. 13).
(See (b)).

After the resin chips 53, 55 are melted, the pressure and vibration applied by the horn 57 are stopped, the coating 3, the resin chips 53, 55 and the solder 93 are hardened, and the joining work is completed.

As described above, according to the fifth embodiment, the coating portion 3 is scattered and melted, the conductor wire portion 1 is brought into conductive contact, and the connection portion S is covered with the resin chips 53 and 55. Since the solder 93 is exposed and melts out inside the conductors 55, 55, the conductor wire portion 1 in conductive contact can be brazed accurately and the solder 93 can be surely prevented from flowing out from the resin chips 53, 55. The joining state and joining workability are improved.

Next, a sixth embodiment according to the invention described in claim 11 will be described.

17 and 18 are perspective views showing a means for obtaining the joint structure of the covered electric wire according to the sixth embodiment. FIG. 17 shows a state before the start of joining, and FIG. 18 shows a state after the start of joining. Shows. 19 is a sectional view of the horn of FIG.
FIG. 20 is an overall perspective view of the flat cable. In addition,
The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 17, the second embodiment is one conductor wire of the flat cable 75 in which the covered electric wire W1 and a plurality of conductor wire portions 1 are arranged side by side in the sheet-shaped resin covering portion 73. The parts 1 are joined at their respective intermediate connection parts S, and the covered electric wire W1 and the flat cable 75 are members which are conductively connected to each other.

The method of connecting the coated electric wires according to the sixth embodiment is almost the same as that of the first embodiment, and the resin chip 5 on the lower side is used.
5 is inserted into the inner diameter portion 65 of the anvil 59, and from above,
The covered electric wire W1 is inserted into the groove portion 67 so that the connecting portion S is located substantially in the center of the inner diameter portion 65, and from above, the covering portion of the flat cable 75 is arranged so that the connecting portion S is located in the substantially center portion of the inner diameter portion 65. The conductor wire portion 1 in 73 is inserted into the groove portion 69. In this case, since the covering portion 73 has a sheet shape, the conductor wire portion 1 cannot be completely inserted into the groove portion 69, and the flat cable 75 cannot be inserted into the anvil 5 as shown in FIG.
The inner diameter portion 65 and the groove portions 67, 69 are shallowly formed in accordance with this because they are placed on the substrate 9. In addition, the flat cable 75 placed on the anvil 59
When the upper resin chip 53 is arranged on the upper side, the resin chip 53
Is placed on the flat cable 75, which makes it difficult to position the resin chip 53 and pressurize and vibrate with the horn 57. Therefore, as shown in FIG. 17, a cylindrical tip holding member 77 is provided outside the horn 57, and a lower end 77 a of the tip holding member 77 is provided.
The head 71 of the horn 57 can be inserted into the resin chip 5
1 is provided with an opening 79 for temporarily holding 3 in FIG.
As shown in FIG. 9, the lower end 77 a of the chip holding member 77 is held with the upper resin chip 53 temporarily held in the opening 79.
Is struck against the flat cable 75 in conformity with the inner diameter portion 65 of the anvil 59, the horn 57 is pressed to push the temporarily held upper resin chip 53 downward, and as shown in FIG. The connection portion S is sandwiched by 55.
Further, a groove 77b having an arcuate cross-section that fits into the conductor wire portion 1 from the outside of the covering portion 73 is formed at the lower end of the chip holding member 77. The groove portion 77b allows the chip holding member 7 to be held.
It is possible to easily perform positioning when 7 is abutted on the flat cable 75. The subsequent joining method is the same as in the first embodiment.

The joint structure of the covered electric wire of the sixth embodiment obtained by the above-mentioned joining method is almost the same as that of the first embodiment shown in FIG. 4. For example, the joint structure at the portion B in FIG. 20 is a pair of resin chips. Inside the resin material 51 composed of 53 and 55, the conductor wire portion 1 of the covered electric wire W1 connected to the connector 81 and the conductor wire portion 1 of the flat cable 75 are exposed at the connection portion S and are in cross-contact with each other. . The covering portion 3 adjacent to the conductor wire portion 1 in conductive contact is welded to the resin material 51, and the circumference of the conductor wire portion 1 in conductive contact is covered with the resin material 51.
The connection portion S is sealed with a resin material. Note that FIG.
FIG. 1 is a perspective view showing a usage state in which the flat cable 75 is folded.

According to the sixth embodiment, the flat cable 7
Even when 5 is electrically connected to the covered electric wire W1, the first
The same effect as the embodiment can be obtained.

The same applies to the case where the flat cables 75 are electrically connected to each other. Further, by making the resin material 51 a transparent body, the conductive contact state of the conductor wire portion 1 can be seen from the outside of the resin material 51. You can

Next, a seventh embodiment of the present invention will be described.

FIG. 22 is a perspective view showing a means for obtaining the joint structure of the covered electric wire of the seventh embodiment, and FIG. 23 is a perspective view showing the joint structure of the seventh embodiment. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 22, in the seventh embodiment, the covered electric wire W1 is joined to the connecting portion S of the terminal fitting 87, and the covered electric wire W1 and the terminal fitting 87 are electrically connected to each other.

The method of connecting the covered electric wires according to the seventh embodiment is basically the same as that of the first embodiment. That is, the connecting portion S at the end of the covered electric wire W1 is placed on the connecting portion S of the terminal metal fitting 87, and the connecting portion S is sandwiched between the pair of resin chips 83 and 85 from above and below to connect the connecting portion S to the upper and lower resin. The horn 89 and the anvil 91 from the outside of the chips 83 and 85
Pressurize and vibrate between. As a result, after the conductor wire portion 1 of the covered electric wire W1 is exposed at the connecting portion S between the resin chips 83 and 85 and comes into conductive contact with the terminal fitting 87, the upper and lower resin chips 83 and 85 are melted and both resins are melted. The surfaces of the chips 83 and 85, which face each other, are welded to each other, and the area around the conductor wire portion 1 that is in conductive contact is covered with the resin chip 83. The resin chips 83 and 85 have a rectangular shape with a width of about 2 to 8 mm, and a supporting recess 91a for the resin chip 85 is formed on the upper surface of the anvil 91 in accordance with this.

According to the seventh embodiment, even when the covered electric wire W1 is conductively connected to the terminal fitting 87, the same effect as that of the first embodiment can be obtained. Further, since the caulking work of the terminal fitting 87 is unnecessary, the joining work can be easily performed.

Also, the covered electric wire W1 described in the sixth embodiment
And the flat cable 75 (see FIG. 17) or the covered electric wire W1 and the terminal fitting 87 described in the seventh embodiment (see FIG. 22) are applied to the fourth embodiment or the fifth embodiment. You can also That is, the resin chips 53, 55, 83, 8 used in the sixth or seventh embodiment
By providing the solder 93 on No. 5, in addition to the effect similar to the sixth embodiment or the seventh embodiment, it is possible to obtain much higher mechanical strength in the connection portion S. Here, in the case of joining the covered electric wire W1 and the terminal fitting 87, the upper resin chip 8 located on the covered electric wire W1 side as shown in FIG.
The conductor wire portion 1 of the covered electric wire W1 and the terminal fitting 87 can be brazed to each other only by providing the solder 93 only on No. 3.

[0132]

As described above, according to the first aspect of the present invention, the work of conducting connection can be easily performed without the need to remove the coating portion in advance, and the cured resin chip can be used for the connection portion. High mechanical strength and sufficient insulation can be obtained to stabilize the current-carrying characteristics, and high versatility can be obtained.

According to the invention of claim 2, in addition to the effect of the invention of claim 1, a waterproof effect can be obtained inside the covered electric wire, so that, for example, one end of the covered electric wire is waterproofed. When connecting to the required part and connecting the other end side to a part that does not require waterproofing functionally, even if water etc. flows into the covered electric wire from the other end side due to the capillary phenomenon,
The water blocking effect prevents the outflow of water or the like to one end side. Therefore, it is possible to secure the waterproofness of the one end side by a simple and inexpensive method without performing the waterproofing treatment on the other end side which does not require waterproofing.

According to the invention of claim 3, in addition to the effect of the invention of claim 1 or 2, a simple method of using a resin chip provided with a brazing material
It is possible to obtain much higher electrical performance in the connection portion, and it is possible to further stabilize the current-carrying characteristics.

According to the invention of claim 4, in addition to the effect of the invention of claim 3, since the brazing material is exposed and melts out inside the resin chip after the connection portion is covered with the resin chip. It is possible to properly braze the connecting portion that is in conductive contact, and it is possible to reliably prevent the brazing material from flowing out from the resin chip, so that the joining state and the joining workability are improved.

According to the fifth aspect of the present invention, the cured resin material provides high mechanical strength and sufficient insulating properties at the connection portion to stabilize the current-carrying characteristics, and also provides high versatility. To be

According to the invention of claim 6, in addition to the effect of the invention of claim 5, a water blocking effect can be obtained inside the covered electric wire. Therefore, for example, one end of the covered electric wire is waterproofed. When connecting to the required part and connecting the other end side to a part that does not require waterproofing functionally, even if water etc. flows into the covered electric wire from the other end side due to the capillary phenomenon,
The water blocking effect prevents the outflow of water or the like to one end side. Therefore, it is possible to secure the waterproofness of the one end side by a simple and inexpensive structure without making the other end side that does not require waterproofing a waterproof structure.

According to the invention of claim 7, in addition to the effect of the invention of claim 5 or claim 6, by brazing of both members, it is possible to obtain much higher electrical performance at the connecting portion. The current-carrying characteristics can be further stabilized.

According to the invention of claim 8, claim 1
In addition to the effect of the invention as set forth in claim 4, the conductor wire portion is better exposed at the connection portion, a reliable conductive contact state is obtained, and a good welded state of the resin chips is obtained.

According to the invention of claim 9, claims 1 to
In addition to the effect of the invention according to any one of claims 4 and 5, the conductor wire portion is better exposed at the connection portion, a reliable conductive contact state is obtained, and a good welded state of the resin chips is obtained, Metallic bonding can be obtained in a wide range in the connection portion, and even when used under harsh conditions, good conduction characteristics can be maintained in the connection portion. In addition, since the metallic joint at the connection part expands, heat generation during conduction can be suppressed to a low level, and even if a relatively inexpensive resin material is used, an expensive resin material with excellent heat resistance is used. The same effect as can be obtained.

According to the invention of claim 10, in addition to the effect of the invention of claim 5, claim 6, or claim 7, the conductive contact state of the conductor wire portion is viewed from the outside of the resin material. Therefore, quality control can be facilitated and quality can be improved.

According to the eleventh aspect of the invention, even when the flat cable is electrically connected to another member, the same effect as that of the fifth, sixth, seventh or tenth aspect of the invention can be obtained. Can be obtained, and versatility is further enhanced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a first embodiment.

FIG. 2 is a perspective view showing a means for obtaining the joint structure of the covered electric wire according to the first embodiment.

3A and 3B are schematic views showing a cross section of the main part taken from the direction A in FIG. 2, where FIG. 3A shows a state immediately after the start of joining, and FIG. 3B shows a state after joining.

FIG. 4 is a perspective view showing a joint structure of the covered electric wire according to the first embodiment, (a) showing an external appearance and (b) showing an internal structure.

5A and 5B are schematic diagrams for explaining the impact given in the experiment, where FIG. 5A shows a state of hitting the connection portion, and FIG. 5B shows a state of shaking the covered electric wire.

FIG. 6 is a plan view showing an experimental sample.

FIG. 7 is a table showing the results of determining the adhesion strength for each welding height of acrylic resin.

FIG. 8 is a graph of FIG. 7, showing an average value of the adhesion force for each welding height.

9 (a) is a view showing a state before joining in the second embodiment. FIG.
FIG. 4B is a sectional view taken along line P-P of FIG. 3, and FIG. 4B is a sectional view taken along line QQ of FIG.

FIG. 10 is a sectional view of an essential part showing a means for obtaining a joint structure for a covered electric wire according to a third embodiment.

FIG. 11 is a cross-sectional view of essential parts showing a modification of the third embodiment.

FIG. 12 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a fourth embodiment.

13A and 13B are cross-sectional views of the main part of FIG. 12, where FIG. 13A shows a state immediately after the start of joining, and FIG. 13B shows a state after joining.

FIG. 14A is a perspective view showing a part of a resin chip of a fourth embodiment in a cross section, and FIG. 14B is a perspective view showing a part of a joint structure of a covered electric wire of the fourth embodiment in a cross section. Is.

FIG. 15 is a perspective view showing a cross section of a part of a resin chip according to a fifth embodiment.

FIG. 16 is a cross-sectional view of an essential part showing the method for joining the covered electric wires according to the fifth embodiment, wherein (a) shows the state of the previous period during joining,
(B) shows the state of the latter stage during joining.

FIG. 17 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a sixth embodiment.

FIG. 18 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a sixth embodiment.

19 is a cross-sectional view of the horn of FIG.

FIG. 20 is an overall perspective view of a flat cable.

FIG. 21 is an overall perspective view showing a usage state in which a flat cable is folded.

FIG. 22 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a seventh embodiment.

FIG. 23 is a perspective view showing a joint structure of a covered electric wire according to a seventh embodiment.

FIG. 24 is a perspective view in which a fourth embodiment or a fifth embodiment is applied to join a covered electric wire and a terminal fitting.

FIG. 25 is a perspective view showing a conventional example.

FIG. 26 is a side view of FIG. 25, in which (a) shows a state before joining and (b) shows a state after joining.

FIG. 27 is a perspective view showing another conventional example.

28 is a side sectional view of FIG. 27.

FIG. 29 is a perspective view showing another conventional example.

FIG. 30 is a perspective view showing another conventional example, (a) shows a state before joining, (b) shows a joined state by a joint terminal, (c) shows a state at the time of thermocompression bonding, (D) shows the winding state of the insulating material.

FIG. 31 is a sectional view showing another conventional example, in which (a) is a side sectional view and (b) is a front sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 conductor wire part 1a core wire 3 coating part 51 resin material 53 resin chip 55 resin chip 57 horn 59 anvil 73 coating part 75 flat cable (members for conducting and connecting with each other) 83 resin chip 85 resin chip 87 terminal fittings (members for conducting and connecting with each other) ) 89 horn 91 anvil 93 solder (brazing material) 95 anvil 97 anvil 99 horn W1 coated electric wire (member for conducting and connecting with each other) W2 coated electric wire (member for conducting and connecting with each other) S connection portion

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] February 9, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction content]

According to the invention described in claim 3, in addition to the function of the invention described in claim 1 or 2, in the second step, a resin chip provided with a brazing material is used, and the resin chip is melted. Since the brazing material is melted by the heat generated at the time of welding and the two members are brazed at the connecting portion which is in conductive contact, a particularly high brazing work is not required, and a much higher electrical strength can be obtained at the connecting portion.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

FIG. 1 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to a first embodiment (state before joining is started) .

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

FIG. 2 is a perspective view showing a means for obtaining the joint structure of the covered electric wire according to the first embodiment (state after joining is started) .

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mineo Takahashi 206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Yazaki Parts Co., Ltd.

Claims (11)

[Claims] 1. A method for joining covered electric wires, wherein at least one of the members that are conductively connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion, and the both members are superposed at the connecting portion. , A first step of sandwiching the overlapped connection part with a pair of resin chips, and after the cover part is dispersed and melted, and the two members are brought into conductive contact at the connection part by pressure from the outside of the resin chip, A second step of welding the pair of resin chips to each other to seal the connection portion, the method of joining a covered electric wire. 2. The method of joining a covered electric wire according to claim 1, wherein in the second step, a molten resin chip is filled between core wires of adjacent conductor wire portions except for the connection portion. And a method for joining covered electric wires. 3. The method for joining a covered electric wire according to claim 1, wherein in the first step, the connecting portion is sandwiched by a pair of resin chips having a brazing material provided on at least one side thereof. In the second step, the brazing material is melted by heat generated when the resin chip is melted, and both members are brazed at the conductively contacted connecting portion. 4. The method for joining a covered electric wire according to claim 3, wherein the brazing material is embedded inside a resin chip. 5. A joint structure of a covered electric wire, wherein at least one of the members electrically connected to each other is a covered electric wire in which an outer periphery of a conductor wire portion is covered with a resin covering part, and a connecting portion in which the both members are overlapped. 2. The joint structure of a covered electric wire, wherein the conductor wire portion of the covered electric wire is exposed to bring the two members into conductive contact with each other, and the connection portion is sealed with a resin material. 6. The joint structure for a covered electric wire according to claim 5, wherein a resin material is filled between core wires of adjacent conductor wire portions excluding the connecting portion. 7. The joint structure for a covered electric wire according to claim 5 or 6, wherein the both members are brazed at the conductively contacted connection portion. 8. The method of joining a covered electric wire according to claim 1, wherein in the second step, the pair of resin chips are sandwiched from above and below in a stacking direction of the both members. The joint of the covered electric wire is characterized in that the connecting portion is pressed and vibrated between the horn and the anvil from the outside of the resin chip, and the pressing and vibrating directions are the stacking direction of the both members. Method. 9. The method of joining a covered electric wire according to claim 1, wherein in the second step, the pair of resin chips are sandwiched from above and below in a stacking direction of the both members. The connecting portion is pressed and vibrated between the horn and the anvil from the outside of the resin chip, the pressing direction is the stacking direction of the both members, and the vibration is a vibration component in the stacking direction. And a vibration component in a direction orthogonal to the stacking direction. 10. The joint structure for a covered electric wire according to claim 5, 6, or 7, wherein the resin material is a transparent body. Construction. 11. The joint structure of the covered electric wire according to claim 5, claim 6, claim 7, or claim 10, wherein the covered electric wire is inside a sheet-shaped resin covering portion. A joint structure for a covered electric wire, which is a flat cable in which a plurality of conductor wire portions are arranged in parallel.