JP3121764B2 - Method of joining covered electric wires and joining structure of covered electric wires - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining a plurality of covered electric wires and a structure for joining covered electric wires.

[0002]

2. Description of the Related Art As modes for electrically connecting a covered wire W to another member, there are a joint between the covered wire W and a terminal, a joint between the covered wires W, and a joint between a covered wire W and a connector.

Conventional methods for joining a covered electric wire to a terminal include crimping, pressure welding (see Japanese Utility Model Publication No. 60-37814), soldering, and ultrasonic welding (Japanese Unexamined Patent Publication No. 2-10609).
No. 2) is known.

[0004] Bonding by crimping is performed by conductor crimping pieces 13 erected on both sides of a connecting portion S of a terminal fitting 11 as shown in FIGS. 18A, the covering portion 3 is removed at the connection portion S at the end of the covered electric wire W to expose the conductor wire portion 1 as shown in FIG. As shown in b), the conductor caulking piece 13 is caulked. Terminal fitting 11
In addition, the cover caulking piece 15 for increasing the mechanical connection strength is provided.
The conductor crimping piece 13 and the covering crimping piece 15 allow the conductor wire portion 1 and the covering portion 3 to be respectively connected to the terminal fittings 1.
1 is crimped.

As shown in FIGS. 19 and 20, the joining by pressure contact is performed by a press contact blade 19 provided at a connection portion S of the press contact terminal 17.
By press-fitting the connection portion S of the covered electric wire W into the slot 21, the covering portion 3 is peeled off by the press-contact blade 19, and the press-contact blade 19 is brought into conductive contact with the conductor wire portion 1.

[0006] In joining by soldering or ultrasonic welding,
As shown in FIG. 21, the covering portion 3 is removed at the connection portion S at the end of the covered electric wire W to expose the conductor wire portion 1, and the exposed conductor wire portion 1 is soldered to the connection portion S of the terminal fitting 23. Conductive connection is made by welding using ultrasonic welding.

[0007] Further, as a conventional method of joining two covered electric wires W, joining by a joint terminal or joining by thermocompression bonding (see Japanese Patent Application Laid-Open No. 3-1462) is known.

[0008] In the joining by the joint terminal, FIG.
(A) As shown in FIG.
Is removed to expose the conductor wire portion 1, and as shown in FIG. 22 (b), the joint terminals 25 are crimped to the exposed conductor wire portions 1 by crimping, and the two are electrically connected.

In the joining by thermocompression bonding, as shown in FIG. 22 (c), the covering portion 3 is removed at the connecting portion S of the both covered electric wires W to expose the conductor wire portion 1, and the exposed conductor wire portions 1 are connected to each other. Are superposed and sandwiched between the electrodes 27 and 29, and the conductor wires 1 are thermocompression-bonded to each other by conducting and heating in a pressurized state, and both are electrically connected. As a method of heating the conductor wire portion 1, a method utilizing frictional heat due to ultrasonic vibration is also known.

When bonding is performed by the joint terminal 25 or thermocompression bonding as described above, a tape or the like is applied to the outer periphery of the connection portion S as shown in FIG. Of insulating material 31 is wound.

As a conventional method for joining the covered electric wire W and the connector, joining by ultrasonic welding is known (see JP-A-4-61777).

In this connection, as shown in FIGS. 23A and 23B, a lower mold 35 and an upper mold 37 constituting the connector 33 are formed.
Are provided with a groove 39 and a ridge 41 fitted to the groove 39, and the connection S of the covered electric wire W is superimposed on the connection S of the conductive connection member 43 arranged in the groove 39 of the lower mold 35, and The protrusions 41 of the upper die 37 are fitted into the groove portions 39, and ultrasonic vibration is applied to the connection portions S from outside the fitted upper and lower dies 37, 35, thereby melting the coating portion 3 of the coated electric wire W to form a conductor. The wire portion 1 and the conductive connection member 43 are brought into conductive contact.

[0013]

However, the coated electric wire W
When the connection between the wire and the terminal is performed by crimping, soldering, or ultrasonic welding, it is necessary to remove the covering portion 3 of the covered electric wire W in advance to expose the conductor wire portion 1, and the operation is complicated. On the other hand, the joining by pressure welding does not require the removal of the covering portion 3, but the mechanical strength of the connecting portion S is inevitably reduced as compared with crimping or soldering, so that the joining operation is simplified and the mechanical strength is reduced. It was difficult to achieve both improvements.

If the two insulated wires W are joined to each other by the joint terminal 25 or thermocompression bonding, the work becomes complicated because the covering portion 3 needs to be removed as described above. Also,
In order to easily perform the work of crimping and thermocompression bonding of the joint terminal 25, it is necessary to set the range L in which the covering portion 3 is removed to a certain extent, and to wind the insulating material 31 in the range in which the covering portion 3 is removed. Since it is necessary to perform the winding longer than L, the wrapping range of the insulating material 31 becomes larger than the contact portion between the conductor wires 1, and the flexibility of the insulated wire W is impaired, and the degree of freedom in wiring is reduced. There was a fear that it would. Further, in the thermocompression bonding, the mechanical strength of the connection portion S was inevitably reduced as compared with the joint terminal 25.

In the case where the insulated wire W and the connector 33 are joined by ultrasonic welding shown in FIG.
5 and the upper die 37 require a specially shaped connector 33 provided with a groove 39 and a ridge 41, so that the connector 33 is not always applicable to all types of connectors. There is a disadvantage that it cannot be easily applied to the joining of W and lacks versatility.

In view of the above circumstances, the present invention can simplify the joining operation and improve the mechanical strength at the same time, and can secure a sufficient insulating property by suppressing the range required for the joining. It is an object of the present invention to provide a method for joining a covered electric wire which can be easily applied to various kinds of joining such as joining of a covered electric wire and a terminal, joining of covered electric wires, and the like and which can obtain high versatility.

[0017]

According to a first aspect of the present invention, at least one of the members electrically connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion. A first step of sandwiching the overlapped connection portion between a pair of resin chips, and scattering and melting the covering portion, and conducting the two members at the connection portion by applying pressure from the outside of the resin chip. After the contact, the pair of resin chips are welded to each other to seal the connection portion.
The method according to claim 1, wherein at least one of the pair of resin chips is formed so as to be recessed from a welding surface with a counterpart chip at a leading end from which the covered wire is led out. A housing is provided, and in the second step, the molten resin flowing out at the time of welding the resin chips to each other is housed in the resin housing and cured.

According to a second aspect of the present invention, at least one of the members that are conductively connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion. After the overlapped connection portion is sandwiched between a pair of resin chips, the covering portion is scattered and melted, and the two members are brought into conductive contact at the connection portion by applying pressure from the outside of the resin chip. Is welded to seal the connection portion, and at least one of the pair of resin chips has a leading end at which the covered wire is led out from a welding surface with a mating chip. A resin accommodating portion formed so as to be recessed and accommodating and hardening the molten resin flowing out when the resin chips are welded to each other is provided.

According to a third aspect of the present invention, there is provided the joined structure of the covered electric wire according to the second aspect, wherein the resin accommodating portion is formed in a notch shape.

According to the first to third aspects of the present invention, the covering member is scattered and melted in a state where both members are overlapped at the connecting portion, and the overlapped connecting portion is sandwiched between a pair of resin chips. By applying pressure from the outside, the two members can be brought into conductive contact at the connection part, so that it is not necessary to remove the covering part in advance, and the two members can be conductively connected by a simple operation.

After the two members are brought into conductive contact at the connection portion, the pair of resin chips are welded to each other to seal the connection portion, so that the resin chip that has been welded and cured has high mechanical strength at the connection portion. Is obtained.

Further, since the pair of resin chips need only be sized and formed so that the connecting portion to be in conductive contact can be sandwiched from above and below, the range required for joining can be reduced, and the connecting portion is sealed by the resin chip. Therefore, sufficient insulation can be ensured.

Further, the joining method is a relatively simple method of sandwiching the overlapped connection portion between a pair of resin chips, melting the covering portion, and applying pressure from outside the resin chip.
There is no particular limitation on the shape or the like of the member to which the insulated wire is to be conductively connected, so that it can be easily applied to various joinings such as joining of an insulated wire and a terminal, joining of insulated wires, and the like. Property is obtained.

Further, when the resin chips are welded to each other, the molten resin tends to flow outward from between the welding surfaces of the lead-out ends and is housed in the resin housing portion. Since the molten resin stored in the resin storage portion is in a high temperature state behind the outflow (closer to the connection portion), the covering portion of the covered electric wire is melted to expose the conductor wire portion. Since the temperature decreases as it moves to the far side, the coating is not completely melted but is welded to the outer peripheral surface of the coating. For this reason, in a portion derived from the resin chip, the conductor wire portion of the covered electric wire can be completely covered with the covering portion and the molten resin.

According to a fourth aspect of the present invention, there is provided the bonded structure of the coated electric wire according to the second aspect, wherein at least one of the pair of resin chips has an electric wire holding portion for temporarily holding the coated electric wire before joining. It is characterized by having been provided.

According to the fourth aspect of the present invention, in addition to the operation of the second aspect of the present invention, the positioning of the connecting portion with respect to the resin chip is achieved by temporarily holding the coated electric wire on the resin chip before joining. It can be performed easily and reliably.

According to a fifth aspect of the present invention, there is provided the joined structure of the coated electric wire according to the second or fourth aspect, wherein the pair of resin chips are engaged with each other to sandwich the connecting portion. An engagement portion for maintaining a state before joining is provided.

According to the fifth aspect of the invention, in addition to the function of the second or fourth aspect, the resin chip can be attached to the connecting portion before the joining, and the joining workability is improved. improves. In addition, the resin chips after welding are less likely to be separated from each other by the engagement of the engagement portions, and the mechanical strength is enhanced.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 are perspective views showing a means for obtaining a joint structure of a covered electric wire according to the first embodiment. FIG. 1 shows a state before the start of joining, and FIG. The state is shown. FIG. 3 is a schematic view showing a cross-section taken along arrow A in FIG. 2, where (a) shows a state immediately after the start of joining.
(B) shows the state after joining.

As shown in FIG. 1, in the present embodiment, two covered electric wires W1 and W2 in which the outer periphery of a conductor wire portion 1 is covered with a covering portion 3 made of resin are joined at an intermediate connecting portion S between them. The two insulated wires W1, W2 are members that are conductively connected to each other.

To join the two covered electric wires W1 and W2, a pair of resin chips 53 and 55 as a resin material 51, a horn 57 for generating ultrasonic vibration, and a
1, an anvil 59 supporting the W2 and the resin chips 53 and 55 is used. The anvil 59 includes a base 61 and a base 61.
, And the supporting portion 63 is formed in a substantially rectangular cylindrical shape. The support portion 63 has a housing recess 65 having a rectangular cross section that opens on the side opposite to the base (the upper side in the figure). The opposing peripheral walls 63 a and 63 b of the support portion 63 are opposed to each other with the center of the housing recess 65 interposed therebetween. A pair of grooves 6 facing each other
7, 69 are provided respectively. These four grooves 6
7, 69 open on the same side as the accommodation recess 65,
3 which are formed along the projecting direction of
69 communicate with each other via the accommodation recess 65.

The pair of resin chips 53, 55 are formed in a rectangular plate shape having an outer periphery slightly smaller than the accommodation recess 65 of the anvil 59, and the end surface 71 of the head 71 of the horn 57 is formed.
“a” is formed in a rectangular shape having an outer periphery substantially the same as or slightly smaller than the resin chips 53 and 55. Resin chip 5
3, 55 are acrylic resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, P
C (polycarbonate) resin, PVC (polyvinyl chloride) resin, PE (polyethylene) resin and the like. When these resins are used for the resin chips 53 and 55, all resins are considered to be practical in terms of continuity and continuity stability, and are evaluated in terms of appearance and insulation. Particularly, acrylic resins and PC resins are suitable, and then ABS resins are suitable.

One surface of each of the resin chips 53, 55 is formed by welding surfaces 53a, 55a which come into contact with each other when the resin chips 53, 55 are vertically stacked in the accommodation recess 65 of the anvil 59.
And a groove 67, within the accommodation recess 65 of the anvil 59.
Both ends of the welding surfaces 53a, 55a close to 69 are connected to leading ends 53b, 53 from which the covered electric wires W1, W2 are led.
c, 55b, and 55c. Each lead-out end 53
b, 53c, 55b, 55c have welding surfaces 53a, 55
A resin housing portion H formed in a notch so as to be recessed from a is provided.

To join the two covered electric wires W1 and W2, the two covered electric wires W1 and W2 are overlapped at the connecting portion S, and the overlapped connecting portion S is sandwiched between a pair of resin chips 53 and 55 from above and below.
Specifically, one (lower) resin chip 55 is inserted into the accommodating recess 65 of the anvil 59 so that the welding surface 55a faces upward, and one of the covered electric wires W1 is inserted from above into one of the opposing groove portions. 67, and the other covered wire W2 is inserted into the other opposing groove 69 from above, and finally the other (upper) resin chip 53 is inserted so that the welding surface 53a faces downward. The two insulated wires W1 and W2 are arranged such that the connection portions S cross each other at the center of the accommodation recess 65, and as a result, as shown in FIG.
Is approximately the center of the upper and lower resin chips 53, 55,
The welding surfaces 53a and 55a are sandwiched from above and below in the overlapping direction.

Next, as shown in FIGS. 3A and 3B, the coating portion 3 of the connection portion S is scattered and melted, and the resin chip 5 is melted.
3 and 55, both coated electric wires W1, W
After the two conductor wires (core wires) 1 are brought into conductive contact with each other at the connection portion S, the pair of resin chips 53 and 55 are welded to each other by a welding surface 53.
a, 55a to seal the connecting portion S.

Specifically, the head 71 of the horn 57 is inserted from above the upper (other) resin chip 53 inserted last, and the connecting portion S is connected to the horn from outside the upper and lower resin chips 53 and 55. Pressure and vibration are applied between 57 and anvil 59. The pressurization of the connection portion S is performed by pressing the horn 57 toward the anvil 59, and the direction of pressurization coincides with the overlapping direction of the both covered electric wires.

When the resin members 51 are welded to each other by ultrasonic vibration, it is best to vibrate in a direction substantially perpendicular to the joining surface of the resin members 51. The direction of vibration applied to both resin chips 53,
55 is set in a direction intersecting the opposing surfaces 53a, 55a, that is, a direction (the arrow X direction in FIG. 3A) that coincides with the overlapping direction of the two covered electric wires W1, W2. A so-called longitudinal vibration is transmitted.

When the connecting portion S is pressurized and vibrated in this state, the covering portion 3 is melted first, and the conductor wire portion 1 of both the covered electric wires W1, W2 is connected to the connecting portion S between the resin chips 53, 55. Exposure. At this time, since the connection portion S is pressed from above and below, the melted coating portion 3 is extruded outward from the center side of the resin chips 53 and 55, and the conductor wire portion 1 is better exposed, and Are surely brought into conductive contact. The direction of vibration applied to the connection S is the same as that of the pressurizing direction.
Since it is set in the overlapping direction of W2, the action of pushing the coating portion 3 outward from the center side of the resin chips 53 and 55 is increased.

When the pressurization and the vibration of the connection portion S are continued even after the coating portion 3 is melted, the resin chips 53 and 55 are melted, and the welding surfaces 53a and 55a of the resin chips 53 and 55 are welded to each other. At the same time, the resin chips 53 and 55 are welded to the outer peripheral surface of the covering portion 3 adjacent to the conductive wire portion 1 in conductive contact. As a result, the area around the conductive wire portion 1 that is in conductive contact is covered with the resin chips 53 and 55.

When the resin chips 53 and 55 are welded to each other, the molten resin R tends to flow out from between the welding surfaces 53a and 55a.
5b and 55c, the outflow of the molten resin R is suppressed by the inner wall surface of the housing recess 65, so that the molten resin R
, Tends to flow outward from the leading ends 53b, 53c, 55b, 55c exclusively, and is accommodated in the resin accommodating portion H. The molten resin R accommodated in the resin accommodating portion H is in a high temperature state after flowing out (on the side close to the connecting portion S), so that the covered electric wire W1
, W2 is melted to expose the conductor wire portion 1. However, the temperature decreases as it moves forward (outward from the connection portion S), so that the coating portion 3 is not completely melted. , Is welded to the outer peripheral surface of the coating portion 3. For this reason, the resin chip 5
The outer periphery of the conductor wire portion 1 of the covered electric wires W1 and W2 at the portions derived from the members 3 and 55 is completely covered with the covering portion 3 and the molten resin R.

On the other hand, as shown in FIG. 5, the resin chips 73 and 75 (the resin material 7) having no resin accommodating portion H are provided.
When 1) is used, as shown in FIGS. 6 (a) and 6 (b), the molten resin R which has flowed outward from between the welding surfaces 73a, 75a of the lead-out ends 73b, 73c, 75b, 75c. Flows into the grooves 67 and 69 (see FIG. 1).
At this time, the lower portions of the covered electric wires W1 and W2
9 is close to or in contact with the bottom of the wire 9, and a gap is not formed enough to allow the inflow of the molten resin R. Therefore, as the outflow increases, the molten resin R moves above the covered electric wires W 1, W 2. (Opening sides of the grooves 67 and 69). Therefore, when the covering portion 3 is melted by the molten resin R in a high temperature state, the conductor wire portion 1 is covered with the molten resin R above the covered electric wires W1 and W2 on which the resin is deposited, but the resin accumulates. Under the difficult lower part, there is a possibility that the conductor wire portion 1 is maintained in an exposed state even though the coating portion 3 is melted (reference numeral 1a indicates the exposed conductor wire portion 1). For this reason, there is a possibility that a hole penetrating through the covering portion 3 may be formed under the lower portion, or the conductor wire portion 1 may be entirely exposed. Therefore, in order to suppress the outflow amount of the molten resin R,
It is necessary to limit the pressurizing and vibrating force by the horn 57, and to enhance the welding force between the resin chips 73 and 75,
It has been difficult to achieve both improvement of the covering property of the glass.

That is, according to the resin chips 53 and 55 according to the present embodiment provided with the resin housing portion H, the horn 57
, The outer periphery of the conductor wire portion 1 at the portion derived from the resin chips 53 and 55 is completely covered by the molten resin R in the resin housing portion H and the covering portion 3. The resin chip 5 has a smaller thickness than the resin chips 73 and 75 in which the resin accommodating portion H is not provided.
It is possible to easily achieve both enhancement of the welding force between the members 3 and 55 and improvement of the covering property of the conductor wire portion 1.

After the melting of the resin chips 53 and 55, the pressurization and the vibration by the horn 57 are stopped, and the covering portion 3 and the resin chips 53 and 55 are cured, and the joining operation is completed.

Next, the joining structure of the covered electric wire obtained by the joining method will be described. FIGS. 4A and 4B are perspective views showing a joint structure of the covered electric wire according to the first embodiment, in which FIG. 4A shows the appearance and FIG. 4B shows the internal structure.

As shown in FIG. 5A, this joint structure is such that two covered electric wires W1 and W2 intersect at a connection portion S inside a resin material 51 composed of a pair of resin chips 53 and 55. Thus, at the connection portion S, the conductor wire portions 1 of the both covered electric wires W1 and W2 are exposed and are in conductive contact. The covering portion 3 adjacent to the conductive wire portion 1 in conductive contact is welded to the resin material 51, whereby the periphery of the conductive wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed by the resin material 51. ing.

The lead-out end 5 of the resin chips 53 and 55
3b, 53c, 55b, and 55c, the resin chip 53,
55, the molten resin R flowing out at the time of welding each other
The outer periphery of the conductor wire portion 1 of the covered electric wires W1 and W2 at the portion derived from the resin chips 53 and 55 is hardened.
It is in a state of being completely covered by the covering portion 3 and the molten resin R.

As described above, according to the joining method according to the present embodiment, the covered electric wires W1 and W2 are overlapped with each other at the connecting portion S, and this connecting portion S is connected to the pair of resin chips 53 and 5.
In the state of being sandwiched by 5, the coated wires W1 and W2 can be brought into conductive contact at the connecting portion S only by scattering and melting the coated portion 3 while applying pressure from the outside of the resin chips 53 and 55. It is not necessary to remove the covering portion 3 in advance, and a conductive connection can be obtained with a simple operation.

Further, according to the joining method and the joining structure, after the covered electric wires W1 and W2 are brought into conductive contact at the connecting portion S, the upper and lower resin chips 53 and 55 are welded to each other to seal the connecting portion S. Therefore, the resin chip 5 which is welded and hardened
3, 55, a high mechanical strength is obtained at the connection portion S.

Further, the resin chips 53 and 55 need only be dimensioned so as to sandwich the connecting portion S to be in conductive contact from above and below, so that the range required for joining can be suppressed to a small extent, and the connecting portion S is formed of a resin chip. Since they are sealed by 53 and 55, sufficient insulation can be secured.

Therefore, the current-carrying characteristics between the covered electric wires W1 and W2 at the connection portion S can be stabilized by the high mechanical strength and the sufficient insulation.

In this bonding method, the overlapped connecting portion S is sandwiched between the resin chips 53 and 55, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from outside the resin chips 53 and 55. This is a relatively simple method, and the joining method and the joining structure particularly limit the shape and the like of the other member (the other insulated wire W2 in the present embodiment) to be electrically connected to one insulated wire W1. Therefore, the present invention can be easily applied to various kinds of joining such as joining of the insulated wires W1, W2 and terminals, and high versatility can be obtained.

Further, the pair of resin chips 53 and 55 are sandwiched from above and below in the direction in which the covered electric wires W1 and W2 are overlapped, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from outside the resin chips 53 and 55. The direction of pressurization is
, W2, so that when the connecting portion S is pressurized,
The melted coating portion 3 is extruded outward from the center of the resin chips 53 and 55, so that the conductor wire portion 1 is better exposed and a reliable conductive contact state is obtained. Also, since the direction of the vibration applied to the connection portion S is the same as the direction in which the coated electric wires W1 and W2 are overlapped in the same direction as the pressing direction, a good welding state of the resin chips 53 and 55 is obtained and the pressing of the coating portion 3 is performed. Outgoing action is increased.

Further, since the resin housing portions H are provided in the resin chips 53 and 55, the molten resin R which has flowed outward from between the welding surfaces 53a and 55a by the pressure and vibration by the horn 57 is housed in the resin housing portions H. And the resin chips 53 and 55
The outer periphery of the conductor wire portion 1 of the covered electric wires W1 and W2 at the portion derived from the wire is completely covered with the covering portion 3 and the molten resin R. Therefore, even when the welding force between the resin chips 53 and 55 is strengthened by increasing the pressing and vibrating force by the horn 57, the lead-out ends 53b, 53c, 55b and 5
5c can completely and completely cover the conductor wire portion 1 and prevent the conductor wire portion 1 from being oxidized. Thereby, both the enhancement of the welding force between the resin chips 53 and 55 and the improvement of the covering property of the conductor wire portion 1 can be easily achieved.

When the resin chips 53 and 55 having relatively low viscosity at the time of melting are used and the connecting portions S are welded between the resin chips 53 and 55, the adjacent conductor wire portions except for the connecting portions S are used. In FIG. 1, the molten resin chips 53 and 55 are filled between the plurality of core wires constituting the conductor wire portion 1 so that the gaps formed between the coating portions 3 of the covered wires W1 and W2 and the core wires and between the core wires are formed. It can be buried and blocked by the resin material 51, and a water stopping effect can be obtained inside the covered electric wires W1, W2. Thus, for example, one end of the insulated wires W1 and W2 is connected to a portion that requires waterproofing (waterproofing portion), and the other end is connected to a portion that does not require waterproofing (non-waterproofing portion). In some cases,
Due to the current state of the capillary, even if water or the like flows into the inside of the covered wires W1 and W2 from the other end and flows through the inside of the covered wires W1 and W2, the outflow of water or the like to the one end is prevented by the water stopping effect. Therefore, the waterproof property of one end can be secured without making the other end a waterproof structure. That is, when connecting both ends of the insulated wires W1 and W2 to the waterproof portion and the non-waterproof portion, the waterproofness of the waterproof portion is secured by a simple and inexpensive method and structure without making the non-waterproof portion a waterproof structure. can do.

Next, a second embodiment of the present invention will be described.

FIG. 7 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to the second embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals. Description is omitted.

As shown in FIG. 7, in the second embodiment,
The insulated wire W1 is joined to the connection portion S of the terminal fitting 81, and is a member for electrically connecting the insulated wire W1 and the terminal fitting 81 to each other.

The method of connecting the covered electric wires according to the second embodiment is basically the same as that of the first embodiment. That is, the connection wire S is connected to the connection portion S of the terminal fitting 81.
The connecting portion S at the end is placed, and the connecting portion S is sandwiched between a pair of resin chips 83 and 85 from above and below, and the connecting portion S is
Pressure and vibration are applied between the horn 87 and the anvil 89 from outside the upper and lower resin chips 83 and 85. As a result, the conductor wire portion 1 of the covered electric wire W1 is exposed at the connection portion S between the resin chips 83 and 85 and is brought into conductive contact with the terminal fitting 81. Chip 83,
The resin chip 83 is formed around the conductor wire portion 1 where the opposite welding surfaces 83a, 85a of the semiconductor chip 85 are welded to each other and brought into conductive contact.
It will be in the state covered by. The resin chips 83, 8
Reference numeral 5 denotes a rectangular shape having a width of about 2 to 8 mm.
9a are formed.

Each welding surface 83 of each resin chip 83, 85
a, 85a constitute lead-out ends 83b, 85b from which the covered electric wire W1 is led out.
A resin housing portion H formed in a notch so as to be recessed from the welding surfaces 83a and 85a is provided in b.

According to the second embodiment, the coated electric wire W1
The same effect as in the first embodiment can be obtained also when the terminal is electrically connected to the terminal fitting 81. Further, since the crimping work of the terminal fitting 81 is not required, the joining work can be easily performed.

Next, a third embodiment of the present invention will be described.

FIG. 8 is an exploded perspective view showing a state before joining of a joint structure of a covered electric wire according to the third embodiment. FIG. 9 is a joint structure of the covered electric wire according to the third embodiment and the structure. FIG. 10 is a cross-sectional view of a main part of FIG. 8, and FIG. 11 is a cross-sectional view of a main part of FIG. The same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIGS. 8 and 10, the third embodiment has a plurality (four in this embodiment) of covered electric wires W.
1, W2, W3, and W4 are joined at their respective terminal portions, and the terminal portions constitute a connection portion S. The welding surfaces 1 of the upper and lower resin chips 103 and 105
03a, 105a, only one end side of the insulated wires W1 to W4
Are formed at the leading ends 103b, 105b from which the welding surfaces 103a, 105b are formed.
A notch-shaped resin housing portion H that is recessed from 5a is formed.

The method of coupling the covered electric wires according to the third embodiment is basically basically the same as that of the first embodiment. That is, after the insulated wires W1 to W4 are entangled with each other so as to overlap with each other at the connection portion S, the connection portion S is sandwiched between a pair of resin chips 103 and 105 from above and below, and the connection portion S
Is pressed and vibrated from outside the upper and lower resin chips 103 and 105 between the horn 107 and the anvil 109 (see FIG. 9). Thereby, as shown in FIG.
After the conductor wire portions 1 to W4 are exposed at the connection portions S between the resin chips 103 and 105 and are brought into conductive contact with each other, the upper and lower resin chips 103 and 105 are melted, and both the resin chips 1 and 105 are melted.
The opposing welding surfaces 103a and 105a of 03 and 105 are welded to each other, and the periphery of the conductive wire portion 1 that is in conductive contact is covered with the resin chips 103 and 105. As shown in FIG. 9, the anvil 109 has a housing recess 111 for housing and supporting the resin chips 103 and 105,
A groove 113 into which the covered electric wires W1 to W4 are inserted is provided.

As shown in FIG. 11, this joint structure is such that the conductor wire portions 1 of the four covered electric wires W1 to W4 are connected to the terminal connecting portion inside the resin material 101 including the pair of resin chips 103 and 105. The covering portion 3 adjacent to the conductive wire portion 1 that is intertwined and conductively contacted at S is welded to the resin material 101. As a result, the periphery of the conductive wire portion 1 in conductive contact is entirely covered with the resin material 101 including the opposite sides 103c and 105c of the lead-out ends 103b and 105b, and the connection portion S is sealed by the resin material 101. I have.

Further, at the leading ends 103b, 105b of the resin chips 103, 105, the resin chips 103, 105
The molten resin R flowing out during the mutual welding is accommodated in the resin accommodating portion H and hardened, and the outer periphery of the conductor wire portion 1 of the covered electric wires W1 to W4 at the portion derived from the resin chips 103 and 105 is formed by the covering portion 3 and the molten resin. And is completely covered by R.

According to the third embodiment, even when the terminal portions of the plurality of covered electric wires W1 to W4 are electrically connected to each other,
The same effects as in the first embodiment can be obtained.

Further, since the covering portions 3 of the covered electric wires W1 to W4 which are intertwined with each other are scattered and melted, the conductor wire portions 1 exposed at the connection portions S are also intertwined with each other. Therefore, the conductor wire portions 1 can be brought into contact with each other at a plurality of locations, and the conduction characteristics can be further stabilized. Also, resin chips 103 and 105 (resin material 101)
Even if a peeling force acts on the insulated wires W1 to W4 outside the above, the stress corresponding thereto is dispersed and acts on the resin chips 103 and 105 at a plurality of entangled places.
The peeling force (peeling strength) is increased, and the resin chips 103 and 105 that have been welded are separated from each other.
03, 105 and the covered electric wires W1 to W4 can be reliably prevented from peeling, and the mechanical strength can be further increased.

Next, a fourth embodiment of the present invention will be described.

FIG. 12 is a perspective view showing a means for obtaining a joined structure of a covered electric wire according to the fourth embodiment before joining.
13 and 14 are perspective views showing a method of holding the coated electric wire on one resin chip, FIG. 15 is an external perspective view showing a state after joining by means of FIG. 12, and FIG. 16 is a main part of FIG. It is sectional drawing. The same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 12, in the fourth embodiment, a welding surface 125 is attached to one (lower) resin chip 125.
The support grooves 145 and 147 as wire holding portions for temporarily holding the insulated wires W1 and W2 before joining are provided on both sides of the wire a. Further, the insulated wires W1 and W2 are engaged with a pair of resin chips 123 and 125 so as to be engaged with each other. Engagement protrusion 13 as an engagement portion for maintaining the state before joining across connection portion S (see FIG. 14) of W2
7 and an engagement recess 139.

The welding surface 125a of the lower resin chip 125
And the leading ends 125b and 125c on both sides of the welding surface 125a
Standing wall portions 141 and 143 protruding above the welding surface 125a are provided integrally with the resin chip 125. The support grooves 145 and 147 are formed at two locations on each of the upright wall portions 141 and 143 on both sides. The groove diameter of each of the support grooves 145, 147 is formed to be slightly smaller than the outer diameter of the corresponding covered electric wire W1, W2.
By pushing W2, the covered electric wires W1, W2 are received and held in the support grooves 145, 147. In addition, lead-out ends 125b and 125c on both sides of the lower resin chip 125.
Is provided with a resin housing portion H similar to that of the first embodiment.

The lower surface side of the upper resin chip 123 has a welding surface 123a protruding corresponding to the lower welding surface 125a so as to conform to the upper surface shape of the lower resin chip 125.
And a lower resin chip 125 on both sides of the welding surface 123a.
And a lid portion 149 for closing the upper opening of the resin housing portion H.
The upper resin chip 123 is not provided with the resin housing portion H.

On both sides of the upper resin chip 123 in the width direction, a flexible arm 135 extends downward intersecting with the welding surface 123a.
5 is protruded inside the front end. The engagement recess 139
Is formed in a notch at the lower part of the side surface intersecting with the welding surface 125a of the lower resin chip 125. Note that the flexible arm 135, the locking projection 137, and the engagement recess 139 are
Only one side in the width direction is shown, and the other side is not shown.

The method of joining the covered electric wires according to the fourth embodiment is such that, in addition to the joining method of the first embodiment, the covered electric wires W1 and W2 are temporarily held by the resin chip 125 before joining. is there. That is, as shown in FIG. 13, first, one side of the covered electric wires W1 and W2 is accommodated and held in the support groove 145 of the lower resin chip 125, and
After the wires 1 and W2 are entangled with each other so as to overlap at the connection portion S, the other sides of the covered wires W1 and W2 are received and held in the support grooves 145 and 147, as shown in FIG. As a result, the two covered electric wires W1 and W2 are temporarily held by the lower resin chip 125 in a state of being overlapped at the connection portion S.

Next, the upper resin chip 123 is put on the upper surface of the lower resin chip 125 so as to sandwich the connection portion S between the welding surfaces 123 a and 125 a, and the locking projection 137 is engaged with the engagement recess 139. Let it. As a result, the upper and lower resin chips 123 and 125 are in a state of being attached to the joint S in advance. In this state, the upper resin chip 123
Is slightly floated from the lower resin chip 125 by the amount of the covered electric wires W1 and W2 sandwiched therebetween.

Then, the connecting portion S is connected to the upper and lower resin chips 1.
Horn 107 and anvil 109 from outside 23 and 125
(See FIG. 12). As a result, as shown in FIGS. 15 and 16, the conductor wire portions 1 of the covered electric wires W1 and W2 are connected to the connection portions S between the resin chips 123 and 125.
Exposed and brought into contact with each other, the upper and lower resin chips 1
23 and 125 are melted and both resin chips 123 and 125 are melted.
The welding surfaces 123a and 125a facing each other are welded to each other, and the area around the conductive wire portion 1 that has been brought into conductive contact is surrounded by the resin chip 12.
3, 125. The anvil 129 has a resin chip 12 as shown in FIG.
An accommodation recess 131 for accommodating and supporting 3,125, and a window 133 through which covered wires W1 and W2 are inserted are provided.

As shown in FIG. 16, in this joint structure, the conductor wires 1 of the covered electric wires W1 and W2 are entangled with each other at the connection portion S inside the resin material 121 composed of the pair of resin chips 123 and 125 so as to conduct. The covering portion 3 adjacent to the conductor wire portion 1 that has come into contact with the conductive contact is welded to the resin material 121. As a result, the periphery of the conductive wire portion 1 that is in conductive contact is entirely covered with the resin material 121, and the connection portion S is sealed with the resin material 121.

Further, at the leading end portions 123b, 123c, 125b, and 125C of the resin chips 123 and 125, the molten resin R flowing out when the resin chips 123 and 125 are welded to each other flows through the support grooves 145 and 147 (see FIG. 12). The resin chips 123, 12
5, the outer periphery of the conductor wire portion 1 of the covered electric wires W1, W2 is completely covered by the covering portion 3 and the molten resin R.

According to the fourth embodiment, in addition to the same effects as those of the first embodiment, before the horn 127 and the anvil 129 are joined, the covered electric wires W 1 and W 2 are connected to the lower resin chip 125. Since the temporary holding is performed, the positioning of the connection portion S with respect to the lower resin chip 125 can be performed more easily and reliably than in the first embodiment in which the connection portion S is positioned within the support recess of the anvil.

Before joining, the upper and lower resin chips 12
3, 125 can be attached to the connection portion S in advance, so that the joining workability is improved as compared with the first embodiment in which the upper and lower resin chips are sequentially overlapped and joined in the support recess of the anvil. I do.

Further, the locking projection 137 and the engagement recess 139
The resin chips 123 and 125 after welding.
It becomes more difficult for the pieces to be separated from each other, and the mechanical strength at the joint S is enhanced.

Further, the anvil 129 is provided with a covered electric wire W 1,
There is no need to provide a groove for positioning W2,
A window 13 of a size that allows the insertion of the insulated wires W1, W2.
3, the same anvil 129 can be used even if the number of covered electric wires W1 and W2 to be joined is different as long as the dimensions and shape of the resin chips 123 and 125 are not changed.

Further, since the covering portions 3 of the insulated wires W1 and W2 which are intertwined with each other are scattered and melted, the current-carrying characteristics are further stabilized and the mechanical strength is further increased as in the third embodiment. Can be enhanced.

In each of the first to third embodiments, the resin accommodating portions H are provided on both the upper and lower resin chips. However, it is not always necessary to provide the resin accommodating portions H on both of the resin chips. At least one of them may be provided.

[0087]

As described above, according to the first to third aspects of the present invention, there is no need to remove the covering portion in advance, the conductive connection operation can be easily performed, and the cured resin is obtained. The chip provides high mechanical strength and sufficient insulation at the joints, stabilizes the current-carrying characteristics, achieves high versatility, and enhances the welding force between the resin chips and improves the conductor wire area. It is possible to easily achieve the improvement of the covering property.

According to the invention described in claim 4, according to claim 2,
In addition to the effects of the invention described in (1), the positioning of the connection portion with respect to the resin chip can be performed easily and reliably.

According to the fifth aspect of the invention, in addition to the effects of the second or fourth aspect of the invention, it is possible to improve the joining workability and the mechanical strength after the joining.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a means for obtaining a jointed structure of a covered electric wire according to a first embodiment (a state before joining is started).

FIG. 2 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to the first embodiment (a state after the start of bonding).

FIGS. 3A and 3B are schematic diagrams showing a cross section taken along arrow A in FIG. 2 and showing a state immediately after joining is started, and FIG. 3B shows a state after joining.

4A and 4B are perspective views showing a joint structure of the covered electric wire according to the embodiment, in which FIG. 4A shows an external appearance, and FIG. 4B shows an internal structure.

FIG. 5 is a perspective view showing a resin chip having no resin accommodating portion.

FIGS. 6A and 6B are schematic diagrams of a bonding structure when a resin chip having no resin accommodation portion is used, wherein FIG. 6A is a perspective view and FIG. 6B is a side view.

FIG. 7 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to a second embodiment.

FIG. 8 is an exploded perspective view showing a state before joining of a joined structure of a covered electric wire according to a third embodiment.

FIG. 9 is a perspective view showing a joint structure of a covered electric wire according to a third embodiment and a means for obtaining the structure.

FIG. 10 is a sectional view of a main part of FIG. 8;

FIG. 11 is a sectional view of a main part of FIG. 9;

FIG. 12 is a perspective view showing a means for obtaining a joined structure of a covered electric wire according to a fourth embodiment before joining.

FIG. 13 is a perspective view showing a method of holding a covered electric wire on one resin chip.

FIG. 14 is a perspective view showing a method of holding a covered electric wire on one resin chip.

FIG. 15 is an external perspective view showing a state after joining by means of FIG. 12;

FIG. 16 is a sectional view of a main part of FIG.

FIG. 17 is a perspective view showing a conventional example.

18A and 18B are side views of FIG. 17, wherein FIG. 18A shows a state before joining and FIG. 18B shows a state after joining.

FIG. 19 is a perspective view showing another conventional example.

FIG. 20 is a side sectional view of FIG. 19;

FIG. 21 is a perspective view showing another conventional example.

FIG. 22 is a perspective view showing another conventional example, (a) shows a state before joining, (b) shows a joining state by a joint terminal, (c) shows a state at the time of thermocompression bonding, (D) shows the wound state of the insulating material.

FIG. 23 is a cross-sectional view showing another conventional example, in which (a) shows a side cross-sectional view and (b) shows a front cross-sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductor wire part 3 Coating part 53 Resin chip 53a Welding surface 53b Outgoing end 53c Outgoing end 55 Resin chip 55a Welding surface 55b Outgoing end 55c Outgoing end 81 Terminal fittings (members which are electrically connected to each other) 83 Resin chip 83a Welding Surface 83b Outgoing end 85 Resin chip 85a Welding surface 85b Outgoing end 103 Resin chip 103a Welding surface 103b Outgoing end 105 Resin chip 105a Welding surface 105b Outgoing end 123 Resin tip 123a Welding surface 123b Outgoing end 123c Outgoing end 125 Resin chip 125a Welding surface 125b Outgoing end 125c Outgoing end 137 Engagement projection (engagement part) 139 Engagement concave part (engagement part) 145 Support groove (wire holding part) 147 Support groove (wire holding part) W1 Insulated wire (Members that are conductively connected to each other) Connecting members) W3 covered electric wire (together conductively connected to members) W4 covered electric wire (together conductively connected to members) S connecting portion H resin receiving portion R molten resin

Continued on the front page (56) References JP-A-7-320842 (JP, A) JP-A-4-92377 (JP, A) JP-A-4-22961 (JP, A) (58) Fields investigated (Int .Cl. ⁷ , DB name) H01R 43/00-43/02 H01R 4/70 H01R 4/02

Claims (5)

(57) [Claims] At least one of the members that are conductively connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin-made covering portion. After the first step of sandwiching between resin chips, the covering portion is scattered and melted, and the two members are brought into conductive contact at the connection portion by applying pressure from the outside of the resin chip,
A second step of welding the pair of resin chips to each other to seal the connecting portion, wherein the coated wire is led out to at least one of the pair of resin chips. A resin accommodating portion formed so as to be recessed from an end surface with respect to a welding surface with a counterpart chip is provided. A method for joining covered electric wires, characterized by curing. 2. At least one of the members that are electrically connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion. After being sandwiched by resin chips, the coating portion is scattered and melted, and the two members are brought into conductive contact at the connection portion by applying pressure from the outside of the resin chip, and then the pair of resin chips are welded to each other to form the connection portion. A sealed structure of a covered electric wire, wherein at least one of the pair of resin chips is formed so as to be recessed from a welding surface with a counterpart chip at a leading end from which the covered electric wire is led out, A joint structure of a covered electric wire, wherein a resin accommodating portion for accommodating and hardening a molten resin flowing out when resin chips are welded to each other is provided. 3. The joint structure of a covered electric wire according to claim 2, wherein the resin accommodating portion is formed in a notch shape. 4. The joint structure of a coated electric wire according to claim 2, wherein at least one of the pair of resin chips is provided with a wire holding portion for temporarily holding the coated electric wire before joining. Joint structure of insulated wire. 5. The joint structure for a coated electric wire according to claim 2, wherein the pair of resin chips is engaged with each other to maintain a state before the joint with the connecting portion interposed therebetween. A joint structure of a covered electric wire, wherein an engagement portion is provided.