JP3110954B2 - Method of joining covered electric wires and joining structure of covered electric wires - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining a covered wire and a joining structure of the covered wire when the covered wire is electrically connected to another member.

[0002]

2. Description of the Related Art As modes for electrically connecting a covered wire W to another member, there are a joint between the covered wire W and a terminal, a joint between the covered wires W, and a joint between a covered wire W and a connector.

Conventional methods for joining a covered electric wire to a terminal include crimping, pressure welding (see Japanese Utility Model Publication No. 60-37814), soldering, and ultrasonic welding (Japanese Unexamined Patent Publication No. 2-10609).
No. 2) is known.

As shown in FIGS. 25 and 26, bonding by crimping is performed by conductor crimping pieces 13 erected on both sides of a connection portion S of a terminal fitting 11 so as to face each other. 26A, the covering portion 3 is removed at the connection portion S at the end of the covered electric wire W to expose the conductor wire portion 1 as shown in FIG. As shown in b), the conductor caulking piece 13 is caulked. Terminal fitting 11
In addition, the cover caulking piece 15 for increasing the mechanical connection strength is provided.
The conductor crimping piece 13 and the covering crimping piece 15 allow the conductor wire portion 1 and the covering portion 3 to be respectively connected to the terminal fittings 1.
1 is crimped.

As shown in FIGS. 27 and 28, the joining by press contact is performed by a press contact blade 19 provided at a connection portion S of the press contact terminal 17.
By press-fitting the connection portion S of the covered electric wire W into the slot 21, the covering portion 3 is peeled off by the press-contact blade 19, and the press-contact blade 19 is brought into conductive contact with the conductor wire portion 1.

[0006] In joining by soldering or ultrasonic welding,
As shown in FIG. 29, the covering portion 3 is removed at the connection portion S at the end of the covered electric wire W to expose the conductor wire portion 1, and the exposed conductor wire portion 1 is soldered to the connection portion S of the terminal fitting 23. Conductive connection is made by welding using ultrasonic welding.

[0007] Further, as a conventional method of joining two covered electric wires W, joining by a joint terminal or joining by thermocompression bonding (see Japanese Patent Application Laid-Open No. 3-1462) is known.

[0008] In the joint by the joint terminal, FIG.
(A) As shown in FIG.
Is removed to expose the conductor wire portion 1, and as shown in FIG. 30B, the joint terminals 25 are crimped to the exposed conductor wire portions 1 by crimping, and both are electrically connected.

In the joining by thermocompression bonding, as shown in FIG. 30 (c), the covering portion 3 is removed at the connecting portion S of the both covered electric wires W to expose the conductor wire portion 1, and the exposed conductor wire portions 1 are connected to each other. Are superposed and sandwiched between the electrodes 27 and 29, and the conductor wires 1 are thermocompression-bonded to each other by conducting and heating in a pressurized state, and both are electrically connected. As a method of heating the conductor wire portion 1, a method utilizing frictional heat due to ultrasonic vibration is also known.

[0010] When bonding is performed by the joint terminal 25 or thermocompression bonding as described above, a tape or the like is applied to the outer periphery of the connection portion S as shown in FIG. Of insulating material 31 is wound.

As a conventional method for joining the covered electric wire W and the connector, joining by ultrasonic welding is known (see JP-A-4-61777).

In this connection, as shown in FIGS. 31 (a) and 31 (b), a lower die 35 and an upper die 37 constituting the connector 33 are formed.
Are provided with a groove 39 and a ridge 41 fitted to the groove 39, and the connection S of the covered electric wire W is superimposed on the connection S of the conductive connection member 43 arranged in the groove 39 of the lower mold 35, and The protrusions 41 of the upper die 37 are fitted into the groove portions 39, and ultrasonic vibration is applied to the connection portions S from outside the fitted upper and lower dies 37, 35, thereby melting the coating portion 3 of the coated electric wire W to form a conductor. The wire portion 1 and the conductive connection member 43 are brought into conductive contact.

[0013]

However, the coated electric wire W
When the connection between the wire and the terminal is performed by crimping, soldering, or ultrasonic welding, it is necessary to remove the covering portion 3 of the covered electric wire W in advance to expose the conductor wire portion 1, and the operation is complicated. On the other hand, the joining by pressure welding does not require the removal of the covering portion 3, but the mechanical strength of the connecting portion S is inevitably reduced as compared with crimping or soldering, so that the joining operation is simplified and the mechanical strength is reduced. It was difficult to achieve both improvements.

If the two insulated wires W are joined to each other by the joint terminal 25 or thermocompression bonding, the work becomes complicated because the covering portion 3 needs to be removed as described above. Also,
In order to easily perform the work of crimping and thermocompression bonding of the joint terminal 25, it is necessary to set the range L in which the covering portion 3 is removed to a certain extent, and to wind the insulating material 31 in the range in which the covering portion 3 is removed. Since it is necessary to perform the winding longer than L, the wrapping range of the insulating material 31 becomes larger than the contact portion between the conductor wires 1, and the flexibility of the insulated wire W is impaired, and the degree of freedom in wiring is reduced. There was a fear that it would. Further, in the thermocompression bonding, the mechanical strength of the connection portion S was inevitably reduced as compared with the joint terminal 25.

When the sheathed wire W and the connector 33 are joined by ultrasonic welding shown in FIG.
5 and the upper die 37 require a specially shaped connector 33 provided with a groove 39 and a ridge 41, so that the connector 33 is not always applicable to all types of connectors. There is a disadvantage that it cannot be easily applied to the joining of W and lacks versatility.

In view of the above circumstances, the present invention can simplify the joining operation and improve the mechanical strength at the same time, and can secure a sufficient insulating property by suppressing the range required for the joining. It is an object of the present invention to provide a method of joining a covered electric wire and a jointed structure of a covered electric wire which can be easily applied to various kinds of joining such as joining of a covered electric wire and a terminal, joining of covered electric wires, etc., and obtaining high versatility. I do.

[0017]

According to the first aspect of the present invention, at least one of the members which are electrically connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion. A first method of overlapping both members at a connection portion and sandwiching the overlapped connection portion between a pair of resin chips.
And, after the coating portion is scattered and melted, and the two members are brought into conductive contact at the connection portion by applying pressure from the outside of the resin chip, the pair of resin chips are welded to each other to form the connection portion. And a second step of sealing.

According to a second aspect of the present invention, there is provided the method for joining a covered electric wire according to the first aspect, wherein the second step comprises the steps of:
A molten resin chip is filled between core wires of adjacent conductor wire portions except for the connection portion.

According to a third aspect of the present invention, there is provided the method for bonding a covered electric wire according to the first or second aspect, wherein
In the step, the connecting portion is sandwiched between a pair of resin chips provided with a brazing material on at least one side, and in the second step, the brazing material is melted by heat generated when the resin chip is melted, and the conductive contact is formed. It is characterized in that the two members are brazed at the connected portions.

According to a fourth aspect of the present invention, there is provided the method for bonding a covered electric wire according to the third aspect, wherein the brazing material is embedded in a resin chip.

[0021]

[0022]

[0023]

According to a fifth aspect of the present invention, there is provided the method for joining a covered electric wire according to any one of the first to fourth aspects,
In the second step, the pair of resin chips is sandwiched from above and below in a direction in which the two members overlap, and the connection portion is pressed and vibrated from the outside of the resin chip between a horn and an anvil,
The direction of the pressurizing and the vibrating may be set to the overlapping direction of the two members.

According to a sixth aspect of the present invention, there is provided the method for joining a covered electric wire according to any one of the first to fourth aspects,
In the second step, the pair of resin chips is sandwiched from above and below in a direction in which the two members overlap, and the connection portion is pressed and vibrated from the outside of the resin chip between a horn and an anvil,
The direction of the pressurization is a direction in which the two members are overlapped, and the excitation has a vibration component in the overlap direction and a vibration component in a direction orthogonal to the overlap direction.

[0026]

[0027]

[0028]

According to the first aspect of the present invention, the covering member is scattered and melted and the pressure is applied from the outside of the resin chip in a state where the two members are overlapped at the connection portion, and the overlapped connection portion is sandwiched between a pair of resin chips. Thereby, since both members can be brought into conductive contact at the connection portion, there is no need to remove the coating portion in advance,
Both members can be electrically connected by a simple operation.

After the two members are brought into conductive contact at the connection portion, the pair of resin chips are welded to each other to seal the connection portion, so that the resin chip that has been welded and cured has high mechanical strength at the connection portion. Is obtained.

Further, since the pair of resin chips need only be dimensioned so that the connecting portion to be in conductive contact can be sandwiched from above and below, the range required for joining can be reduced, and the connecting portion is sealed by the resin chip. Therefore, sufficient insulation can be ensured.

Further, such a joining method is a relatively simple method of sandwiching the overlapped connection portion between a pair of resin chips, melting the coating portion, and applying pressure from the outside of the resin chip. Since the shape and the like of the mating member are not particularly limited, it can be easily applied to various kinds of joining such as joining of a covered electric wire and a terminal and joining of covered electric wires, and high versatility can be obtained.

According to the second aspect of the present invention, in addition to the operation of the first aspect, in the second step, the molten resin chip is filled between the core wires of the adjacent conductor wires except for the connection portion. The gap formed between the core wires of the covered electric wires is blocked by the cured resin chip, and a water stopping effect can be obtained inside the covered electric wires.

According to the third aspect of the present invention, in addition to the operation of the first or second aspect, in the second step, a resin chip provided with a brazing material is used, and the resin chip is melted. Since the brazing material is melted by the heat generated at the time of soldering, and the two members are brazed at the connection portion that has been brought into conductive contact, higher electrical strength can be obtained at the connection portion by a simple operation without particularly requiring a brazing operation.

According to the invention described in claim 4, according to claim 3,
In addition to the operation of the invention described, since the brazing material is embedded in the resin chip, in the second step, after the covering portion is scattered and melted, both members are brought into conductive contact, and after the connection portion is covered by the resin chip, The brazing material is exposed and melts inside the resin chip. Therefore, it is possible to accurately braze the connected portion that has been brought into conductive contact, and it is possible to reliably prevent the brazing material from flowing out of the resin chip.

[0035]

[0036]

[0037]

[0038]

[0039]

According to the fifth aspect of the present invention, when the pair of resin chips are sandwiched from above and below in the direction in which the two members overlap, and the connecting portion is pressed and vibrated from the outside of the resin chip between the horn and the anvil, the resin chip and the coating are covered. Since the parts are melted and both members are brought into conductive contact at the connection part and the resin chips are welded to each other,
By such a simple method, it is possible to obtain the same operation as the invention according to any one of claims 1 to 4.

Further, since the pressing direction of the resin chip is set to the overlapping direction of the two members, when the connecting portion is pressed, the molten coating portion is extruded outward from the center side of the resin chip, and the conductor wire portion is formed. It is better exposed and a reliable conductive contact state is obtained.

Further, since the direction of the vibration applied to the connecting portion is set to the overlapping direction of the two members in the same manner as the pressing direction, a good welded state of the resin chip is obtained, and the covering portion is moved from the center side of the resin chip. The outward pushing action is increased.

According to the sixth aspect of the present invention, when the pair of resin chips is sandwiched from above and below in the direction in which the two members overlap, and the connection portion is pressed and vibrated from the outside of the resin chip between the horn and the anvil, the resin chip and the coating are covered. Since the parts are melted and both members are brought into conductive contact at the connection part and the resin chips are welded to each other,
By such a simple method, it is possible to obtain the same operation as the invention according to any one of claims 1 to 4.

Further, since the pressing direction of the resin chip is set to the overlapping direction of the two members, when the connecting portion is pressed, the molten coating portion is extruded outward from the center side of the resin chip, and the conductor wire portion is formed. It is better exposed and a reliable conductive contact state is obtained.

Further, the vibration applied to the connection portion has a vibration component in the overlapping direction and a vibration component in the direction orthogonal to the overlapping direction, so that the resin component is favorably welded by the vibration component in the overlapping direction. A state is obtained, the action of pushing the covering portion outward from the center side of the resin chip is increased, and the metallic connection between the two members at the connection portion is enlarged by a vibration component orthogonal to the overlapping direction.

[0046]

[0047]

[0048]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment according to the first or fifth aspect of the present invention will be described below with reference to the drawings.

1 and 2 are perspective views showing a means for obtaining a joint structure of a covered electric wire according to the first embodiment. FIG. 1 shows a state before the start of joining, and FIG. 2 shows a state after the start of joining. Is shown. FIG. 3 is a schematic view showing a cross section taken along arrow A in FIG. 2, wherein FIG. 3A shows a state immediately after the start of joining, and FIG.
Indicates the state after joining.

As shown in FIG. 1, in the first embodiment, two covered electric wires W1 and W2 in which the outer periphery of a conductor wire portion 1 is covered with a covering portion 3 made of resin are joined at their intermediate connection portions S. The two insulated wires W1, W2 are members that are conductively connected to each other.

First, the coated electric wires W1,
The method of joining W2 will be described. Two insulated wires W1
, W2, a pair of resin chips 53 and 55 as a resin material 51 and a horn 57 for generating ultrasonic vibration.
At the time of joining, the covered electric wires W1, W2 and the resin chip 53,
An anvil 59 supporting 55 is used. Anvil 59
Includes a base 61 and a support portion 63 protruding from the base 61, and the support portion 63 is formed in a substantially cylindrical shape. The support portion 63 has an inner diameter portion 65 that is open on the side opposite to the base (the upper side in the figure), and a pair of groove portions opposing each other across the substantially center of the inner diameter portion 65 on a peripheral wall 63a of the support portion 63. 67, 69 intersect, and are provided in two sets (almost at 90 °). The four grooves 67, 69 open on the same side as the inner diameter portion 65, and are formed along the projecting direction of the support portion 63, and the opposing grooves 67, 69 communicate with each other via the inner diameter portion 65. ing. The pair of resin chips 53 and 55 are formed in a circular plate shape having an outer diameter slightly smaller than the inner diameter portion 65 of the anvil 59, and the end surface 71 a of the head 71 of the horn 57 is substantially the same as the resin chips 53 and 55. Or it is formed in a circular shape having a slightly smaller outer diameter. The material of the resin chips 53 and 55 is acrylic resin, ABS (acrylonitrile-
Butadiene-styrene copolymer) resin, PC (polycarbonate) resin, PVC (polyvinyl chloride) resin, PE (polyethylene) resin and the like.

To join the two covered electric wires W1 and W2, the two covered electric wires W1 and W2 are overlapped at the connection portion S, and the overlapped connection portion S is sandwiched between a pair of resin chips 53 and 55 from above and below.
Specifically, one (lower) side is attached to the inner diameter portion 65 of the anvil 59.
, One of the covered wires W1 is inserted into one of the opposed grooves 67 from above, and the other covered wire W2 is further inserted from above into the other opposed grooves 69.
And finally the other (upper) resin chip 53 is inserted. The two insulated wires W1 and W2 are arranged such that their connection portions S intersect at the center of the inner diameter portion 65, whereby
As shown in FIG. 3A, the connection portion S is sandwiched from above and below in the overlapping direction at substantially the centers of the upper and lower resin chips 53 and 55.

Next, the covering portion 3 of the connection portion S is scattered and melted, and the conductor wire portions 1 of both the covered wires W1 and W2 are brought into conductive contact with each other at the connection portion S by pressurization from outside the resin chips 53 and 55. After this, the pair of resin chips 53 and 55 are welded to each other to seal the connection portion S.

Specifically, the head 71 of the horn 57 is inserted from above the upper (other) resin chip 53 inserted last, and the connecting portion S is connected to the horn from outside the upper and lower resin chips 53 and 55. Pressure and vibration are applied between 57 and anvil 59. The pressurization of the connection portion S is performed by pressing the horn 57 toward the anvil 59, and the direction of pressurization coincides with the overlapping direction of the both covered electric wires.

When the resin members 51 are welded to each other by ultrasonic vibration, it is best to vibrate the resin members 51 in a direction substantially perpendicular to the joining surface of the resin members 51. The direction of vibration applied to both resin chips 53,
55 is set in a direction intersecting the opposing surfaces 53a, 55a, that is, in a direction coinciding with the overlapping direction of the two covered electric wires W1, W2 (arrow X direction in the figure). Be sent.

When the connecting portion S is pressurized and vibrated in such a state, the covering portion 3 is melted first, and the conductor wire portion 1 of the both covered electric wires W1, W2 is connected to the connecting portion S between the resin chips 53, 55. Exposure. At this time, since the connection portion S is pressed from above and below, the melted coating portion 3 is extruded outward from the center side of the resin chips 53 and 55, and the conductor wire portion 1 is better exposed, and Are surely brought into conductive contact. The direction of vibration applied to the connection S is the same as that of the pressurizing direction.
Since it is set in the overlapping direction of W2, the action of pushing the coating portion 3 outward from the center side of the resin chips 53 and 55 is increased.

When the pressurization and the vibration of the connection portion S are continued even after the coating portion 3 is melted, the resin chips 53 and 55 are melted, and the surfaces of the resin chips 53 and 55 facing each other (the upper resin chip 53). Lower surface 53a and upper surface 55a of lower resin chip 55)
Is welded, and the resin chips 53 and 55 are welded to the outer peripheral surface of the covering portion 3 adjacent to the conductive wire portion 1 in conductive contact. As a result, the area around the conductive wire portion 1 that is in conductive contact is covered with the resin chips 53 and 55.

After the melting of the resin chips 53 and 55, the application of pressure and vibration by the horn 57 is stopped, and the covering portion 3 and the resin chips 53 and 55 are cured, and the joining operation is completed.

Next, a description will be given of a joint structure of a covered electric wire of the first embodiment obtained by the above-described joining method. FIG. 4 is a perspective view showing a joint structure of the covered electric wire of the first embodiment,
(A) shows the appearance, and (b) shows the internal structure.

As shown in FIG. 6A, this joint structure is such that two covered electric wires W 1, W 2 intersect at a connection portion S inside a resin material 51 consisting of a pair of resin chips 53, 55. Thus, at the connection portion S, the conductor wire portions 1 of the both covered electric wires W1 and W2 are exposed and are in conductive contact. The covering portion 3 adjacent to the conductive wire portion 1 in conductive contact is welded to the resin material 51, whereby the periphery of the conductive wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed by the resin material 51. ing.

Next, the relationship between the material of the resin chips 53 and 55 and the conductivity will be described.

The conductivity is determined by preparing a plurality of samples each having the above-described bonding structure for each material, obtaining a contact resistance (initial resistance) R for each sample, and determining the average value and the magnitude of variation.

As to the conduction stability, as shown in FIG. 5 (a), the insulated wires W1, W
5 by violently tapping the connection S (resin material 51).
The contact resistance (impact resistance after impact) after applying an impact to the insulated wires W1, W2 and the connecting portion S by performing the operation of grasping and shaking the both insulated wires W1, W2 as shown in (b).
Ra is obtained, and this value is compared with the initial resistance R.
It can be determined that the smaller the difference between the initial resistance R and the resistance after impact Ra, the better the conduction stability. Initial resistance R and after impact resistance Ra, the following equation is calculated according to _{R = R 0 -r × (x} + y) Ra = Ra 0 -r × (x + y). R ₀ and Ra ₀ in the _equation are actual resistance values (measured values) measured at the ends p and q of the covered electric wires W 1 and W 2 distant from the connection portion S as shown in FIG.
Is the conductor resistance value per unit length of the used conductor wire portion (CVS 0.5 sg) (3.27 m per 100 mm)
Ω) and x + y are the sum of the line lengths from the connection portion S to the ends p and q of the covered wires W1 and W2 as shown in FIG. The material of the resin chips 53 and 55 is acrylic resin,
Five types of PC resin, ABS resin, PE resin, and PVC resin are used.

According to the results, the acrylic resin has a low contact resistance as a whole, a very small variation between samples, and a very small difference between before and after the impact of 1 mΩ or less. It turns out that the state is good and stable.

Among the other four types, the PC-based resin has a good and stable conduction state similarly to the acrylic-based resin. In other cases, the ABS-based resin is inferior in characteristics to the acrylic-based and PC-based resins. The variation is the least, the change before and after the impact is small, and the conduction state is good and stable. Among the above five types, the PE resin has a high average contact resistance, a large variation, and a poorest conduction state.

When the molten state of the five types of resin materials is compared, the acrylic resin transmits the ultrasonic vibration most easily. The lower resin chip 55 is also vibrated similarly to the upper resin chip 53, and Resin chips 53 and 55 are almost crushed. On the other hand, in the other three types of resins, the upper and lower resin chips 53 and 55 are not evenly crushed, and the upper resin chip 53 is crushed more than the lower resin chip 55. In the upper resin chip 53, the upper surface 53 b in contact with the horn 57 is crushed more than the lower surface 53 a joined to the lower resin chip 55.

The PE resin is composed of upper and lower resin chips 53, 5
The resin material 51 crushed from between the opposing lower surfaces 53a and 53b and the upper surface of the 5 is exposed.

The ABS resin and the PVC resin are crushed like a burr on the upper surface 53b of the upper resin chip 53 which comes into contact with the horn 57.

It can be seen from this that the acrylic resin is the best in crushing the upper and lower resin chips 53 and 55, and is excellent in appearance and insulation.

When the above results are put together, practicality is recognized for all resins in terms of conductivity and conduction stability, but acrylic resins and PC resins are particularly suitable, including appearance and insulating properties. Then, it turns out that the ABS resin is suitable.

Next, the relationship between the welding height and the electrical conductivity and the relationship between the welding height and the mechanical strength will be described. Here, the welding height refers to the overall height of the upper and lower resin chips that are welded in the overlapping direction.

The continuity is determined by preparing 20 samples each having the above-mentioned bonding structure and different welding heights, determining the contact resistance for each sample, and determining the average value and the magnitude of variation. The specific method of calculating the contact resistance is the same as the method of calculating the initial resistance R.

The mechanical strength is determined in the same manner by preparing ten samples each having a different welding height, performing a rupture test on each sample to obtain a fixing force, and determining the average value.

The welding height is not changed by changing the setting of the vibration time by the ultrasonic vibration, but by stopping the transmission of the ultrasonic vibration when the specified welding height is reached.
2.9mm, 3.1mm, 3.3mm, 3.4mm, 3.5mm,
Eight types of 3.6 mm, 3.7 mm, and 3.8 mm samples were prepared. As other conditions, the pressure (welding pressure) for pressing the horn is 1 kg / cm ² , the resin chip is an acrylic resin, a circular plate with a diameter of 5 mm and a thickness of 2 mm, and the coated electric wire is C
AVVS−0.5 sq, and the line length L ₀ shown in FIG.
20 mm and its wire resistance is 2 mΩ.

FIG. 7 is a table showing the results of the determination of the adhesion force for each of the welding heights of the acrylic resin. FIG. 8 is a graph showing the results of the determination of the average value of the adhesion force for each of the welding heights. In the values of FIG. 7, those with a mark before the numerical value indicate those in which the conductor wire portion 1 was pulled out from the connection portion S and were broken, and those with a blank before the numerical value indicate the outside. The exposed insulated wires W1, W2 are broken. The values in the lowermost column indicate the standard deviation.

According to the result, even if the welding height is different, almost the same fixing force can be obtained, the value is high, and sufficient mechanical strength can be obtained.

As described above, according to the joining method of the first embodiment, the covered electric wires W1 and W2 are overlapped at the connecting portion S, and the connecting portion S is connected to the pair of resin chips 53 and 5.
In the state of being sandwiched by 5, the coated wires W1 and W2 can be brought into conductive contact at the connecting portion S only by scattering and melting the coated portion 3 while applying pressure from the outside of the resin chips 53 and 55. It is not necessary to remove the covering portion 3 in advance, and a conductive connection can be obtained with a simple operation.

According to the joining method and the joining structure, after the insulated wires W1 and W2 are brought into conductive contact at the connecting portion S, the upper and lower resin chips 53 and 55 are welded to each other to seal the connecting portion S. Therefore, the resin chip 5 which is welded and hardened
3, 55, a high mechanical strength is obtained at the connection portion S.

Further, since the resin chips 53 and 55 need only be dimensioned so as to sandwich the connecting portion S to be in conductive contact from above and below, the range required for joining can be suppressed to a small extent, and the connecting portion S is formed of a resin chip. Since they are sealed by 53 and 55, sufficient insulation can be secured.

Therefore, due to the high mechanical strength and the sufficient insulation, the current-carrying characteristics between the covered electric wires W1 and W2 at the connection portion S can be stabilized.

Further, such a bonding method uses the overlapping connecting portion S
Are sandwiched between the resin chips 53, 55, and the resin chips 53, 55
Is a relatively simple method of pressurizing and vibrating the connecting portion S between the horn 57 and the anvil 59 from the outside, and the joining method and the joining structure are the same as those of the mating electric wire W1 which are conductively connected. Since the shape of the member (the other insulated wire W2 in this embodiment) is not particularly limited, it can be easily applied to various kinds of joining such as joining of the insulated wires W1, W2 and terminals, and is highly versatile. Property is obtained.

Further, the pair of resin chips 53 and 55 are sandwiched from above and below in the direction in which the covered electric wires W1 and W2 are overlapped, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from outside the resin chips 53 and 55. And the direction of pressurization is
1 and W2, so that when the connection S is pressed,
The melted coating portion 3 is extruded outward from the center of the resin chips 53 and 55, so that the conductor wire portion 1 is better exposed and a reliable conductive contact state is obtained. Also, since the direction of the vibration applied to the connection portion S is the same as the direction in which the covered wires W1 and W2 are overlapped in the same direction as the pressing direction, a good welding state of the resin chips 53 and 55 is obtained, and the covering portion 3 is pressed. Outgoing action is increased.

Further, in the first embodiment, by making the resin material 51 transparent, the conductive contact state of the conductor wire portion 1 can be viewed from outside the resin material 51, facilitating quality control and improving quality control. The quality can be improved.

[0084] Next, the second according to the invention described in claim 2
An embodiment will be described.

FIG. 9 is a cross-sectional view of a main portion showing a portion adjacent to a connection portion of a covered electric wire according to the second embodiment. FIG. 9A shows a state before joining (PP cross section in FIG. 3). (B) shows a state after joining (a QQ cross section in FIG. 3). The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the second embodiment, the covered electric wires are basically joined in substantially the same manner as in the first embodiment. However, as shown in FIG. 3, the connection portions S are sandwiched between the resin chips 53 and 55. At the time of welding, as shown in FIG. 9B, the molten resin chip 5 is inserted between the plurality of core wires 1a constituting the conductor wire portion 1 in the adjacent conductor wire portion 1 except for the connection portion S.
3,55 are filled. As the resin chips 53 and 55, those having relatively low viscosity at the time of melting are used so that the resin chips 53 and 55 can be easily filled between the core wires 1a.

According to the second embodiment, in addition to the actions and effects of the first embodiment, as shown in FIG.
, W2, and the gap C formed between the core wire 1a and the core wire 1a, as shown in FIG.
As a result, water is stopped inside the covered electric wires W1 and W2. Thus, for example, one end of the insulated wires W1 and W2 is connected to a portion that requires waterproofing (waterproofing portion), and the other end is connected to a portion that does not require waterproofing (non-waterproofing portion). In some cases, depending on the current state of the capillary, water or the like flows into the inside of the covered electric wires W1, W2 from the other end side, and the covered electric wire W1
, W2, the outflow of water or the like to the one end is prevented by the water stopping effect, so that the waterproof end of the one end can be secured without making the other end a waterproof structure. it can. That is, when connecting both ends of the insulated wires W1 and W2 to the waterproof portion and the non-waterproof portion, the waterproofness in the waterproof portion is secured by a simple and inexpensive method and structure without making the non-waterproof portion a waterproof structure. can do.

Next , the third aspect of the present invention will be described.
An example will be described.

FIG. 10 is a sectional view of a main part showing a means for obtaining the method of joining the covered electric wires according to the third embodiment. The same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof will be omitted. Omitted.

As shown in FIG. 10, the third embodiment is similar to the first embodiment in that the horn 57 extends in the vertical direction (the direction indicated by the arrow X in the figure).
, And an anvil 95 having substantially the same shape as the anvil 59 of the first embodiment (see FIG. 3) transmits an ultrasonic vibration in the lateral direction (the direction of arrow Y in the figure). Things. That is, the connecting portion S of the covered electric wires W1 and W2 includes a vibration component in the vertical direction (X direction in the figure) that coincides with the overlapping direction of the covered electric wires W1 and W2 by the horn 57,
The vibration is three-dimensionally excited by a vibration component in the horizontal direction (Y direction in the drawing) orthogonal to the overlapping direction by the anvil 95.

According to the third embodiment, the vibration component in the vertical direction improves the welding state of the resin chips 53 and 55 as in the first embodiment, and the covering portion 3 is formed by the resin chips 53 and 55. The action of pushing out from the center side of 55 to the outside is increased.

Further, when metal is joined by ultrasonic vibration, it is most likely that vibration is applied in the direction along the joining surface, so that the vibration component in the lateral direction is added to the conductor. The line portions 1 are joined in an expanded range.
Therefore, even when the insulated wires W1 and W2 are used in a severe environment such as being strongly pulled, the conduction characteristics at the connection portion S can be maintained satisfactorily.

Further, since the metallic joint of the conductor wire portion 1 is expanded, the heat generation at the connection portion S can be suppressed to a low level when the covered electric wires W1 and W2 conduct. Thus, even when a relatively inexpensive resin material is used, the same operation and effect as when an expensive resin material having excellent heat resistance is used can be obtained, and the product cost can be reduced.

FIG. 11 shows a modification of the third embodiment. In place of the anvil 95 (see FIG. 10) of the third embodiment, a vibration component in the vertical direction (the direction of arrow X in the figure) is used. And an anvil 97 for transmitting vibration in an oblique direction (arrow Z direction in the figure) composed of vibration components in the horizontal direction (arrow Y direction in the figure) and pressing the connecting portion S without transmitting vibration. A horn 99 having only a horn 99 is provided. That is, due to the transmission of the anvil 97, the connection portion S is excited by the vibration component in the vertical direction and the vibration component in the horizontal direction as in the third embodiment.

According to this modification, the same operation and effect as those of the third embodiment can be obtained only by transmitting only the anvil 97, and the apparatus can be simplified.

[0096] Next, a fourth according to the invention described in claim 3
An example will be described.

FIG. 12 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to the fourth embodiment. 13A and 13B are cross-sectional views of main parts showing a state after the start of joining in FIG. 12, in which FIG. 13A shows a state immediately after the start of joining, and FIG. 13B shows a state after joining. 14 (a) is a perspective view partially showing the resin chip of the fourth embodiment in a cross section, and FIG. 14 (b) is a perspective view showing a part of the joint structure of the covered electric wire of the fourth embodiment in a cross section. . The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIGS. 12 and 13, in the fourth embodiment, the resin chips 51 and 53 are provided with solder 93 as brazing material.
When the connecting portion S is sandwiched between the resin chips 51 and 53 and joined, the conductor wires 1 of the two covered electric wires W1 and W2 are soldered to each other inside the resin material 51 by solder 93.

The method of joining the covered electric wires according to the fourth embodiment is almost the same as that of the first embodiment except that the resin chips 53 and 55 are provided with the solder 93 having a circular plate shape. FIG.
(A) shows the lower resin chip 55, and the solder 93 has a substantially upper surface 55a of the resin chip 55 substantially in the center so that its circular upper surface 93a is substantially flush with the upper surface 55a of the resin chip 55a. It is in a state of being fitted into.
In addition, the solder 93 is fitted almost at the center of the lower surface 53a of the upper resin chip 53, similarly to the upper surface 55a of the lower resin chip 55.

More specifically, similarly to the first embodiment, FIG.
As shown in (a), the resin chips 53 and 55 are
9, the resin chip 53, 55 sandwiches the connecting portion S in which the two covered electric wires W1, W2 are overlapped from above and below. Thereby, the connection portion S is connected to the upper and lower resin chips 5.
It will be in a state of being sandwiched between 3,55 solders 93.

Next, the connecting portion S is connected to the upper and lower resin chips 5.
Pressure and vibration are applied between the horn 57 and the anvil 59 from the outside of the members 3 and 55. As a result, as shown in FIG. 13 (b), the conductor wire portions 1 of the insulated wires W1, W2 are
Both are exposed at the connection S between the two, and the two are in conductive contact.

When the pressurization and vibration of the connection portion S are further continued, the resin chips 53 and 55 are melted, and the resin chips 5 and 55 are melted.
3, 55 facing surfaces (the lower surface 5 of the upper resin chip 53).
3a and the upper surface 55a) of the lower resin chip 55 are welded, and the outer peripheral surface of the covering portion 3 adjacent to the conductive wire portion 1 in conductive contact and the resin chips 53, 55 are welded together, and the conductive wire portion in conductive contact is formed. 1 is covered with the resin chips 53 and 55.

Further, the heat generated when the resin chips 53 and 55 are melted causes the solder 9 provided on the resin chips 53 and 55 to be removed.
3 are melted, and at the connection portions S in the resin chips 53 and 55, the conductor wire portions 1 of the insulated wires W1 and W2 which are in conductive contact are brazed to each other.

After the melting of the resin chips 53 and 55, the application of pressure and vibration by the horn 57 is stopped, and the covering portion 3, the resin chips 53 and 55 and the solder 93 are hardened, and the joining operation is completed.

Next, a description will be given of a joint structure of a covered electric wire according to a fourth embodiment obtained by the above-described joining method.

As shown in FIG. 14 (b), in this joint structure, two covered electric wires W1 and W2 intersect at a connecting portion S inside a resin material 51 composed of a pair of resin chips 53 and 55. At the connection portion S, the conductor wire portions 1 of the both covered electric wires W1 and W2 are exposed and brought into conductive contact, and the contact portions are soldered with solder 93. The covering portion 3 adjacent to the conductive wire portion 1 in conductive contact is welded to the resin material 51, whereby the periphery of the conductive wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed by the resin material 51. ing.

According to the joining method and the joining structure, in addition to the same effects as those of the first embodiment, since the conductor portions 1 of the both covered electric wires W1 and W2 are brazed at the joining portion S, the joining portion is formed. In S, higher electric performance can be obtained,
The current-carrying characteristics can be further stabilized.

The solder 93 is attached to the resin chips 53 and 55.
The soldering between the conductor wires 1 is performed by utilizing the heat generated when the resin chips 53 and 55 are fused together. Therefore, the soldering operation is not particularly required, and the resin chip 53 provided with the solder 93 is provided. , 55, the electrical performance of the connection S can be improved.

Further, since the resin material 51 is made of a transparent material, in addition to the conductive contact state of the conductor wire portions 1, the brazing state of the conductor wire portions 1 can be viewed from the outside of the resin material 51.

Further, similar to the second embodiment (see FIG. 9), the adjacent conductor wire portions 1 except for the soldered connection portions S are provided.
By filling the melted resin chips 53, 55 between the core wires 1a, a water stopping effect inside the covered electric wires W1, W2 can be obtained.

Next, the fifth aspect of the present invention will be described.
An example will be described.

FIG. 15 is a perspective view showing a partial cross section of the resin chip of the fifth embodiment, and FIGS. 16 (a) and 16 (b) are main part cross sectional views showing a state in which a covered electric wire is being joined.

The fifth embodiment is almost the same as the fourth embodiment except that the solder 93 is embedded in the resin chips 53 and 55 as shown in FIG. That is, the solder 9
3 is covered with the resin chips 53 and 55, and the circular upper surfaces 53a and 53a of the resin chips 53 and 55 are covered.
The solder 93 is not exposed at 55a.

The joining method according to the fifth embodiment is almost the same as that of the fourth embodiment. First, the resin chips 53 and 55 are inserted into the inner diameter portion 65 of the anvil 59, and the resin chips 53 and 55 are inserted.
A connecting portion S in which two covered electric wires W1 and W2 are overlapped is sandwiched from above and below (see FIG. 13A).

Next, the connecting portion S is connected to the upper and lower resin chips 5.
Pressure and vibration are applied between the horn 57 and the anvil 59 from the outside of the members 3 and 55. As a result, as shown in FIG. 16 (a), the conductor wire portions 1 of the both insulated wires W1, W2 are
Both are exposed at the connection S between the two, and the two are in conductive contact. When the pressurization and vibration of the connection portion S are further continued, FIG.
As shown in (b), the resin chips 53 and 55 are melted, the two resin chips 53 and 55 are welded, and the outer peripheral surface of the covering portion 3 adjacent to the conductive wire portion 1 in conductive contact with the resin chip. The portions 53 and 55 are welded, and the periphery of the conductive wire portion 1 in conductive contact is covered with the resin chips 53 and 55. In this state, the resin chips 53, 5
The solder 93 buried in 5 is exposed and comes into contact with the conductor wire portion 93.

The solder 93 is melted by the heat generated when the resin chips 53 and 55 are melted, and the resin chip 5 is melted.
At the connecting portions S in the connecting wires 3, 55, the conductor wire portions 1 of the insulated wires W1, W2 that have come into contact with each other are brazed (FIG. 13).
(B)).

After the melting of the resin chips 53 and 55, the pressurization and the vibration by the horn 57 are stopped, and the covering portion 3, the resin chips 53 and 55 and the solder 93 are hardened, and the joining operation is completed.

As described above, according to the fifth embodiment, after the covering portion 3 is scattered and melted and the conductor wire portion 1 is brought into conductive contact, and the connection portion S is covered with the resin chips 53 and 55, , 55, the solder 93 is exposed and melts, so that the conductive wire portion 1 in conductive contact can be accurately brazed and the solder 93 can be reliably prevented from flowing out of the resin chips 53, 55. The joining state and joining workability are improved.

Next, a sixth embodiment will be described.

FIGS. 17 and 18 are perspective views showing a means for obtaining a joint structure of a covered electric wire according to the sixth embodiment. FIG. 17 shows a state before the start of joining, and FIG. 18 shows a state after the start of joining. Is shown. FIG. 19 is a sectional view of the horn of FIG.
FIG. 20 is an overall perspective view of the flat cable. In addition,
The same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 17, in the second embodiment, a conductor wire W1 and one conductor wire of a flat cable 75 in which a plurality of conductor wire portions 1 are arranged in a sheet-like resin covering portion 73 are arranged side by side. The insulated wire W1 and the flat cable 75 are conductively connected to each other by joining the portions 1 at their intermediate connection portions S.

The method of joining the covered electric wires according to the sixth embodiment is almost the same as that of the first embodiment, and the lower resin chip 5
5 is inserted into the inner diameter portion 65 of the anvil 59, and from there,
The insulated wire W1 is inserted into the groove 67 so that the connecting portion S is located substantially at the center of the inner diameter portion 65, and from above, the covering portion of the flat cable 75 is placed so that the connecting portion S is located substantially at the center of the inner diameter portion 65. The conductor wire portion 1 in 73 is inserted into the groove portion 69. In this case, since the covering portion 73 has a sheet shape, the conductor wire portion 1 cannot be completely inserted into the groove portion 69, and the flat cable 75 has the anvil 5 as shown in FIG.
9, the inner diameter 65 and the grooves 67, 69 are formed shallowly. Also, the flat cable 75 placed on the anvil 59
When the upper resin chip 53 is disposed above, the resin chip 53
Is placed on the flat cable 75, so that it is difficult to perform the operation of positioning the resin chip 53 and applying pressure and vibration by the horn 57. Therefore, as shown in FIG. 17, a cylindrical tip holding member 77 is provided outside the horn 57, and the lower end 77a of the tip holding member 77 is provided.
The head 71 of the horn 57 can be inserted through
An opening 79 is provided so as to temporarily hold the opening 3 in FIG.
As shown in FIG. 9, in a state where the upper resin chip 53 is temporarily held in the opening 79, the lower end 77a of the chip holding member 77 is
Is pressed against the flat cable 75 in accordance with the inner diameter portion 65 of the anvil 59, and the horn 57 is pressed to push out the temporarily held upper resin chip 53 downward, as shown in FIG. At 55, the connecting portion S is sandwiched.
At the lower end of the chip holding member 77, a groove 77b having an arc-shaped cross section that fits into the conductor wire portion 1 from outside the covering portion 73 is formed.
7 can be easily positioned when the flat cable 7 abuts on the flat cable 75. The subsequent joining method is the same as in the first embodiment.

The joint structure of the insulated wire of the sixth embodiment obtained by the above joining method is almost the same as that of the first embodiment shown in FIG. 4. For example, the joint structure at the portion B in FIG. Inside the resin material 51 composed of 53 and 55, the conductor wire portion 1 of the insulated wire W1 connected to the connector 81 and the conductor wire portion 1 of the flat cable 75 are exposed at the connection portion S, intersect, and are in conductive contact. . The covering portion 3 adjacent to the conductive wire portion 1 in conductive contact is welded to the resin material 51, and the periphery of the conductive wire portion 1 in conductive contact is covered with the resin material 51,
The connection portion S is sealed with a resin material. Note that FIG.
1 is a perspective view showing a use state in which the flat cable 75 is folded.

According to the sixth embodiment, the flat cable 7
5 is electrically connected to the insulated wire W1.
The same effect as that of the embodiment can be obtained.

The same applies to the case where the flat cables 75 are conductively connected to each other. Further, by making the resin material 51 transparent, the conductive contact state of the conductor wire portion 1 can be viewed from the outside of the resin material 51. Can be.

Next, a seventh embodiment of the present invention will be described.

FIG. 22 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to the seventh embodiment, and FIG. 23 is a perspective view showing the joint structure of the seventh embodiment. The same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 22, the seventh embodiment joins a covered electric wire W1 to a connection portion S of a terminal fitting 87, and is a member in which the covered electric wire W1 and the terminal fitting 87 are electrically connected to each other.

The method of connecting the covered electric wires according to the seventh embodiment is basically the same as that of the first embodiment. That is, the connecting portion S of the end of the insulated wire W1 is placed on the connecting portion S of the terminal fitting 87, and the connecting portion S is sandwiched between a pair of resin chips 83 and 85 from above and below. Horn 89 and anvil 91 from outside of chips 83 and 85
Press and shake between. As a result, after the conductor wire portion 1 of the covered electric wire W1 is exposed at the connection portion S between the resin chips 83 and 85 and is brought into conductive contact with the terminal fitting 87, the upper and lower resin chips 83 and 85 are melted, and both resin chips 83 and 85 are melted. Opposite surfaces of the chips 83 and 85 are welded, and the periphery of the conductive wire portion 1 that is in conductive contact is covered with the resin chip 83. The resin chips 83 and 85 have a rectangular shape with a width of about 2 to 8 mm, and a supporting recess 91 a for the resin chip 85 is formed on the upper surface of the anvil 91 in accordance with the rectangular shape.

According to the seventh embodiment, the same effects as in the first embodiment can be obtained when the covered electric wire W1 is connected to the terminal fitting 87 in a conductive manner. Further, since the crimping operation of the terminal fitting 87 is not required, the joining operation can be easily performed.

Also, the coated electric wire W1 described in the sixth embodiment
The fourth embodiment or the fifth embodiment is applied to the joining between the flat cable 75 and the flat cable 75 (see FIG. 17) and the joining between the covered electric wire W1 and the terminal fitting 87 described in the seventh embodiment (see FIG. 22). You can also. That is, in the sixth embodiment or the seventh embodiment, the resin chips 53, 55, 83, 8
By providing the solder 93 in the fifth embodiment, in addition to the same effect as in the sixth embodiment or the seventh embodiment, further higher mechanical strength can be obtained in the connection portion S. Here, in the case of joining the insulated wire W1 and the terminal fitting 87, as shown in FIG. 24, the upper resin chip 8 located on the insulated wire W1 side is used.
By merely providing the solder 93 only on the wire 3, the conductor wire portion 1 of the insulated wire W1 can be brazed to the terminal fitting 87.

[0132]

As described above, according to the first aspect of the present invention, it is not necessary to remove the covering portion in advance, and the operation of conducting connection can be easily performed. High mechanical strength and sufficient insulation can be obtained to stabilize current-carrying characteristics, and high versatility can be obtained.

According to the second aspect of the present invention, in addition to the effect of the first aspect, a water stopping effect can be obtained inside the covered electric wire. When connecting to the required part and connecting the other end to a part that does not require functional waterproofing, even if water etc. flows into the inside of the covered electric wire from the other end due to capillary action,
The outflow of water or the like to one end side is prevented by the water stopping effect. Therefore, the waterproof property of one end can be ensured by a simple and inexpensive method without performing the waterproof treatment on the other end that does not require waterproofing.

According to the third aspect of the present invention, in addition to the effects of the first or second aspect of the invention, a simple method of using a resin chip provided with a brazing material is provided.
Even higher electrical performance can be obtained at the connection portion, and the conduction characteristics can be further stabilized.

According to the fourth aspect of the invention, in addition to the effect of the third aspect, the brazing material is exposed and melts inside the resin chip after the connection portion is covered with the resin chip. In addition, it is possible to accurately braze the connection portion that has been brought into conductive contact, and it is possible to reliably prevent the brazing material from flowing out of the resin chip, thereby improving the joining state and joining workability.

[0136]

[0137]

[0138]

According to the invention set forth in claim 5 , claims 1 to 1 are provided.
In addition to the effect of the invention according to claim 4, the conductor wire portion is better exposed at the connection portion, a reliable conductive contact state is obtained, and a good welding state between the resin chips is obtained.

According to the invention set forth in claim 6 , claims 1 to 1 are provided.
In addition to the effect of the invention according to claim 4, the conductor wire portion is better exposed at the connection portion, a reliable conductive contact state is obtained, and a good welded state between the resin chips is obtained, Metallic bonding can be obtained in a wide range at the connection portion, and the conduction characteristics at the connection portion can be favorably maintained even when used under severe conditions. In addition, since the metallic joint at the connection portion is expanded, heat generation during conduction can be suppressed low, and even if a relatively inexpensive resin material is used, an expensive resin material having excellent heat resistance is used. The same effect can be obtained.

[0141]

[0142]

[Brief description of the drawings]

FIG. 1 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to a first embodiment (a state before the start of bonding) .

FIG. 2 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to the first embodiment (a state after the start of bonding) .

FIGS. 3A and 3B are schematic diagrams showing a cross section taken along arrow A in FIG. 2 and showing a state immediately after joining is started, and FIG. 3B shows a state after joining.

FIGS. 4A and 4B are perspective views showing a joint structure of the covered electric wire according to the first embodiment, wherein FIG. 4A shows an external appearance and FIG. 4B shows an internal structure.

FIGS. 5A and 5B are schematic diagrams for explaining an impact given at the time of an experiment, wherein FIG. 5A shows a state where a connecting portion is hit, and FIG. 5B shows a state where a covered electric wire is waving.

FIG. 6 is a plan view showing an experimental sample.

FIG. 7 is a chart showing the results of determining the fixing force for each welding height of an acrylic resin.

FIG. 8 is a graph of FIG. 7, showing the average value of the fixing force for each welding height.

FIG. 9A is a view showing a state before bonding in the second embodiment.
FIG. 4B is a cross-sectional view taken along line PP of FIG. 3, and FIG. 4B is a cross-sectional view taken along line QQ of FIG.

FIG. 10 is a sectional view of an essential part showing a means for obtaining a joint structure of a covered electric wire according to a third embodiment.

FIG. 11 is a cross-sectional view of a main part showing a modification of the third embodiment.

FIG. 12 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to a fourth embodiment.

13A and 13B are cross-sectional views of main parts of FIG. 12, in which FIG. 13A shows a state immediately after the start of bonding, and FIG. 13B shows a state after the bonding.

14A is a perspective view showing a part of a resin chip of a fourth embodiment in a cross section, and FIG. 14B is a perspective view showing a part of a joint structure of a covered electric wire of the fourth embodiment in a cross section. It is.

FIG. 15 is a perspective view showing a part of a resin chip of a fifth embodiment in cross section.

16A and 16B are cross-sectional views of a main part showing a method of joining a covered electric wire according to a fifth embodiment, where FIG.
(B) shows the latter state during joining.

FIG. 17 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to a sixth embodiment.

FIG. 18 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to a sixth embodiment.

FIG. 19 is a sectional view of the horn of FIG. 17;

FIG. 20 is an overall perspective view of a flat cable.

FIG. 21 is an overall perspective view showing a use state in which a flat cable is folded.

FIG. 22 is a perspective view showing a means for obtaining a bonded structure of a covered electric wire according to a seventh embodiment.

FIG. 23 is a perspective view showing a joint structure of a covered electric wire according to a seventh embodiment.

FIG. 24 is a perspective view in which the fourth embodiment or the fifth embodiment is applied to joining of a covered electric wire and a terminal fitting.

FIG. 25 is a perspective view showing a conventional example.

26A and 26B are side views of FIG. 25, wherein FIG. 26A shows a state before joining, and FIG. 26B shows a state after joining.

FIG. 27 is a perspective view showing another conventional example.

FIG. 28 is a side sectional view of FIG. 27;

FIG. 29 is a perspective view showing another conventional example.

FIG. 30 is a perspective view showing another conventional example, (a) shows a state before joining, (b) shows a joining state by a joint terminal, (c) shows a state at the time of thermocompression bonding, (D) shows the wound state of the insulating material.

FIG. 31 is a cross-sectional view showing another conventional example, in which (a) shows a side cross-sectional view and (b) shows a front cross-sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductor wire part 1a Core wire 3 Covering part 51 Resin material 53 Resin chip 55 Resin chip 57 Horn 59 Anvil 73 Covering part 75 Flat cable (member which connects and connects mutually) 83 Resin chip 85 Resin chip 87 Terminal fitting (member which connects and connects mutually) ) 89 Horn 91 Anvil 93 Solder (brazing material) 95 Anvil 97 Anvil 99 Horn W1 Insulated wire (members connected to each other) W2 Coated wire (members connected to each other) S Connection

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mineo Takahashi 206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Inside Yazaki Parts Co., Ltd. (56) References JP-A-4-92377 (JP, A) JP-A-Hei 4-29961 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 4/70 H01R 43/00-43/02

Claims (6)

(57) [Claims] 1. A method of joining a covered electric wire, wherein at least one of the members that are conductively connected to each other is a covered electric wire in which an outer periphery of a conductor wire portion is covered with a resin covering portion, wherein the two members are overlapped at a connecting portion A first step of sandwiching the overlapped connection portion between a pair of resin chips, and scattering and melting the coating portion, and bringing the two members into conductive contact at the connection portion by applying pressure from outside the resin chip, A second step of welding the pair of resin chips to each other to seal the connection portion. 2. The method for bonding a covered electric wire according to claim 1, wherein, in the second step, a molten resin chip is filled between core wires of adjacent conductor wires except for the connection portion. A method for bonding a covered electric wire, characterized in that: 3. The method according to claim 1, wherein in the first step, the connecting portion is sandwiched between a pair of resin chips having at least one brazing material. The method according to claim 2, wherein in the second step, the brazing material is melted by heat generated when the resin chip is melted, and both members are brazed at the conductively connected portions. 4. The method according to claim 3, wherein the brazing material is embedded in a resin chip. 5. The method for bonding a covered electric wire according to claim 1, wherein in the second step, the pair of resin chips are sandwiched from above and below in a direction in which the two members overlap. And pressurizing and vibrating the connecting portion between the horn and the anvil from outside the resin chip, wherein the direction of the pressurizing and vibrating is set to a direction in which the two members overlap. Method. 6. The method for bonding a covered electric wire according to claim 1, wherein in the second step, the pair of resin chips are sandwiched from above and below in a direction in which the two members overlap. Pressurizing and vibrating the connecting portion between the horn and the anvil from the outside of the resin chip; the pressing direction is a direction in which the two members overlap, and the vibration is a vibration component in the overlapping direction. And a vibration component in a direction orthogonal to the overlapping direction.