JP4963143B2

JP4963143B2 - Metal-to-metal joining method

Info

Publication number: JP4963143B2
Application number: JP2001038470A
Authority: JP
Inventors: 健一花崎; 由紀子島田
Original assignee: Yazaki Corp
Current assignee: Yazaki Corp
Priority date: 2001-02-15
Filing date: 2001-02-15
Publication date: 2012-06-27
Anticipated expiration: 2021-02-15
Also published as: JP2002239752A

Description

【０００１】
【発明の属する技術分野】
本発明は、すずまたはすず合金などからなるめっき層を備えた金属と、他の金属とを接合する金属同士の接合方法に関する。
【０００２】
【従来の技術】
例えば、自動車などに配索されるワイヤハーネスは、電線と該電線の端部に取り付けられる端子金具と、を備えている。前記電線は、銅などの金属からなる芯線と、該芯線を被覆する絶縁性の被覆部と、を備えている。端子金具は、導電性の金属からなる母材の表面に、すずなどからなるめっき層が形成されている。
【０００３】
【発明が解決しようとする課題】
従来から、前記端子金具と前記電線とを電気的及び機械的に接続する際には、端子金具の一部分を前記電線にかしめるなどしてきた。このため、例えば、自動車などに前記ワイヤハーネスが配索された際に、該自動車の走行中の振動などによって、前記端子金具と電線との電気的な接続が、断線する恐れが生じる。
【０００４】
また、半田などを用いたろう付けによって、前記端子金具と前記電線とを電気的及び機械的に接続することも考えられる。半田などを用いたろう付けを用いても、該自動車の走行中の振動などによって前記端子金具と電線との電気的な接続が断線する恐れが生じ、かつ経年変化などによって前記端子金具と電線との電気的な接続が断線する恐れがあった。
【０００５】
したがって、本発明の目的は、表面にめっき層が形成された金属に他の金属を確実に接合できる金属同士の接合方法を提供することにある。
【０００７】
【課題を解決するための手段】
前記課題を解決し目的を達成するために、請求項１に記載の本発明の金属同士の接合方法は、表面にすずまたはすず合金からなるめっき層が形成された第１金属と、該第１金属とは別体の銅または銅合金からなる第２金属と、を接合する接合方法において、前記第１金属のめっき層に、前記第１及び第２金属とは別体の第３金属を重ね、該第３金属にさらに前記第２金属を重ねて、互いに接合されていない前記第１〜第３金属に対して超音波溶着を行うことで、前記第３金属を介して前記第１金属と前記第２金属とを接合し、前記第３金属は、板状の板部材であり、前記板部材は、インジウム、ビスマス、鉛、カドミウムのうち一つの金属若しくは二つ以上を含んだ合金またははんだからなることを特徴としている。
【０００８】
請求項２に記載の本発明の金属同士の接合方法は、表面にめっき層が形成された第１金属と、該第１金属とは別体の第２金属と、を接合する接合方法において、前記第１金属のめっき層に、前記第１及び第２金属とは別体の第３金属を重ね、該第３金属にさらに前記第２金属を重ねて、互いに接合されていない前記第１〜第３金属に対して超音波溶着を行うことで、前記第３金属を介して前記第１金属と前記第２金属とを接合し、前記第３金属は、板状の板部材と、粒状に形成されかつ前記めっき層の厚みより大きい金属粒と、であることを特徴としている。
【００１０】
請求項３に記載の本発明の金属同士の接合方法は、請求項２に記載の金属同士の接合方法において、前記板部材は、インジウム、ビスマス、鉛、カドミウムのうち一つの金属若しくは二つ以上を含んだ合金またははんだからなることを特徴としている。
【００１１】
請求項４に記載の本発明の金属同士の接合方法は、請求項２に記載の金属同士の接合方法において、前記第１金属は黄銅からなり、第２金属は銅からなり、前記金属粒は黄銅からなることを特徴としている。
【００１２】
請求項５に記載の本発明の金属同士の接合方法は、請求項２ないし請求項４のうち何れか一項に記載の金属同士の接合方法において、前記めっき層は、すずまたはすず合金からなることを特徴としている。
【００１３】
請求項１に記載した本発明の金属同士の接合方法によれば、第１金属のめっき層に第３金属を重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。なお、前記第３金属は、前記めっき層に馴染みやすい（くっつき易い）ものであるのが望ましい。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。
【００１４】
また、第３金属が板状の板部材であるため、該第３金属と、第１及び第２金属双方と、の接触面積が大きくなる。このため、第３金属と、第１及び第２金属双方と、を確実に接合できる。
【００１５】
請求項２に記載した本発明の金属同士の接合方法によれば、第１金属のめっき層を第３金属に重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。なお、前記第３金属は、前記めっき層に馴染みやすい（くっつき易い）ものであるのが望ましい。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。また、第３金属としてめっき層の厚みより大きな金属粒と、板状の板部材と、を用いる。このため、該板部材と、第１及び第２金属双方と、の接触面積が大きくなるので、超音波溶着を行うと、第３金属と第１及び第２金属双方とを確実に接合できる。さらに、金属粒が、めっき層の厚みより大きいので、超音波溶着を行うと前記金属粒がめっき層を突き破り第１金属の母材と第２金属との双方と確実に接合する。
【００１７】
請求項３に記載した本発明の金属同士の接合方法によれば、板部材が、インジウム、ビスマス、鉛、カドミウムなどからなる。このため、板部材の融点が比較的低くなり、かつめっき層との馴染みが良くなる。したがって、超音波接合を行うと、第３金属が、第１及び第２金属双方と確実に接合する。
【００１８】
請求項４に記載した本発明の金属同士の接合方法によれば、金属粒が、黄銅からなるので、黄銅からなる第１金属と銅からなる第２金属との双方と、確実に接合する。
【００１９】
請求項５に記載した本発明の金属同士の接合方法によれば、第１金属のめっき層に第３金属を重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。
【００２０】
【発明の実施の形態】
以下、本発明の第１の実施形態にかかる金属同士の接合方法を、図１ないし図４を参照して説明する。第１の実施形態にかかる金属同士の接合方法は、図１に示す電線モジュール１を組み立てる方法である。電線モジュール１は、図１に示すように、第１金属としての金属片２と、被覆電線３と、第３金属としての板部材４と、を備えている。
【００２１】
金属片２は、板状の母材５と、該母材５の一方または両方の表面に形成されためっき層６と、を備えて、比較的薄い薄板状に形成されている。母材５は、導電性を有する金属からなる。図示例では、母材５は黄銅からなる。めっき層６は、すずまたはすず合金からなる。図示例では、めっき層６は、すずからなる。
【００２２】
被覆電線３は、断面形状が丸形に形成されている。被覆電線３は、断面丸形の第２金属としての芯線７と、この芯線７を被覆する被覆部８と、を備えている。芯線７は、前記金属片２とは勿論別体でかつ導電性を有する金属からなる。芯線７は、一本の導電性の導線または、複数の導電性の導線が撚られて構成されている。
【００２３】
芯線７は、可撓性を有している。芯線７を構成する導線は、銅または銅合金などからなる。図示例では、芯線７を構成する導線は、銅からなる。即ち、図示例では、芯線７は、銅からなる。被覆部８は、絶縁性と可撓性とを有する合成樹脂からなる。
【００２４】
板部材４は、金属片２と芯線７との双方と勿論別体で、かつ比較的薄い薄板状に形成されている。板部材４は、比較的融点の低い金属からなる。板部材４は、前記芯線７を構成する金属と前記めっき層６を構成する金属との双方と、比較的馴染みの良い（合金に成りやすいまたはくっつき易い）金属からなる。
【００２５】
板部材４は、インジウム（Ｉｎ）、ビスマス（Ｂｉ）、鉛（Ｐｂ）、カドミウム（Ｃｄ）のうち一つの金属からなるのが望ましい、または、板部材４は、インジウム（Ｉｎ）、ビスマス（Ｂｉ）、鉛（Ｐｂ）、カドミウム（Ｃｄ）のうち二つ以上の合金からなるのが望ましい、または、板部材４は、すずと鉛の合金であるはんだからなるのが望ましい。図示例では、板部材４は、インジウム（Ｉｎ）からなる。
【００２６】
前記電線モジュール１は、金属片２のめっき層６に板部材４が重なり、更に該板部材４に芯線７が重なった状態で、金属片２と板部材４とが互いに接合し、板部材４と芯線７とが互いに接合している。このとき、前記板部材４を構成する金属は、芯線７内に拡散している。
【００２７】
前記電線モジュール１は、前記金属片２と、板部材４と、芯線７とが、超音波溶着機によって互いに固定されて得られる。超音波溶着機は、図４に示すように、チップ２０（工具ホーンともいう）と、このチップ２０に相対するアンビル２１と、図示しない発振機と、振動子と、ホーンなどを備えている。
【００２８】
超音波溶着機は、チップ２０とアンビル２１との間に互いに溶着する溶着対象物を挟み、これらのチップ２０とアンビル２１とを互いに近づける方向に加圧した状態で、発振機で振動子を振動させてこの振動をホーン経由でチップ２０に伝える。そして、超音波溶着機は、チップ２０とアンビル２１との間に挟んだ溶着対象物に超音波振動を加えて該対象物を溶着させる。
【００２９】
前記電線モジュール１を組み立てる際、即ち、金属片２と板部材４と芯線７とを固定する際には、予め被覆部８の一部分を除去して芯線７の一部分を露出させておく。なお、図示例では、被覆電線３の端部３ａに位置する被覆部８を除去している。
【００３０】
そして、図４に示すように、めっき層６がチップ２０に相対するように、アンビル２１に金属片２を重ねる。金属片２のめっき層６に板部材４を重ね、該板部材４に芯線７を重ねる。芯線７にチップ２０の先端面を接触させる。こうして、チップ２０とアンビル２１との間に、金属片２と板部材４と芯線７とを挟む。
【００３１】
そして、チップ２０とアンビル２１とを互いに近づける方向に加圧した後、発振機で振動子を振動させてこの振動をホーン経由でチップ２０に伝える。芯線７と板部材４との間と、板部材４とめっき層６との間と、に前述した振動が生じて、比較的融点の低い金属からなるので板部材４の一部分が溶ける。チップ２０とアンビル２１とが互いに近づく方向に加圧されているので、溶けた板部材４の一部分は、芯線７を構成する銅内に拡散する。こうして、板部材４は、芯線７と金属結合する。
【００３２】
また、板部材４とめっき層６との間とに前述した振動が生じており、板部材４はめっき層６と合金になり易い（くっつき易い）金属からなるので、板部材４とめっき層６とは溶融しないで固相のまま互いに金属結合する。こうして、前記板部材４と芯線７とは、所謂超音波溶着（超音波溶接または超音波接合ともいう）によって互いに接合され、板部材４とめっき層６即ち金属片２とは所謂超音波溶着（超音波溶接または超音波接合ともいう）によって互いに接合される。そして、前述した構成の電線モジュール１を得る。
【００３３】
前述した電線モジュール１を組み立てる金属同士の接合方法は、例えば、表面にすずなどからなるめっき層が形成された金属としての端子金具に、他の金属としての被覆電線３の芯線７を接合する場合に、好適である。
【００３４】
次に、本発明の発明者は、前記金属同士の接合方法で得られた電線モジュール１の接合箇所の断面に、ＥＰＭＡ（Electron Probe Microanalyser）を用いて、Ｘ線分光分析を施した。このＸ線分光分析によって、図２及び図３に示す結果が得られた。図２は、図３に示す実際に得られたＸ線分光分析の結果を、模式的に示す図である。また、図２中には、図１などと同一部分には、同一符号を付している。さらに、図２中に平行斜線で示す部分は板部材４を示しており、図３中に白っぽく見える部分は同じく板部材４を示している。
【００３５】
図２及び図３に示すように、図２中の平行斜線で示す板部材４及び図３中の白っぽく見える板部材４が、芯線７内に拡散している。このため、前述したＸ線分光分析によって、板部材４と芯線７とが確実に金属的に接合していることが明らかとなった。
【００３６】
本実施形態によれば、芯線７とめっき層６との間に比較的融点の低く、芯線７とめっき層６との双方と馴染み易い板部材４を挿入して、金属片２と芯線７とを超音波溶着する。このため、表面にすずなどからなるめっき層６が施されて、銅と接合しづらい金属片２を、該金属片２とは別体の芯線７と確実に接合できる。
【００３７】
板部材４が、板状に形成されている。このため、該板部材４と金属片２との接触面積が大きくなり、前記板部材４と芯線７との接触面積が大きくなる。このため、板部材４と金属片２とを確実に接合でき、板部材４と芯線７とを確実に接合できる。したがって、互いに接合しづらくかつ別体の金属片２と芯線７とをより確実に接合できる。
【００３８】
次に、参考例にかかる金属同士の接合方法を、図５ないし図７を参照して説明する。なお、前述した第１の実施形態と同一構成部分には同一符号を付して説明を省略する。参考例にかかる金属同士の接合方法で組み立てる電線モジュール１は、図５及び図６に示すように、板部材４の代わりに、第３金属として金属粒１０を多数用いる。
【００３９】
金属粒１０は、勿論、金属片２と芯線７との双方とは別体でかつ粒状に形成されている。金属粒１０は、図６に示すように、めっき層６の厚みＴより寸法Ｌが大きい。前記寸法Ｌは、金属粒１０の最も長い寸法を示している。なお、寸法Ｌは、本明細書に記した金属粒１０の大きさを示している。
【００４０】
本明細書に記したように金属粒１０がめっき層６の厚みＴより大きいということは、金属粒１０の少なくとも最も長い寸法Ｌがめっき層６の厚みＴより大きいということを示している。なお、図示例では、金属粒１０は、球状または楕円体状に形成されており、前記寸法Ｌは、球状の金属粒１０の直径または楕円体状の金属粒１０の長径となっている。
【００４１】
金属粒１０は、導電性を有し、かつめっき層６と同等の堅さまたはめっき層６よりやや硬い金属からなる。図示例では、金属粒１０は、黄銅からなる。なお、図示例では、金属粒１０は球状または楕円体状であるが、本発明では、金属粒１０は適宜の形状に形成されても良いことは勿論である。
【００４２】
本参考例にかかる接合方法で得られる電線モジュール１は、図５に示すように、金属片２のめっき層６に芯線７が重なり、かつ、図６に示すように、金属粒１０がめっき層６を突き破って母材５と芯線７との双方と接合している。
【００４３】
本参考例にかかる金属同士の接合方法においても、前述した第１の実施形態と同様に、前記金属片２と、金属粒１０と、芯線７とが、超音波溶着機によって互いに固定されて得られる。
【００４４】
前記電線モジュール１を組み立てる際、即ち、金属片２と金属粒１０と芯線７とを固定する際には、予め被覆部８の一部分を除去して芯線７の一部分を露出させておく。なお、図示例では、被覆電線３の端部３ａに位置する被覆部８を除去している。
【００４５】
そして、図７に示すように、めっき層６がチップ２０に相対するように、アンビル２１に金属片２を重ね、めっき層６に金属粒１０を多数置く。さらに、めっき層６と金属粒１０との双方に、芯線７を重ねる。芯線７にチップ２０の先端面を接触させる。こうして、チップ２０とアンビル２１との間に、金属片２と金属粒１０と芯線７とを挟む。
【００４６】
そして、チップ２０とアンビル２１とを互いに近づける方向に加圧した後、発振機で振動子を振動させてこの振動をホーン経由でチップ２０に伝える。芯線７とめっき層６との間に前述した振動が生じる。前記金属粒１０がめっき層６と同等の堅さであるまたは前記めっき層６より硬いので、金属粒１０がめっき層６の一部を削り取る。そして、前記金属粒１０は、寸法Ｌが厚みＴより大きいので、めっき層６を突き破って、母材５と芯線７との双方と接触する。
【００４７】
また、芯線７とめっき層６との間に前述した振動が生じているため、金属粒１０が母材５と芯線７との双方と接触すると、前記金属粒１０と、母材５と芯線７との双方とは溶融しないで固相のまま互いに金属結合する。こうして、金属粒１０と芯線７とは、所謂超音波溶着（超音波溶接または超音波接合ともいう）によって互いに接合され、金属粒１０と金属片２とは所謂超音波溶着（超音波溶接または超音波接合ともいう）によって互いに接合される。そして、前述した構成の電線モジュール１を得る。
【００４８】
さらに、本参考例の金属同士の接合方法も、前述した第１の実施形態と同様に、例えば、表面にすずなどからなるめっき層が形成された金属としての端子金具に、他の金属としての被覆電線３の芯線７を接合する場合に、好適である。
【００４９】
本参考例によれば、芯線７とめっき層６との間に、寸法Ｌが厚みＴより大きくかつめっき層６と同等か該めっき層６より硬い金属粒１０を、多数を置いて、金属片２と芯線７とを超音波溶着する。金属粒１０がめっき層６を突き破るので、該金属粒１０が母材５と芯線７との双方に確実に接合する。このため、表面にめっき層６が施されて、銅と接合しづらい金属片２を、該金属片２とは別体の芯線７と確実に接合できる。
【００５０】
また、金属粒１０が、めっき層６の厚みＴより大きくかつめっき層６と同等か該めっき層６より硬いので、該金属粒１０がめっき層６を確実に突き破る。このため、金属粒１０が、母材５と芯線７との双方と確実に接触して、これら母材５と芯線７との双方と確実に接合する。
【００５１】
次に、本発明の第２の実施形態にかかる金属同士の接合方法を、図８ないし図１３を参照して説明する。なお、前述した第１の実施形態及び参考例と同一構成部分には同一符号を付して説明を省略する。本実施形態にかかる金属同士の接合方法で組み立てる電線モジュール１は、図８及び図９に示すように、第３金属として、板部材４と多数の金属粒１０との双方を用いる。勿論、板部材４と多数の金属粒１０とは、それぞれ、金属片２と芯線７との双方とは別体である。
【００５２】
本実施形態で用いられる金属粒１０は、図１０から図１３に示すように、熱処理などによって、板部材４内にうめ込まれている。さらに、金属粒１０は、図１３に示すように、一部分が板部材４の両面から突出している。
【００５３】
図１０及び図１１は、金属粒１０を多数うめ込んだ板部材４の断面を、電子顕微鏡を用いて拡大して観察した結果である。なお、図１０は、図１１に示す実際に得られた結果を、模式的に示す図である。
【００５４】
また、図１０及び図１１中では、板部材４を構成する金属を示している部分には符号Ａを付し、金属粒１０を構成する金属を示している部分には符号Ｂを付している。なお、図１１では、符号Ａで示す部分は、比較的黒くなっているとともに、符号Ｂで示す部分は、前記符号Ａで示す部分より白っぽくなっている。
【００５５】
図１０及び図１１に示すように、金属粒１０を構成する金属が、板部材４を構成する金属内に、多数分布している。このため、金属粒１０が板部材４内に多数分布していることが明らかとなり、金属粒１０が板部材４に多数うめ込まれていることが明らかとなった。
【００５６】
また、本実施形態で用いられる金属粒１０は、図９に示すように、寸法Ｌが合金層１１の厚みＴａより大きい。なお、合金層１１は、めっき層６と板部材４とからなり、後述する超音波溶着する際の熱などによって前記めっき層６と板部材４とが混ざり合って形成される。また、金属粒１０は、図１３に示すように、寸法Ｌが板部材４の厚みＴｂより大きい。このため、金属粒１０は、前述した第２の実施形態と同様に、寸法Ｌがめっき層６の厚みＴより大きい。なお、前記寸法Ｌは、金属粒１０の最も長い寸法を示している。こうして、金属粒１０は、板部材４と合金層１１とめっき層６の厚みＴｂ，Ｔａ，Ｔより大きい。
【００５７】
金属粒１０は、導電性を有し、かつめっき層６と同等の堅さまたはめっき層６よりやや硬い金属からなる。図示例では、金属粒１０は、黄銅からなる。なお、図示例では、金属粒１０は球状または楕円体状であるが、本発明では、金属粒１０は適宜の形状に形成されても良いことは勿論である。
【００５８】
本実施形態にかかる接合方法で得られる電線モジュール１は、図８に示すように、金属片２のめっき層６に板部材４が重なりかつ該板部材４に芯線７が重なっている。さらに、図９に示すように、金属片２と板部材４と芯線７との接合箇所では、金属粒１０が合金層１１を突き破って母材５と芯線７との双方と接合しているとともに、前述した第１の実施形態と同様に、前記板部材４を構成する金属が芯線７内に拡散している。
【００５９】
本実施形態にかかる金属同士の接合方法においても、前述した第１の実施形態及び参考例と同様に、前記金属片２と、金属粒１０をうめ込んだ板部材４と、芯線７とが、超音波溶着機によって互いに固定されて得られる。
【００６０】
前記電線モジュール１を組み立てる際、即ち、金属片２と金属粒１０と板部材４と芯線７とを固定する際には、予め被覆部８の一部分を除去して芯線７の一部分を露出させておく。なお、図示例では、被覆電線３の端部３ａに位置する被覆部８を除去している。
【００６１】
そして、図１２に示すように、めっき層６がチップ２０に相対するように、アンビル２１に金属片２を重ね、該金属片２のめっき層６に金属粒１０を多数うめ込んだ板部材４を重ねる。さらに、該板部材４に芯線７を重ねる。芯線７にチップ２０の先端面を接触させる。こうして、チップ２０とアンビル２１との間に、金属片２と金属粒１０をうめ込んだ板部材４と芯線７とを挟む。
【００６２】
そして、チップ２０とアンビル２１とを互いに近づける方向に加圧した後、発振機で振動子を振動させてこの振動をホーン経由でチップ２０に伝える。芯線７と板部材４との間と、板部材４とめっき層６との間に前述した振動が生じる。比較的融点の低い金属からなるので、板部材４の特に前記チップ２０とアンビル２１との間に位置する一部分が溶ける。チップ２０とアンビル２１とが互いに近づく方向に加圧されているので、溶けた板部材４の一部分は、芯線７を構成する銅内に拡散する。こうして、板部材４は、芯線７と金属結合する。
【００６３】
板部材４とめっき層６との間に前述した振動が生じているため、めっき層６の特に前記チップ２０とアンビル２１との間に位置する一部分が溶ける。さらに、板部材４がめっき層６と合金に成りやすい金属からなるので、板部材４とめっき層６とは互いに混ざり合って合金層１１となる。
【００６４】
また、前記金属粒１０がめっき層６と同等の堅さであるまたは前記めっき層６より硬いので、金属粒１０がめっき層６の一部を削り取る。そして、金属粒１０は、めっき層６を突き破って、母材５と芯線７との双方と接触する。
【００６５】
また、芯線７とめっき層６との間に前述した振動が生じているため、金属粒１０は、母材５と芯線７との双方と接触すると、これら母材５と芯線７との双方と溶融しないで固相のまま金属結合する。こうして、チップ２０とアンビル２１とが互いに近づく方向に加圧され、かつ前述した振動が付与されているので、金属粒１０は、芯線７と母材５即ち金属片２との双方と所謂超音波溶着（超音波溶接または超音波接合ともいう）によって接合される。こうして、金属片２と芯線７とは、所謂超音波溶着（超音波溶接または超音波接合ともいう）によって互いに接合される。そして、前述した構成の電線モジュール１を得る。
【００６６】
さらに、本実施形態の金属同士の接合方法も、前述した第１及び第２の実施形態と同様に、例えば、表面にすずなどからなるめっき層が形成された金属としての端子金具に、他の金属としての被覆電線３の芯線７を接合する場合に、好適である。
【００６７】
本実施形態によれば、芯線７とめっき層６との間に、寸法Ｌが厚みＴより大きくかつめっき層６と同等か該めっき層６より硬い金属粒１０を多数うめ込んだ板部材４を置いて、金属片２と芯線７とを超音波溶着する。めっき層６と板部材４とが合金層１１をなし、かつ金属粒１０がめっき層６を突き破り母材５と芯線７との双方と接合する。したがって、表面にめっき層６が施されて、芯線７と接合しづらい金属片２を、該金属片２とは別体の芯線７と確実に接合できる。
【００６８】
また、板部材４が、板状に形成されている。このため、該板部材４と金属片２との接触面積が大きくなり、前記板部材４と芯線７との接触面積が大きくなる。このため、板部材４と金属片２とを確実に接合でき、板部材４と芯線７とを確実に接合できる。したがって、互いに接合しづらくかつ別体の金属片２と芯線７とをより確実に接合できる。
【００６９】
さらに、金属粒１０が、合金層１１の厚みＴａより大きくかつめっき層６の厚みＴより大きい。また、金属粒１０が、めっき層６と同等か該めっき層６より硬いので、金属粒１０が、母材５と芯線７との双方と確実に接触して、これら母材５と芯線７との双方と確実に接合する。
【００７０】
前述した第１及び第２の実施形態では、金属片２に被覆電線３の芯線７を接合する場合を示している。しかしながら、本発明では、被覆電線３の芯線７に限らず、金属片２に多種多様な導電性の金属を接合しても良いことは勿論である。
【００７１】
また、本発明では、図１４に示すように、アンビル２１に金属片２を重ね、該金属片２のめっき層６に金属粒１０を多数置き、さらに板部材４を重ねて、該板部材４に芯線７を重ねて、超音波溶着を施して、電線モジュール１を組み立てるようにしても良い。
【００７２】
この場合、金属粒１０は、勿論寸法Ｌがめっき層６の厚みより大きい。この場合、板部材４の一部分が芯線７内に拡散するとともに、金属粒１０がめっき層６を突き破って母材５と超音波溶着する。こうして、表面にめっき層６が施されて、芯線７と接合しづらい金属片２を、該金属片２とは別体の芯線７と確実に接合できる。
【００７３】
【発明の効果】
以上説明したように、請求項１に記載の本発明は、第１金属のめっき層に第３金属を重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【００７４】
また、第３金属が板状の板部材であるため、該第３金属と、第１及び第２金属双方と、の接触面積が大きくなる。このため、第３金属と、第１及び第２金属双方と、を確実に接合できる。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【００７５】
請求項２に記載の本発明は、第１金属のめっき層に第３金属を重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。また、第３金属としてめっき層の厚みより大きな金属粒と、板状の板部材と、を用いる。このため、該板部材と、第１及び第２金属双方と、の接触面積が大きくなるので、超音波溶着を行うと、第３金属と第１及び第２金属双方とを確実に接合できる。さらに、金属粒が、めっき層の厚みより大きいので、超音波溶着を行うと前記金属粒が第１金属の母材と前記第２金属との双方と確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【００７７】
請求項３に記載の発明は、板部材が、インジウム、ビスマス、鉛、カドミウムなどからなる。このため、板部材の融点が比較的低くなり、かつめっき層との馴染みが良くなる。したがって、超音波接合を行うと、第３金属が、第１及び第２金属双方と確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【００７８】
請求項４に記載の発明は、金属粒が黄銅からなるので、黄銅からなる第１金属と銅からなる第２金属との双方と確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【００７９】
請求項５に記載の発明は、第１金属のめっき層に第３金属を重ね、さらに第３金属に第２金属を重ねて超音波溶着を行う。このため、めっき層と第３金属とが確実に接合し、第３金属と第２金属とが確実に接合する。したがって、表面にめっき層が施された第１金属と、この第１金属とは別体の第２金属と、を確実に接合できる。
【図面の簡単な説明】
【図１】本発明の第１の実施形態にかかる金属同士の接合方法で組み立てられる電線モジュールを示す斜視図である。
【図２】図１に示された電線モジュールの接合箇所にＸ線分光分析を施して得られた結果を模式的に示す図である。
【図３】図１に示された電線モジュールの接合箇所にＸ線分光分析を施して得られた結果を示す図である。
【図４】図１に示された電線モジュールの分解斜視図である。
【図５】参考例にかかる金属同士の接合方法で組み立てられる電線モジュールを示す斜視図である。
【図６】図５中のＶＩ−ＶＩ線に沿った断面図である。
【図７】図５に示された電線モジュールの分解斜視図である。
【図８】本発明の第２の実施形態にかかる金属同士の接合方法で組み立てられる電線モジュールを示す斜視図である。
【図９】図８中のＩＸ−ＩＸ線に沿った断面図である。
【図１０】図８に示された電線モジュールの板部材の断面を拡大した状態を模式的に示す図である。
【図１１】図８に示された電線モジュールの板部材の断面を拡大した状態を示す図である。
【図１２】図８に示された電線モジュールの分解斜視図である。
【図１３】図１２中のＸＩＩＩ−ＸＩＩＩ線に沿った断面図である。
【図１４】本発明の変形例の金属同士の接合方法で組み立てられる電線モジュールの分解斜視図である。
【符号の説明】
２金属片（第１金属）
４板部材（第３金属）
６めっき層
７芯線（第２金属）
１０金属粒（第３金属）
Ｔめっき層の厚み
Ｌ金属粒の寸法（大きさ）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for joining metals, which joins a metal having a plating layer made of tin or a tin alloy, and another metal.
[0002]
[Prior art]
For example, a wire harness routed in an automobile or the like includes an electric wire and a terminal fitting attached to an end portion of the electric wire. The electric wire includes a core wire made of a metal such as copper and an insulating covering portion that covers the core wire. In the terminal fitting, a plating layer made of tin or the like is formed on the surface of a base material made of a conductive metal.
[0003]
[Problems to be solved by the invention]
Conventionally, when the terminal fitting and the electric wire are electrically and mechanically connected, a part of the terminal fitting is caulked on the electric wire. For this reason, for example, when the wire harness is routed in an automobile or the like, there is a risk that the electrical connection between the terminal fitting and the electric wire is broken due to vibration or the like while the automobile is running.
[0004]
It is also conceivable to electrically and mechanically connect the terminal fitting and the electric wire by brazing using solder or the like. Even when brazing using solder or the like is used, there is a risk that the electrical connection between the terminal fitting and the electric wire may be broken due to vibration during traveling of the automobile, and the terminal fitting and the electric wire may be damaged due to secular change or the like. There was a risk that the electrical connection would break.
[0005]
Therefore, the objective of this invention is providing the joining method of the metals which can join another metal reliably to the metal by which the plating layer was formed in the surface.
[0007]
[Means for Solving the Problems]
In order to solve the problems and achieve the object, the metal-to-metal bonding method according to claim 1 is provided on a surface. Made of tin or tin alloy The first metal on which the plating layer is formed and the first metal are separated from each other. Made of copper or copper alloy In the joining method of joining the second metal, a third metal separate from the first and second metals is stacked on the plating layer of the first metal, and the second metal is further applied to the third metal. Again, For the first to third metals not joined to each other By performing ultrasonic welding, the first metal and the second metal are joined via the third metal, and the third metal is , Board Shaped plate member The plate member is made of one metal of indium, bismuth, lead, cadmium, an alloy containing two or more, or solder. It is characterized by that.
[0008]
The metal-to-metal bonding method of the present invention according to claim 2 is a bonding method of bonding a first metal having a plating layer formed on a surface thereof and a second metal separate from the first metal. A third metal separate from the first and second metals is superimposed on the plating layer of the first metal, and the second metal is further superimposed on the third metal, For the first to third metals not joined to each other By performing ultrasonic welding, the first metal and the second metal are joined via the third metal, and the third metal is , Board And a metal particle formed in a granular shape and having a thickness greater than the thickness of the plating layer.
[0010]
The metal-to-metal bonding method according to the third aspect of the present invention is the following. 2 The metal-to-metal bonding method according to claim 1, wherein the plate member is one metal of indium, bismuth, lead, and cadmium. Or It is characterized by comprising an alloy or solder containing two or more.
[0011]
Claim 4 The metal-to-metal joining method of the present invention described in claim 2 The metal-to-metal bonding method described in 1), wherein the first metal is made of brass, the second metal is made of copper, and the metal particles are made of brass.
[0012]
The metal-to-metal joining method of the present invention according to claim 5 2 In the metal-to-metal bonding method according to any one of claims 4 to 4, the plating layer is made of tin or a tin alloy.
[0013]
According to the metal-to-metal bonding method of the first aspect of the present invention, ultrasonic welding is performed by superimposing the third metal on the plating layer of the first metal and further superimposing the second metal on the third metal. In addition, it is desirable that the third metal is easy to become familiar with (attach to) the plating layer. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably.
[0014]
The second Since the three metals are plate-like plate members, the contact area between the third metal and both the first and second metals is increased. For this reason, a 3rd metal and both the 1st and 2nd metal can be joined reliably.
[0015]
Claim 2 According to the metal-to-metal bonding method of the present invention described in The first metal plating layer is superposed on the third metal, and the second metal is superposed on the third metal for ultrasonic welding. In addition, it is desirable that the third metal is easy to become familiar with (attach to) the plating layer. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably. Also, As the third metal, metal particles larger than the thickness of the plating layer and a plate-like plate member are used. For this reason, since the contact area between the plate member and both the first and second metals is increased, the third metal and both the first and second metals can be reliably joined by ultrasonic welding. Furthermore, since the metal particles are larger than the thickness of the plating layer, when ultrasonic welding is performed, the metal particles break through the plating layer and reliably join both the base material of the first metal and the second metal.
[0017]
Claim 3 According to the metal-to-metal bonding method of the present invention described in 1), the plate member is made of indium, bismuth, lead, cadmium, or the like. For this reason, melting | fusing point of a plate member becomes comparatively low, and familiarity with a plating layer becomes good. Therefore, when ultrasonic bonding is performed, the third metal is reliably bonded to both the first and second metals.
[0018]
Claim 4 According to the metal-to-metal bonding method of the present invention described in 1. above, the metal particles are made of brass, so that the metal particles are reliably bonded to both the first metal made of brass and the second metal made of copper.
[0019]
Claim 5 According to the metal-to-metal bonding method of the present invention described in the above, ultrasonic welding is performed by superimposing the third metal on the plating layer of the first metal and further superimposing the second metal on the third metal. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The metal-to-metal bonding method according to the first embodiment of the present invention will be described below with reference to FIGS. The metal-to-metal joining method according to the first embodiment is a method of assembling the electric wire module 1 shown in FIG. As shown in FIG. 1, the electric wire module 1 includes a metal piece 2 as a first metal, a covered electric wire 3, and a plate member 4 as a third metal.
[0021]
The metal piece 2 includes a plate-like base material 5 and a plating layer 6 formed on one or both surfaces of the base material 5 and is formed in a relatively thin thin plate shape. The base material 5 is made of a conductive metal. In the illustrated example, the base material 5 is made of brass. The plating layer 6 is made of tin or a tin alloy. In the illustrated example, the plating layer 6 is made of tin.
[0022]
The covered electric wire 3 has a round cross section. The covered electric wire 3 includes a core wire 7 as a second metal having a round cross section and a covering portion 8 that covers the core wire 7. The core wire 7 is made of a metal that is separate from the metal piece 2 and has conductivity. The core wire 7 is formed by twisting one conductive conductor or a plurality of conductive conductors.
[0023]
The core wire 7 has flexibility. The conducting wire constituting the core wire 7 is made of copper or a copper alloy. In the example of illustration, the conducting wire which comprises the core wire 7 consists of copper. That is, in the illustrated example, the core wire 7 is made of copper. The covering portion 8 is made of a synthetic resin having insulating properties and flexibility.
[0024]
The plate member 4 is of course a separate body from both the metal piece 2 and the core wire 7 and is formed in a relatively thin thin plate shape. The plate member 4 is made of a metal having a relatively low melting point. The plate member 4 is made of both a metal constituting the core wire 7 and a metal constituting the plating layer 6 and a metal that is relatively familiar (easily formed into an alloy or easily stuck).
[0025]
The plate member 4 is preferably made of one of indium (In), bismuth (Bi), lead (Pb), and cadmium (Cd), or the plate member 4 is made of indium (In), bismuth (Bi). ), Lead (Pb), and cadmium (Cd). It is preferable that the plate member 4 is made of a solder that is an alloy of tin and lead. In the illustrated example, the plate member 4 is made of indium (In).
[0026]
In the electric wire module 1, the metal piece 2 and the plate member 4 are joined to each other with the plate member 4 overlapping the plating layer 6 of the metal piece 2 and the core wire 7 overlapping the plate member 4. And the core wire 7 are joined to each other. At this time, the metal constituting the plate member 4 is diffused in the core wire 7.
[0027]
The electric wire module 1 is obtained by fixing the metal piece 2, the plate member 4, and the core wire 7 to each other by an ultrasonic welding machine. As shown in FIG. 4, the ultrasonic welder includes a tip 20 (also referred to as a tool horn), an anvil 21 opposed to the tip 20, an oscillator (not shown), a vibrator, a horn, and the like.
[0028]
In the ultrasonic welding machine, an object to be welded is sandwiched between the tip 20 and the anvil 21, and the vibrator is vibrated by the oscillator in a state in which the tip 20 and the anvil 21 are pressurized in a direction approaching each other. Then, this vibration is transmitted to the chip 20 via the horn. Then, the ultrasonic welding machine applies ultrasonic vibration to the welding target object sandwiched between the tip 20 and the anvil 21 to weld the target object.
[0029]
When the electric wire module 1 is assembled, that is, when the metal piece 2, the plate member 4, and the core wire 7 are fixed, a part of the covering portion 8 is removed in advance to expose a part of the core wire 7. In the illustrated example, the covering portion 8 located at the end 3a of the covered electric wire 3 is removed.
[0030]
Then, as shown in FIG. 4, the metal piece 2 is overlaid on the anvil 21 so that the plating layer 6 faces the chip 20. The plate member 4 is overlaid on the plating layer 6 of the metal piece 2, and the core wire 7 is overlaid on the plate member 4. The tip surface of the chip 20 is brought into contact with the core wire 7. Thus, the metal piece 2, the plate member 4, and the core wire 7 are sandwiched between the chip 20 and the anvil 21.
[0031]
Then, after pressurizing the chip 20 and the anvil 21 in a direction to bring them close to each other, the vibrator is vibrated by an oscillator, and this vibration is transmitted to the chip 20 via a horn. The vibration described above is generated between the core wire 7 and the plate member 4 and between the plate member 4 and the plating layer 6, and a part of the plate member 4 is melted because it is made of a metal having a relatively low melting point. Since the tip 20 and the anvil 21 are pressurized in a direction approaching each other, a part of the melted plate member 4 diffuses into the copper constituting the core wire 7. Thus, the plate member 4 is metal-bonded to the core wire 7.
[0032]
In addition, the vibration described above is generated between the plate member 4 and the plating layer 6, and the plate member 4 is made of a metal that is easily alloyed with the plating layer 6. And do not melt and form metal bonds with each other in the solid phase. Thus, the plate member 4 and the core wire 7 are bonded to each other by so-called ultrasonic welding (also referred to as ultrasonic welding or ultrasonic bonding), and the plate member 4 and the plating layer 6, that is, the metal piece 2 are so-called ultrasonic welding ( They are joined together by ultrasonic welding or ultrasonic joining). And the electric wire module 1 of the structure mentioned above is obtained.
[0033]
The metal-to-metal joining method for assembling the electric wire module 1 described above is, for example, a case where the core wire 7 of the covered electric wire 3 as another metal is joined to a terminal fitting as a metal having a plating layer formed of tin or the like on the surface. It is preferable.
[0034]
Next, the inventor of the present invention performed X-ray spectroscopic analysis using EPMA (Electron Probe Microanalyser) on the cross section of the joining portion of the electric wire module 1 obtained by the metal-to-metal joining method. The results shown in FIGS. 2 and 3 were obtained by this X-ray spectroscopic analysis. FIG. 2 is a diagram schematically showing the result of the X-ray spectroscopic analysis actually obtained shown in FIG. In FIG. 2, the same parts as those in FIG. Furthermore, the part shown by parallel oblique lines in FIG. 2 shows the plate member 4, and the part that looks whitish in FIG. 3 shows the plate member 4.
[0035]
As shown in FIGS. 2 and 3, the plate member 4 indicated by the parallel oblique lines in FIG. 2 and the plate member 4 that looks whitish in FIG. 3 are diffused in the core wire 7. For this reason, the X-ray spectroscopic analysis described above revealed that the plate member 4 and the core wire 7 are securely joined metallically.
[0036]
According to the present embodiment, the plate member 4 having a relatively low melting point between the core wire 7 and the plating layer 6 and easily compatible with both the core wire 7 and the plating layer 6 is inserted, and the metal piece 2 and the core wire 7 Ultrasonic welding. For this reason, the plating layer 6 which consists of tin etc. on the surface is given, and the metal piece 2 which is hard to join with copper can be reliably joined to the core wire 7 separate from the metal piece 2.
[0037]
The plate member 4 is formed in a plate shape. For this reason, the contact area between the plate member 4 and the metal piece 2 is increased, and the contact area between the plate member 4 and the core wire 7 is increased. For this reason, the plate member 4 and the metal piece 2 can be reliably joined, and the plate member 4 and the core wire 7 can be reliably joined. Therefore, it is difficult to join each other and the separate metal piece 2 and the core wire 7 can be joined more reliably.
[0038]
next, Reference example A method for joining the metals will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same component as 1st Embodiment mentioned above, and description is abbreviate | omitted. Reference example As shown in FIG. 5 and FIG. 6, the electric wire module 1 assembled by the metal-to-metal bonding method uses a large number of metal particles 10 as the third metal instead of the plate member 4.
[0039]
Of course, the metal particles 10 are formed separately and granular from both the metal piece 2 and the core wire 7. As shown in FIG. 6, the metal particle 10 has a dimension L larger than the thickness T of the plating layer 6. The dimension L indicates the longest dimension of the metal particle 10. In addition, the dimension L has shown the magnitude | size of the metal grain 10 described in this specification.
[0040]
As described in this specification, the fact that the metal particle 10 is larger than the thickness T of the plating layer 6 indicates that at least the longest dimension L of the metal particle 10 is larger than the thickness T of the plating layer 6. In the illustrated example, the metal particle 10 is formed in a spherical or ellipsoidal shape, and the dimension L is the diameter of the spherical metal particle 10 or the major axis of the ellipsoidal metal particle 10.
[0041]
The metal particle 10 is made of a metal that has conductivity and is as hard as the plating layer 6 or slightly harder than the plating layer 6. In the illustrated example, the metal particles 10 are made of brass. In the illustrated example, the metal particles 10 are spherical or ellipsoidal. However, in the present invention, the metal particles 10 may be formed in an appropriate shape.
[0042]
Reference example As shown in FIG. 5, the wire module 1 obtained by the joining method according to 1 is such that the core wire 7 overlaps the plating layer 6 of the metal piece 2, and the metal particles 10 break through the plating layer 6 as shown in FIG. 6. The base material 5 and the core wire 7 are both joined.
[0043]
Reference example Also in the joining method between the metals, the metal piece 2, the metal particles 10, and the core wire 7 are fixed to each other by an ultrasonic welding machine as in the first embodiment described above.
[0044]
When the electric wire module 1 is assembled, that is, when the metal piece 2, the metal particle 10, and the core wire 7 are fixed, a part of the covering portion 8 is removed in advance to expose a part of the core wire 7. In the illustrated example, the covering portion 8 located at the end 3a of the covered electric wire 3 is removed.
[0045]
Then, as shown in FIG. 7, the metal pieces 2 are stacked on the anvil 21 so that the plating layer 6 faces the chip 20, and a large number of metal particles 10 are placed on the plating layer 6. Further, the core wire 7 is overlapped on both the plating layer 6 and the metal particle 10. The tip surface of the chip 20 is brought into contact with the core wire 7. Thus, the metal piece 2, the metal particle 10, and the core wire 7 are sandwiched between the chip 20 and the anvil 21.
[0046]
Then, after pressurizing the chip 20 and the anvil 21 in a direction to bring them close to each other, the vibrator is vibrated by an oscillator, and this vibration is transmitted to the chip 20 via a horn. The vibration described above occurs between the core wire 7 and the plating layer 6. Since the metal particles 10 are as hard as the plating layer 6 or harder than the plating layer 6, the metal particles 10 scrape a part of the plating layer 6. And since the said metal particle 10 has the dimension L larger than the thickness T, it pierces the plating layer 6 and contacts both the base material 5 and the core wire 7. FIG.
[0047]
Moreover, since the vibration mentioned above has arisen between the core wire 7 and the plating layer 6, if the metal particle 10 contacts both the base material 5 and the core wire 7, the metal particle 10, the base material 5, and the core wire 7 will be described. And both do not melt and form metal bonds with each other in the solid phase. Thus, the metal particles 10 and the core wire 7 are joined to each other by so-called ultrasonic welding (also referred to as ultrasonic welding or ultrasonic bonding), and the metal particles 10 and the metal pieces 2 are so-called ultrasonic welding (ultrasonic welding or ultrasonic welding). Are also joined together. And the electric wire module 1 of the structure mentioned above is obtained.
[0048]
further, Reference example In the same way as in the first embodiment described above, for example, the metal wire having a plating layer made of tin or the like is formed on the metal terminal fitting, and the core wire of the covered electric wire 3 as another metal. This is suitable when 7 is joined.
[0049]
Reference example According to the above, between the core wire 7 and the plating layer 6, a large number of metal grains 10 having a dimension L larger than the thickness T and equal to or harder than the plating layer 6 are placed, and the metal piece 2 and the core wire 7 is ultrasonically welded. Since the metal particles 10 break through the plating layer 6, the metal particles 10 are reliably bonded to both the base material 5 and the core wire 7. For this reason, the plating layer 6 is applied to the surface, and the metal piece 2 that is difficult to be joined to copper can be reliably joined to the core wire 7 separate from the metal piece 2.
[0050]
Further, since the metal particle 10 is larger than the thickness T of the plating layer 6 and is equal to or harder than the plating layer 6, the metal particle 10 surely breaks through the plating layer 6. For this reason, the metal particles 10 are surely in contact with both the base material 5 and the core wire 7 and are reliably joined to both the base material 5 and the core wire 7.
[0051]
Next, the first of the present invention 2 A metal-to-metal joining method according to the embodiment will be described with reference to FIGS. The first mentioned above Embodiments and reference examples The same components as those in FIG. As shown in FIGS. 8 and 9, the electric wire module 1 assembled by the metal-to-metal bonding method according to the present embodiment uses both the plate member 4 and a large number of metal particles 10 as the third metal. Of course, the plate member 4 and the many metal grains 10 are separate from both the metal piece 2 and the core wire 7, respectively.
[0052]
As shown in FIGS. 10 to 13, the metal particles 10 used in the present embodiment are embedded in the plate member 4 by heat treatment or the like. Furthermore, as shown in FIG. 13, the metal particles 10 partially protrude from both surfaces of the plate member 4.
[0053]
10 and 11 show the results of observing the cross section of the plate member 4 in which a large number of metal particles 10 are embedded using an electron microscope. FIG. 10 is a diagram schematically showing the results actually obtained shown in FIG.
[0054]
Further, in FIGS. 10 and 11, a part indicating the metal constituting the plate member 4 is denoted by reference symbol A, and a part indicating the metal constituting the metal grain 10 is denoted by reference numeral B. Yes. In FIG. 11, the portion indicated by reference sign A is relatively black, and the portion indicated by reference sign B is whitish than the portion indicated by reference sign A.
[0055]
As shown in FIGS. 10 and 11, a large number of metals constituting the metal particles 10 are distributed in the metal constituting the plate member 4. For this reason, it became clear that many metal particles 10 were distributed in the plate member 4, and it became clear that many metal particles 10 were embedded in the plate member 4.
[0056]
Further, the metal grains 10 used in this embodiment have a dimension L larger than the thickness Ta of the alloy layer 11 as shown in FIG. The alloy layer 11 includes a plating layer 6 and a plate member 4, and is formed by mixing the plating layer 6 and the plate member 4 by heat or the like when ultrasonic welding described later is performed. Further, as shown in FIG. 13, the metal particle 10 has a dimension L larger than the thickness Tb of the plate member 4. For this reason, the metal grains 10 have a dimension L larger than the thickness T of the plating layer 6 as in the second embodiment described above. The dimension L indicates the longest dimension of the metal particle 10. Thus, the metal particles 10 are larger than the thicknesses Tb, Ta, and T of the plate member 4, the alloy layer 11, and the plating layer 6.
[0057]
The metal particle 10 is made of a metal that has conductivity and is as hard as the plating layer 6 or slightly harder than the plating layer 6. In the illustrated example, the metal particles 10 are made of brass. In the illustrated example, the metal particles 10 are spherical or ellipsoidal. However, in the present invention, the metal particles 10 may be formed in an appropriate shape.
[0058]
As shown in FIG. 8, the electric wire module 1 obtained by the joining method according to the present embodiment has the plate member 4 overlapped with the plating layer 6 of the metal piece 2 and the core wire 7 overlapped with the plate member 4. Furthermore, as shown in FIG. 9, at the joining location of the metal piece 2, the plate member 4, and the core wire 7, the metal particles 10 penetrate the alloy layer 11 and are joined to both the base material 5 and the core wire 7. As in the first embodiment, the metal constituting the plate member 4 is diffused in the core wire 7.
[0059]
Also in the method for joining metals according to the present embodiment, as described above. First embodiment and reference example Similarly, the metal piece 2, the plate member 4 in which the metal particles 10 are embedded, and the core wire 7 are obtained by being fixed to each other by an ultrasonic welding machine.
[0060]
When the electric wire module 1 is assembled, that is, when the metal piece 2, the metal particle 10, the plate member 4, and the core wire 7 are fixed, a part of the covering portion 8 is removed in advance to expose a part of the core wire 7. deep. In the illustrated example, the covering portion 8 located at the end 3a of the covered electric wire 3 is removed.
[0061]
Then, as shown in FIG. 12, the plate member 4 in which the metal piece 2 is stacked on the anvil 21 so that the plating layer 6 faces the chip 20, and a large number of metal particles 10 are embedded in the plating layer 6 of the metal piece 2. Repeat. Further, the core wire 7 is overlapped on the plate member 4. The tip surface of the chip 20 is brought into contact with the core wire 7. Thus, the plate member 4 in which the metal piece 2 and the metal particle 10 are embedded and the core wire 7 are sandwiched between the chip 20 and the anvil 21.
[0062]
Then, after pressurizing the chip 20 and the anvil 21 in a direction to bring them close to each other, the vibrator is vibrated by an oscillator, and this vibration is transmitted to the chip 20 via a horn. The vibration described above occurs between the core wire 7 and the plate member 4 and between the plate member 4 and the plating layer 6. Since it is made of a metal having a relatively low melting point, a part of the plate member 4 located between the tip 20 and the anvil 21 is melted. Since the tip 20 and the anvil 21 are pressurized in a direction approaching each other, a part of the melted plate member 4 diffuses into the copper constituting the core wire 7. Thus, the plate member 4 is metal-bonded to the core wire 7.
[0063]
Since the vibration described above is generated between the plate member 4 and the plating layer 6, a part of the plating layer 6 located between the tip 20 and the anvil 21 is melted. Furthermore, since the plate member 4 is made of a metal that easily forms an alloy with the plating layer 6, the plate member 4 and the plating layer 6 are mixed with each other to form the alloy layer 11.
[0064]
Further, since the metal particles 10 are as hard as the plating layer 6 or harder than the plating layer 6, the metal particles 10 scrape a part of the plating layer 6. Then, the metal particles 10 break through the plating layer 6 and come into contact with both the base material 5 and the core wire 7.
[0065]
Moreover, since the vibration mentioned above has arisen between the core wire 7 and the plating layer 6, when the metal particle 10 contacts both the base material 5 and the core wire 7, both of the base material 5 and the core wire 7 It does not melt and bonds to the metal in the solid phase. In this way, since the tip 20 and the anvil 21 are pressurized in a direction approaching each other and the vibration described above is applied, the metal particles 10 are formed by both the core wire 7 and the base material 5, that is, the metal piece 2, so-called ultrasonic waves. They are joined by welding (also referred to as ultrasonic welding or ultrasonic joining). Thus, the metal piece 2 and the core wire 7 are joined to each other by so-called ultrasonic welding (also referred to as ultrasonic welding or ultrasonic bonding). And the electric wire module 1 of the structure mentioned above is obtained.
[0066]
In addition, the metal-to-metal bonding method of the present embodiment is similar to the first and second embodiments described above, for example, to other metal terminal fittings having a plating layer made of tin or the like formed on the surface. It is suitable when joining the core wire 7 of the covered electric wire 3 as a metal.
[0067]
According to this embodiment, the plate member 4 in which a large number of metal particles 10 having a dimension L larger than the thickness T and equal to or harder than the plating layer 6 is embedded between the core wire 7 and the plating layer 6 is provided. Then, the metal piece 2 and the core wire 7 are ultrasonically welded. The plating layer 6 and the plate member 4 form the alloy layer 11, and the metal particles 10 break through the plating layer 6 and are bonded to both the base material 5 and the core wire 7. Therefore, the plating layer 6 is applied to the surface, and the metal piece 2 that is difficult to be joined to the core wire 7 can be reliably joined to the core wire 7 that is separate from the metal piece 2.
[0068]
The plate member 4 is formed in a plate shape. For this reason, the contact area between the plate member 4 and the metal piece 2 is increased, and the contact area between the plate member 4 and the core wire 7 is increased. For this reason, the plate member 4 and the metal piece 2 can be reliably joined, and the plate member 4 and the core wire 7 can be reliably joined. Therefore, it is difficult to join each other and the separate metal piece 2 and the core wire 7 can be joined more reliably.
[0069]
Further, the metal grains 10 are larger than the thickness Ta of the alloy layer 11 and larger than the thickness T of the plating layer 6. Further, since the metal particles 10 are equal to or harder than the plating layer 6, the metal particles 10 are surely in contact with both the base material 5 and the core wire 7, and the base material 5 and the core wire 7 are Securely join to both.
[0070]
Mentioned above 1st and 2nd In the embodiment, the case where the core wire 7 of the covered electric wire 3 is joined to the metal piece 2 is shown. However, in the present invention, it is needless to say that not only the core wire 7 of the covered electric wire 3 but also various conductive metals may be joined to the metal piece 2.
[0071]
Further, in the present invention, as shown in FIG. 14, the metal piece 2 is stacked on the anvil 21, a large number of metal particles 10 are placed on the plating layer 6 of the metal piece 2, and the plate member 4 is further stacked. The electric wire module 1 may be assembled by superimposing the core wire 7 and applying ultrasonic welding.
[0072]
In this case, the metal particle 10 is naturally larger in dimension L than the thickness of the plating layer 6. In this case, a part of the plate member 4 diffuses into the core wire 7, and the metal particles 10 penetrate the plating layer 6 and are ultrasonically welded to the base material 5. Thus, the plating layer 6 is applied to the surface, and the metal piece 2 that is difficult to be joined to the core wire 7 can be reliably joined to the core wire 7 that is separate from the metal piece 2.
[0073]
【Effect of the invention】
As described above, according to the present invention, ultrasonic welding is performed by superimposing the third metal on the plating layer of the first metal and further superimposing the second metal on the third metal. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[0074]
Also, Since the third metal is a plate-like plate member, the contact area between the third metal and both the first and second metals is increased. For this reason, a 3rd metal and both the 1st and 2nd metal can be joined reliably. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[0075]
Claim 2 The present invention described in The third metal is superposed on the first metal plating layer, and the second metal is superposed on the third metal for ultrasonic welding. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly. Also, As the third metal, metal particles larger than the thickness of the plating layer and a plate-like plate member are used. For this reason, since the contact area between the plate member and both the first and second metals is increased, the third metal and both the first and second metals can be reliably joined by ultrasonic welding. Furthermore, since the metal grains are larger than the thickness of the plating layer, the ultrasonic welding makes it possible for the metal grains to reliably join both the base material of the first metal and the second metal. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[0077]
Claim 3 In the invention described in 1), the plate member is made of indium, bismuth, lead, cadmium, or the like. For this reason, melting | fusing point of a plate member becomes comparatively low, and familiarity with a plating layer becomes good. Therefore, when ultrasonic bonding is performed, the third metal is reliably bonded to both the first and second metals. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[0078]
Claim 4 In the invention described in, since the metal particles are made of brass, both the first metal made of brass and the second metal made of copper are reliably bonded. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[0079]
Claim 5 In the invention described in (1), the third metal is overlapped on the plating layer of the first metal, and the second metal is further overlapped on the third metal to perform ultrasonic welding. For this reason, a plating layer and a 3rd metal join reliably, and a 3rd metal and a 2nd metal join reliably. Therefore, the 1st metal by which the plating layer was given to the surface and the 2nd metal separate from this 1st metal can be joined certainly.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electric wire module assembled by a metal joining method according to a first embodiment of the present invention.
FIG. 2 is a diagram schematically showing a result obtained by performing X-ray spectroscopic analysis on a joint portion of the electric wire module shown in FIG. 1;
3 is a view showing a result obtained by performing X-ray spectroscopic analysis on a joint portion of the electric wire module shown in FIG. 1; FIG.
4 is an exploded perspective view of the electric wire module shown in FIG. 1. FIG.
[Figure 5] Reference example It is a perspective view which shows the electric wire module assembled by the joining method of the metals concerning.
6 is a cross-sectional view taken along line VI-VI in FIG.
7 is an exploded perspective view of the electric wire module shown in FIG.
[Fig. 8] Fig. 8 2 It is a perspective view which shows the electric wire module assembled with the joining method of the metals concerning embodiment of this.
9 is a cross-sectional view taken along line IX-IX in FIG.
10 is a view schematically showing an enlarged state of a cross section of a plate member of the electric wire module shown in FIG. 8. FIG.
11 is a view showing a state in which a cross section of a plate member of the electric wire module shown in FIG. 8 is enlarged. FIG.
12 is an exploded perspective view of the electric wire module shown in FIG. 8. FIG.
13 is a cross-sectional view taken along line XIII-XIII in FIG.
FIG. 14 is an exploded perspective view of an electric wire module assembled by a metal-to-metal joining method according to a modification of the present invention.
[Explanation of symbols]
2 Metal piece (first metal)
4 Plate member (third metal)
6 Plating layer
7 Core wire (second metal)
10 Metal grains (third metal)
T Plating layer thickness
L Dimensions of metal particles (size)

Claims

In a joining method of joining a first metal having a plating layer made of tin or a tin alloy formed on a surface thereof and a second metal made of copper or a copper alloy separate from the first metal,
The first metal that is not joined to each other is stacked on the first metal plating layer by stacking a third metal separate from the first and second metals, and further stacking the second metal on the third metal . by performing the ultrasonic welding for the third metal, and bonding the second metal and the first metal over the third metal,
The third metal is a plate- like plate member ,
The metal plate joining method , wherein the plate member is made of one metal of indium, bismuth, lead, cadmium, an alloy containing two or more, or solder .

In the joining method of joining the first metal having the plating layer formed on the surface and the second metal separate from the first metal,
The first metal that is not joined to each other is stacked on the first metal plating layer by stacking a third metal separate from the first and second metals, and further stacking the second metal on the third metal . by performing the ultrasonic welding for the third metal, and bonding the second metal and the first metal over the third metal,
The third metal is a plate- like plate member and metal particles formed in a granular shape and larger than the thickness of the plating layer.

The plate member, indium, bismuth, lead, a bonding method between metals according to claim 2, characterized in that an alloy or solder containing one metal or two or more of the cadmium.

The metal-to-metal joining method according to claim 2, wherein the first metal is made of brass, the second metal is made of copper, and the metal particles are made of brass.

The metal-plating method according to any one of claims 2 to 4, wherein the plating layer is made of tin or a tin alloy.