JPH09293577A - Joining method and joining structure of coated electric wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a joining method, capable of simplifying joining work, improving mechanical strength, narrowly restraining a range needed to joining to ensure sufficient insulation, and obtaining high versatility. SOLUTION: Resin housing parts H, recessed lower than deposited surfaces 53a and 55a with partner tips, are provided on the lead-out end parts 53b, 53c, 55b, and 55c of the coated electric wires W1 and W2 of the resin tips 53 and 55, and melted resin, flowed out at the time of the deposition of the resin tips 53 and 55 with each other, is housed in the resin housing part H to be hardened; by a joining method where two coated electric wires W1 and W2, conductively connected with each other, are overlapped on a connection part S, to nip the connection part S, thereon the electric wires W1 and W2 are overlapped, by a pair of resin tips 53 and 55, to melt coated parts 3, and the conductive wire parts 1 of both the coated electric wires W1 and W2 are conductively contacted on the connection part S, and then a pair of resin tips 53 and 55 are mutually deposited, to seal the connection part S.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for joining a plurality of covered electric wires and a joint structure for the covered electric wires.

[0002]

2. Description of the Related Art As a mode of electrically connecting a covered electric wire W to another member, there are joining of the covered electric wire W and a terminal, joining of the covered electric wires W to each other, joining of the covered electric wire W and a connector, and the like.

Conventional methods for joining the covered electric wire to the terminal include crimping, pressure welding (see Japanese Utility Model Publication No. 60-37814), soldering, and ultrasonic welding (Japanese Patent Laid-Open No. 2-10609).
No. 2), etc. are known.

In the joining by crimping, as shown in FIGS. 17 and 18, the conductor crimping pieces 13 provided upright on both sides of the connecting portion S of the terminal fitting 11 are opposed to each other. 18 (a) to make a conductive connection, and as shown in FIG. 18 (a), after the covering portion 3 is removed at the connecting portion S at the end of the covered electric wire W to expose the conductor wire portion 1, FIG. The conductor crimping piece 13 is crimped as shown in b). Terminal fitting 11
The cover crimping piece 15 for increasing the mechanical connection strength.
And the conductor caulking piece 13 and the covering caulking piece 15 respectively connect the conductor wire portion 1 and the covering portion 3 to the terminal fitting 1
1 is crimped.

As shown in FIGS. 19 and 20, the welding by the pressure contact is performed by the pressure contact blade 19 provided at the connecting portion S of the pressure contact terminal 17.
By press-fitting the connection portion S of the covered electric wire W into the slot 21, the cover portion 3 is stripped off by the press contact blade 19, and the press contact blade 19 is brought into conductive contact with the conductor wire portion 1.

In joining by soldering or ultrasonic welding,
As shown in FIG. 21, the covering portion 3 is removed at the connecting portion S at the end of the covered electric wire W to expose the conductor wire portion 1, and the exposed conductor wire portion 1 is soldered to the connecting portion S of the terminal fitting 23. It is welded by ultrasonic welding to establish a conductive connection.

Further, as a conventional method for joining two covered electric wires W to each other, joining by a joint terminal, joining by thermocompression bonding (see Japanese Patent Laid-Open No. 3-1462), and the like are known.

In the case of joining with a joint terminal, FIG.
As shown in (a), the covering portion 3 is covered by the connecting portion S of both covered electric wires W.
Are removed to expose the conductor wire portion 1, and the joint terminals 25 are crimped and crimped to the exposed conductor wire portions 1 as shown in FIG.

In the joining by thermocompression bonding, as shown in FIG. 22 (c), the covering portion 3 is removed at the connecting portion S of both covered electric wires W to expose the conductor wire portion 1 and the exposed conductor wire portions 1 to each other. Are overlapped and sandwiched between the electrodes 27 and 29, and the conductor wire portions 1 are thermocompression-bonded to each other by conducting current heating in a pressurized state to electrically connect both. As a method of heating the conductor wire portion 1, a method of utilizing frictional heat due to ultrasonic vibration is also known.

When the joint terminal 25 or the thermocompression bonding is used in this manner, in order to secure the insulation property at the connecting portion S, a tape or the like is formed on the outer periphery of the connecting portion S as shown in FIG. The insulating material 31 is wrapped around.

As a conventional method for joining the covered electric wire W and the connector, joining by ultrasonic welding is known (see Japanese Patent Application Laid-Open No. 4-61777).

In such joining, as shown in FIGS. 23 (a) and 23 (b), a lower mold 35 and an upper mold 37 which form the connector 33 are formed.
The groove 39 and the protrusion 41 that fits in the groove 39, and the connecting portion S of the covered electric wire W is superposed on the connecting portion S of the conductive connecting member 43 arranged in the groove 39 of the lower mold 35. The ridge 41 of the upper die 37 is fitted in the groove 39, and ultrasonic vibration is applied to the connecting portion S from the outside of the fitted upper and lower dies 37, 35 to melt the covering portion 3 of the covered electric wire W and to conduct the conductor. The line portion 1 and the conductive connection member 43 are brought into conductive contact with each other.

[0013]

However, the covered electric wire W
If the connection between the terminal and the terminal is performed by crimping, soldering, or ultrasonic welding, it is necessary to remove the covering portion 3 of the covered electric wire W to expose the conductor wire portion 1 in advance, which complicates the work. On the other hand, in the joining by pressure welding, the removal of the covering portion 3 is not necessary, but the mechanical strength of the connecting portion S is unavoidably lowered as compared with the crimping or soldering, which simplifies the joining work and reduces the mechanical strength. It was difficult to achieve both improvement and improvement.

Further, if the two covered electric wires W are joined by the joint terminal 25 or thermocompression bonding, the covering portion 3 needs to be removed similarly to the above, which makes the work complicated. Also,
In order to easily perform the work of caulking and thermocompression bonding of the joint terminal 25, it is necessary to set the range L for removing the covering portion 3 to a certain length, and the winding of the insulating material 31 is the range where the covering portion 3 is removed. Since it needs to be performed longer than L, the winding range of the insulating material 31 becomes larger than that of the contact portion between the conductor wire portions 1, the flexibility of the covered electric wire W is impaired, and the degree of freedom in wiring is reduced. I was afraid to end up. Further, in the thermocompression bonding, the mechanical strength of the connection portion S was unavoidably lower than that of the joint terminal 25.

When the covered electric wire W and the connector 33 are joined by ultrasonic welding shown in FIG. 23, the lower mold 3 is used.
5 and the upper mold 37, the connector 33 having a special shape in which the groove 39 and the protrusion 41 are provided is not necessarily applicable to all connectors, and the covered electric wire W and the terminal are joined or the covered electric wire. There is a disadvantage that it cannot be easily applied to joining Ws and lacks versatility.

Therefore, in consideration of the above circumstances, the present invention can achieve both simplification of the joining work and improvement of the mechanical strength, and keep the range required for the joining narrow to ensure sufficient insulation. It is an object of the present invention to provide a method for joining a covered electric wire, which can be easily applied to various kinds of joining such as joining of a covered electric wire and a terminal, joining of covered electric wires, and the like and which is highly versatile.

[0017]

According to a first aspect of the present invention, at least one of the members that are electrically connected to each other is a covered electric wire in which the outer circumference of the conductor wire portion is covered with a resin covering portion. In a connecting portion, sandwiching the overlapped connecting portion with a pair of resin chips, and spraying and melting the coating portion, and applying pressure from the outside of the resin chip to conduct the two members at the connecting portion. After contacting, the pair of resin chips are welded to each other to seal the connection part.
A method of joining a covered electric wire comprising the step of: a resin formed on at least one of the pair of resin chips so as to be recessed from a welding surface with a mating chip at a lead-out end from which the covered electric wire is led out. An accommodating portion is provided, and in the second step, the molten resin that flows out when the resin chips are welded to each other is accommodated in the resin accommodating portion and cured.

According to a second aspect of the present invention, at least one of the members that are electrically connected to each other is a covered electric wire in which the outer periphery of the conductor wire portion is covered with a resin covering portion, and both members are overlapped at the connecting portion. The overlapping connection part is sandwiched by a pair of resin chips, the coating part is scattered and melted, and the both members are brought into conductive contact at the connection part by pressure from the outside of the resin chip, and then the pair of resin chips are mutually connected. Is a joint structure of a covered electric wire formed by welding and sealing the connection portion, wherein at least one of the pair of resin chips has a lead-out end from which the covered electric wire is drawn out, as compared with a welding surface with a mating chip. It is characterized in that a resin accommodating portion which is formed so as to be recessed and which accommodates and cures the molten resin that flows out when the resin chips are welded to each other is provided.

According to a third aspect of the present invention, in the joint structure of the covered electric wire according to the second aspect, the resin accommodating portion is formed in a notch shape.

In the invention described in claims 1 to 3, both members are overlapped at the connecting portion, and the overlapping connecting portion is sandwiched by a pair of resin chips, and the covering portion is scattered and melted, and the resin chip By pressing from the outside, both members can be brought into conductive contact with each other at the connecting portion, so that it is not necessary to remove the covering portion in advance, and both members can be electrically connected by a simple operation.

Further, after the two members are brought into conductive contact with each other at the connection portion, the pair of resin chips are welded to each other to seal the connection portion. Therefore, the resin chip which is welded and cured has high mechanical strength at the connection portion. Is obtained.

Further, since the pair of resin chips has a size and shape capable of sandwiching the connecting portion which is in conductive contact with each other in the vertical direction, the range required for the bonding can be narrowed and the connecting portion is sealed by the resin chip. Therefore, sufficient insulation can be secured.

In addition, such a joining method is a relatively simple method in which the overlapped connecting portion is sandwiched by a pair of resin chips, the covering portion is melted, and pressure is applied from the outside of the resin chips.
Since the shape or the like of the other member for conducting the conductive connection of the covered electric wire is not particularly limited, it can be easily applied to various kinds of joining such as joining of the covered electric wire and the terminal, joining of the covered electric wires, etc. Sex is obtained.

Further, when the resin chips are welded to each other, the molten resin tries to flow out from between the welding surfaces of the lead-out end portion and is housed in the resin housing portion. Since the molten resin contained in the resin container is in a high temperature state at the rear of the outflow (the side close to the connection part), the covering part of the covered electric wire is melted to expose the conductor wire part. Since the temperature decreases as it moves to the distant side), the coating portion is not completely melted, but is welded to the outer peripheral surface of the coating portion. Therefore, the conductor wire portion of the covered electric wire can be completely covered with the covering portion and the molten resin at the portion derived from the resin chip.

According to a fourth aspect of the present invention, in the joint structure of the covered electric wire according to the second aspect, an electric wire holding portion for temporarily holding the covered electric wire before joining is provided on at least one of the pair of resin chips. It is characterized by being provided.

According to the invention described in claim 4, in addition to the function of the invention described in claim 2, by positioning the covered electric wire on the resin chip temporarily before joining, positioning of the connection portion with respect to the resin chip is performed. It can be performed easily and surely.

A fifth aspect of the present invention is the joint structure of the covered electric wire according to the second or fourth aspect, wherein the pair of resin chips are engaged with each other to sandwich the connecting portion. It is characterized in that an engaging portion for maintaining the state before joining is provided.

According to the invention described in claim 5, in addition to the function of the invention described in claim 2 or 4, the resin chip can be preliminarily attached to the connection portion before the bonding, so that the bonding workability is improved. improves. Further, the resin chips after welding are more difficult to separate due to the engagement of the engaging portions, and the mechanical strength is enhanced.

[0029]

DETAILED DESCRIPTION OF THE INVENTION A first embodiment of the present invention will be described below with reference to the drawings.

1 and 2 are perspective views showing a means for obtaining a joint structure of a covered electric wire according to the first embodiment. FIG. 1 shows a state before the start of joining, and FIG. 2 shows a state after the start of joining. It shows the state. FIG. 3 is a schematic view showing a cross section of the main part taken along the arrow A in FIG. 2, and FIG. 3A shows a state immediately after the start of joining,
(B) shows the state after joining.

As shown in FIG. 1, in the present embodiment, two covered electric wires W1 and W2 in which the outer circumference of the conductor wire portion 1 is covered with a resin covering portion 3 are joined at their intermediate connecting portions S. The two covered electric wires W1 and W2 are members which are electrically connected to each other.

For joining the two covered electric wires W1 and W2, a pair of resin chips 53 and 55 as a resin material 51, a horn 57 for generating ultrasonic vibration, and a covered electric wire W at the time of joining.
Anvil 59 supporting 1, W2 and resin chips 53, 55 is used. The anvil 59 includes a base 61 and a base 61.
The support portion 63 is provided so as to protrude from the support portion 63, and the support portion 63 is formed in a substantially rectangular tubular shape. The support portion 63 has a storage recess 65 having a rectangular cross section, which is open on the side opposite to the base (upper side in the drawing). The support portion 63 is opposed to the peripheral walls 63 a and 63 b facing each other with the center of the storage recess 65 interposed therebetween. A pair of two facing grooves 6
7, 69 are provided respectively. These four grooves 6
7, 69 open on the same side as the accommodation recess 65, and
Groove portions 67, which are formed along the protruding direction of 3 and face each other,
The 69 are communicated with each other via the accommodation recess 65.

The pair of resin chips 53, 55 are formed in a rectangular plate shape having an outer circumference slightly smaller than the accommodating recess 65 of the anvil 59, and an end surface 71 of the head 71 of the horn 57.
The a is formed in a rectangular shape having an outer periphery that is substantially the same as or slightly smaller than the resin chips 53 and 55. Resin chip 5
The material of 3,55 is acrylic resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, P
Examples thereof include C (polycarbonate) based resin, PVC (polyvinyl chloride) based resin, PE (polyethylene) based resin, and the like. The suitability when these resins are used for the resin chips 53 and 55 is that the practicality of all the resins is recognized in terms of conductivity and conduction stability, and the appearance and insulation are also included in the judgment. In particular, acrylic resin and PC resin are suitable, and then ABS resin is suitable.

One surface of each of the resin chips 53, 55 is a welding surface 53a, 55a which abuts each other when the resin chips 53, 55 are vertically stacked in the accommodation recess 65 of the anvil 59.
And a groove 67 in the accommodation recess 65 of the anvil 59,
Both ends of each welding surface 53a, 55a close to 69 are lead-out ends 53b, 53 from which the covered electric wires W1, W2 are led out.
c, 55b, 55c. Each lead end 53
b, 53c, 55b, 55c have welding surfaces 53a, 55
A resin accommodating portion H formed in a notched shape so as to be recessed from a is provided.

In order to join the two covered electric wires W1 and W2, the covered electric wires W1 and W2 are overlapped at the connecting portion S, and the overlapped connecting portion S is sandwiched between the pair of resin chips 53 and 55 from above and below.
Specifically, one (lower) resin chip 55 is inserted into the accommodating recess 65 of the anvil 59 so that the welding surface 55a faces upward, and one covered electric wire W1 is inserted from above to one of the opposite groove portions. 67, and then the other covered electric wire W2 is inserted into the groove portion 69 opposite to the other, and finally the other (upper) resin chip 53 is inserted so that the welding surface 53a faces downward. Both of the covered electric wires W1 and W2 are arranged so that the respective connecting portions S thereof intersect at the center of the accommodating concave portion 65, whereby the connecting portions S are connected as shown in FIG. 3 (a).
Is approximately at the center of the upper and lower resin chips 53, 55,
The welding surfaces 53a and 55a are sandwiched from above and below in the stacking direction.

Next, as shown in FIGS. 3 (a) and 3 (b), the covering portion 3 of the connecting portion S is scattered and melted, and the resin chip 5 is used.
Both coated wires W1, W by pressure from outside of 3,55
After the two conductor wire portions (core wires) 1 are brought into conductive contact with each other at the connection portion S, the pair of resin chips 53, 55 are welded to each other on the welding surface 53.
The connection portion S is sealed by welding with a and 55a.

Specifically, the head 71 of the horn 57 is inserted from above the resin chip 53 on the upper side (other side) which is finally inserted, and the connecting portion S is provided from the outside of the upper and lower resin chips 53 and 55. Pressure and vibration are applied between 57 and anvil 59. The pressure applied to the connecting portion S is performed by pressing the horn 57 toward the anvil 59, and the direction of the pressure coincides with the stacking direction of both covered electric wires.

In addition, when the resin materials 51 are welded together by ultrasonic vibration, it is best to apply vibration in a direction that intersects substantially perpendicularly to the joint surface of the resin materials 51. The direction of vibration to the resin chips 53,
It is set in a direction intersecting with the opposing surfaces 53a, 55a of 55, that is, a direction coinciding with the stacking direction of both covered wires W1, W2 (direction of arrow X in FIG. 3 (a)). So-called vertical vibration is transmitted.

When the connecting portion S is pressurized and vibrated in such a state, the covering portion 3 is melted first, and the conductor wire portion 1 of both covered electric wires W1 and W2 is connected to the connecting portion S between the resin chips 53 and 55. To expose. At this time, since the connecting portion S is pressed from above and below, the melted covering portion 3 is extruded outward from the center side of the resin chips 53 and 55, so that the conductor wire portion 1 is better exposed. Surely makes a conductive contact. The direction of vibration applied to the connection S is the same as that of the pressurizing direction.
Since W2 is set in the stacking direction, the action of pushing the covering portion 3 outward from the center side of the resin chips 53, 55 is enhanced.

If the pressure and vibration of the connecting portion S are continued after the covering portion 3 is melted, the resin chips 53, 55 are melted and the welding surfaces 53a, 55a of the resin chips 53, 55 are welded to each other. At the same time, the resin chips 53 and 55 are welded to the outer peripheral surface of the covering portion 3 adjacent to the conductor wire portion 1 which is in conductive contact therewith. As a result, the area around the conductor wire portion 1 that is in conductive contact is covered with the resin chips 53 and 55.

When the resin chips 53 and 55 are welded to each other, the molten resin R tries to flow out from between the welding surfaces 53a and 55a to the outside, but the lead-out end portions 53b, 53c and 5 are formed.
In portions other than 5b and 55c, the molten resin R is prevented from flowing out by the inner wall surface of the accommodation recess 65, so that the molten resin R
Is about to flow out from the lead-out ends 53b, 53c, 55b, 55c, and is housed in the resin housing H. The molten resin R accommodated in the resin accommodating portion H is in a high temperature state behind the outflow (the side close to the connecting portion S), and therefore the covered electric wire W1
, W2 is melted to expose the conductor wire portion 1, but the temperature decreases as it moves toward the outflow front side (the side farther from the connecting portion S), so the cover portion 3 is not completely melted. , Is welded to the outer peripheral surface of the covering portion 3. Therefore, the resin chip 5
The outer circumferences of the conductor wire portions 1 of the covered electric wires W1 and W2 at the portions derived from 3, 55 are completely covered with the covering portion 3 and the molten resin R.

On the other hand, as shown in FIG. 5, resin chips 73 and 75 (resin material 7
When 1) is used, as shown in FIGS. 6A and 6B, the molten resin R flows out from between the welding surfaces 73a, 75a of the lead-out end portions 73b, 73c, 75b, 75c. Flows into the grooves 67, 69 (see FIG. 1).
At this time, below the covered electric wires W1 and W2, the groove portions 67 and 6 are provided.
Since it is close to or in contact with the bottom portion of 9 and does not have a sufficient space for allowing the inflow of the molten resin R, the molten resin R is above the coated wires W1 and W2 as the outflow amount increases. (The opening side of the groove portions 67 and 69) is deposited. Therefore, when the coating portion 3 is melted by the molten resin R in a high temperature state, the conductor wire portion 1 is coated with the molten resin R above the coated electric wires W1 and W2 where the resin is deposited, but the resin is accumulated. In the lower part, which is difficult, the conductor wire portion 1 may be kept exposed despite the melting of the coating portion 3 (reference numeral 1a indicates the exposed conductor wire portion 1). Therefore, there is a possibility that a hole penetrating the covering portion 3 may be formed in the lower portion or the conductor wire portion 1 may be entirely exposed. Therefore, in order to reduce the outflow amount of the molten resin R,
It is necessary to limit the pressurizing force and the vibrating force by the horn 57. The welding force between the resin chips 73 and 75 is strengthened, and the conductor wire portion 1 at the lead-out end portions 73b, 73c, 75b and 75c.
It was difficult to achieve both improvement of the coating property of

That is, according to the resin chips 53 and 55 according to the present embodiment provided with the resin housing portion H, the horn 57 is provided.
Even when the pressure and the vibration force due to are increased, the outer periphery of the conductor wire portion 1 at the lead-out portion from the resin chips 53, 55 is completely covered with the molten resin R in the resin housing portion H and the coating portion 3. Since it is in the opened state, compared with the resin chips 73 and 75 in which the resin housing portion H is not provided, the resin chip 5
It is possible to easily achieve both enhancement of the welding force between 3, 55 and improvement of the covering property of the conductor wire portion 1 at the same time.

After the resin chips 53 and 55 are melted, the pressure and vibration applied by the horn 57 are stopped, the covering portion 3 and the resin chips 53 and 55 are cured, and the joining operation is completed.

Next, the joint structure of the covered electric wire obtained by the joining method will be described. 4A and 4B are perspective views showing a joint structure of the covered electric wire according to the first embodiment, in which FIG. 4A shows an appearance and FIG. 4B shows an internal structure.

As shown in FIG. 3A, this joint structure has a structure in which two covered electric wires W1 and W2 intersect at a connecting portion S inside a resin material 51 composed of a pair of resin chips 53 and 55. At the connecting portion S, the conductor wire portions 1 of both covered electric wires W1 and W2 are exposed and are in conductive contact. The covering portion 3 adjacent to the conductor wire portion 1 in conductive contact is welded to the resin material 51, so that the circumference of the conductor wire portion 1 in conductive contact is covered with the resin material 51, and the connection portion S is sealed with the resin material 51. ing.

In addition, the lead-out end portion 5 of the resin chips 53 and 55
3b, 53c, 55b, 55c, resin chips 53,
55 Molten resin R flowing out when welding each other
The outer circumference of the conductor wire portion 1 of the covered electric wires W1 and W2 in the lead-out portions from the resin chips 53 and 55 is
It is in a state of being completely covered by the covering portion 3 and the molten resin R.

As described above, according to the joining method of the present embodiment, the covered electric wires W1 and W2 are overlapped with each other at the connecting portion S, and the connecting portion S is made into a pair of resin chips 53, 5
In the state of being sandwiched by 5, the covered electric wires W1 and W2 can be brought into conductive contact at the connecting portion S only by spraying and melting the covered portion 3 while applying pressure from the outside of the resin chips 53 and 55. It is not necessary to remove the covering portion 3 in advance, and the conductive connection can be obtained by a simple operation.

Further, according to the joining method and the joining structure, after the covered electric wires W1 and W2 are brought into conductive contact with each other at the connection portion S, the upper and lower resin chips 53 and 55 are welded to each other to seal the connection portion S. Therefore, the resin chip 5 that was welded and hardened
Due to 3,55, high mechanical strength can be obtained in the connection portion S.

Further, since the resin chips 53 and 55 have a size and shape capable of sandwiching the connecting portion S, which is in conductive contact, from the vertical direction, the range required for joining can be narrowed, and the connecting portion S is a resin chip. Since it is sealed by 53 and 55, sufficient insulation can be secured.

Therefore, due to the high mechanical strength and sufficient insulation, the current-carrying characteristics between the covered wires W1 and W2 in the connection portion S can be stabilized.

In the joining method, the overlapped connecting portion S is sandwiched between the resin chips 53 and 55, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from the outside of the resin chips 53 and 55. This is a relatively simple method, and the joining method and the joining structure particularly limit the shape and the like of the member (the other covered electric wire W2 in the present embodiment) of the mating member that is conductively connected to the one covered electric wire W1. Since it is not a material, it can be easily applied to various kinds of joining such as joining of the covered electric wires W1 and W2 and terminals, and high versatility can be obtained.

Further, a pair of resin chips 53, 55 is sandwiched from above and below in the stacking direction of the covered electric wires W1, W2, and the connecting portion S is pressed and vibrated between the horn 57 and the anvil 59 from the outside of the resin chips 53, 55. However, the pressing direction is covered wire W1
, W2 are overlapped with each other.
The molten coating portion 3 is extruded from the center side of the resin chips 53, 55 toward the outside, so that the conductor wire portion 1 is better exposed and a reliable conductive contact state is obtained. Further, since the direction of vibration to the connecting portion S is also the stacking direction of the coated electric wires W1 and W2 in the same manner as the pressing direction, a good welded state of the resin chips 53 and 55 can be obtained and the covering portion 3 is pushed. The action to put out is increased.

Further, since the resin accommodating portion H is provided in the resin chips 53 and 55, the molten resin R flowing out from between the welding surfaces 53a and 55a to the outside by the pressurization and vibration of the horn 57 is accommodated in the resin accommodating portion H. The resin chips 53, 55
The outer peripheries of the conductor wire portions 1 of the coated electric wires W1 and W2 at the portion derived from the above are completely covered with the coating portion 3 and the molten resin R. Therefore, even when the pressing force and the vibration force by the horn 57 are strengthened to strengthen the welding force between the resin chips 53, 55, the lead-out end portions 53b, 53c, 55b, 5 are formed.
It is possible to reliably and completely cover the conductor wire portion 1 in 5c and prevent the conductor wire portion 1 from being oxidized. This makes it possible to easily enhance the welding force between the resin chips 53 and 55 and improve the coverage of the conductor wire portion 1 at the same time.

When the resin chips 53 and 55 having a relatively low viscosity during melting are used and the connection portion S is sandwiched between the resin chips 53 and 55 for welding, adjacent conductor wire portions except the connection portion S are used. By filling the molten resin chips 53, 55 between the core wires constituting the conductor wire portion 1 in 1, the gaps formed between the core wire and the cover portion 3 of the covered wires W1, W2 and between the core wires are formed. The resin material 51 can be buried and blocked, and a waterproof effect can be obtained inside the covered electric wires W1 and W2. Thus, for example, one end of the insulated wires W1 and W2 is connected to a portion that requires waterproofing (waterproofing portion), and the other end is connected to a portion that does not require waterproofing (non-waterproofing portion). In some cases,
Due to the current state of the capillary, even if water or the like flows into the covered wires W1 and W2 from the other end side and flows inside the covered wires W1 and W2, the water blocking effect prevents the water and the like from flowing out to one end side. Therefore, the waterproofness of the one end side can be ensured without forming the other end side of the waterproof structure. That is, when connecting both ends of the insulated wires W1 and W2 to the waterproof portion and the non-waterproof portion, the waterproofness of the waterproof portion is secured by a simple and inexpensive method and structure without making the non-waterproof portion a waterproof structure. can do.

Next, a second embodiment of the present invention will be described.

FIG. 7 is a perspective view showing a means for obtaining the joint structure of the covered electric wire according to the second embodiment. The same parts as those in the first embodiment are designated by the same reference numerals and their parts are omitted. The description is omitted.

As shown in FIG. 7, in the second embodiment,
The covered electric wire W1 is joined to the connecting portion S of the terminal fitting 81, and the covered electric wire W1 and the terminal fitting 81 are members which are electrically connected to each other.

The method of connecting the covered electric wires according to the second embodiment is basically the same as that of the first embodiment. That is, the covered wire W1 is attached to the connecting portion S of the terminal fitting 81.
The connecting portion S at the end is placed, and the connecting portion S is sandwiched between the pair of resin chips 83 and 85 from above and below, and the connecting portion S is
Pressure and vibration are applied between the horn 87 and the anvil 89 from the outside of the upper and lower resin chips 83, 85. As a result, the conductor wire portion 1 of the covered electric wire W1 is exposed at the connecting portion S between the resin chips 83 and 85 and comes into conductive contact with the terminal fitting 81, and then the upper and lower resin chips 83 and 85 are melted, and both resins are melted. Chip 83,
The resin chip 83 is provided around the conductor wire portion 1 in which the opposite welding surfaces 83a, 85a of 85 are welded to each other and are in conductive contact with each other.
It will be in the state covered by. The resin chips 83, 8
5 has a rectangular shape with a width of about 2 to 8 mm, and in accordance with this, the accommodating recess 8 of the resin chip 85 is formed on the upper surface of the anvil 89.
9a is formed.

Each welding surface 83 of each resin chip 83, 85
One end of each of a and 85a constitutes a lead-out end 83b, 85b from which the covered electric wire W1 is led out.
The resin accommodating portion H formed in a cutout shape so as to be recessed from the welding surfaces 83a and 85a is provided at b.

According to the second embodiment, the covered electric wire W1
The same effect as in the first embodiment can be obtained even when the terminal is conductively connected to the terminal fitting 81. Moreover, since the caulking work of the terminal fitting 81 is not required, the joining work can be easily performed.

Next, a third embodiment of the present invention will be described.

FIG. 8 is an exploded perspective view showing the joint structure of the covered electric wire according to the third embodiment before joining, and FIG. 9 is the joint structure of the covered electric wire according to the third embodiment and the structure. FIG. 10 is a cross-sectional view of the main part of FIG. 8, and FIG. 11 is a cross-sectional view of the main part of FIG. 9. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 8 and 10, in the third embodiment, a plurality (4 in the present embodiment) of covered electric wires W are provided.
1, W2, W3, W4 are joined at their respective terminal portions, and the terminal portions constitute the connecting portion S. In accordance with this, the welding surface 1 of the upper and lower resin chips 103, 105
Only one end side of 03a, 105a has covered electric wires W1 to W4
Of the welding surfaces 103a, 10b.
A notched resin accommodating portion H that is recessed from 5a is formed.

The method of connecting the covered electric wires according to the third embodiment is also basically the same as that of the first embodiment. That is, the covered electric wires W1 to W4 are entwined with each other so as to overlap each other at the connection portion S, and then the connection portion S is sandwiched between the pair of resin chips 103 and 105 from above and below to form the connection portion S.
Is pressurized and vibrated between the horn 107 and the anvil 109 (see FIG. 9) from the outside of the upper and lower resin chips 103, 105. Thereby, as shown in FIG. 11, each covered electric wire W
After the conductor wire portion 1 of 1 to W4 is exposed at the connection portion S between the resin chips 103 and 105 and is brought into conductive contact with each other, the upper and lower resin chips 103 and 105 are melted and both resin chips 1
The opposing welding surfaces 103a and 105a of 03 and 105 are welded to each other, and the area around the conductor wire portion 1 that is in conductive contact is covered with the resin chips 103 and 105. As shown in FIG. 9, the anvil 109 has a housing recess 111 for housing and supporting the resin chips 103 and 105,
A groove 113 for inserting the covered electric wires W1 to W4 is provided.

As shown in FIG. 11, in this joint structure, the conductor wire portions 1 of the four covered wires W1 to W4 are connected to each other at the terminal connection portion inside the resin material 101 including the pair of resin chips 103 and 105. The covering portion 3 adjacent to the conductor wire portion 1 which is entwined and conductively contacted by S is welded to the resin material 101. As a result, the circumference of the conductor wire portion 1 in conductive contact is entirely covered with the resin material 101 including the opposite sides 103c and 105c of the lead-out ends 103b and 105b, and the connection portion S is sealed with the resin material 101. There is.

At the lead-out end portions 103b and 105b of the resin chips 103 and 105, the resin chips 103 and 105 are
The molten resin R flowing out at the time of mutual welding is accommodated in the resin accommodating portion H and hardened, and the outer periphery of the conductor wire portion 1 of the covered electric wires W1 to W4 at the lead-out portions from the resin chips 103 and 105 has the covering portion 3 and the molten resin. It is completely covered by R and.

According to the third embodiment, even when the end portions of the plurality of covered electric wires W1 to W4 are electrically connected,
The same effects as in the first embodiment can be obtained.

Further, since the covering portions 3 of the covered electric wires W1 to W4 which are intertwined with each other are scattered and melted, the conductor wire portions 1 exposed at the connection portion S are also intertwined with each other. Therefore, the conductor wire portions 1 can be brought into contact with each other at a plurality of points, and the current-carrying characteristics can be further stabilized. Further, the resin chips 103 and 105 (resin material 101)
Even if a peeling force acts on the coated electric wires W1 to W4 outside of, the stress against it acts on the resin chips 103 and 105 at a plurality of entangled locations, and therefore acts.
The peeling force (peeling strength) is increased, the resin chips 103 and 105 that have been welded are separated from each other, and the resin chip 1
It is possible to reliably prevent the peeling between 03 and 105 and the covered electric wires W1 to W4 and further increase the mechanical strength.

Next, a fourth embodiment of the present invention will be described.

FIG. 12 is a perspective view showing, before joining, means for obtaining the joined structure of the covered electric wire according to the fourth embodiment.
13 and 14 are perspective views showing a method of holding the covered electric wire on one resin chip, FIG. 15 is an external perspective view showing a state after joining by the means of FIG. 12, and FIG. 16 is a main part of FIG. FIG. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 12, in the fourth embodiment, the welding surface 125 is attached to one (lower) resin chip 125.
Support grooves 145 and 147 as electric wire holding portions for temporarily holding the covered electric wires W1 and W2 before joining are provided on both sides of a, and further, the pair of resin chips 123 and 125 are engaged with each other to cover the electric wires W1 and W1. Locking protrusion 13 as an engaging portion for maintaining the state before joining, sandwiching the connecting portion S (see FIG. 14) of W2
7 and the engaging recess 139 are provided.

Welding surface 125a of the lower resin chip 125
And lead-out end portions 125b, 125c on both sides of the welding surface 125a
Standing wall portions 141 and 143 projecting upward from the welding surface 125a are provided integrally with the resin chip 125 between and. The support grooves 145, 147 are formed in two places on each of the standing wall portions 141, 143 on both sides. The diameters of the support grooves 145, 147 are formed to be slightly smaller than the outer diameters of the corresponding covered wires W1, W2, and the covered wires W1, 147 are inserted into the support grooves 145, 147 from above.
By pressing W2, the covered electric wires W1 and W2 are accommodated and held in the support grooves 145 and 147. Further, the lead-out ends 125b and 125c on both sides of the lower resin chip 125 are also provided.
The same resin accommodating portion H as that of the first embodiment is provided in.

The lower surface of the upper resin chip 123 has a protruding welding surface 123a corresponding to the lower welding surface 125a so as to match the upper surface shape of the lower resin chip 125.
And the lower resin chip 125 on both sides of the welding surface 123a.
Support grooves 145, 147 and a lid portion 149 that closes the upper opening portion of the resin housing portion H.
The resin housing portion H is not provided in the upper resin chip 123.

Flexible arms 135 are provided on both sides in the width direction of the upper resin chip 123 so as to extend downward so as to intersect with the welding surface 123a, and the locking projections 137 are provided with the flexible arms 13.
5 is projectingly provided on the inner side of the tip portion. The engaging recess 139
Is formed in a notch shape on the lower portion of the side surface that intersects with the welding surface 125a of the lower resin chip 125. The flexible arm 135, the locking protrusion 137, and the engaging recess 139 are
Only one side in the width direction is shown, and the other side is not shown.

In addition to the joining method of the first embodiment, the joining method of the covered electric wire according to the fourth embodiment is such that the covered electric wires W1 and W2 are temporarily held in advance by a resin chip 125 before joining. is there. That is, as shown in FIG. 13, first, one side of the covered electric wires W1 and W2 is housed and held in the support groove 145 of the lower resin chip 125, and the covered electric wires W1 and W2 are held.
After 1, W2 are entwined with each other so as to overlap each other at the connecting portion S, the other sides of the covered electric wires W1, W2 are accommodated and held in the support grooves 145, 147 as shown in FIG. As a result, the covered electric wires W1 and W2 are temporarily held by the lower resin chip 125 in a state of being overlapped at the connection portion S.

Next, the upper resin chip 123 is covered on the upper surface of the lower resin chip 125 so that the connecting portion S is sandwiched between the welding surfaces 123a and 125a, and the engaging projection 137 is engaged with the engaging recess 139. Let As a result, the upper and lower resin chips 123 and 125 are attached to the joint S in advance. Further, in this state, the upper resin chip 123
Is in a state of being slightly floated from the lower resin chip 125 by the amount of the sandwiched covered wires W1 and W2.

Then, the connecting portion S is connected to the upper and lower resin chips 1
From outside of 23 and 125, horn 107 and anvil 109
(See FIG. 12). As a result, as shown in FIGS. 15 and 16, the conductor wire portion 1 of the covered electric wires W1 and W2 is connected to the connecting portion S between the resin chips 123 and 125.
Exposed and exposed to each other in electrical contact, and then the upper and lower resin chips 1
23 and 125 are melted, and both resin chips 123 and 125 are melted.
The welding surfaces 123a, 125a facing each other are welded to each other, and the resin chip 12 is surrounded by the conductor wire portion 1 which is conductively contacted.
It is in a state of being covered by 3,125. As shown in FIG. 12, the resin chip 12 is attached to the anvil 129.
An accommodating recess 131 for accommodating and supporting 3,125 and a window 133 through which the covered electric wires W1 and W2 are inserted are provided.

As shown in FIG. 16, in this joint structure, the conductor wire portions 1 of the covered electric wires W1 and W2 are entangled at the connection portion S inside the resin material 121 composed of the pair of resin chips 123 and 125 so as to conduct electricity. The covering portion 3 adjacent to the conductor wire portion 1 that is in contact with and is in conductive contact is welded to the resin material 121. As a result, the circumference of the conductor wire portion 1 that is in conductive contact is entirely covered with the resin material 121, and the connection portion S is sealed with the resin material 121.

In the lead-out end portions 123b, 123c, 125b, 125C of the resin chips 123, 125, the molten resin R flowing out when the resin chips 123, 125 are welded to each other flows through the support grooves 145, 147 (see FIG. 12). Then, the resin chips 123, 12 are housed in the resin housing portion H and cured.
The outer periphery of the conductor wire portion 1 of the coated electric wires W1 and W2 at the portion derived from 5 is completely covered with the coating portion 3 and the molten resin R.

According to the fourth embodiment, in addition to the effect similar to that of the first embodiment, the covered electric wires W1 and W2 are connected to the lower resin chip 125 before the joining by the horn 127 and the anvil 129. Since it is temporarily held, the positioning of the connecting portion S with respect to the lower resin chip 125 can be performed more easily and more reliably than in the first embodiment, which is performed in the supporting recess of the anvil.

Before the joining, the upper and lower resin chips 12 are joined.
Since 3,125 can be attached to the connection part S in advance, the bonding workability is improved as compared with the first embodiment in which the upper and lower resin chips are sequentially stacked in the supporting recess of the anvil to perform the bonding work. To do.

Further, the engaging projection 137 and the engaging recess 139 are provided.
And the resin chips 123 and 125 after welding by engagement with
It becomes more difficult for them to separate from each other, and the mechanical strength at the joint S is enhanced.

Further, the anvil 129 is provided with a covered electric wire W1,
It is not necessary to provide a groove for positioning W2,
A window 13 of a size that allows insertion of the covered electric wires W1 and W2
Since it is sufficient to provide 3, the same anvil 129 can be used as long as the dimensions and shapes of the resin chips 123 and 125 do not change even if the number of covered electric wires W1 and W2 to be joined is different.

Further, since the covering portions 3 of the covered electric wires W1 and W2 which are intertwined with each other are scattered and melted, similarly to the third embodiment, the energization characteristics are further stabilized and the mechanical strength is further improved. Can be increased.

In each of the first to third embodiments described above, the resin accommodating portions H are provided on both the upper and lower resin chips, but it is not always necessary to provide them on both sides, as in the fourth embodiment. It should be provided on at least one side.

[0087]

As described above, according to the inventions of claims 1 to 3, it is possible to easily carry out the work of conducting connection without removing the covering portion in advance, and to set the cured resin. With the tip, high mechanical strength and sufficient insulation can be obtained at the connection part to stabilize the current-carrying characteristics, high versatility can be obtained, and the welding force between the resin chips can be enhanced and the conductor wire part It is possible to easily achieve both improvement of the covering property.

According to the invention described in claim 4, according to claim 2,
In addition to the effects of the invention described in (1), the connection portion can be easily and reliably positioned with respect to the resin chip.

According to the invention described in claim 5, in addition to the effect of the invention described in claim 2 or 4, it is possible to improve the workability of bonding and enhance the mechanical strength after bonding.

[Brief description of drawings]

FIG. 1 is a perspective view showing a means for obtaining a joint structure of a covered electric wire according to a first embodiment (state before joining is started).

FIG. 2 is a perspective view showing a means for obtaining the joint structure of the covered electric wire according to the first embodiment (state after joining is started).

3A and 3B are schematic views showing a cross section of the main part taken from the direction A in FIG. 2, where FIG. 3A shows a state immediately after the start of joining, and FIG. 3B shows a state after joining.

FIG. 4 is a perspective view showing a joint structure of the covered electric wire according to the embodiment, (a) showing an external appearance, and (b) showing an internal structure.

FIG. 5 is a perspective view showing a resin chip having no resin housing portion.

6A and 6B are schematic views of a joint structure in the case where a resin chip having no resin housing portion is used, FIG. 6A is a perspective view, and FIG. 6B is a side view.

FIG. 7 is a perspective view showing a means for obtaining a joint structure for a covered electric wire according to a second embodiment.

FIG. 8 is an exploded perspective view showing a state before joining of a covered electric wire joining structure according to a third embodiment.

FIG. 9 is a perspective view showing a joint structure of a covered electric wire and a means for obtaining the structure according to a third embodiment.

10 is a cross-sectional view of the main parts of FIG.

FIG. 11 is a sectional view of a main part of FIG. 9;

FIG. 12 is a perspective view showing a means for obtaining a joined structure of a covered electric wire according to a fourth embodiment before joining.

FIG. 13 is a perspective view showing a method of holding a covered electric wire on one resin chip.

FIG. 14 is a perspective view showing a method of holding a covered electric wire on one resin chip.

15 is an external perspective view showing a state after joining by the means of FIG.

16 is a cross-sectional view of the main parts of FIG.

FIG. 17 is a perspective view showing a conventional example.

FIG. 18 is a side view of FIG. 17, in which (a) shows a state before joining and (b) shows a state after joining.

FIG. 19 is a perspective view showing another conventional example.

20 is a side sectional view of FIG.

FIG. 21 is a perspective view showing another conventional example.

FIG. 22 is a perspective view showing another conventional example, (a) shows a state before joining, (b) shows a joined state by a joint terminal, (c) shows a state at the time of thermocompression bonding, (D) shows the winding state of the insulating material.

FIG. 23 is a sectional view showing another conventional example, in which (a) is a side sectional view and (b) is a front sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductor wire part 3 Cover part 53 Resin chip 53a Welding surface 53b Derivation end part 53c Derivation end part 55 Resin chip 55a Welding surface 55b Derivation end part 55c Derivation end part 81 Terminal metal fittings (members electrically connected to each other) 83 Resin chip 83a Welding Surface 83b Derived end portion 85 Resin chip 85a Welding surface 85b Derived end portion 103 Resin chip 103a Welded surface 103b Derived end portion 105 Resin chip 105a Welded surface 105b Derived end portion 123 Resin chip 123a Welded surface 123b Derived end portion 123c Derived end portion 125 Resin chip 125a Welding surface 125b Derived end 125c Derived end 137 Locking protrusion (engaging part) 139 Engaging recess (engaging part) 145 Support groove (electric wire holding part) 147 Support groove (electric wire holding part) W1 Coated wire (Members for conducting and connecting with each other) W2 coated electric wire (conducting with each other) Connecting members) W3 covered electric wire (together conductively connected to members) W4 covered electric wire (together conductively connected to members) S connecting portion H resin receiving portion R molten resin

Claims (5)

[Claims] 1. At least one of the members that are electrically connected to each other is a covered electric wire in which the outer periphery of a conductor wire portion is covered with a resin covering portion, and the two members are overlapped at the connection portion, and the overlapped connection portion is provided as a pair. After the first step of sandwiching with resin chips, after the cover portion is scattered and melted, and both members are brought into conductive contact at the connection portion by pressure from the outside of the resin chip,
A method of joining a covered electric wire, comprising a second step of welding the pair of resin chips to each other and sealing the connection portion, wherein the covered electric wire is led out to at least one of the pair of resin chips. A resin containing portion formed so as to be recessed from the welding surface with the mating chip at the end portion is provided, and in the second step, the molten resin that has flowed out during the mutual welding of the resin chips is contained in the resin containing portion. A method for joining covered electric wires, characterized by curing. 2. At least one of the members that are electrically connected to each other is a covered electric wire in which the outer periphery of the conductor wire portion is covered with a resin covering portion, and both members are overlapped at the connection portion, and the overlapped connection portion is provided as a pair. After sandwiching between resin chips, the coating portion is scattered and melted, and after the two members are brought into conductive contact with the connection portion by pressure from the outside of the resin chip, the pair of resin chips are welded to each other to connect the connection portion. Is a joint structure of a covered electric wire formed by sealing, at least one of the pair of resin chips, the covered electric wire is formed so as to be recessed from the welding surface with the mating chip at the lead-out end portion, A joint structure for a covered electric wire, comprising: a resin accommodating portion that accommodates and cures molten resin that has flowed out when the resin chips are welded to each other. 3. The joint structure for a covered electric wire according to claim 2, wherein the resin accommodating portion is formed in a cutout shape. 4. The joint structure for a covered electric wire according to claim 2, wherein an electric wire holding portion for temporarily holding the covered electric wire before joining is provided on at least one of the pair of resin chips. Joint structure of covered electric wire. 5. The joint structure for a covered electric wire according to claim 2 or 4, wherein the pair of resin chips are engaged with each other to maintain the state before joining with the connection portion sandwiched therebetween. A joint structure for a covered electric wire, comprising an engaging portion.