JPH0732054Y2 - Thermal head feed line connection structure - Google Patents

Thermal head feed line connection structure

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Publication number
JPH0732054Y2
JPH0732054Y2 JP1988094105U JP9410588U JPH0732054Y2 JP H0732054 Y2 JPH0732054 Y2 JP H0732054Y2 JP 1988094105 U JP1988094105 U JP 1988094105U JP 9410588 U JP9410588 U JP 9410588U JP H0732054 Y2 JPH0732054 Y2 JP H0732054Y2
Authority
JP
Japan
Prior art keywords
thermal head
flexible substrate
common electrode
substrate
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988094105U
Other languages
Japanese (ja)
Other versions
JPH0215362U (en
Inventor
史明 田頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
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Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1988094105U priority Critical patent/JPH0732054Y2/en
Publication of JPH0215362U publication Critical patent/JPH0215362U/ja
Application granted granted Critical
Publication of JPH0732054Y2 publication Critical patent/JPH0732054Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 (イ)産業上の利用分野 この考案は、接続作業性の良いサーマルヘッドの給電線
接続構造に関する。
[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a feed line connecting structure for a thermal head having good connection workability.

(ロ)従来の技術 第4図は、従来のサーマルヘッドの電極パターン例を示
す平面図である。
(B) Conventional Technology FIG. 4 is a plan view showing an example of an electrode pattern of a conventional thermal head.

サーマルヘッドは、絶縁基板(ヘッド基板)61の上面に
複数の個別電極62と共通電極63と、発熱抵抗体64とを形
成している。この種のサーマルヘッドでは、使用に際し
共通電極63の両端部(図中、「A」「A」)から給電す
る。ところが、この給電方式では共通電極63の給電点よ
り各発熱抵抗体64までの抵抗値差が無視できず、両端部
に位置する発熱抵抗体64より、中央部(B付近)に位置
する発熱抵抗体64の方が、給電点よりの共通電極63の距
離が長く、その分だけ電気抵抗が大きくなり、電圧降下
が大となる。この結果、中央部に位置する発熱抵抗体64
の印字濃度が低下する不利がある。
The thermal head has a plurality of individual electrodes 62, a common electrode 63, and a heating resistor 64 formed on the upper surface of an insulating substrate (head substrate) 61. In this type of thermal head, power is supplied from both ends (“A” and “A” in the figure) of the common electrode 63 when used. However, in this power feeding method, the difference in resistance value from the power feeding point of the common electrode 63 to each heating resistor 64 cannot be ignored, and the heating resistors located at the central portion (near B) from the heating resistors 64 located at both ends. In the body 64, the distance of the common electrode 63 from the feeding point is longer, the electric resistance becomes larger accordingly, and the voltage drop becomes larger. As a result, the heating resistor 64 located at the center is
However, there is a disadvantage that the print density decreases.

そこで、近年、第5図に示すようなサーマルヘッドが実
施されている。このサーマルヘッドは、ヘッド基板61の
上面(表面)に複数の個別電極62、発熱抵抗体64を設け
る一方、共通電極63を上面の発熱抵抗体64側端部から裏
面(下面)にまで延長して配備している。そして、裏面
の共通電極63と外部回路接続用フレキシブル基板65の共
通電極リードパターン部66間は、リード線67を接続する
ことで導通させている。この給電線接続方式によれば、
共通電極63がヘッド基板61の裏面全面に配備してあり、
平電極であるため電気抵抗が小さく、第4図に示すよう
な「B」点における電圧降下が生じず、印字精度を確保
し得る。
Therefore, in recent years, a thermal head as shown in FIG. 5 has been implemented. In this thermal head, a plurality of individual electrodes 62 and a heating resistor 64 are provided on the upper surface (front surface) of a head substrate 61, while the common electrode 63 is extended from the end portion of the upper surface on the heating resistor 64 side to the back surface (lower surface). Have been deployed. Then, a lead wire 67 is connected between the common electrode 63 on the back surface and the common electrode lead pattern portion 66 of the external circuit connecting flexible substrate 65 to establish conduction. According to this feeder connection method,
The common electrode 63 is provided on the entire back surface of the head substrate 61,
Since it is a flat electrode, the electric resistance is small, and the voltage drop at the point "B" as shown in FIG. 4 does not occur, and the printing accuracy can be secured.

(ハ)考案が解決しようとする課題 上記、第5図に示すサーマルヘッドの給電線接続構造で
は、リード線をハンダ付けすることで、ヘッド基板の裏
面に備える共通電極と外部回路接続用フレキシブル基板
(共通電極リードパターン部)とを接続するものであ
る。このため、ヘッド基板に備える共通電極は、ハンダ
付け可能なパターン、例えばAg−Pdによるパターンが必
要であり、高価となる不利がある。また、通常、ヘッド
基板の下面は放熱板により支承されるものであるため、
リード線のハンダ付け作業が手間な許かりでなく、リー
ド線を外方へ引き出すために、例えば放熱板にリード線
逃がし用溝を設ける必要がある等、工数が増加する不利
がある。
(C) Problems to be Solved by the Invention In the above-described power supply line connection structure for the thermal head shown in FIG. 5, by soldering the lead wires, the common electrode provided on the back surface of the head substrate and the flexible substrate for external circuit connection are provided. (Common electrode lead pattern portion). Therefore, the common electrode provided on the head substrate requires a solderable pattern, for example, a pattern of Ag-Pd, which is disadvantageous in that it is expensive. Also, since the lower surface of the head substrate is usually supported by a heat sink,
Since the work of soldering the lead wire is troublesome, there is a disadvantage that the number of steps is increased, for example, in order to pull out the lead wire to the outside, it is necessary to provide a lead wire escape groove in the heat sink.

この考案は、以上のような課題を解消させ、電圧降下が
生じず、簡易な構成で共通電極を接続し得るサーマルヘ
ッドの給電線続構造を提供することを目的とする。
An object of the present invention is to solve the above problems, and to provide a power supply wire connection structure for a thermal head in which a voltage drop does not occur and a common electrode can be connected with a simple configuration.

(ニ)課題を解決するための手段及び作用 この考案のサーマルヘッドの給電線接続構造は、上面に
発熱抵抗体列、個別電極が配置され、上面から裏面に連
設される共通電極を備えたサーマルヘッド基板(1)へ
の給電線の接続構造であって、前記個別電極に対応する
個別リードパターンを有し、前記共通電極に対応する共
通リードパターンを発熱抵抗体列方向の両端部にそれぞ
れ有する第1のフレキシブル基板(5)と、前記サーマ
ルヘッド基板の共通電極に対応する導体層を有し、この
導体層から前記第1のフレキシブル基板の共通リードパ
ターンに対応して発熱抵抗体列方向の両端部にそれぞれ
延設された引出し用脚部を有する第2のフレキシブル基
板(2)とを備え、第1のフレキシブル基板の個別リー
ドパターンをサーマルヘッド基板の個別電極に圧接接続
し、第2のフレキシブル基板をサーマルヘッド基板の裏
面側に配置して、第2のフレキシブル基板の導体層をサ
ーマルヘッド基板の共通電極に圧接接続すると共に、第
2のフレキシブル基板の引出し用脚部を第1のフレキシ
ブル基板の共通リードパターンに圧接接続するようにし
ている。
(D) Means and Actions for Solving the Problems The power supply line connection structure of the thermal head of the present invention is provided with a heating resistor array and individual electrodes on the upper surface, and a common electrode connected from the upper surface to the back surface. A structure for connecting a power supply line to a thermal head substrate (1), which has individual lead patterns corresponding to the individual electrodes, and common lead patterns corresponding to the common electrodes are provided at both ends in the heating resistor row direction. A first flexible substrate (5) having the same, and a conductor layer corresponding to a common electrode of the thermal head substrate, and from this conductor layer corresponding to a common lead pattern of the first flexible substrate, a heating resistor column direction. A second flexible substrate (2) having extension legs respectively extending at both ends of the thermal head substrate. The individual flexible electrodes of the plate are pressure-contact connected, the second flexible substrate is arranged on the back surface side of the thermal head substrate, the conductor layer of the second flexible substrate is pressure-connected to the common electrode of the thermal head substrate, and The drawer leg portion of the flexible substrate is pressure-contacted to the common lead pattern of the first flexible substrate.

このサーマルヘッドの給電線接続構造では、第1のフレ
キシブル基板の個別リードパターンと、サーマルヘッド
基板の個別電極が対応して接面し、第2のフレキシブル
基板の導体層が、サーマルヘッド基板の下面の共通電極
に接面し、第2のフレキシブル基板の引出し用脚部が、
第1のフレキシブル基板の共通リードパターンと接面す
る。そして、この接面状態で、第1のフレキシブル基板
の個別リードパターンと、サーマルヘッド基板の個別電
極の接面部、及び第1と第2のフレキシブル基板の共通
リードパターンの接面部が、例えば圧接用金属カバー
(シリコンゴムを介して圧接する全面カバー)により、
圧接固定される。
In this thermal head feed line connection structure, the individual lead patterns of the first flexible substrate and the individual electrodes of the thermal head substrate are in contact with each other, and the conductor layer of the second flexible substrate is the lower surface of the thermal head substrate. Of the second flexible printed circuit board facing the common electrode of
The surface is in contact with the common lead pattern of the first flexible substrate. Then, in this contact state, the individual lead patterns of the first flexible substrate, the individual electrode contact faces of the thermal head substrate, and the common lead pattern contact faces of the first and second flexible substrates are used for pressure contact, for example. With a metal cover (a full-face cover that is pressed through silicon rubber),
Pressed and fixed.

かくして、サーマルヘッド基板の共通電極は、共通電極
接続用の第2フレキシブル基板を介して、極めて簡易な
作業で外部回路接続用の第1のフレキシブル基板の共通
リードパターンと導通させ得る。従って、従来のような
共通電極パターンの接続にリード線をハンダ付けする等
の作業が解消される。
Thus, the common electrode of the thermal head substrate can be electrically connected to the common lead pattern of the first flexible substrate for external circuit connection through the second flexible substrate for connecting the common electrode by a very simple operation. Therefore, the conventional work of soldering the lead wire to the connection of the common electrode pattern is eliminated.

(ホ)実施例 第2図は、この考案に係るサーマルヘッドの給電線接続
構造を示す要部拡大斜視図である。
(E) Embodiment FIG. 2 is an enlarged perspective view of a main part showing a power supply line connection structure of a thermal head according to the present invention.

サーマルヘッドのパターン接続構造は、上面に個別電極
及び発熱抵抗体を備え、上面から下面にかけて連設した
共通電極を備えたサーマルヘッド基板1と、このサーマ
ルヘッド基板1の共通電極に導体層が接続され、引出し
用脚部が外部回路接続用フレキシブル基板(第1のフレ
キシブル基板)5の共通電極リードパターン部51に接続
される共通電極接続用フレキシブル基板(第2のフレキ
シブル基板)2とから構成される。
In the pattern connection structure of the thermal head, the thermal head substrate 1 is provided with an individual electrode and a heating resistor on the upper surface, and a common electrode is continuously provided from the upper surface to the lower surface, and a conductor layer is connected to the common electrode of the thermal head substrate 1. The pull-out leg portion is composed of the common electrode connecting flexible substrate (second flexible substrate) 2 connected to the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate (first flexible substrate) 5. It

サーマルヘッド基板1は、上面に個別電極、発熱抵抗体
(図示せず)、上面から下面に共通電極を形成した、第
5図に示す構造に等しいもので(第3図参照)、放熱板
3の上面に載置固定される。放熱板3は、サーマルヘッ
ド基板1を上面一端部側に載置し、他端部側に後述する
共通電極接続用フレキシブル基板2の引出し脚部21に対
応する幅の切欠部31を一定長さ設けている。また、放熱
板3の他端部側(引出し脚部21引出し側)の上面には、
補強板4を重合し、この補強板4上に外部回路接続用フ
レキシブル基板5を載置している。この外部回路接続用
フレキシブル基板5は、面内中央部に個別電極リードパ
ターン部52を設け、両端部に共通電極リードパターン部
51が設けてある。そして、共通電極リードパターン部51
は上記放熱板3の切欠部31手前側に位置し、中央部の突
出先端部(個別電極リードパターン部52)が、等高位置
である上記サーマルヘッド基板1の上面個別電極11に接
合して導通するように設定してある。この外部回路接続
用フレキシブル基板5は、第3図で示すように、ベース
フィルム5a上に表側導体(共通電極リードパターン部5
1)5b、表側導体5b上に絶縁フィルム5c、更にベースフ
ィルム5aの下に裏側導体(個別電極リードパターン部5
2)5d、裏側導体5dの下に絶縁フィルム5eを重合した5
層構造に形成されている。
The thermal head substrate 1 has the same structure as that shown in FIG. 5 in which individual electrodes, heating resistors (not shown) are formed on the upper surface, and a common electrode is formed from the upper surface to the lower surface (see FIG. 3). It is placed and fixed on the upper surface of. The heat dissipation plate 3 mounts the thermal head substrate 1 on one end side of the upper surface, and has a notch 31 of a width corresponding to a lead-out leg 21 of a flexible substrate 2 for common electrode connection, which will be described later, at a certain length on the other end side. It is provided. In addition, on the upper surface of the other end of the heat dissipation plate 3 (the drawer leg 21 drawer side),
The reinforcing plate 4 is superposed, and the external circuit connecting flexible substrate 5 is placed on the reinforcing plate 4. This external circuit connecting flexible substrate 5 is provided with an individual electrode lead pattern portion 52 at the center of the surface and a common electrode lead pattern portion at both ends.
51 is provided. Then, the common electrode lead pattern portion 51
Is located on the front side of the cutout portion 31 of the heat dissipation plate 3, and the protruding tip portion (individual electrode lead pattern portion 52) of the central portion is joined to the upper surface individual electrode 11 of the thermal head substrate 1 which is at the equal height position. It is set to conduct electricity. As shown in FIG. 3, the flexible substrate 5 for external circuit connection has a front side conductor (common electrode lead pattern portion 5) on the base film 5a.
1) 5b, the insulating film 5c on the front conductor 5b, and the back conductor (individual electrode lead pattern part 5
2) 5d, an insulating film 5e was polymerized under the back conductor 5d 5
It is formed in a layered structure.

この実施例の特徴は、サーマルヘッド基板1の裏面に備
える共通電極12と、外部回路接続用フレキシブル基板
(共通電極リードパターン部51)5とを導通させる共通
電極接続用フレキシブル基板2を設けたことである。
The feature of this embodiment is that the common electrode connecting flexible substrate 2 for electrically connecting the common electrode 12 provided on the back surface of the thermal head substrate 1 and the external circuit connecting flexible substrate (common electrode lead pattern portion 51) 5 is provided. Is.

第1図は、共通電極接続用フレキシブル基板2を示す一
部省略斜視図である。
FIG. 1 is a partially omitted perspective view showing a flexible substrate 2 for connecting a common electrode.

共通電極接続用フレキシブル基板2は、対向する2片の
引出し用脚部21と、この2片の脚部21を連続させる固定
部22とから成る平面形状「コ」字状に形成される。この
共通電極接続用フレキシブル基板2は、導体層2cの上・
下面に絶縁フィルム2a、2bを重合した3層構造に形成し
ている。中間に位置する導体層2cは、引出し用脚部21側
において下面が一定長さ臨出し(下側絶縁フィルム2bに
対し臨出し)、固定部22側において上面が臨出(上側絶
縁フィルム2aより臨出)するように設定されている。そ
して、この導体層2cの固定部22側は、サーマルヘッド基
板1の幅にほぼ対応する大きさとし、引出し用脚部21側
は外部回路接続用フレキシブル基板5の共通電極リード
パターン部51に対応した大きさ(幅)に設定してある。
The common electrode connecting flexible substrate 2 is formed in a U-shape in a plan view, which includes two facing leg portions 21 for pulling out and a fixing portion 22 that connects the two leg portions 21. The flexible substrate 2 for connecting the common electrode is formed on the conductor layer 2c.
The lower surface has a three-layer structure in which insulating films 2a and 2b are polymerized. In the conductor layer 2c located in the middle, the lower surface is exposed for a certain length on the side of the drawing leg portion 21 (adjacent to the lower insulating film 2b), and the upper surface is exposed on the side of the fixed portion 22 (from the upper insulating film 2a). Appearance) is set. The fixed portion 22 side of the conductor layer 2c has a size substantially corresponding to the width of the thermal head substrate 1, and the lead-out leg portion 21 side corresponds to the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate 5. The size (width) is set.

このような構成を有する共通電極接続用フレキシブル基
板2を使用して、サーマルヘッド基板1と外部回路接続
用フレキシブル基板5とを接続する場合、第3図に示す
ように実施する。つまり、この共通電極接続用フレキシ
ブル基板2は、固定部22側がサーマルヘッド基板1と放
熱板3との間に圧着固定される。この時、ヘッド基板1
の裏面共通電極12と共通電極接続用フレキシブル基板2
の固定部22、つまり導体層2cの臨出面(上部臨出面)が
完全に接面し導通する。共通電極12は、ヘッド基板1の
裏面全面に設けられており、発熱抵抗体(図示せず)の
電圧降下現象はほとんど生じない。
When the thermal head substrate 1 and the external circuit connecting flexible substrate 5 are connected using the common electrode connecting flexible substrate 2 having such a configuration, it is carried out as shown in FIG. That is, in this common electrode connecting flexible substrate 2, the fixing portion 22 side is pressure-bonded and fixed between the thermal head substrate 1 and the heat dissipation plate 3. At this time, the head substrate 1
Back side common electrode 12 and flexible substrate 2 for common electrode connection
The fixed portion 22, that is, the exposed surface (upper exposed surface) of the conductor layer 2c is completely in contact with and electrically connected. The common electrode 12 is provided on the entire back surface of the head substrate 1, and the voltage drop phenomenon of the heating resistor (not shown) hardly occurs.

更に、引出し用脚部21はヘッド基板1より放熱板3の切
欠部31を介して外方へ引出され、外部回路接続用フレキ
シブル基板5の共通電極リードパターン部51の上面に接
面する。つまり、引出し用脚部21の先端に位置する導体
層2cの下面臨出部が、外部回路接続用フレキシブル基板
5の共通電極リードパターン部51と接続される。
Furthermore, the lead-out leg portion 21 is pulled out from the head substrate 1 through the cutout portion 31 of the heat dissipation plate 3 and contacts the upper surface of the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate 5. That is, the lower surface protruding portion of the conductor layer 2c located at the tip of the lead-out leg portion 21 is connected to the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate 5.

また、サーマルヘッド基板1の上面個別電極11の上面に
は、外部回路接続用フレキシブル基板5の個別電極リー
ドパターン部52が接面し、従来同様に導通される。そし
て、これらの接続状態、つまりヘッド基板1の個別電極
11と外部回路接続用フレキシブル基板5の個別電極リー
ドパターン部52との接続、及び共通電極接続用フレキシ
ブル基板2の導体層2cと外部回路接続用フレキシブル基
板5の共通電極リードパターン部51との接続は、例えば
従来使用されている圧接用金属カバー(シリコンゴムを
介して圧接する金属カバー)により圧接固定する。
Further, the individual electrode lead pattern portion 52 of the external circuit connecting flexible substrate 5 is in contact with the upper surface of the upper surface individual electrode 11 of the thermal head substrate 1 and is electrically connected as in the conventional case. Then, these connection states, that is, the individual electrodes of the head substrate 1
11 and the individual electrode lead pattern portion 52 of the external circuit connecting flexible substrate 5, and the connection between the conductor layer 2c of the common electrode connecting flexible substrate 2 and the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate 5. Is fixed by pressure using, for example, a conventionally used pressure-contact metal cover (metal cover pressure-contacted via silicon rubber).

かくして、ヘッド基板1の個別電極11は従来同様に外部
回路接続用フレキシブル基板5の個別電極リードパター
ン部52と接続され、サーマルヘッド基板1の共通電極12
は、共通電極接続用フレキシブル基板2を介して、極め
て簡易な作業で外部回路接続用フレキシブル基板5の共
通電極リーパターン部51と導通させ得る。従って、共通
電極パターンをリード線を介して接続するようなハンダ
付け作業が全く不要である。
Thus, the individual electrode 11 of the head substrate 1 is connected to the individual electrode lead pattern portion 52 of the external circuit connecting flexible substrate 5 as in the conventional case, and the common electrode 12 of the thermal head substrate 1 is connected.
Can be electrically connected to the common electrode lead pattern portion 51 of the external circuit connecting flexible substrate 5 through the common electrode connecting flexible substrate 2 by an extremely simple operation. Therefore, the soldering work of connecting the common electrode pattern through the lead wire is completely unnecessary.

(ヘ)考案の効果 この考案では、以上のように、上面に個別電極、下面に
共通電極を備えたサーマルヘッド基板に対し、このサー
マルヘッド基板の下面共通電極に共通電極接続用の第2
のフレキシブル基板の導体層を圧着固定し、引出し用脚
部を上記個別電極と接続する外部回路接続用の第1のフ
レキシブル基板の共通電極リードパターン部に接続する
こととしたから、第2のフレキシブル基板の導体層はサ
ーマルヘッド基板と放熱板との間に圧着固定され、引出
し用脚部は第1のフレキシブル基板の共通電極リードパ
ターン部に接続される。そして、サーマルヘッド基板の
個別電極と第1のフレキシブル基板の個別リードパター
ン、第1のフレキシブル基板の共通リードパターンと第
2のフレキシブル基板が、それぞれ例えば圧接用金属カ
バーで圧接固定され、極めて簡易な作業で給電用のパタ
ーンが接続される。従って、発熱抵抗体の電圧降下現象
が生じない許かりでなく、従来のようなリード線ハンダ
付け作業、及びハンダ付け用パターンの形成が不要であ
る等、考案目的を達成した優れた効果を有する。
(F) Effect of the Invention According to the invention, as described above, the thermal head substrate having the individual electrodes on the upper surface and the common electrode on the lower surface is provided with the second common electrode for connecting the common electrode to the lower common electrode of the thermal head substrate.
Since the conductor layer of the flexible substrate is pressure-bonded and fixed, and the extraction leg portion is connected to the common electrode lead pattern portion of the first flexible substrate for external circuit connection for connecting to the individual electrode, the second flexible The conductor layer of the substrate is pressure-bonded and fixed between the thermal head substrate and the heat radiating plate, and the extraction leg portion is connected to the common electrode lead pattern portion of the first flexible substrate. Then, the individual electrodes of the thermal head substrate and the individual lead patterns of the first flexible substrate, and the common lead pattern of the first flexible substrate and the second flexible substrate are press-contacted and fixed by, for example, a metal cover for press-contacting. A pattern for power supply is connected during work. Therefore, the voltage drop phenomenon of the heating resistor does not occur, and the conventional lead wire soldering work and the formation of a soldering pattern are unnecessary, and the excellent effect of achieving the object of the invention is achieved. .

【図面の簡単な説明】[Brief description of drawings]

第1図は、共通電極接続用フレキシブル基板を示す斜視
図、第2図は、実施例サーマルヘッドのパターン接続構
造を示す要部拡大斜視図、第3図は、実施例サーマルヘ
ッドのパターン接続構造を示す要部拡大説明図、第4図
は、従来のサーマルヘッドの電極パターンを示す平面
図、第5図は、近年実施されているサーマルヘッドのパ
ターン接続構造を示す斜視図である。 1:サーマルヘッド基板、2:共通電極接続用フレキシブル
基板、5:外部回路接続用フレキシブル基板、11:個別電
極、12:共通電極。
FIG. 1 is a perspective view showing a common electrode connecting flexible substrate, FIG. 2 is an enlarged perspective view of a principal part showing a pattern connecting structure of an embodiment thermal head, and FIG. 3 is a pattern connecting structure of an embodiment thermal head. FIG. 4 is a plan view showing an electrode pattern of a conventional thermal head, and FIG. 5 is a perspective view showing a pattern connection structure of a thermal head which has been recently implemented. 1: Thermal head substrate, 2: Flexible substrate for common electrode connection, 5: Flexible substrate for external circuit connection, 11: Individual electrode, 12: Common electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】上面に発熱抵抗体列、個別電極が配置さ
れ、上面から裏面に連設される共通電極を備えたサーマ
ルヘッド基板への給電線の接続構造であって、 前記個別電極に対応する個別リードパターンを有し、前
記共通電極に対応する共通リードパターンを発熱抵抗体
列方向の両端部にそれぞれ有する第1のフレキシブル基
板と、前記サーマルヘッド基板の共通電極に対応する導
体層を有し、この導体層から前記第1のフレキシブル基
板の共通リードパターンに対応して発熱抵抗体列方向の
両端部にそれぞれ延設された引出し用脚部を有する第2
のフレキシブル基板とを備え、第1のフレキシブル基板
の個別リードパターンをサーマルヘッド基板の個別電極
に圧接接続し、第2のフレキシブル基板をサーマルヘッ
ド基板の裏面側に配置して、第2のフレキシブル基板の
導体層をサーマルヘッド基板の共通電極に圧接接続する
と共に、第2のフレキシブル基板の引出し用脚部を第1
のフレキシブル基板の共通リードパターンに圧接接続す
るようにしたサーマルヘッドの給電線接続構造。
1. A structure for connecting a power supply line to a thermal head substrate, wherein a heating resistor array and individual electrodes are arranged on the upper surface, and a common electrode is provided continuously from the upper surface to the rear surface, the structure corresponding to the individual electrodes. And a conductor layer corresponding to the common electrode of the thermal head substrate, and a first flexible substrate having common lead patterns corresponding to the common electrode at both ends in the heating resistor array direction. And a second leg having lead-out portions extending from the conductor layer at both ends in the heating resistor row direction corresponding to the common lead pattern of the first flexible substrate.
A flexible substrate, the individual lead patterns of the first flexible substrate are pressure-contacted to the individual electrodes of the thermal head substrate, and the second flexible substrate is arranged on the back surface side of the thermal head substrate. The conductor layer of the first head is pressed and connected to the common electrode of the thermal head substrate, and the pull-out leg portion of the second flexible substrate is connected to the first electrode.
The power supply line connection structure of the thermal head, which is connected by pressure contact to the common lead pattern of the flexible substrate of.
JP1988094105U 1988-07-15 1988-07-15 Thermal head feed line connection structure Expired - Lifetime JPH0732054Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988094105U JPH0732054Y2 (en) 1988-07-15 1988-07-15 Thermal head feed line connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988094105U JPH0732054Y2 (en) 1988-07-15 1988-07-15 Thermal head feed line connection structure

Publications (2)

Publication Number Publication Date
JPH0215362U JPH0215362U (en) 1990-01-31
JPH0732054Y2 true JPH0732054Y2 (en) 1995-07-26

Family

ID=31318600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988094105U Expired - Lifetime JPH0732054Y2 (en) 1988-07-15 1988-07-15 Thermal head feed line connection structure

Country Status (1)

Country Link
JP (1) JPH0732054Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6103533B2 (en) * 2013-06-12 2017-03-29 アルプス電気株式会社 Input device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215874A (en) * 1983-05-23 1984-12-05 Matsushita Electric Ind Co Ltd Thermal recording head
JPS608084A (en) * 1983-06-27 1985-01-16 Matsushita Electric Ind Co Ltd Thermal head
JPS62109668A (en) * 1985-11-07 1987-05-20 Alps Electric Co Ltd Thermal head

Also Published As

Publication number Publication date
JPH0215362U (en) 1990-01-31

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