JPH07316886A - Transporting device in plating stage - Google Patents

Abstract

PURPOSE:To automate plating stages for executing a plating treatment of printed circuit boards, etc., and to lessen the manpower thereof. CONSTITUTION:Mounting and dismounting of the circuit boards to and from racks are executed in a circuit board attaching and detaching section A. The racks carried out of this circuit board attaching and detaching section A are transported to a transfer section B in a rack transporting section C and the racks of this transfer section B are transported to the circuit board attaching and detaching section A. Mounting and dismounting of the racks to carrier bars are executed in the transfer section B. Transfer and reception of the carrier bars are executed in the transfer section B and a carrier bar transporting section D. Transportation of the carrier bars between the transfer section B and a plating tank 100 is executed in the carrier bar transporting section D. Transfer and reception of the carrier bars are executed between the carrier bar transporting section D and the plating tank 100. Plating treatment and peeling treatment are executed in the same transporting path.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention attaches a substrate, which is a rectangular flat plate-shaped object such as a copper clad laminate or a printed circuit board, to a plating rack, and further attaches the rack to a carrier bar or the like to mount the substrate. The present invention relates to a transporting device in a plating process suitable for automating a plating process for plating and a stripping process of a rack and a carrier bar.

[0002]

2. Description of the Related Art Conventionally, for manufacturing a printed wiring board or the like, for example, electroless plating in which a metal is deposited on an insulating substrate by a chemical reduction reaction to impart conductivity, or conductivity is imparted by this electroless plating or the like. The substrate thus formed is subjected to a treatment such as electrolytic plating for reducing copper ions by an electrolysis reaction to form a printed circuit board.

In the plating process for performing such a plating process, for example, as disclosed in Japanese Patent Laid-Open No. 4-348586, a printed circuit board (printed wiring board) is mounted by a power supply chuck jig arranged on a cathode bar for supplying electricity. ) Is held, or as shown in JP-A-4-14199, a printed circuit board is attached to a side frame that hangs down on a cathode bar (feeding horizontal frame), and the printed circuit board is placed in a plating treatment tank. Plating is performed.

However, in such a printed board mounting method (rackless method), it is difficult to mount a large number of printed boards on one cathode bar, and there is a problem that productivity is poor. On the other hand, according to the method of mounting the printed circuit board on the frame-shaped rack and mounting the rack on the carrier bar that functions as the cathode bar (rack method), many printed circuit boards can be mounted on one carrier bar. It is possible and excellent in productivity.

[0005]

However, the work of mounting and removing the printed circuit board from the rack and the work of mounting and removing the rack from the carrier bar are
Conventionally, it is done manually, and automation and labor saving are required.

[0006] In particular, in a panel plating process in which plating pretreatment, electroless plating, and electrolytic plating are continuously performed on the same rack, the rack and carrier bar from which the plated substrate is removed are plated on the rack and carrier bar themselves. Since it is put in the peeling tank provided in the plating tank to perform the peeling process, the work of attaching the rack to the carrier bar or removing the rack from the carrier bar, the transfer process handling these racks and carrier bars, etc. Efficient automation is required.

An object of the present invention is to provide a transporting device for a plating process suitable for automation and labor saving of the plating process by the rack system.

[0008]

In order to solve the above-mentioned problems, the transporting apparatus of the present invention for the plating step is to mount a substrate to be plated on a rack and to mount the rack on a carrier bar. Racks and boards are supplied to the plating tank together with the bar, and the plated rack is removed from the plated carrier bar that has been plated in the plating tank, and the plated board is removed from the plated rack. A carrier device for a plating process that collects the plated substrate by mounting the substrate on a rack and removes the plated substrate from the plated rack and attaches to the carrier bar and a carrier bar. On the other hand, a transfer section for mounting and removing the rack and a rack carried out from the board attaching / detaching section are transferred to the transfer section. Along with, a rack transfer unit that transfers the rack removed from the carrier bar to the substrate attaching / detaching unit in the transfer unit and a carrier bar to which the rack is attached in the transfer unit is transferred to the plating tank and the plating is performed. And a carrier bar transport unit that transports the carrier bar to which the rack is attached from the tank to the transfer unit.

[0009]

FIG. 1 is a diagram showing the basic structure of a transfer device in the plating process of the present invention. The arrows and marks shown in FIG.
The flow of the rack and the carrier bar is shown. The upper line of the broken line shows the flow when performing the plating process, and the lower line shows the flow when performing the peeling process. In the marks, a small square represents a substrate, a rectangle represents a rack, and a large square represents a carrier bar. Further, white marks indicate a non-plated substrate or a peeled rack and carrier bar, and black marks indicate a plated plate. The above flow is a typical flow.

In the plating process flow, the substrate attaching / detaching portion A
Is supplied with a peeled rack via the rack transport unit C, and is supplied with a non-plated substrate,
The board attaching / detaching section A attaches the board to the rack and carries it out to the rack carrying section C. The rack transfer section C transfers the rack (and the substrate) to the transfer section B. The transfer section B attaches the peeled rack to which the non-plated substrate is attached to the peeled carrier bar, and the carrier bar transport section D transports the substrate, the rack and the carrier bar to the plating tank 100.

The carrier bar transfer section D transfers the plated substrate, rack and carrier bar plated in the plating tank 100 to the transfer section B, and the transfer section B receives the plated carrier bar. The plated rack (and the substrate) is removed from the rack, and the rack transport unit C transports the plated rack (and the substrate) to the substrate attaching / detaching unit A. Then, the board attaching / detaching section A removes the plated board from the rack and carries it out.

In the flow of the peeling process, the board attaching / detaching section A moves the rack on which the board is removed to the rack carrying section C.
The rack transport section C transports the plated rack to the transfer section B. The transfer unit B attaches the plated rack to the plated carrier bar, and the carrier bar transfer unit D transfers the plated rack and carrier bar to the plating tank 100.

Further, the carrier bar conveying section D conveys the peeled rack and the carrier bar, which have been peeled in the plating tank 100, to the transfer section B, and the transfer section B is peeled from the peeled carrier bar. The completed rack is removed, and the rack transport section C supplies the rack, which has been subjected to the peeling process, to the substrate attaching / detaching section A.

As described above, the rack transport section C transports the rack, the transfer section B transports the rack and the carrier bar, and the carrier bar transport section D transports the carrier bar. The same operation may be performed on the same member regardless of whether the carrier bar is plated or not, which is suitable for automation and labor saving.

In the transfer section B, a rack alignment holding section to which racks aligned in a vertical plane are supplied, a carrier bar is held in a vertical plane parallel to the rack, and the carrier bar is held by the carrier bar. The transfer unit B includes a carrier bar slide device that moves the rack to and from the transport unit, and a rack moving device that moves the rack. The rack moving device holds the racks in the rack alignment holding unit in the aligned state. If you move the rack in parallel and attach it to the carrier bar of the carrier bar slide device while taking it out, you can simplify the operation of attaching and removing the rack to and from the carrier bar, and align the rack attached to the carrier bar. It has been done.

Further, the rack aligning / holding section of the transfer section B includes a rack aligning section, a rack standby section, and a rack ejecting section, and the rack aligning / holding section takes out from the rack aligning section by a rack moving device. Once the rack is aligned with the rack standby part, this aligned rack is attached to the carrier bar of the carrier bar slide device,
When the rack is taken out from the carrier bar of the carrier bar slide device and supplied to the rack payout section, the operation of mounting and removing the carrier bar can be performed without delay.

[0017]

EXAMPLE FIG. 23 (A) is a front view of a plating rack applied to a transfer device in a plating step of an example of the present invention, and FIG.
(B) is a side view of the same plating rack, FIG. 23 (C) is a bottom view of the same plating rack, and FIG. 24 is A- of FIG. 23 (A).
It is an A expanded sectional view.

The plating rack in this embodiment is for immersing a printed wiring board (hereinafter referred to as "substrate" in this embodiment) having holes for through holes in a plating tank. A plurality of substrates are attached to a rack, and a plurality of racks (for example, three) with the substrates attached are attached to a carrier bar, and the carrier bar is immersed in the plating bath. In this embodiment, the "plating rack" will be simply referred to as "rack".

In the figure, 1 is a vertical frame which constitutes the frame in the longitudinal direction of the rack, 2 is a biting member arranged along the vertical frame 1, and 3 is an elasticity for pressing the biting member 2 against the vertical frame 1. Members 4 are horizontal frames attached to the lower end and the upper part of the vertical frame 1. The vertical frame 1, the bite member 2, the elastic member 3, and the horizontal frame 4 are made of a material having good conductivity.

At the upper end of the vertical frame 1, the front end is bent downward to form an engaging portion 1a, and an engaging projection 1b is formed on the rear surface of the engaging portion 1a. Also, the bite member 2
Are arranged along the vertical frame 1 in groups of three on each side,
A conductive square bar 5 is provided between the vertical frame 1 and the bite member 2 in the vertical frame 1.
Is fixed along.

The elastic member 3 is formed by processing a plate material having strong elasticity, such as a steel plate or a stainless plate, and is bent so that its cross-sectional shape becomes an isosceles triangle before being assembled to the rack.

This elastic member 3 is attached so as to bite each biting member 2 and the vertical frame 1 from the outside at an appropriate number of positions in the longitudinal direction of the vertical frame 1, and the square bar 5 is provided at the approximate center of the biting member 2.
With one side as a fulcrum O, the inner edge 2A of the bite member 2 is connected to the vertical frame 1
Is urged towards. As shown in FIG. 24, the plate member of the elastic member 3 corresponding to the side end of the rack is curved inward.

The upper and lower horizontal frames 4 have the same structure, and the frame members 4A and 4B fixed to the vertical frames 1 on both sides are combined. Frame material 4A on one side
Is slidably engaged with the other frame member 4B, and the tip of the frame member 4B has a long hole 4A formed in the frame member 4A.
The bolt 4Ba passed through a is screwed to the nut 4Bb attached to the tip of the frame member 4B, so that the frame member 4A
It is fixed to.

The upper and lower horizontal frames 4 are attached to the surface of the vertical frame 1 opposite to the surface on which the bite member 2 is arranged.
The horizontal frame 4 is provided outside the extension surface of the gap between the vertical frame 1 and the bite member 2.

With the above-described structure, first, as shown in FIG. 24, the rack is held horizontally with the vertical frame 1 facing downward, and the bolts 4Ba of the horizontal frame 4 are loosened.
The frame member 4B is made slidable, the interval between the pair of vertical frames 1 is adjusted to the width of the substrate 10, and the bolts 4Ba are tightened to fix the interval between the pair of vertical frames 1.

Next, for each biting member 2 on both the left and right sides,
As shown in FIG. 25 (A), the outer upper end 2B of the bite member 2 is pressed, and as shown in FIG. 25 (B), the bite member 2 is set to the vertical frame 1 against the elastic force of the elastic member 3. The bite members 2 and the vertical frame 1 are made parallel to each other, and a gap ε corresponding to the thickness of the square bar 5 is provided between them.

In this state, the substrate 10 is horizontally fed from the side of the horizontal frame 4 at the lower end (the side opposite to the engaging portion 1a) shown in FIG. 23, and both ends of the substrate 10 are slid on the vertical frame 1. And insert it into the gap T. At this time, the number of substrates 10 (two in the example of FIG. 23) according to the size is inserted in series or sequentially. Then, as shown in FIG. 25 (C), the force pressing the outer upper end 2B of each bite member 2 is released, and the vertical frame 1 and bite member 2 both ends of the substrate 10 by the restoring force of the elastic member 3. Bite. This completes the mounting of the substrate 10.

The rack to which the substrate 10 is attached is attached to a carrier bar and conveyed to a plating tank for performing a predetermined plating treatment as described later. Then, when removing the plated substrate, the vertical frame 1
The rack is held horizontally so that the bottom faces downward, and the outer upper ends of the left and right bite members 2 are pressed to form a gap ε between the bite member 2 and the vertical frame 1 for the thickness of the square bar 5. Open and the plated substrate is pulled out from the gap ε between the vertical frame 1 and the bite member 2.

FIG. 26 is a view showing a state where the rack of the embodiment is attached to the carrier bar. In this example, three racks A are attached to the carrier bar 20, and in this embodiment, two carrier bars are attached. A set of 20 is handled by the carrier bar transport unit D and a carrier bar slide device described later. The carrier bar is used not only for holding the rack and the like, but also for energizing the rack and the like when performing electrolytic plating, and is also called a moving cathode bar.

FIG. 2 is a plan view of the carrying device in the plating process of the embodiment. The carrier device of this embodiment includes a substrate mounting device A1 for mounting a substrate on a rack and a substrate removing device A2 for removing a substrate from the rack. The substrate mounting device A1 and the substrate removing device A2 are used by the substrate mounting / demounting unit A of the embodiment. Is configured.

Further, the carrying apparatus of this embodiment is provided with a transfer section B for mounting and removing the rack on the carrier bar, and this transfer section B mounts and removes the rack on the carrier bar. A rack moving device B1, a rack aligning part B2 for aligning and holding the racks, a rack standby part B3 for waiting the aligned racks, a carrier bar slide device B4 for moving the carrier bars, and a rack for delivering the racks. The dispensing unit B5 is provided. In this embodiment, the rack aligning / holding unit of the transfer unit B includes a rack aligning unit B2, a rack standby unit B3, and a rack payout unit B5.
It is composed by.

Also, the rack is inverted to remove the board A.
2 receives the rack from the first reversing conveyance device C1 that conveys the rack horizontally from 2, the second reversing conveyance device C2 that conveys the rack carried out from the substrate mounting device A1 and reverses the rack in the vertical direction, and the second reversing conveyance device C2. Rack aligning section B of transfer section B
First aligning and traveling device C3 for aligning to 2 and second aligning and traveling device C4 for conveying the rack held in the rack payout part B5 of the transfer part B to the first reversing and conveying device C1 and the substrate from the first reversing and conveying device C1. An elevator conveyor C5 for transporting the rack to the second reversal transport device C2 through the removal device A2 and the board mounting device A1 is provided.

Then, the first reversing and conveying device C1,
The second reversing / conveying device C2, the first aligning / traveling device C3, the second aligning / traveling device C4, and the elevating / lowering conveyor C5 constitute a rack conveying section C of the embodiment. The first reversing conveyance device C1 and the second reversing conveyance device C2 have the same structure.

Further, it is provided with a carrier bar transporting section D for transporting the carrier bar between the transfer section B and the plating tank 100, and further, the transporting apparatus of this embodiment is a substrate feeding apparatus 200 for feeding a substrate. A substrate drying device 300 for drying a plated substrate and a rack reservoir section 400 for storing a rack are provided.

FIG. 3 is a diagram for explaining the flow of the substrate, rack and carrier bar in the transfer apparatus of the embodiment. The dashed arrows in the figure show the flow of boards, the solid arrows show the flow of boards and racks or only racks, and the white arrows show the flow of boards and racks and carrier bars or racks and carrier bars.

When the plating process and the stripping process are performed in the plating tank 100, the substrates, racks and carrier bars are handled as follows by the operation of the devices of the respective parts described later.

First, the substrate supply device 2 with the substrate horizontal.
No. 00 is supplied to the substrate mounting apparatus A1, and the rack is in a horizontal state by the elevating conveyor C5 and the first reversing and conveying apparatus C.
1 through the substrate removing device A2 and the substrate attaching device A1
And the substrate is attached to the rack by the substrate attaching device A1.

The rack to which the substrates are attached is horizontally conveyed by the elevating conveyor C5 to the second reversing and conveying device C2, and the rack is firstly conveyed by the second reversing and conveying device C2.
It is conveyed to the alignment traveling device C3 side, inverted 90 degrees, and held in a vertical state. Then, the second reversing transport device C
The rack vertically held by 2 is supplied to the rack aligning section B2 of the transfer section B by the first aligning traveling device C3.

In the rack alignment section B2, as many racks as the number to be attached to the carrier bar are aligned and arranged by the operation of the first alignment traveling apparatus C3, and the racks arranged in the rack alignment section B2 are arranged by the rack moving apparatus B1. It is moved to the rack standby section B3 in the aligned state.

Further, the rack waiting in the rack waiting section B3 is attached to the carrier bar of the carrier bar slide device B4 by the rack moving device B1, and the carrier bar to which the rack is attached is carried by the carrier bar slide device B4. The carrier bar is moved to the transfer section D, and the carrier bar transfer section D supplies the carrier bar to the plating bath 100.

In the plating tank 100, the carrier bar supplied from the carrier bar transporting section D is put into a plating processing section or a peeling processing tank to perform a predetermined process, and the processed carrier bar, rack and substrate are treated as carriers. Supply to the bar transport unit D.

The plated carrier bar supplied from the plating tank 100 is transported to the carrier bar slide device B4 by the carrier bar transport part D, and this carrier bar is received by the carrier bar slide device B4 and transferred in the transfer part B. Will be collected.

In the transfer section B, the rack which has been plated is removed from the carrier bar of the carrier bar slide apparatus B4 by the rack moving apparatus B1, and the rack is temporarily stored in the rack unloading section B5. The rack is transferred to the first reverse transport device C1 by the second alignment traveling device C4.

The rack to which the plated substrate is attached is inverted by 90 degrees by the first reversing / conveying device C1 to be in a horizontal state, is further supplied to the elevating conveyor C5, and is in a horizontal state by the elevating conveyor C5. It is supplied to the substrate removing device A2.

Then, in the substrate removing device A2, the plated substrate is removed from the plated rack, and the plated substrate is collected by the substrate drying device 300.

On the other hand, the rack on which the substrate has been removed and which has been subjected to the plating treatment is mounted on the substrate mounting device A by the elevator conveyor C5.
The first reverse traveling device C2 and the first aligning traveling device C passing through 1
3 is transported to the rack alignment section B2 of the transfer section B, and the number of racks attached to the carrier bar is aligned and arranged by the operation of the first alignment traveling device C3.

The racks arranged in the rack aligning section B2 are attached to the plated carrier bars of the carrier bar slide apparatus B4 via the rack standby section B3 in the same manner as described above, and the carrier bar is mounted on the carrier bar slide apparatus B4. And the carrier bar transfer section D allows the plating tank 10
Supplied to zero.

In the plating bath 100, the plated carrier bars supplied from the carrier bar transporting section D are put into the stripping processing bath, and the stripped carrier bars and racks are supplied to the carrier bar transporting section D. .

The carrier bar and the rack that have been subjected to the peeling treatment supplied to the carrier bar transporting section D are transported to the carrier bar slide device B4, and the rack that has undergone the peeling treatment is removed from the carrier bar by the rack moving device B1 and the rack unloading section. The rack that has been collected in B5 and has been subjected to the peeling processing in the rack dispensing section B5 is transferred by the second alignment traveling device C4. Then, it is supplied to the substrate removing device A2 via the first reversing / conveying device C1 to be used for the plating process,
Alternatively, it is collected in the rack reservoir section 400.

The above-described flow of the plating process and the flow of the peeling process are processed in consideration of the timing so that the transport operations of the respective parts do not overlap, and the plating process and the peeling process are performed substantially in parallel. Be seen. For example, plating tank 1
Operation timing of each device such that the flow of the plating process is performed while the stripping process is performed in the stripping bath of 00 and the flow of the stripping process is performed while the plating is performed in the plating bath of 100. Should be controlled.

FIG. 4 is a front view of the first reversing / conveying device C1 of the embodiment, FIG. 5 is a partially crushed plan view thereof, and FIG. 6 is a side view thereof. The first reversing / conveying device C1 includes a rotating frame portion 11, a horizontal moving slider 12 that horizontally moves the rotating frame portion 11, and a conveyor 13 disposed above an end portion of the horizontal slider 12.
The horizontal moving slider 12 reciprocates the moving table 12a in the horizontal direction on the guide rail 12b.

The rotating frame portion 11 is provided with an elevating shaft 112 which is slidably supported up and down on a slide shaft 111 which is erected on a moving base 12a of the horizontal moving slider 12, and the elevating shaft 11
The lower end of 2 is fixed to the drive shaft of an elevating cylinder 113 arranged in parallel with the slide shaft 111.

Further, a rotating frame 115 is fixed to a horizontal shaft 114 rotatably supported at the tip of the elevating shaft 112, and a rotating arm 116 is provided at the end of the horizontal shaft 114 on the elevating shaft 112 side. Is attached, and the tip of the rotating arm 116 is rotatably supported by the drive shaft of the air cylinder 117. The end of the air cylinder 117 is rotatably supported by a mounting member 118 fixed to the drive shaft of the lifting cylinder 113 near the lower end of the lifting shaft 112.

The rotating frame 115 has a bottom plate 11 for holding the lower end of the rack A at the lower end of the surface opposite to the horizontal shaft 114.
5a and the upper end of the same surface bites the upper end of the rack A 2
The book has parallel arms 115b. The bottom plate 115a is moved by the cylinder 115c as shown by the arrow in FIG. 4 to receive the lower end of the rack A, and the parallel arm 115b is moved by the cylinder 115d as shown by the arrow in FIG. , Bite and hold the vicinity of the upper end of the rack A.

With the above configuration, the first alignment traveling device C3
First, the moving slider 12 is used to position the rotating frame portion 11 on the opposite side of the conveyor 13 (position indicated by the solid line in FIG. 4), and at this position, the rotating frame portion 11 is erected vertically from the second alignment traveling device C4 or the reservoir portion 400. The rack supplied in this state is taken in, the bottom plate 115a is applied to the lower end of the rack A, and the vicinity of the upper end of the rack A is bitten and held by the parallel arm 115b.

Next, the air cylinder 117 is driven to move the rotary frame 115 from the state shown by the solid line in FIG.
Rotate the rack A horizontally to hold the rack A horizontally, and move the slider 1
The rotating frame 11 is moved to the conveyor 13 side by 2 and the rack A is conveyed to the upper part of the conveyor 13.

Then, the elevating cylinder 113 lowers the elevating shaft 112 to place the rack A on the conveyor 113, and the bottom plate 115a and the parallel arm 115b are released to release the rack A on the conveyor 113. In addition, conveyor 1
Reference numeral 13 supplies the rack A to the lifting / lowering conveyor C5 on the substrate removing device A2 side.

FIG. 7 is a front view of the substrate removing device A2 of the embodiment, FIG. 8 is a partially crushed plan view thereof, FIG. 9 is a view taken along the line BB of FIG. 8, and FIG. 10 is a line CC of FIG. It is a perspective view. The substrate removing device A2 includes a substrate removing unit 21 and a substrate drawing unit 2
2. The rack which has the board take-in section 23 and which has the plated board attached thereto is supplied to the board removing section 21, and the board removed from the rack by the board removing section 21 is the board drawing section. 22 and the substrate loading section 23 are carried in this order.

In the board removing section 21, an elevator conveyor C5 is arranged on the rack 21a along the rack transport direction, and two sliders 21b are attached to the rack 21a in parallel with the elevator conveyor C5. Cage, slider 21
On b, a fixed rack opening / closing device 211 and a moving rack opening / closing device 212, which are based on long stands 211a and 212a which are laid in a direction orthogonal to the slider 21b, are respectively arranged.

The fixed rack opening / closing device 211 and the moving rack opening / closing device 212 are reciprocally moved in the rack transport direction by a slide mechanism 21c arranged below the frame 21a. Further, a horizontal frame holding mechanism 213 for holding the horizontal frame of the rack downward and a horizontal frame holding mechanism 213 at the positions corresponding to the ends of the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 at the edge of the frame 21a. A bolt tightening / releasing mechanism 214 is disposed adjacent to the.

As shown in FIG. 9, this bolt tightening / releasing mechanism 214 is provided with a wrench 214b at the tip of a motor 214a, and is fixed from the reference position of the fixed rack opening / closing device 211, that is, the rack shown in FIG. Vertical frame 1 of frame material 4B
To the bolt 4Ba.

The horizontal frame holding mechanism 213 is provided with a rotary claw 213b at the tip of the vertically moving cylinder 213a, and operates so that the rotary claw 213b is engaged with the horizontal frame and slightly lowered. As a result, when adjusting the width of the rack,
The bolt 4Ba of the rack is engaged with the wrench 214b of the bolt tightening / loosening mechanism 214 to loosen or tighten the bolt 4Ba. Further, when the board is removed from the rack, the board pulled out from the rack can be surely passed.

The fixed rack opening / closing device 211 and the movable rack opening / closing device 212 have a substantially symmetrical structure facing each other, and the vertical plate 21 is provided along the long stands 211a and 212a, respectively.
1b and 212b are erected, and the vertical plates 211b and 212
In b, five air cylinders 211c and 212c are vertically arranged side by side.

At the upper ends of the vertical plates 211b and 212b, receiving plates 211d and 212d are arranged along the vertical frame 1 of the rack, and at the rods of the air cylinders 211c and 212c, the receiving plates 211d and 212d are provided. Opposing presser plate 2
Long plates 211f and 212f, on which 11e and 212e are arranged, are attached. Further, the vertical plates 211b and 212b
Auxiliary rollers 211g and 212g for supporting the board when the board is removed from the rack are attached to the facing surface side.

The substrate pull-out section 22 is provided with a large number of rollers 22b on the upper surface of the pedestal 22a, and the rollers 22b are rotated by a motor 22c. Above the roller 22b,
The substrate is provided with a suction pad 22d whose longitudinal direction is the substrate transport direction and whose lower surface is a suction surface. The suction pad 22d is moved up and down by an air cylinder 22e and the horizontal slide mechanism 22f removes the substrate withdrawing portion 22 and the substrate. It is reciprocally moved to and from the unit 21.

The substrate loading section 23 is provided with a large number of rollers 23b on the upper surface of the pedestal 23a, and the rollers 23b are rotated by a motor 23c.

With the above structure, the substrate removing device A2 operates as follows. First, in the board removing section 21,
As shown by the chain double-dashed line in FIG. 10, the elevating conveyor C5 is positioned such that its upper surface is above the fixed rack opening / closing device 211 and the upper long plates 211f, 212f of the moving rack opening / closing device 212. 1 The rack is loaded from the reversing transport device C1, and the vertical frame at the head is the fixed rack opening / closing device 211.
Stop at a position near the front of.

Next, the elevator conveyor C5 is lowered to the position shown by the solid line in FIG. At this time, the upper surface of the elevating conveyor C5 is fixed rack opening / closing device 211 and moving rack opening / closing device 212.
It is set so as to be positioned slightly below the upper surfaces of the receiving plates 211d and 212d, and in this state, the fixed rack opening / closing device 211 is slightly moved inward.

At this time, the lower surface of the vertical frame of the rack is received by the tapered surface formed at the tip of the receiving plate 211d of the fixed rack opening / closing device 211, and the fixed rack opening / closing device 211 is attached.
The vertical frame of the rack and the biting member are housed between the receiving plate 211d and the pressing plate 211e of the rack.
Is stopped at a predetermined position regulated by the position.

The movable rack opening / closing device 212 moves inward with the operation of the fixed rack opening / closing device 211, and similarly to the above, the vertical frame on the opposite side of the rack and the bite member receiving plate 21.
It is housed between 2d and the holding plate 212e. In this manner, the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 make the rack horizontal with the vertical frame facing downward, and the board pull-out unit 22 so that the vertical frame of the rack is parallel to the substrate transfer direction. Held in front of.

When the vertical frames and the bite members on both sides of the rack are housed in the fixed rack opening / closing device 211 and the movable rack opening / closing device 212, the horizontal frame is held by the horizontal frame holding mechanism 213, and FIG.
As shown in FIG. 1, the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 include the air cylinders 211c and 2c.
12c is driven, as described with reference to FIG.
A space is provided between the bite members 2 and the vertical frame 1 such that each bite member 2 is parallel to the vertical frame 1. In this state,
The rack is fixed to the fixed rack opening / closing device 211 and the moving rack opening / closing device 212.

Next, the suction pad 22 of the substrate drawing section 22
d moves between the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 of the board removing unit 21 and descends, and the suction pads 22d adsorb the board mounted on the rack. Then, the suction pad 22d is moved onto the roller 22b of the substrate pull-out unit 22 to pull out the substrate from the rack, the suction force of the suction pad 22d is released on the roller 22b, and the substrate is placed on the roller 22b.

The substrate pulled out onto the roller 22b is conveyed by the roller 22b and the roller 23b of the substrate take-in section 23, is supplied to the substrate drying device 300, and is subjected to a drying process.

When the board is removed from the rack,
The air cylinders 211c and 212c are released, the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 are moved to the outside, and the plated rack is placed on the elevating conveyor C5 and conveyed to the board mounting device A1. .

The above operation is the operation for removing the plated substrate from the plated rack. In the substrate removing device A2, the rack width is adjusted to correspond to the type of the substrate width. I am also doing the action.

That is, when the rack having been subjected to the peeling process is carried into the substrate removing section 21 of the substrate removing device A2 from the first reversing / conveying device C1 by the elevating conveyor C5, first, the same operation as when the substrate is removed is performed. The rack to the fixed rack opening / closing device 211 and the moving rack opening / closing device 212.
Fixed to.

When the fixing of the rack is completed, the horizontal frame holding mechanism 213 presses down the horizontal frame to push the bolts 4Ba of the frame member 4B.
Engage the wrench 214b of the bolt tightening / releasing mechanism 214,
The motor 214a is driven in a predetermined direction to loosen the bolt 4Ba to release the horizontal frame holding mechanism 213.

Next, with the vertical frame of the rack and the biting member 2 fixed to the fixed rack opening / closing device 211 and the moving rack opening / closing device 212, the moving rack opening / closing device 212 is moved to the outside or inside to move the vertical frame 1 of the vertical frame 1. Adjust the spacing to the desired width.

Then, again, the horizontal frame holding mechanism 213 presses the horizontal frame downward so that the bolt 4Ba of the frame member 4B is engaged with the wrench 214b of the bolt tightening / releasing mechanism 214, and the motor 214
a and drive the bolt 4Ba to tighten the horizontal frame holding mechanism 213.
To cancel. As a result, the width of the vertical frame 1 of the rack can be adjusted to a desired width, and the rack whose width has been adjusted is conveyed to the board mounting apparatus A1.

FIG. 12 is a front view of the substrate mounting apparatus A1 of the embodiment, FIG. 13 is a partially crushed plan view thereof, FIG. 14 is a BB arrow view of FIG. 13, and FIG. Is a perspective view,
The board mounting device A1 has substantially the same structure as the board removing device A2.

Therefore, for simplicity, the board mounting device A
Regarding the similar elements corresponding to 1 and the board removing device A2, those having a two-digit numeral have the same alphabet as the first lower digit, and those having a three-digit numeral have the same lower two digits and the same alphabet. Then, the detailed description of the same elements as the board removing apparatus A2 in the board mounting apparatus A1 will be omitted.

The board mounting device A1 includes a board feeding section 33,
The board aligning section 32 and the board mounting section 31 are provided, and the rack is supplied from the board removing device A2 to the board mounting section 31 by the elevator conveyor C5. In addition, the substrate is supplied from the substrate supply device 200 to the substrate feeding unit 33, and the substrate feeding unit 33 conveys the substrate in the direction of the arrow of FIG. It is sequentially sent to the section 32.

As shown in FIG. 13, the board aligning section 32 is provided with a fixing guide 32g protruding from the roller surface through a gap between the rollers 32b on one side of the carrying surface on the pedestal 32a, and fixing the fixing guide 32g. A moving guide 32h protruding from the roller surface is arranged on the opposite side of the guide 32g. Further, a stopper 32i that moves up and down with respect to the roller surface is provided on the board mounting portion 31 side, and
A plurality of stages of movement stoppers 32j are arranged in parallel with the stoppers 32i on the conveyance surface on a.

The movement stopper 32j moves up and down with respect to the roller surface and, when it is below the roller 32b, can reciprocate in the substrate carrying direction.
The position of the movement stopper 32j in the substrate transport direction is set according to the length of the substrate.

The board aligning section 32 is connected to the board feeding section 3
When the first substrate is brought into contact with the stopper 32i and stopped by the roller 32b, the moving stopper 3 whose position is set according to the length of this substrate is taken in.
2j is lifted from the gap between the rollers 32b near the rear end of the first substrate. Then, when the next substrate is sent and comes into contact with the movement stopper 32j and stops, the movement stopper 32j at the subsequent stage is similarly raised near the rear end portion of the substrate so that the next substrate hits the movement stopper 32j. Stop by touching.

In this way, the substrates are sequentially stopped and the alignment in the front-rear direction is completed. Then, when the required number of substrates to be mounted on one rack is taken in from the substrate feeding portion 33, the moving guide 32h is moved to the fixed guide 32g side, and the substrates are sandwiched by the fixed guide 32g and the moving guide 32h, and the lateral alignment is completed. .

Then, when the required number of substrates to be mounted on one rack are taken in from the substrate feeding section 33, the movement guide 3
2h is moved to the fixed guide 32g side, and the substrate is sandwiched between the fixed guide 32g and the moving guide 32h to complete the horizontal alignment. In this way, since the stop positions of the second and subsequent substrates are regulated by the movement stopper 32j, the alignment becomes easy even when the substrates are thin.

When the alignment is completed, the suction pad 32d is lowered by the air cylinder 32e, and the suction pad 3
The lower surface of 2d attracts the substrates on the roller 32b in a state of being horizontally aligned. Then, after lowering the stopper 32i and the moving stopper 32j, the suction pad 32d is moved by the horizontal slide mechanism 32f to hold the substrates in an aligned state and horizontally to the board mounting portion 31 in the direction of the arrow in FIG. Transfer.

On the other hand, in the board mounting portion 31, the fixed rack opening / closing device 311 and the moving rack opening / closing device 312 operate similarly to the fixed rack opening / closing device 211 and the moving rack opening / closing device 212 of the board removing device A2, but they are fixed. The rack opening / closing device 311 is set to have a slight movement range outward from a predetermined reference position corresponding to the fixed guide 32g of the board aligning unit 32, and the moving rack opening / closing device 312 is set to a movement range corresponding to the interval of the vertical frame of the rack. To be done.

The board mounting unit 31 carries in the rack from the board removing device A2 by the elevating conveyor C5, and, as in the case of the board removing device A2, the fixed rack opening / closing device 311.
Is set to the reference position, and the vertical frame of the rack and the bite member are housed between the receiving plates 311d and 312d and the holding plates 311e and 312e of the fixed rack opening / closing device 311 and the moving rack opening / closing device 312.

Then, as in the case of the substrate removing device A2, as described with reference to FIG.
A space is provided between the bite member 2 and the vertical frame 1 so that the vertical axis is parallel to the vertical frame 1.

Here, at the fixing position of this rack, the gap between the vertical frame 1 fixed to the receiving plates 311d and 312d of the fixed rack opening / closing device 311 and the moving rack opening / closing device 312 and the bite member 2 is the above-mentioned substrate. It is set so that both ends of the substrate sucked on the lower surface of the suction pad 32d of the alignment section 32 are at the same position and height as the both ends of the substrate transferred by the suction pad 32d and the biting member 2 vertically. It is inserted in the gap with the frame 1.

When the board is inserted, the air cylinders 311c and 312c are released, the board 10 is fixed to the rack as shown in FIG. 25C, and the installation of the board is completed.

When the substrate is mounted on the rack, the fixed rack opening / closing device 311 and the moving rack opening / closing device 312 move to the outside of each other, and the rack is placed on the elevating conveyor C5, and the elevating conveyor C5 is lifted and the elevating conveyor C5 is moved. Is driven to carry out the rack to the second reversal transport device C2.

The second reversing / conveying device C2 has the same structure as the first reversing / conveying device C1 described with reference to FIGS. The rack carried out from the rack is received from the elevating conveyor C5 in a horizontal state, is conveyed, is rotated 90 degrees at the position of the end of the first alignment traveling device C3, and stands vertically to supply the rack to the first alignment traveling device C3. .

FIG. 16 is a diagram showing a part of the first alignment traveling device C3, the second alignment traveling device C4 and the transfer section B. FIG. 16 (A) is a plan view and FIG. 16 (B) is a front view. 16C is a side view.

The first aligning traveling device C3 includes a traveling device 41 disposed on the upper end of the vertical frame and a traveling hand 42 disposed on the traveling device 41. The traveling device 41 includes a guide rail 41a that passes through the transfer section B from a position where the rack A is vertically erected by the second reversal transport device C2, and a motor 41 that is arranged at one end of the guide rail 41a.
b, a pulley 41 arranged at the other end of the guide rail 41a
c, a motor 41b, and a belt 41d that is wound around a pulley 41c.

Further, the traveling hand 42 has the guide rail 41.
It is slidably disposed on a and is fixed to the belt 41d, and the traveling hand 42 travels with the belt 41d by the drive of the motor 41b. As a result, the traveling hand 42 moves from the position of the second reversing conveyance device C2 on the guide rail 41a to the second reversing conveyance device C of the transfer section B.
It is reciprocated to a position opposite to 2.

FIG. 17 is a side view of the traveling hand 42.
The traveling hand 42 includes an elevating part 423 slidably held in the vertical direction by a slide shaft 424 erected on a moving base 421, and a cylinder 422 for vertically moving the elevating part 423. As indicated by the arrow 17, the elevating part 423 moves up and down with respect to the guide rail 41 a by driving the cylinder 422.

Further, the elevating part 423 is provided with the guide rail 41a.
And a gripping device 42 slidably held by the slide shaft 423a extending in a horizontal direction at a right angle to the slide shaft 423a.
3b and a cylinder 423c for horizontally moving the gripping device 423b. The gripping device 423b reciprocates in the horizontal direction perpendicular to the guide rail 41a by driving the cylinder 423c as shown by the arrow in FIG.

Further, the gripping device 423b is arranged in parallel with the guide rail 41a and a pair of gripping plates 423b-1, 42 which are opened and closed by a cylinder (not shown).
3b-2, and an engagement groove 423b-3 that engages with an engagement protrusion 1b formed on the back surface of the engagement portion 1a of the rack is formed inside one of the grip plates 423b-2. .

Further, as shown in FIG. 16, the guide rail 41a is arranged in the transfer section B adjacent to the rack alignment section B2, and the rack alignment section B2 is arranged in the guide rail 4a.
Two bars B2-1 and B2-2 are provided in parallel with 1a. Note that, similarly to the rack alignment section B2, the rack standby section B3 of the transfer section B is parallel to the bars B2-1 and B2-2.
The rack dispensing unit B5 includes three bars B3-1, B3-2, B3-3, B3-4, and three bars B5-1, B5- parallel to the bars B2-1, B2-2. 2, B5-3
Is equipped with.

With the above-described structure, the traveling hand 42 attaches the engaging portion 1a of the rack vertically erected by the second reversing / conveying device C2 to the grip plates 423b-1 and 423b-1 of the grip device 423b.
The rack is gripped by 423b-2, and the gripped rack is moved to the rack alignment portion B2 along the guide rail 41a. Then, the bar B is moved by the horizontal movement of the gripping device 423.
Move the rack to either position 2-1 or B2-2,
The engaging portion 1a of the rack is connected to the bar B2-1 or the bar B2.
-2 is attached.

In this way, the positions of the traveling hand 42 and the gripping device 423 are controlled, and the racks supplied from the second reversing / conveying device C2 are moved to the bars B2-1 and B of the rack aligning unit B2.
2-2 are sequentially aligned and arranged. In addition, this bar B2
The lengths of -1, B2-2 are the conductive plate 20 of the carrier bar 20.
The length is approximately the same as that of a, and only one bar B2-1 or B2 is provided for each rack mounted on one carrier bar.
-2.

As shown in FIG. 16, the second aligned traveling device C4 also has a structure similar to that of the first aligned traveling device C3, and is provided with a traveling device 51 and a traveling hand 52. The traveling device 51 includes a guide rail 51a and a motor 51.
b, a pulley 51c, and a belt 51d, the traveling hand 5
2 is slidably arranged on the guide rail 51a and fixed to the belt 51d.

The traveling hand 52 has the same structure as the traveling hand 42 of the first aligning traveling device C3, and is attached to the bars B5-1, B5-2, B5-3 of the rack dispensing section B5. The rack is gripped by the gripping device and travels, and the rack is supplied to the first reverse transporting device C1 at the position of the first reverse transporting device C1.

FIG. 18 is a view showing the rack moving device B1 of the transfer section B. FIG. 18 (A) is a plan view, FIG. 18 (B) is a front view, and FIG. 18 (C) is a side view. Rack moving device B1
Is mounted on the upper end of the vertical frame surrounding the transfer section B.
Book guide rail 61 and ball screw 62 and guide rail 61 mounted in parallel with this guide rail 61
A moving device 63 disposed above is provided.

The moving device 63 includes two guide rails 61.
By moving the movable board 631 slidably on the upper side and rotating the nut member 633 screwed to the ball screw 62 by the motor 632 arranged on the movable board 631, the entire moving device 63 is placed on the guide rail 61. It is designed to move in parallel.

Further, in the moving device 63, two slide shafts 635 are arranged side by side on a vertical frame 634 which is erected at substantially the center of the moving substrate 631, and a gripping device 636 is held on the slide shaft 635 so as to be lifted and lowered. The gripping device 636 moves up and down along the vertical frame 634 by driving the ball screw 637.

Further, the gripping device 636 is provided at its lower end with a pair of gripping plates 636a and 636b arranged in parallel with the bars B2-1 and B2-2 of the transfer section B. 636a and 636b are opened and closed back and forth to hold the rack of the transfer section B.

With the above configuration, the gripping device 636 of the rack moving device B1 moves as shown by the alternate long and short dash line in FIG. 18C, and the bars B2-1 and B2- of the rack aligning unit B2 are moved.
2. Bars B3-1, B3-2, B3 of the rack standby unit B3
-3, B3-4, the bar B5-1 of the rack dispensing unit B5
B5-2, B5-3 and carrier bar slide device B
The rack transfer operation is performed between the four carrier bars.

FIG. 19 is a diagram for explaining an example of the rack transfer operation by the rack transfer device B1. The rack transfer device B1 performs the following three types of transfer operations. Rack (and substrate) with plated carrier bar slide device B4
Alternatively, the operation of transferring the rack subjected to the peeling processing to the rack dispensing section B5 (in FIG. 19). An operation of transferring the rack (and the substrate) on which the rack alignment section B2 is plated or the rack on which the peeling process is performed to the rack standby section B3 (in FIG. 19). An operation of transferring the rack (and the substrate) on which the rack standby section B3 is plated or the rack on which the stripping process is performed to the carrier bar slide device B4 (in FIG. 19).

As described above, in the transfer section B, the above transfer operation corresponding to the type of rack is made to correspond to the operation of each of the other sections, whereby the timing of the whole process can be set and the work efficiency can be improved. Is improved.

FIG. 20 is a side view of the carrier bar slide device B4 of the transfer section B and the carrier bar transfer section D, FIG. 21 is a view showing the carrier bar transfer section D, and FIG. 21 (A) is the carrier bar transfer section. 2D is a plan view, FIG. 21B is a front view, and FIG.
1 (C) is a side sectional view.

The carrier bar slide device B4 is a transfer part B.
20 and a moving frame 72 that moves along the guide rails 71 along the guide rails 71 as shown by the arrow in FIG.
And the receiving groove 72 is formed on the upper end of the moving frame 72.
Two sets of carrier bars are formed on the moving frame 72 by placing the ends of the hook portions 20b (FIG. 26) of the carrier bars in the receiving grooves 72a. Is retained.

Further, as shown in FIG. 21, the carrier bar carrying section D has a long frame 81 provided between the carrier bar slide device B4 and the plating tank 100, and two frames along the frame 81. A guide rail 82, a traveling device 83 that travels on the guide rail 82, and a plurality of carrier bar standby portions 84 arranged along the frame 81 near the lower portion of the guide rail 82 are provided.

FIG. 22 is a view showing the traveling device 83, FIG. 22 (A) is a plan view, FIG. 22 (B) is a side view, and FIG. 22 (C) is a front view. The traveling device 83 rotates wheels 832 pivotally supported by a frame 831 by a motor 833 to travel on the guide rail 82.

A moving block 835 is slidably held by a slide shaft 834 arranged in a direction orthogonal to the traveling direction, and the moving block 835 is driven by a cylinder 836 to move the moving block 835 in the direction of the arrow in FIG. 22 (A). Move back and forth.

Further, a carrier bar hand 838 is suspended below the moving block 835 by a cylinder 837 provided upright on the moving block 835, and receiving grooves 838a are provided at both ends of the carrier bar 838.

Then, the carrier bar hand 838 is moved up and down by driving the cylinder 837, and the end portions of the hook portions 20b of the carrier bar 20 are placed in the receiving grooves 838a formed at both ends of the carrier bar hand 838, so that two carrier bars are placed. Hold the bar 20.

With the above structure, the traveling device 83 transfers the carrier bar to and from the moving frame 72 of the carrier bar slide device B4, the carrier bar waiting portion 84, and the plating tank 100.

For example, when the carrier bar is held by the moving frame 72 and is carried into the frame 81 of the carrier bar transporting section D, the carrier bar hand 838 is lowered to move to the moving frame 72 side, and the lower part of the carrier bar. By raising the carrier bar hand 838 from above, the carrier groove is held by the receiving groove 838a of the carrier bar hand 838 to receive the inner end portion of the hook portion 20b of the carrier bar. Then, the carrier bar hand 838 is attached to the frame 8
It is retracted to the central position of 1 and taken into the carrier bar transport section D.

Then, the traveling device 83 travels in the frame 81 and conveys the carrier bar to the plating tank 100 side, moves the carrier bar hand 838 to the plating tank 100 side in the same manner as above, and moves the carrier bar to the plating tank 100. Supply. In this operation, a carrier bar to which a rack loaded with substrates for mounting a plating is attached is used for plating bath 10
The same operation is performed in the case of supplying 0 to the case and in the case of supplying the plated carrier bar to which the plated rack is attached for performing the peeling process to the plating tank 100.

Further, when the carrier bar is supplied from the plating tank 100, the traveling device 83 takes in the carrier bar by the raising / lowering operation and the forward / backward movement of the carrier bar hand 838 in the same manner as described above, travels in the frame 81, and moves. The carrier bar is placed on the moving frame 72 of B. This behavior is
The same operation is carried out when the plated substrate, the rack and the carrier bar are carried and when the peeled rack and the carrier bar are carried.

Further, the traveling device 83 transfers the carrier bar to and from the carrier bar standby portion 84 by the operation of the carrier bar hand 838 similar to the above, and takes timings of supplying and collecting the carrier bar.

As described above, the rack on which the substrate to be plated is mounted and the rack for the peeling process are moved from the substrate mounting device A1 through the second reversing / conveying device C2 and the first aligning traveling device C3. The second alignment traveling device C4 and the first reversing / conveying device from the transfer part B for the rack on which plating is performed and the rack on which plating has been performed and the rack on which peeling has been performed so that the rack is transported to the mounting part B. C
It is configured to be conveyed to the substrate removing device A2 via the device 1.

Further, the rack is conveyed by the elevating conveyor C5 among the first reverse conveying device C1, the substrate removing device A2, the substrate attaching device A1 and the second reverse conveying device C2,
In the transfer section B, the rack is transferred to the carrier bar, and the carrier bar transfer device D transfers the carrier bar between the transfer section B and the plating tank 100.

Therefore, the first reverse conveying device C1 and the second
Reversal transfer device C2, first alignment travel device C3, second alignment travel device C4, and elevating conveyor C5 transfer, rack and carrier bar transfer on transfer part B, carrier bar transfer part D
The carrier bar transporting operation in 1 is suitable for automation and labor saving because it is sufficient to perform the same operation for the same transported object both when performing the plating process and when performing the peeling process.

Further, since the transport route during the plating process and the transport route during the peeling process are the same route, space can be saved.

The board mounting device A1 and the board mounting / dismounting device A2 of this embodiment are easy to automate because the racks are horizontally mounted and mounted to mount and dismount the boards. Further, the rack transfer section performs the first reverse transfer. An apparatus C1 and a second reversing conveyance device C2 are provided, and the first reversing conveyance device C1 and the second
The reversing and conveying device C2 inverts the racks from the vertical direction to the horizontal direction and from the horizontal direction to the vertical direction. Therefore, it is possible to easily deal with the plating tank 100 in which the substrate is processed vertically.

Further, according to the rack of this embodiment, both ends of the substrate are fixed by the vertical frame 1 and the bite members 2 arranged along the vertical frame 1, so that the substrate can be securely fixed. You can Moreover, since the bite member 2 continuously contacts the same end as the vertical frame 1 at the end of the substrate, the potential distribution becomes uniform on the front and back of the substrate, and the plating film thickness on the front and back is more than that of the conventional one. Will also be uniform.

Further, since the board mounting device A1 can easily make a gap between the bite member 2 and the vertical frame 1 only by pressing the bite member 2 of the rack, the board can be easily attached and detached. It is possible to easily automate the work of attaching and detaching the board.

Further, in the transfer section B, the racks are aligned in a plurality of vertical planes parallel to each other by the rack aligning section B2, the rack standby section B3, and the rack unloading section B5, and the carrier bar slide device B4 aligns the racks. Hold the carrier bar in the parallel vertical planes and move the rack moving device B.
Since the rack is moved in parallel at 1 and the rack is attached to and removed from the carrier bar, the rack can be attached to and removed from the carrier bar without delay.

[0134]

As described above, in the transporting apparatus of the plating process of the present invention, the substrate is mounted on the rack and the rack is carried out, and the plated substrate is removed from the plated rack to perform the plating treatment. Board mounting / demounting section that separates and carries out the finished board and the plated rack, a transfer section that mounts and removes the rack to / from the carrier bar, and a rack that is carried out from the board mounting / demounting section Rack transport unit that transports the rack removed from the carrier bar to the substrate mounting / demounting unit at the transfer unit and the carrier bar to which the rack is attached at the transfer unit to the plating tank and the plating Since it has a carrier bar transport unit that transports the carrier bar to which the rack is attached from the tank to the transfer unit, rack transport at the rack transport unit and rack at the transfer unit are performed. Since the carrier bar transfer operation and carrier bar transfer operation in the carrier bar transfer unit are performed on the same member regardless of whether the substrate, the rack, and the carrier bar are plated, automation is possible. Labor saving can be easily performed.

Also, according to the embodiment, in the transfer section,
The rack aligning unit, the rack standby unit, and the rack payout unit align the racks in a plurality of vertical planes parallel to each other, and the carrier bar slide device holds the carrier bars in the vertical planes parallel to the racks. Move the rack in parallel with and attach the rack to the carrier bar.
Since the rack is removed from the carrier bar, the rack can be attached to and removed from the carrier bar without interruption, and automation and labor saving can be easily performed.

[Brief description of drawings]

FIG. 1 is a diagram showing a basic configuration of a transfer device in a plating process of the present invention.

FIG. 2 is a plan view of a transfer device in a plating process according to an embodiment of the present invention.

FIG. 3 is a diagram illustrating flows of a substrate, a rack, and a carrier bar in the transfer device according to the embodiment.

FIG. 4 is a front view of the first reversing and conveying device according to the embodiment.

FIG. 5 is a partially crushed plan view of the first reverse conveyance device according to the embodiment.

FIG. 6 is a side view of the first reversing conveyance device of the embodiment.

FIG. 7 is a front view of the substrate removing device according to the embodiment.

FIG. 8 is a partially crushed plan view of the substrate removing device according to the embodiment.

9 is a view taken along the line BB of FIG.

FIG. 10 is a view on arrow CC of FIG.

FIG. 11 is an operation explanatory diagram of the main parts of the fixed rack opening / closing device and the moving rack opening / closing device in the embodiment.

FIG. 12 is a front view of the board mounting device of the embodiment.

FIG. 13 is a partially crushed plan view of the board mounting device of the embodiment.

14 is a view as seen from the arrow BB in FIG.

FIG. 15 is a view on arrow CC in FIG.

FIG. 16 is a diagram showing a part of a first alignment traveling device, a second alignment traveling device and a transfer section of the embodiment.

FIG. 17 is a side view of the traveling hand of the embodiment.

FIG. 18 is a diagram showing a rack moving device of a transfer unit of the embodiment.

FIG. 19 is a diagram illustrating an example of a rack transfer operation performed by the rack moving device according to the embodiment.

FIG. 20 is a side view of the carrier bar slide device and the carrier bar transport unit of the transfer unit of the embodiment.

FIG. 21 is a diagram showing a carrier bar transport unit of the embodiment.

FIG. 22 is a diagram showing a traveling device of an example.

FIG. 23 is a diagram showing a plating rack as a rack applied to the transfer device in the plating process of the example.

FIG. 24 is an enlarged cross-sectional view taken along the line AA of FIG.

FIG. 25 is a diagram for explaining the opening / closing operation of the plating rack in the embodiment.

FIG. 26 is a view showing a state in which the plating rack of the embodiment is attached to the carrier bar.

[Explanation of symbols]

A ... Substrate attachment / detachment section, B ... Transfer section, C ... Rack transport section, D ...
Carrier bar transporting unit, A1 ... Board mounting device, A2 ... Board removing device, B1 ... Rack moving device, B2 ... Rack aligning unit, B3 ... Rack standby unit, B4 ... Carrier bar slide device, B5 ... Rack dispensing unit, C1 ... 1st reversal conveyance apparatus, C2 ... 2nd reversal conveyance apparatus, C3 ... 1st alignment traveling apparatus, C4 ... 2nd alignment traveling apparatus, C5 ... Elevating conveyor.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hitoshi Yamashita 1-31, Kurobeoka, Hiratsuka-shi, Kanagawa Japan Tobacco Inc. Production Technology Development Center (72) Inventor Tomoyoshi Kitamoto Kurobe, Hiratsuka-shi, Kanagawa Hill No. 1-31 Japan Tobacco Inc. Production Technology Development Center

Claims (4)

[Claims] 1. A substrate to be plated is attached to a rack, the rack is attached to a carrier bar, and the rack and the substrate are supplied together with the carrier bar to a plating tank.
Remove the plated rack from the plated carrier bar that has been plated in the plating tank, remove the plated substrate from the plated rack, and collect the plated substrate. The transfer device for the plating process, which mounts the board to the rack and removes the plated board from the plated rack, and the transfer section that mounts and removes the rack to and from the carrier bar. And a rack transfer section that transfers the rack carried out from the board mounting / demounting section to the transfer section, and also transfers the rack removed from the carrier bar in the transfer section to the board mounting / demounting section, and the transfer section. The carrier bar having a rack attached thereto is conveyed to the plating tank and the rack is attached from the plating tank. And a carrier bar carrying section for carrying the carrier to the transfer section. 2. The transfer section holds a rack alignment holder to which racks aligned in a vertical plane are supplied, and a carrier bar in a vertical plane parallel to the vertical plane of the rack alignment holder. And a carrier moving device for moving the rack, and a rack moving device for moving the rack, and the rack moving device for the rack aligning and holding by the rack moving device. 2. The transporting apparatus in the plating process according to claim 1, wherein the racks of the parts are taken out while keeping the aligned state, and the racks are moved in parallel and attached to the carrier bar of the carrier bar slide device. 3. The rack aligning and holding unit includes a rack aligning unit, a rack standby unit, and a rack ejecting unit, and the rack aligning and holding unit removes the rack taken out from the rack aligning unit by the rack moving device. The rack is aligned once in the standby unit, the rack aligned in the rack standby unit is attached to the carrier bar of the carrier bar slide device, and the rack is taken out from the carrier bar of the carrier bar slide device and supplied to the rack dispensing unit. The transport device for the plating step according to claim 2, wherein 4. The plated rack carried out from the substrate attaching / detaching section is transferred to the transfer section by the rack transfer section, and the plated rack is transferred to the transfer section by the transfer section. The carrier bar is attached to a carrier bar, and the rack is supplied to the plating tank together with the carrier bar in the carrier bar transporting section, and the carrier bar and the rack after the stripping treatment in which the plating film is stripped in the plating tank are finished. 3. The method according to claim 1, wherein the rack is supplied to the transfer section, and the rack is removed from the carrier bar that has been subjected to the peeling process by the transfer section to recover the rack that has been peeled. The transport device for the plating process according to claim 3.