JPH07316853A - Washing treatment device for metallic parts or metallic member - Google Patents

Abstract

PURPOSE:To prevent formation of undesired films, such as oxidized films by shortening the time from the end of etching till rinsing on the surface, in a device for washing metallic parts and metallic members by an etching treatment. CONSTITUTION:This washing treatment device includes a carrier 6 for vertically and horizontally transporting a washing tray 5 housing articles to be treated to the part above a chemical tank 1 for executing the etching treatment and a normal rinsing tank 2 for executing normal rinsing and a receiver 3 in common use as a shutter mechanism and rinsing nozzles 7 for executing preliminary rinsing in the part above the chemical tank 1. Since the rinsing nozzles 7 are arranged in the part above the chemical tank 1, the time from the end of the etching till the rinsing is rapidly executed and, therefore, the formation of the undesired films, such as oxidized films, on the metallic parts is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning and treating metal parts or metal members, and more particularly to an apparatus for cleaning and treating metal parts or metal members of electronic devices.

[0002]

2. Description of the Related Art As electronic devices have become higher in performance, smaller in size and lighter in weight, there has been an increasing demand for improvement in surface cleanliness of metal parts such as metal parts, wires and plates that make up electronic devices. For example, in microwave tubes widely used as amplification devices in the fields of communication broadcasting and satellite broadcasting, high performance and high efficiency have become urgent issues.
Along with this, the development of miniaturized and high-power microwave tubes is becoming more and more necessary. For this purpose, it is necessary to sufficiently clean the surfaces of various metal parts and metal members (hereinafter referred to as parts) that constitute the microwave tube in order to improve the performance and reliability of the microwave tube. It has become essential. Therefore, in the manufacturing process of the microwave tube, the individual components to be formed are composed of inorganic acid, organic acid and organic acid for the purpose of removing stains such as machine oil and oxide adhering to the surface of the component after completion of machining. Immersed in these mixed chemicals, the surface of the parts is etched and cleaned. In the process of cleaning the parts, as described above, the etching solution suitable for the material of the parts is used, and the entire surface of the parts is immersed in this etching solution to remove the oxide film and foreign matter on the surface of the parts. In order to remove this etching solution, it is washed with pure water and city water, and finally the parts are dried by a drying means such as hot air drying, oven drying, centrifugal drying or vacuum drying.

In this type of metal component or metal member cleaning processing apparatus (hereinafter referred to as cleaning processing apparatus), the time from the etching processing to the water cleaning is important, and if this time is long, the object to be processed will be processed. An oxide film is generated on the surface of the component due to the etching liquid remaining on the component and oxygen in the air.
When a component in such a state is used in a microwave tube, for example, the vapor pressure of the produced oxide is high, so vaporization occurs during operation of the microwave tube and the degree of vacuum inside the microwave tube increases. And the operating characteristics cannot be maintained. Also,
In recent years, when the communication system has changed from analog to digital, high insulation is required for each electrode such as cathode, anode and Wehnelt constituting the microwave tube which is the amplification device. The leak current deteriorates the amplification effect. For this reason, there is a demand for a highly clean component in which the above-mentioned oxide is not present on the surface. Also in the field of semiconductor devices, if the time from the etching process of a silicon wafer to the washing with water is long, a non-conductive film is formed on the silicon wafer, which causes a problem that ohmic contact cannot be obtained.

Conventionally, a surface treatment apparatus of this type is disclosed in, for example, Japanese Patent Application Laid-Open No. 59-098527, as shown in FIGS. 7A and 7B, a chemical tank 1 for etching a silicon wafer and a main water washing apparatus. A technique is provided in which a washing head 10 for performing preliminary washing is provided between the washing tank 2 and the washing tank 2 to prevent formation of an undesired film such as a non-conductive film within the time required from the end of etching to the main washing. It is disclosed. This is a structure in which a silicon wafer is held by a chuck head 9 by vacuum suction, the lower surface of the silicon wafer is etched in the upper part of the chemical tank 1, and then the chuck head 9 moves horizontally and a preliminary washing head part 10 performs preliminary washing. Has become. Therefore, the time from the completion of etching of the silicon wafer to the washing with water can be shortened, and the formation of an undesired film such as a stain film on the surface of the silicon wafer can be prevented.

However, the chemical tank 1 and the washing head section 1
Since it is arranged so as to be separated from 0, there is a limit in principle in shortening the time from the end of etching to the preliminary water washing. That is, it was impossible to reduce the time required for the chuck head 9 to move from the chemical tank 1 to the washing head 10 or less. Further, since the component holding mechanism is a vacuum suction system and the component transport mechanism is limited to a horizontal plane, there are the following drawbacks.

The shape of applicable parts is limited to a plate-like shape such as a silicon wafer, and etching processing can be performed only on one side. Therefore, it can be applied when cleaning the entire surface of a part having a three-dimensional shape. Therefore, the versatility is low. Further, since the chemical tank 1 and the washing head 10 are separated,
After the etching is completed, the highly harmful etching liquid (hydrofluoric acid) falls to the outside of the bath while moving to the washing head 10, which is very dangerous in the working environment.

[0007]

This conventional cleaning apparatus has a problem that an oxide film is formed on the surface of the component to be processed.

Further, there is also a problem that the mechanism for transporting the parts to be processed is limited to the horizontal direction and is not versatile.

Further, there is a problem that a highly harmful etching solution drops outside the bath during the movement after the etching, which is very dangerous in the working environment.

The object of the present invention is to provide a metal part or metal member which can be washed with water before an undesired harmful film such as an oxide film is formed on the surface of the part, has high versatility and is excellent in working environment. To provide a cleaning processing device.

[0011]

SUMMARY OF THE INVENTION The present invention comprises a container for containing an object to be processed, a chemical treatment tank for immersing the container for etching the surface of the object to be processed, and a preliminary treatment after the etching. In the apparatus for cleaning treatment of metal parts or metal members, comprising: a water washing means for performing a water washing treatment on the object to be treated, and a main washing tank for dipping the container to perform a water washing treatment on the object to be treated, A transport mechanism for vertically and horizontally transporting the container above and below the chemical treatment tank and the main washing tank, and a single or two-divided receiver that also functions as a shutter mechanism above the chemical treatment tank; It is provided with a water washing nozzle arranged in the transport mechanism or the receiver for performing a water washing treatment of the treated material.

[0012]

In the cleaning apparatus of the present invention having the above-mentioned structure in which the washing nozzle for preliminarily washing water is arranged on the upper part of the chemical tank, the parts to be processed are placed on the upper part of the chemical tank after etching. It is transported and in parallel with it, the aforementioned receptacle is placed on the chemical bath. After that, the parts to be treated are washed with water in the upper part of the chemical bath, and thereafter, the parts to be treated are horizontally moved to the upper part of the main washing tank by the transport mechanism, descended, immersed in the main washing tank and washed with water.

As described above, since the cleaning apparatus of the present invention has a structure in which the washing nozzle for preliminarily washing water is provided above the chemical tank, the chemical tank and the washing nozzle are separated from each other. Compared with the cleaning processing device of No. 3, the time from the end of etching to water washing can be significantly shortened.

Therefore, the cleaning processing apparatus of the present invention is more reliable than the conventional cleaning processing apparatus and can prevent the formation of an undesired oxide film generated during the time from the completion of etching to the cleaning with water. Further, the washing liquid during the preliminary washing is captured by the receiver, and therefore the highly harmful chemical treatment liquid does not drop to the outside of the apparatus, and the working environment is excellent.

[0015]

Embodiments of the present invention will now be described with reference to the drawings.

FIGS. 1A and 1B are a side view and a plan view showing the configuration of the first embodiment of the present invention, and FIGS.
FIG. 2B is a side view and a plan view illustrating the holding mechanism of the cleaning tray of FIG. 1. The first embodiment of the present invention is shown in FIG.
As shown in (a), (b) and FIGS. 2 (a), (b), the chemical bath 1 is a bath for etching parts, and a chemical treatment liquid (not shown) adapted to each metal is provided therein. Is included. The main washing tank 2 is for washing the surface of the component with water after the completion of etching, and has water inside. The parts to be processed (not shown) are housed inside a cleaning tray 5 having a mesh-shaped periphery, and the frame 4 of the loading part 4 is accommodated.
It is set to a predetermined position on 1. The cleaning tray (hereinafter, referred to as a cleaning tray) 5 in which the parts to be processed set in the load unit 4 are stored is a horizontal movement mechanism unit 61.
The carrier 6 which is a transport mechanism including the vertical movement mechanism 62 and the chucking portion 63 and the receiving portion 51 of the cleaning tray 5.
Held in. The horizontal movement mechanism unit 61 has, for example, a motor (not shown) therein, and the rotation of the motor causes the roller 64 to rotate via a gear and a shaft (both not shown), so that the roller 67 is mounted on the rail 67. The cleaning tray 5 is moved horizontally by traveling. Similarly, the vertical movement mechanism unit 62 vertically converts the rotation of a motor (not shown) provided therein by a rack gear and a shaft (both not shown) to vertically move the cleaning tray 5.

The cleaning tray 5 held by the carrier 6 as described above is conveyed to a position right above the chemical tank 1 and then the chemical tank 1
It descends to the inside, and the parts to be processed inside the cleaning tray 5 are etched. After performing the etching process for a predetermined time, the cleaning tray 5 rises, and at the same time, the receiver 3 arranged on the upper part of the chemical tank 1 is moved right above the chemical tank 1 along the guide shaft 32 by the operation of the cylinder 31. Move up to. Immediately thereafter, water (pure water) is ejected from the water washing nozzle 7 provided inside the cover portion 65 of the carrier 6 to remove the chemicals remaining on the parts to be treated. Wash nozzle 7
Is connected to a water supply pipe 71, and water (pure water) can be supplied to the water washing nozzle 7 by opening an electromagnetic valve (not shown) or the like.

In this embodiment, by appropriately adjusting the ascending speed of the cleaning tray 5 after the etching treatment, the opening / closing speed of the receiver 3, the timing, the timing of supplying water to the washing nozzle 7, etc., the preliminary washing after the completion of the etching. It was possible to reduce the time to less than 1 second. The washing nozzle 7
The arrangement and the number of the parts are appropriately determined. In this embodiment, three parts are provided on each of the four sides on the inner surface side of the cover part 65 at a position higher than the mesh part 52 of the cleaning tray 5 on which the parts to be processed are mounted by about 100 mm. The water washing nozzle 7 was arranged one by one. Further, the water (pure water) ejected from the water washing nozzle 7 at the time of this preliminary water washing is received together with the chemicals remaining on the parts to be treated in the receiver 3
Then, it is naturally dropped into the discharge hole 34 and discharged through the drain pipe 33. The cover portion 65 of the carrier 6 can prevent water (pure water) from scattering during preliminary washing. After finishing the preliminary water washing, the washing tray 5 moves to a position right above the main water washing tank 2 and descends to the inside of the main water washing tank 2, whereby the parts to be treated are main water washed. After the main washing is completed, the washing tray 5 is moved up and moved in the same manner, and is sent to the next step such as a drying step.

As described above, in the cleaning apparatus of this embodiment, the carrier 6 for holding the water cleaning nozzle 7 and the cleaning tray 5 of the receiver 3 having the shutter mechanism on the upper part of the chemical tank 1 is vertically moved,
It has a mechanism to move horizontally. Therefore, after completion of the etching treatment of the component to be treated, the component can be washed with water within 1 second, so that generation of an undesired oxide film on the component to be treated can be suppressed. In addition, it can be applied to three-dimensional parts that were impossible in the past, and has excellent versatility. Further, after the etching is completed, pre-washing can be performed on the upper portion of the apparatus, so that highly harmful chemicals do not leak to the outside of the apparatus and the work environment is excellent.

FIG. 3 is a sectional view of the parts used in the cleaning process of the first embodiment. Using this cleaning apparatus, a part made of oxygen-free copper having an outer diameter of 30 mm and a height of 25 mm having the non-through hole 8 shown in FIG. 3 was cleaned. The dimensions of the non-penetrating hole 8 of this component are 1) hole diameter 10 mm, depth 10 mm, 2) hole diameter 5 m
m, depth 20 mm, 3) three types of samples having a hole diameter of 15 mm and a depth of 10 mm were washed with an etching solution in which 70 vol% sulfuric acid aqueous solution and 65 vol% nitric acid aqueous solution were mixed in equal amounts (volume ratio). As a result, no oxidation was observed in the finished state of any of the parts. On the other hand, when washing was performed without performing preliminary water washing, copper was clearly formed in the 8 holes of the non-penetrating holes where most of the chemical remained, and copper oxide was clearly formed. Therefore, it was confirmed that the cleaning apparatus of this example is useful.

FIG. 4 is a side view of the essential portions of the second embodiment of the present invention. In this embodiment, as shown in FIG.
Is arranged independently of the carrier (not shown) and can be moved independently. Therefore, the time from the completion of the etching process to the preliminary water washing can be further shortened as compared with the first embodiment. it can.

FIG. 5 is a sectional view of the Wehnelt part of the microwave tube used in the main cleaning process. With this cleaning device,
In the microwave tube in which the Wehnelt parts and other various parts shown in FIG. 5 are cleaned, parts made of various materials are used according to the use of the constituent parts. What is suitable for the material is used. For example, in this embodiment, the same chemicals as in the first embodiment are used for copper, molybdenum, nickel and copper-nickel alloy, and stainless steel, 42% Ni are used.
A mixed solution of nitric acid and hydrofluoric acid was used for the -6% Cr-residual Fe (426) alloy, and a mixed solution of hydrochloric acid, sulfuric acid and nitric acid was used for the Kovar alloy. As a result of confirming the characteristics of the microwave tube assembled using the components thus washed, it was confirmed that there was no problem in the characteristics.

6 (a) and 6 (b) are a side view and a plan view of an essential part of a third embodiment of the present invention. Third of the present invention
In the embodiment, as shown in FIGS. 6 (a) and 6 (b), the receivers 3 also serving as shutters are divided into two parts so that they can be opened and closed horizontally, and the washing nozzle 7 is provided on the bottom surface of each receiver 3. It is arranged. Each of the two divided receptors 3 is
It is configured to be in contact with each other on the chemical tank 1 in a closed state. Therefore, the time required for the receiver 3 to move directly above the chemical tank 1 can be further shortened as compared with the first and second embodiments.
The time until pre-washing can be halved (approximately 0.5 seconds) as compared with the first and second embodiments.

The carrier 6 has a suction surface 66 by vacuum suction.
It is possible to hold the plate-shaped parts by means of, and, although not shown, it has horizontal and vertical transport mechanisms as in the first and second embodiments. This cleaning apparatus is capable of single-sided etching of a silicon wafer, and further has an advantage that the time from completion of etching to preliminary washing with water can be reduced to half as compared with the conventional cleaning processing apparatus which took 1 second as described above. .

[0025]

As described above, in the cleaning processing apparatus of the present invention, the receptacle having the shutter mechanism on the upper portion of the chemical tank for performing the etching processing, the washing nozzle, and the carrier holding the parts to be processed move vertically and horizontally. Since it has a mechanism and can be pre-washed with water in the upper part of the chemical tank, the time from the completion of the etching treatment of the parts to be treated to the washing can be reduced to half or less of the conventional equipment. Therefore, it is possible to suppress the generation of an undesired oxide film on the component to be processed, to provide a component with a high degree of cleaning, and to apply it to a component having a three-dimensional shape, which is impossible with conventional equipment. It has the advantage of being versatile.

In addition, after the etching is completed, preliminary washing can be performed on the upper part of the chemical tank, and the washing liquid can be caught by the receiver, so that highly harmful chemicals do not leak to the outside of the apparatus and the working environment. It also has the advantage of excellent properties.

[Brief description of drawings]

1A and 1B are a side view and a plan view showing a configuration of a first embodiment of the present invention.

2 (a) and 2 (b) are a side view and a plan view illustrating a holding mechanism of the cleaning tray of FIG.

FIG. 3 is a cross-sectional view of components used in the cleaning process of the first embodiment.

FIG. 4 is a side view of the essential parts of the second embodiment of the present invention.

FIG. 5 is a cross-sectional view of a Wehnelt component of a microwave tube.

6 (a) and 6 (b) are a side view and a plan view of a main portion of a third embodiment of the present invention.

7A and 7B are a side view and a front view of an example of a conventional surface treatment apparatus.

[Explanation of symbols]

 1 chemical tank 2 water washing tank 3 receptor 31 cylinder 32 guide shaft 33 drainage pipe 34 discharge hole 4 load section 41 frame 5 cleaning tray 51 receiving section 52 mesh section 6 carrier 61 horizontal movement mechanism section 62 vertical movement mechanism section 63 chucking Part 64 Roller 65 Cover part 66 Adsorption surface 67 Rail 7 Washing nozzle 71 Water supply pipe 8 Impermeable hole 9 Chuck head 10 Washing head

Claims (5)

[Claims] 1. A container for containing an object to be processed, a chemical treatment tank for immersing the container to etch the surface of the object to be processed, and a preliminary washing process of the object to be treated with water after the etching process. In a washing treatment apparatus for a metal part or a metal member, which comprises a washing means for carrying out the above, and a main washing tank for immersing the container to wash the object to be treated, the chemical treatment tank and the main washing tank A transport mechanism for transporting the container vertically and horizontally in the upper part of the container, a receiver also serving as a shutter mechanism in the upper part of the chemical treatment tank, and a washing nozzle for preliminarily washing the object to be treated with water. A cleaning device for a metal part or a metal member, which is characterized by: 2. The apparatus for cleaning a metal part or a metal member according to claim 1, wherein the water washing nozzle is arranged in a transport mechanism. 3. The cleaning processing apparatus for a metal part or a metal member according to claim 1, wherein the water washing nozzle is arranged in a receiver. 4. The cleaning apparatus for a metal part or a metal member according to claim 1, wherein the receiver is composed of a single body. 5. The metal component according to claim 1, wherein the receiver is horizontally divided into two, and each of the two divided receivers opens and closes to form a shutter mechanism. Cleaning device for metal parts.