JPH073141U - High-speed / high-frequency IC component board structure - Google Patents
High-speed / high-frequency IC component board structureInfo
- Publication number
- JPH073141U JPH073141U JP029998U JP2999893U JPH073141U JP H073141 U JPH073141 U JP H073141U JP 029998 U JP029998 U JP 029998U JP 2999893 U JP2999893 U JP 2999893U JP H073141 U JPH073141 U JP H073141U
- Authority
- JP
- Japan
- Prior art keywords
- terminal lead
- component
- ground
- substrate
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 プリント基板とこれに面実装するIC部品の
特性インピーダンスを高速信号に対応して整合できるよ
うなIC部品の基板構造を得る。
【構成】 IC部品の基板構造において、一様な厚さの
セラミック基板11を逆U字形に焼成する。信号端子リ
ード14とアース端子リード15をセラミック基板11
の湾曲部を含む両端部外面に密着して配設する。セラミ
ック基板11の内面全面にアース導体16を密着接合
し、その突出端を内側に折り曲げてその一方にアース端
子リード15の下端部を接合し、両折曲部外面に半田メ
ッキ膜17を設ける。
(57) [Abstract] [Purpose] To obtain a substrate structure of an IC component capable of matching the characteristic impedances of a printed circuit board and an IC component surface-mounted on the printed circuit board in correspondence with a high-speed signal. [Structure] In a substrate structure of an IC component, a ceramic substrate 11 having a uniform thickness is fired in an inverted U shape. Connect the signal terminal lead 14 and the ground terminal lead 15 to the ceramic substrate 11
The outer surfaces of both ends including the curved portion are closely attached. The ground conductor 16 is closely bonded to the entire inner surface of the ceramic substrate 11, the projecting end is bent inward, the lower end of the ground terminal lead 15 is bonded to one of the ends, and the solder plating film 17 is provided on the outer surface of both bent parts.
Description
【0001】[0001]
この考案は、面実装形の高速・高周波用IC部品がその信号端子部において、 装着するプリント基板と安定した特性インピーダンス整合が得られるようにした 基板構造に関するものである。 The present invention relates to a board structure in which a surface mount type high-speed / high-frequency IC component is capable of obtaining stable characteristic impedance matching with a printed board to be mounted in a signal terminal portion thereof.
【0002】[0002]
従来、面実装形IC部品における信号端子部の端子接続構造は図2に示す構成 例のものが一般に知られている。図2は側断面図を示しており、印刷配線板(以 下P・C・Bという)1の上面中央部にはICチップ2が搭載され、また、両端 縁部にはそれぞれ信号端子リード3及びアース端子リード4がP・C・B1表面 上に印刷された導体箔5を介して配設されている。なお、6はボンデングワイヤ ーで、ICチップ2はこのボンデングワイヤー6を介して導体箔5を経てそれぞ れ信号端子リード3及びアース端子リード4と接続され、電気的に導通されてい る。7はプラスチックカバーで前記部品全体を保護している。 このように構成されたIC部品はその信号端子リード3及びアース端子リード 4をプリント基板(図示せず)の対応する接続部に半田接続することによって、 プリント基板の送受信、電源電圧供給及びグランドアース接続が可能になる。 2. Description of the Related Art Conventionally, as a terminal connection structure of a signal terminal portion in a surface mount type IC component, a structure example shown in FIG. 2 is generally known. FIG. 2 shows a side cross-sectional view. An IC chip 2 is mounted on the center of the upper surface of a printed wiring board (hereinafter referred to as P, C, B) 1, and signal terminal leads 3 are provided on both edges. Also, the ground terminal lead 4 is provided via the conductor foil 5 printed on the P, C, B1 surface. Reference numeral 6 is a bonding wire, and the IC chip 2 is electrically connected to the signal terminal lead 3 and the ground terminal lead 4 via the bonding wire 6 and the conductor foil 5, respectively. . A plastic cover 7 protects the entire component. The IC component configured as described above is connected to the corresponding connection portion of the printed circuit board (not shown) by soldering the signal terminal lead 3 and the ground terminal lead 4 of the printed circuit board to transmit / receive, supply power voltage and ground ground. Connection is possible.
【0003】[0003]
しかしながら、上記構成のIC部品は比較的遅い伝送速度の信号には対応でき ていたが、近年、伝送信号の高速化・高周波化が進み、プリント基板や実装IC 部品に対しても高速信号を伝送するための対応が要求される情勢になり、上記構 成のIC部品では高速信号を伝送するために必要な特性インピーダンスの整合が なされないという問題点があった。これを具体的に示すと、高速信号を移送する 場合伝送線路上でその物理定数である特性インピーダンスを一定に保ち、いわゆ るインピーダンス整合を図らねばならない。このため、IC部品等を実装するプ リント基板レベルではマイクロストリップライン構造やストリップライン構造を 伝送線路として用いることにしているが、このようなプリント基板に実装される 部品レベルではまだ構造的対策が考慮されていないのが実情である。このため、 プリント基板とこれに電気的接続がなされる面実装IC部品とでは特性インピー ダンスの整合がとれないため、高速信号をプリント基板の伝送線路と既存のIC 部品との間で正常に送受信するには技術的に不十分であった。 However, although the IC components with the above configuration were able to handle signals with a relatively slow transmission rate, in recent years, transmission signals have become faster and higher in frequency, and high-speed signals are also transmitted to printed circuit boards and mounted IC components. Therefore, there has been a problem that the characteristic impedance required for transmitting high-speed signals cannot be matched in the IC component having the above-mentioned structure. To show this concretely, when transferring a high-speed signal, the characteristic impedance, which is its physical constant, must be kept constant on the transmission line to achieve what is called impedance matching. For this reason, we have decided to use a microstrip line structure or a strip line structure as a transmission line at the level of a printed circuit board on which IC parts and the like are mounted, but structural measures still need to be taken at the level of parts mounted on such a printed circuit board. The reality is that it is not considered. For this reason, the characteristic impedance cannot be matched between the printed circuit board and the surface-mounted IC components that are electrically connected to the printed circuit board, and high-speed signals are normally transmitted and received between the printed circuit board transmission line and existing IC components. Was technically insufficient to do so.
【0004】 本考案はこのような従来の技術の有していた、プリント基板の伝送線路と既存 のIC部品との間に起きる特性インピーダンスの不整合によって高速信号の正常 な送受信がなされないという問題点を除去するため、IC部品の基板を一定誘電 率の誘電体例えばセラミック材とし、これを断面が一様な厚さの逆U字形に焼成 し、さらに、その内側にプリント基板と導通させるためのアース導体を設け、プ リント基板との安定した特定インピーダンス整合が得られる伝送線路構造を有す るIC部品を提供することを目的とするものである。The present invention has a problem in that normal transmission and reception of high-speed signals cannot be performed due to the mismatch of the characteristic impedance between the transmission line of the printed circuit board and the existing IC component, which the conventional technique has. In order to remove the dots, the substrate of the IC component is made of a dielectric material with a constant dielectric constant, for example, a ceramic material, which is fired into an inverted U-shape with a uniform cross section, and to connect to the printed circuit board inside it. It is an object of the present invention to provide an IC component having a transmission line structure which is provided with the ground conductor of (1) and which can obtain stable specific impedance matching with the printed board.
【0005】[0005]
上記目的を達成するため本考案の構成を、実施例に対応する図1を用いて説明 すると、本考案は、面実装IC部品の基板構造であって、断面が一定の厚さの逆 U字形でその外面中央にICチップ12の搭載部があるように構成されたセラミ ック基板11と、この基板11の両端部外面にそれぞれ密着して配列された信号 端子リード14及びアース端子リード15と、前記基板11の内面全面に密着し 両突端部は内側に折り曲げられて一方にはアース端子リード15が接合し、外面 には半田メッキ膜が施されたアース導体16とを備えたことを特徴とするもので ある。 In order to achieve the above object, the structure of the present invention will be described with reference to FIG. 1 corresponding to an embodiment. The present invention is a substrate structure of a surface mount IC component, and has an inverted U-shaped cross section with a constant thickness. And a ceramic substrate 11 having a mounting portion for the IC chip 12 at the center of the outer surface thereof, and a signal terminal lead 14 and a ground terminal lead 15 arranged in close contact with the outer surfaces of both ends of the substrate 11, respectively. In addition, it is provided with a ground conductor 16 which is in close contact with the entire inner surface of the substrate 11 and is bent inward at both projecting ends, is joined to the ground terminal lead 15 on one side, and is provided on the outer surface with a ground conductor 16 coated with a solder plating film. It is what
【0006】[0006]
このように構成されたものにおいては、セラミック基板11が断面逆U字形の セラミック材で焼成されたものであり、その外面の両端部の湾曲部11bにおい ても、信号端子リード14及びアース端子リード15がそれぞれ密着して配設さ れ、かつ、内面には全面に亘ってべたアース導体16が密着されているから、安 定した特性インピーダンスが得られ、高速・高周波信号の送受信を行うことがで きる。 また、セラミック基板11の厚さ及び誘電率の調整によって伝送線路の特性イ ンピーダンスを所望の値に選択実施することができる。 さらに、IC部品のべたアース導体16の先端折曲部16aによって、面実装 したプリント基板のアースとの広い導通面積が得られ、従来に比べて安定かつ確 実なアースが得られる。 In such a structure, the ceramic substrate 11 is fired with a ceramic material having an inverted U-shaped cross section, and the signal terminal lead 14 and the ground terminal lead are also provided in the curved portions 11b at both ends of the outer surface thereof. Since 15 are arranged in close contact with each other and a solid ground conductor 16 is adhered over the entire inner surface, a stable characteristic impedance can be obtained and high-speed and high-frequency signals can be transmitted and received. it can. In addition, the characteristic impedance of the transmission line can be selectively set to a desired value by adjusting the thickness and the dielectric constant of the ceramic substrate 11. Further, the bent portion 16a of the tip of the solid ground conductor 16 of the IC component provides a large conductive area with the ground of the surface-mounted printed circuit board, and a stable and reliable ground can be obtained as compared with the conventional case.
【0007】[0007]
以下、本考案の実施例について図面を参照して説明する。 図1は本考案に係る高速・高周波用IC部品の基板構造の一実施例を示す側断 面図である。同図において、基板11は誘電体としてのセラミック材で作られて おり、断面が一様な厚さの逆U字形に焼成されている。外面中央部11aにはI Cチップ12搭載用凹部があり、両端の湾曲部11bは一定曲率で湾曲し平板部 と同一の厚さに形成されている。13,14はそれぞれセラミック基板11上に 印刷された導体箔及び密着された信号端子リードで、このリード14の下端部は 外側に折り曲げられている。15はアース端子リードで信号端子リード14と同 様にセラミック基板11に密着され、下端部は内側に折り曲げられてセラミック 基板11の内面全面に密着されたべたアース導体16と接合され、また、アース 導体16の両端16a,16aは内側に折り曲げられ、その外面には半田メッキ 膜17が施されている。なお、18はボンデング・ワイヤーでICチップ12と 導体箔13との間を電気的に接続しており、19はIC部品表面を保護するため のカバーで図示していないが、その四隅の端縁部にはそれぞれセラミック基板1 1に引掛ける爪を有している。 上記のように構成したので、一様な厚さのセラミック基板11を挟んで、上下 から信号端子リード14とアース端子リード15が密着して対設されているから 、これらにより決定されるユニットキャパシタンス値などはほぼ一定となり、I C部品の特性インピーダンスは導体箔13,信号端子リード14の厚さと幅及び セラミック基板11の厚さと誘電率などのパラメータに支配されるようになる。 従って、本実施例によれば、従来構造(図2参照)の端子間隔を変えることなし に、セラミック基板11の厚さと誘電率を選択することによって特性インピーダ ンスの調整が可能となり、マイクロストリップライン構造等の伝送線路を用いた 高速・高周波に対応可能なプリント基板側の特性インピーダンスとも整合可能に なるから、プリント基板と面実装IC部品との接続点における反射が起らなくな り、最大の電力等を移送できるようになる。 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing an embodiment of a substrate structure of a high speed / high frequency IC component according to the present invention. In the figure, the substrate 11 is made of a ceramic material as a dielectric, and is fired into an inverted U-shape having a uniform thickness in cross section. The central portion 11a of the outer surface has a recess for mounting the IC chip 12, and the curved portions 11b at both ends are curved with a constant curvature and are formed to have the same thickness as the flat plate portion. Reference numerals 13 and 14 respectively denote a conductor foil printed on the ceramic substrate 11 and closely attached signal terminal leads, and the lower ends of the leads 14 are bent outward. Reference numeral 15 is a ground terminal lead, which is closely attached to the ceramic substrate 11 in the same manner as the signal terminal lead 14, and the lower end portion is bent inward to be joined to the solid earth conductor 16 which is closely attached to the entire inner surface of the ceramic substrate 11 and is also grounded. Both ends 16a, 16a of the conductor 16 are bent inward, and a solder plating film 17 is applied to the outer surface thereof. Reference numeral 18 is a bonding wire for electrically connecting the IC chip 12 and the conductor foil 13. Reference numeral 19 is a cover for protecting the surface of the IC component, which is not shown, but the four corner edges thereof. Each part has a claw hooked on the ceramic substrate 11. With the above-described configuration, the signal terminal lead 14 and the ground terminal lead 15 are closely attached from above and below with the ceramic substrate 11 having a uniform thickness interposed therebetween. The values and the like are almost constant, and the characteristic impedance of the IC component is controlled by parameters such as the thickness and width of the conductor foil 13 and the signal terminal lead 14, the thickness and the dielectric constant of the ceramic substrate 11. Therefore, according to the present embodiment, the characteristic impedance can be adjusted by selecting the thickness and the dielectric constant of the ceramic substrate 11 without changing the terminal spacing of the conventional structure (see FIG. 2), and the microstrip line can be adjusted. Since it is also possible to match the characteristic impedance on the printed circuit board side that is compatible with high speed and high frequency using a transmission line such as a structure, reflection at the connection point between the printed circuit board and surface mount IC components does not occur, and the maximum Power can be transferred.
【0008】[0008]
以上説明したように、本考案によれば、以下に記載するような効果を奏する。 セラミックなどの誘電体基板を一様な厚さの断面逆U字形に焼成し、その両湾 曲部に沿って信号端子リード及びアース端子リードを配設するとともに、その内 面一面にアース導体を配設したことにより、端子リードに沿って安定した回路素 子が得られるようになるので、高速・高周波信号の送受信に好適である。 また、誘電体のセラミック基板はその厚さと誘電率の調整により、伝送線路の 特性インピーダンスを任意の値に設計することが可能になり、プリント基板との 特性インピーダンス整合が容易になる。 さらには、IC部品のべたアース導体により、プリント基板との導通が広い面 積で行えるので、従来よりも安定したグランドを達成することができ、アース効 果が著しく向上する。 As described above, according to the present invention, the following effects can be obtained. A dielectric substrate such as ceramic is fired to have an inverted U-shaped cross section with a uniform thickness, and the signal terminal lead and the ground terminal lead are arranged along the curved parts of the substrate, and the ground conductor is provided on the entire inner surface. By arranging them, a stable circuit element can be obtained along the terminal leads, which is suitable for transmitting and receiving high-speed and high-frequency signals. In addition, by adjusting the thickness and permittivity of the dielectric ceramic substrate, the characteristic impedance of the transmission line can be designed to an arbitrary value, facilitating the characteristic impedance matching with the printed circuit board. Furthermore, since the solid ground conductor of the IC component allows a large area for conduction with the printed circuit board, a more stable ground can be achieved than before, and the ground effect is significantly improved.
【図1】本考案の実施例を示す側断面図である。FIG. 1 is a side sectional view showing an embodiment of the present invention.
【図2】従来の構成例を示す側断面図である。FIG. 2 is a side sectional view showing a conventional configuration example.
11 セラミック基板 12 ICチップ 13 導体箔 14 信号端子リード 15 アース端子リード 16 アース導体 17 半田メッキ膜 18 ボンデングワイヤー 19 カバー 11 Ceramic Substrate 12 IC Chip 13 Conductor Foil 14 Signal Terminal Lead 15 Ground Terminal Lead 16 Ground Conductor 17 Solder Plating Film 18 Bonding Wire 19 Cover
Claims (1)
記基板を所定誘電率の誘電体で断面が一定の厚さの逆U
字形に形成するとともに、その外面中央部にはICチッ
プ搭載部を設け、この基板においてその両端部外面には
それぞれ信号端子リード、アース端子リードを定着させ
るとともに、内面には全面にアース導体を密着させて前
記アース端子リードを接続し、該アース導体の突端部は
内側に折り曲げて外面に半田メッキ膜を施したことを特
徴とする高速・高周波用IC部品の基板構造。1. A substrate structure of a surface mount IC component, wherein the substrate is a dielectric material having a predetermined permittivity and an inverse U having a constant cross section.
In addition to forming a letter shape, an IC chip mounting part is provided in the center of the outer surface, and the signal terminal lead and the ground terminal lead are fixed to the outer surfaces of both ends of this board, and the ground conductor is adhered to the entire inner surface. A substrate structure of a high-speed / high-frequency IC component, characterized in that the ground terminal lead is connected to the ground terminal lead, and the projecting end portion of the ground conductor is bent inward and a solder plating film is applied to the outer surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP029998U JPH073141U (en) | 1993-06-04 | 1993-06-04 | High-speed / high-frequency IC component board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP029998U JPH073141U (en) | 1993-06-04 | 1993-06-04 | High-speed / high-frequency IC component board structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH073141U true JPH073141U (en) | 1995-01-17 |
Family
ID=12291600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP029998U Pending JPH073141U (en) | 1993-06-04 | 1993-06-04 | High-speed / high-frequency IC component board structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH073141U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
JP2007514320A (en) * | 2003-12-09 | 2007-05-31 | ゲルコアー リミテッド ライアビリティ カンパニー | Surface mount light emitting chip package |
-
1993
- 1993-06-04 JP JP029998U patent/JPH073141U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007514320A (en) * | 2003-12-09 | 2007-05-31 | ゲルコアー リミテッド ライアビリティ カンパニー | Surface mount light emitting chip package |
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
JP4563980B2 (en) * | 2006-10-13 | 2010-10-20 | 三菱電機株式会社 | Surface mount type package and semiconductor device |
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