JPH07294863A - Manufacture of liquid crystal electrooptic device - Google Patents
Manufacture of liquid crystal electrooptic deviceInfo
- Publication number
- JPH07294863A JPH07294863A JP9034794A JP9034794A JPH07294863A JP H07294863 A JPH07294863 A JP H07294863A JP 9034794 A JP9034794 A JP 9034794A JP 9034794 A JP9034794 A JP 9034794A JP H07294863 A JPH07294863 A JP H07294863A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid crystal
- panel
- grinding
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、主として直視型電気光
学装置や投影型電気光学装置に用いられる平板型光弁装
置、例えば、TN方式等の単純マトリクスパネルやTF
T方式やMIM方式等のアクティブマトリクスパネル等
の液晶電気光学装置の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat type light valve device mainly used in a direct-view type electro-optical device and a projection type electro-optical device, for example, a simple matrix panel such as a TN system or a TF.
The present invention relates to a method of manufacturing a liquid crystal electro-optical device such as an active matrix panel of T type or MIM type.
【0002】[0002]
【従来の技術】従来、直視型電気光学装置や投影型電気
光学装置は、量産のほとんどが高効率化の為に、流動基
板は多面取り基板を採用している。その為、製造過程で
は、AB両基板貼り合わせ後にはパネル分離工程が生じ
る。通常の分離は硝子研削装置を使用して罅割り分割を
するが、最近の高精細 パターンや小型パネル化した多
面取り基板を正確に寸法通り分離する事が困難になって
いる。2. Description of the Related Art Conventionally, in most of mass production of direct-view type electro-optical devices and projection type electro-optical devices, a multi-chambered substrate is adopted as a flow substrate in order to improve efficiency. Therefore, in the manufacturing process, a panel separation process occurs after the AB substrates are bonded together. Usually, a glass grinder is used to divide into slits, but it is difficult to separate the recent high-definition patterns and small-panel multi-chambered substrates accurately according to size.
【0003】そこで、半導体基板を切断する研削装置を
使用して研削分割し、正確な寸法で分離する方法が実施
されている。Therefore, a method has been implemented in which a grinding device for cutting a semiconductor substrate is used to grind and divide the semiconductor substrate to separate it with accurate dimensions.
【0004】[0004]
【発明が解決しようとする課題】多面取り基板を半導体
基板を切断する研削装置を使用して分離する方法は、研
削中に装置から噴射される潤滑水がパネル内部に浸入す
る不具合が発生する。パネル内に水分が浸入すると、後
述するパネル不良が発生してしまう。In the method of separating the multi-chambered substrate by using the grinding device for cutting the semiconductor substrate, there is a problem that the lubricating water sprayed from the device during the grinding enters the inside of the panel. If water enters the panel, a panel defect described later will occur.
【0005】(1) パネル内部に潤滑水が浸入する
と、内部を乾燥する事が難しく、乾燥出来たとしても、
潤滑水に混入した基板や研削刃の微小破片等がパネル内
部に残り、画質や液晶光学装置の寿命に著しく悪影響を
与えてしまう。 (2) パネル内部に水分が残存したまま液晶注入工程
に入ると、液晶注入装置の真空系統の装置部分が水分に
より破壊され機能しなくなる。(1) When lubricating water enters the inside of the panel, it is difficult to dry the inside, and even if it can be dried,
Substrates and minute fragments of the grinding blade mixed with the lubricating water remain inside the panel, which significantly affects the image quality and the life of the liquid crystal optical device. (2) If the liquid crystal injecting process is started while the water remains inside the panel, the device part of the vacuum system of the liquid crystal injecting device is broken by the water and does not function.
【0006】(3) パネル内部に液晶を注入して液晶
パネルを製造するが、パネル内部の残存水分に液晶が混
入する場合、液晶材料自体の特性が全く失われ、液晶電
気光学装置として作動しなくなる。 (4) パネル内部の残存水分により、内部の絶縁状態
が失われる為、少なくとも一方に設けられた画素駆動用
の電気回路構成層に於いては、パネル外部もしくは内部
の電位差によりショートが発生し易くなり、駆動回路が
破壊され、液晶電気光学装置として作動しなくなる。(3) A liquid crystal panel is manufactured by injecting liquid crystal into the inside of the panel. However, when the liquid crystal is mixed with the residual water inside the panel, the characteristics of the liquid crystal material itself are completely lost and the liquid crystal electro-optical device operates. Disappear. (4) Since the internal insulation state is lost due to the residual water inside the panel, a short circuit is likely to occur due to the potential difference inside or outside the panel in the pixel driving electric circuit constituent layer provided on at least one side. As a result, the drive circuit is destroyed and the liquid crystal electro-optical device does not operate.
【0007】パネル内に水分が侵入すると、こうした多
くの不具合が生じるため、製造工程中にパネル内に水分
が侵入することを防止しなければならない。Many kinds of problems occur when water enters the panel. Therefore, it is necessary to prevent the water from entering the panel during the manufacturing process.
【0008】[0008]
【課題を解決するための手段】上記課題を解決する為
に、本発明は、多面取りパネルを分離する際の研削方法
を、基板全厚を研削するのではなく、外部応力で分割可
能な厚みのみを残す方法とした。In order to solve the above-mentioned problems, the present invention uses a grinding method for separating a multi-chamfered panel from a thickness that can be divided by external stress instead of grinding the entire thickness of the substrate. I chose to leave only.
【0009】[0009]
【作用】上記手段の如く切断分離した液晶電気光学装置
に於いては、研削分離中に装置から噴射される潤滑水が
パネル内部に浸入する事が完全に無くなった。In the liquid crystal electro-optical device cut and separated as described above, the lubricating water sprayed from the device during grinding and separation completely disappears from the inside of the panel.
【0010】[0010]
【実施例1】図1(A)は、分離前の多面取りパネルを
上部から見た図である。A基板1は、B基板2と単個パ
ネルシール3と各単個パネル部5を内部に含む形にした
防水シール4で接着されている。6はAB両基板を組合
わせるときの合わせマークであり、7はコモン電極取出
し端子である。[Embodiment 1] FIG. 1 (A) is a view of a multi-panel, which has not been separated, viewed from above. The A substrate 1 is adhered by a B substrate 2, a single panel seal 3, and a waterproof seal 4 including each single panel portion 5 inside. Reference numeral 6 is an alignment mark when combining both AB substrates, and 7 is a common electrode extraction terminal.
【0011】A、B基板はそれぞれ0.4mmの厚さの
ガラスを使用した。こうして組合わせられたAB基板の
接合体を分離するために、半導体基板切断用の研削装置
を使用したが、A、B各基板の研削においては、0.0
5mmの残余部を残すように、0.35mmの深さの溝
ができるように設定し、研削した。その研削後の基板の
状態を示しているのが図1(B)である。As the A and B substrates, glass having a thickness of 0.4 mm was used. In order to separate the bonded assembly of the AB substrates thus combined, a grinding device for cutting a semiconductor substrate was used.
Grinding was performed so that a groove having a depth of 0.35 mm was formed so as to leave a residual portion of 5 mm. FIG. 1B shows the state of the substrate after the grinding.
【0012】図1(B)は、図1(A)のa−a’の線
で切った断面図を示している。A、B基板の横方向、縦
方向の全ての切断面を上記のように0.05mmの残余
部を残し、研削した。そして、2のAB基板接合体を薄
いゴムラバー上に置き、押圧すると、研削した部分は、
きれいに切断された。FIG. 1B is a sectional view taken along the line aa 'in FIG. 1A. All the cut surfaces in the horizontal and vertical directions of the A and B substrates were ground with the residual portion of 0.05 mm left as described above. Then, when the AB substrate bonded body of 2 is placed on a thin rubber rubber and pressed, the ground portion is
It was cut cleanly.
【0013】さらに、各単個パネル内に、研削時に噴射
される水が残っているか確認したが、全数とも単個パネ
ル内への水の侵入はなかった。以上の実施例では、防水
シール4を設けたが、防水シールなしで行っても、高い
比率で単個パネル内への水の侵入を防ぐことができた。Further, it was confirmed whether or not the water sprayed during the grinding remained in each single panel, but all the water did not enter the single panel. In the above examples, the waterproof seal 4 was provided, but even if the waterproof seal 4 was not used, it was possible to prevent water from entering the single panel at a high rate.
【0014】[0014]
【効果】以上説明した様に、本願発明の切断方法を採用
することにより、これまでパネル内への水の侵入により
生じていた様々な不良をなくすことができ、製造歩留ま
りを大幅に改善することができた。[Effect] As described above, by adopting the cutting method of the present invention, it is possible to eliminate various defects that have been caused by the intrusion of water into the panel, and to greatly improve the manufacturing yield. I was able to.
【図1】A基板とB基板の接合体を上部から見た略式図
である。FIG. 1 is a schematic view of a joined body of an A substrate and a B substrate as seen from above.
1 A基板 2 B基板 3 単個パネル用シール 4 防水シール 5 単個パネル部分 6 AB基板合わせマーク 7 コモン電極取出し端子 1 A board 2 B board 3 Single panel seal 4 Waterproof seal 5 Single panel part 6 AB board alignment mark 7 Common electrode extraction terminal
Claims (1)
の製造方法に於いて、単個パネルに分離する際に、セル
を構成する基板の外側面から基板厚みの一部を残し研削
し、外部応力によって単個パネルに分離切断することを
特徴とする液晶電気光学装置の製造方法。1. A method for manufacturing a liquid crystal electro-optical device using a multi-chamfered substrate, wherein when separating into a single panel, grinding is performed by leaving a part of the substrate thickness from the outer surface of the substrate constituting the cell, A method for manufacturing a liquid crystal electro-optical device, which comprises separating and cutting a single panel by external stress.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9034794A JPH07294863A (en) | 1994-04-27 | 1994-04-27 | Manufacture of liquid crystal electrooptic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9034794A JPH07294863A (en) | 1994-04-27 | 1994-04-27 | Manufacture of liquid crystal electrooptic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07294863A true JPH07294863A (en) | 1995-11-10 |
Family
ID=13996003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9034794A Pending JPH07294863A (en) | 1994-04-27 | 1994-04-27 | Manufacture of liquid crystal electrooptic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07294863A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008056507A (en) * | 2006-08-29 | 2008-03-13 | Seiko Epson Corp | Scribing method for stuck mother substrate and splitting method of stuck mother substrate |
-
1994
- 1994-04-27 JP JP9034794A patent/JPH07294863A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008056507A (en) * | 2006-08-29 | 2008-03-13 | Seiko Epson Corp | Scribing method for stuck mother substrate and splitting method of stuck mother substrate |
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