JPH07288395A - Part attraction method and its device - Google Patents

Abstract

PURPOSE:To provide a part attraction device for attracting an electronic part without making a tip of an attraction nozzle collide with an electronic part which is an attraction object. CONSTITUTION:A part attraction device which constitutes a part of a part mounting equipment for mounting an electronic part 9 on a circuit substrate 8 and attracts and takes out the electronic part 9 from a part supply position 8 by an attraction nozzle 1 is provided with a head part 2 having the attraction nozzle 1 which moves in a vertical direction to the part supply position 8. It also has an optical measuring means 3 provided to the head part 2 for optically measuring a distance between the attraction nozzle 1 and an upper surface of the electronic part 9 in the part supply position 8, a descending distance calculation means (not illustrated) for calculating a descending distance until just immediately before the attraction nozzle 1 comes into contact with an upper surface of an attraction object of the electronic part 9 based on the measured distance and a control part 10 for controlling the attraction nozzle 1 to descend just by the calculated descending distance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component suction method and apparatus for picking up an electronic component from a component supply position in a process of mounting the electronic component on a circuit board.

[0002]

2. Description of the Related Art A conventional example of a component suction method and a device for picking up an electronic component from a component supply position in a process of mounting the electronic component on a circuit board will be described with reference to FIG.

In FIG. 5, an electronic component 29 stored in a component storage tape wound around a component supply cassette 27.
Are supplied from the component supply cassette 27 to the component supply position 28.

In order to suck and take out the electronic component 29 from the component supply position 28, the control unit 30 controls the XY table 2.
The recognition unit 23 attached to the head unit 22 by 4X and 24Y is moved right above the component supply position 28 so that the electronic component 29 at the component supply position 28 is recognized, and the obtained image data is processed to obtain the target. The quality determination and the position recognition of the electronic component 29 that has been turned on are performed.

If the recognition result is good, the control unit 30 controls the X
-The head unit 22 is moved by the Y tables 24X and 24Y, and the suction nozzle 21 is moved based on the position recognition.
Precisely, the electronic component 29 is positioned right above the component supply position 28.

Next, the head portion 22 lowers the suction nozzle 21 by a predetermined height, and the suction nozzle 21 lightly contacts the target electronic component 29 and sucks it.

Next, the suction state is confirmed, and the head portion 22
Lifts the suction nozzle 21 to take out the electronic component 29, and mounts the electronic component 29 at a predetermined position on the circuit board 26.

[0008]

However, in the configuration of the above-mentioned conventional example, the distance between the suction nozzle 21 and the target electronic component 29 at the time of suction is determined by the standard distance between the suction nozzle 21 and the component supply position. Is subtracted from the preset thickness of the component storage tape and the thickness of the electronic component. In reality, since the thickness of the component storage tape and the thickness of the electronic component are not constant, there is a problem in that the tip of the descending suction nozzle 21 may collide with the target electronic component 29 due to these errors. There is. This problem does not lead to trouble if the impact of the collision is absorbed by the leads coming out of the electronic component 29 or the electronic component 29 has a sufficient strength, but the electronic components of the leadless used recently However, when the size is reduced and the strength becomes insufficient, there is a problem in that electronic components are broken or chipped due to the collision of the tip of the suction nozzle 21.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide a component suction method and apparatus for sucking an electronic component without causing the tip of the suction nozzle to collide with the electronic component to be sucked.

[0010]

In order to solve the above problems, the component suction method of the first invention of the present application, in the step of mounting an electronic component on a circuit board, sucks the electronic component from a component supply position by a suction nozzle. In the component suction method that takes out
An optical measuring unit for optically measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position is provided in a head unit having a suction nozzle that moves in a direction perpendicular to the component supply position. The optical measuring means measures the distance, and based on the measured distance, the suction nozzle is calculated to have a descending distance that is lowered immediately before it comes into contact with the upper surface of the electronic component to be suctioned, and the suction nozzle is calculated. The feature is that it is lowered by the descending distance.

In order to solve the above problems, the component suction device of the second invention of the present application constitutes a part of component mounting equipment for mounting an electronic component on a circuit board, and the electronic component is connected to a suction nozzle from a component supply position. In a component suction device that sucks and takes out, a head portion provided with a suction nozzle that moves in a direction perpendicular to the component supply position, and the head portion,
Optical measuring means for optically measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position, and the suction nozzle contacts the upper surface of the electronic component to be suctioned based on the measured distance. It is characterized in that it has a descending distance calculating means for calculating a descending distance down to the immediately preceding point, and a control unit for controlling so that the suction nozzle descends by the calculated descending distance.

In order to solve the above-mentioned problems, the component suction method of the third invention of the present application is a component suction method in which the electronic component is sucked and picked up from a component supply position by a suction nozzle in the step of mounting the electronic component on a circuit board. In a head part having a suction nozzle that moves in a direction perpendicular to the component supply position, an optical measuring unit that optically measures a distance between the suction nozzle and the upper surface of the electronic component at the component supply position, And a recognition unit that detects an XY coordinate position of the electronic component at the component supply position, and measures the distance by the optical measurement unit before lowering the suction nozzle toward the component supply position, On the basis of the measured distance, the suction nozzle calculates a descending distance that descends until just before the suction nozzle comes into contact with the upper surface of the electronic component to be sucked. The XY coordinate position of the product is detected, the correction amount of the XY coordinate position of the suction nozzle is calculated, the position of the suction nozzle is corrected by the calculated correction amount of the XY coordinate position, and the calculation is performed. The suction nozzle is lowered by the lowered distance.

In order to solve the above problems, the component suction device of the fourth invention of the present application constitutes a part of component mounting equipment for mounting an electronic component on a circuit board, and the electronic component is connected to a suction nozzle from a component supply position. In a component suction device that sucks and takes out, a head portion provided with a suction nozzle that moves in a direction perpendicular to the component supply position, and the head portion,
Optical measuring means for optically measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position, and the suction nozzle contacts the upper surface of the electronic component to be suctioned based on the measured distance. Descending distance calculating means for calculating the descending distance descending to immediately before, and provided in the head portion,
Recognition means for detecting the XY coordinate position of the electronic component;
Calculation means for calculating the correction amount of the XY coordinate position of the suction nozzle according to the detected XY coordinate position, and correction means for correcting the position of the suction nozzle by the correction amount of the calculated XY coordinate position. And a control unit that controls the suction nozzle to descend by the calculated descending distance.

In the component suction device of the fifth invention of the present application, in addition to the configuration of the fourth invention, the optical measuring means and the recognizing means are:
A laser beam emitted from the optical measuring means, reflected by an electronic component at the component supplying position, and returned to the optical measuring means is linearly transmitted back and forth, and reflected illumination light from the electronic component is reflected at a right angle toward the recognition means. It is characterized in that it is configured to share a half mirror arranged at a position.

[0015]

According to the first and second aspects of the present invention, there is provided an electronic component provided at a head portion having a suction nozzle that moves in a direction perpendicular to a component supply position, and the electronic component at the component supply position of the suction nozzle and the component mounting equipment. Since the optical measuring means for optically measuring the distance between the upper surfaces is provided, the distance between the suction nozzle and the upper surface of the electronic component at the component supply position can be measured.

Further, it has a descending distance calculating means for calculating a descending distance to a position immediately before the suction nozzle comes into contact with the upper surface of the electronic component to be sucked based on the measured distance, and the descending distance is calculated by the calculated descending distance. Since the suction nozzle is controlled so as to descend, the descending distance of the suction nozzle is always an appropriate descending distance.

This is because, in the conventional example, during suction, the distance between the suction nozzle and the electronic component at the component supply position is preset from the standard distance between the suction nozzle and the component supply position. The value is set to the value obtained by subtracting the thickness of the tape and the thickness of the electronic component. In reality, the thickness of the component storage tape and the thickness of the electronic component are not constant. It is possible to solve the problem that the tip of the device may collide with a target electronic component.

The third and fourth inventions of the present application relate to the first and second aspects of the present invention.
In addition to the configuration and operation of the second aspect of the invention, a recognition unit that is provided in a head unit that includes a suction nozzle that moves in a direction perpendicular to a component supply position and that detects an XY coordinate position of the electronic component, Calculation means for calculating a correction amount of the XY coordinate position of the suction nozzle based on the detected XY coordinate position;
Since it has a correction means for correcting the position of the suction nozzle according to the calculated correction amount of the X-Y coordinate position, immediately before the tip of the suction nozzle that has descended contacts the upper surface of the electronic component to be suctioned more accurately. Since it descends to, it is possible to more reliably eliminate the collision of the suction nozzle with respect to the target electronic component.

The fifth invention of the present application is the same as the fourth invention.
The optical measuring unit and the recognizing unit linearly reciprocally transmit a laser beam that is emitted from the optical measuring unit and reflected by the electronic component at the component supply position and returns to the optical measuring unit, and reflects illumination light from the electronic component. Since the half mirror arranged at a position where it reflects at a right angle toward the recognition means is shared, the required space becomes small.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of a component mounting equipment equipped with a component suction device according to an embodiment of the present invention will be described with reference to FIGS.

In FIG. 1, the electronic component 9 stored in the component storage tape wound around the component supply cassette 7 is supplied from the component supply cassette 7 to the component supply position 8.

In order to suck and take out the electronic component 9 from the component supply position 8, the control unit 10 controls the XY table 4X,
Laser measuring device 3 attached to the head part 2 by 4Y
And the recognition camera 5 are moved right above the component supply position 8.

In FIG. 2 showing the head portion 2 of the present embodiment, the head portion 2 moves in the Y direction of the XY table 4
The suction nozzle 1 is attached to the X and slides in the X direction, and the suction nozzle 1 that moves vertically is provided at the lower end thereof, and the laser measuring device 3 and the recognition camera 5 are provided on the side surface thereof.

Laser measuring instrument 3 and recognition camera 5 of this embodiment
In FIG. 2 which shows and, 11 is a half mirror and 12 is an illuminating means. The laser measuring instrument 3 reciprocally transmits the laser beam output by itself through the half mirror 11, and measures the distance between the laser measuring instrument 3 and the electronic component 9. Recognition camera 5
Reflects the light beam from the illumination means reflected from the electronic component by the half mirror 11 and recognizes the quality and position of the electronic component 9.

If the recognition result recognized by the recognition camera 5 as described above is good, the control unit 10 moves the head unit 2 by the XY tables 4X and 4Y, and based on the position recognition, The suction nozzle 1 is accurately positioned right above the electronic component 9 at the component supply position 8. In parallel with this, the control unit 10 determines the tip of the suction nozzle 1 based on the distance between the laser measuring instrument 3 and the electronic component 9 measured by the laser measuring instrument 3 as described above, and adjusts the component supply position. The descending distance to stop the electronic component 9 located immediately above the upper surface of the electronic component 9 is calculated.

Then, the controller 10 lowers the tip of the suction nozzle 1 by the descending distance calculated as described above.

By the above-mentioned lowering of the tip of the suction nozzle 1, the tip of the suction nozzle 1 stops immediately above the electronic component 9 of the object.

Next, the suction nozzle 1 picks up the electronic component and ascends to take out the electronic component 9, and mounts the electronic component 9 at a predetermined position on the circuit board 6.

The operation of this embodiment will be described with reference to the flow chart of FIG. 4 and FIGS.

In the electronic component supply process of step # 1, the electronic components 9 stored in the component storage tape 13
Are supplied from the component supply cassette 7 to the component supply position 8.

In the positioning process of step # 2, the head unit 2 moves the laser measuring device 3 and the recognition camera 5 right above the component supply position 8.

In the pass / fail / position / height recognition step of step # 3, the illuminating means 12 illuminates the electronic component 9 located at the component supply position 8 and the light beam reflected from the electronic component 9 located at the component supply position 8 is halved. The recognition camera 5 recognizes the quality of the electronic component 9 and the position of the electronic component 9 by the reflected light reflected by the mirror 11.

The laser measuring instrument 3 transmits the laser beam output by itself through the half mirror 11 to reach the electronic component 9 at the component supplying position 8 and reflects it from the electronic component 9 at the component supplying position 8. Half mirror 11 for laser beam
Through the laser beam that has been transmitted,
The distance between the laser measuring device 3 and the electronic component 9 is measured.

In the determination step of step # 4, it is determined whether or not there is a defective outer shape of the electronic component 9 at the component supply position 8. If the outer shape is defective, the process proceeds to step # 5. Proceed to.

In the discarding process of step # 5, the defective electronic component is sucked by the suction nozzle 1 and discarded.

In the correction step of step # 6, the laser measuring instrument 3 measured by the laser measuring instrument 3 in the step # 3.
Of the suction nozzle 1 provided on the head portion 2 is calculated based on the distance between the electronic component 9 and the electronic component 9, and the head portion 2 is determined based on the position of the electronic component 9 recognized by the recognition camera 5 in step # 3. The X-Y coordinate position of the provided suction nozzle 1 is corrected.

In the suction process of step # 7, the tip of the suction nozzle 1 descends the above-mentioned descending distance and stops at a position immediately above which does not contact the electronic component 9 at the component supply position 8,
The target electronic component 9 is adsorbed and taken out.

In the mounting step of step # 8, the suction nozzle 1 mounts the sucked electronic component 9 on the circuit board 6.

[0039]

The first and second inventions of the present application have the optical measuring means for measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position, so that the suction nozzle is at the component supply position. Before descending toward the component, it is possible to measure the actual distance between the suction nozzle and the upper surface of the electronic component at the component supply position, and based on this measured distance, the suction nozzle causes the electronic component to be suctioned. Since the descending distance that descends to just before contacting the upper surface of the suction nozzle is calculated and the suction nozzle is lowered by the calculated descending distance, the descending distance of the suction nozzle is always an appropriate descending distance, and the suction nozzle that has descended. It is possible to solve the problem that the tip of the electronic component collides with the target electronic component and the electronic component is cracked or chipped.

The third and fourth inventions of the present application correspond to the first and second inventions of the present application.
In addition to the effect of the second aspect of the invention, the XY coordinate position of the suction nozzle for the electronic component to be sucked is corrected, so that it is possible to more reliably eliminate the collision of the suction nozzle with respect to the target electronic component.

In addition to the above effects, the fifth invention of the present application
The optical measuring unit and the recognizing unit linearly reciprocally transmit a laser beam that is emitted from the optical measuring unit and reflected by the electronic component at the component supply position and returns to the optical measuring unit, and reflects illumination light from the electronic component. Since the half mirror arranged at a position that reflects at a right angle toward the recognition means is shared, there is an effect that the required space becomes small.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of component mounting equipment using a component suction device based on the method of the present invention.

FIG. 2 is a side view showing a main part of an example of a component suction device based on the method of the present invention.

FIG. 3 is a side view showing a main part of an example of a component suction device based on the method of the present invention.

FIG. 4 is a flowchart showing the operation of the component suction device based on the method of the present invention.

FIG. 5 is a perspective view of a component mounting facility using a conventional component suction device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adsorption nozzle 2 Head part 3 Laser measuring device 4X, 4Y XY table 5 Recognition camera 6 Circuit board 7 Component supply cassette 8 Component supply position 9 Electronic component 10 Control part 11 Half mirror 12 Illumination means

Front page continued (72) Inventor Kunio Sakurai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. In a component suction method for sucking and picking up an electronic component from a component supply position by a suction nozzle in the step of mounting an electronic component on a circuit board, a suction nozzle that moves in a direction perpendicular to the component supply position is used. With the head part,
An optical measuring unit for optically measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position is provided, the distance is measured by the optical measuring unit, and the suction is performed based on the measured distance. A component suction method comprising: calculating a descending distance down to just before the nozzle comes into contact with an upper surface of an electronic component to be sucked, and lowering the sucking nozzle by the calculated descending distance. 2. A component suction device which constitutes a part of component mounting equipment for mounting an electronic component on a circuit board, and which picks up the electronic component by suction from a component supply position with a suction nozzle, and is perpendicular to the component supply position. A head unit having a suction nozzle that moves in a direction, and an optical measurement unit that is provided in the head unit and that optically measures a distance between the suction nozzle and the upper surface of the electronic component at the component supply position. And a descending distance calculating means for calculating a descending distance down to just before the suction nozzle comes into contact with the upper surface of the electronic component to be sucked based on the distance, and control so that the suction nozzle descends by the calculated descending distance. And a control unit for controlling the component suction device. 3. A component suction method for sucking and picking up an electronic component from a component supply position by a suction nozzle in the step of mounting an electronic component on a circuit board, wherein a suction nozzle that moves in a direction perpendicular to the component supply position is used. With the head part,
Optical measuring means for optically measuring the distance between the suction nozzle and the upper surface of the electronic component at the component supply position and recognition means for detecting the XY coordinate position of the electronic component at the component supply position are provided. Before the suction nozzle is lowered toward the component supply position, the distance is measured by the optical measuring means, and immediately before the suction nozzle comes into contact with the upper surface of the electronic component to be suctioned based on the measured distance. The XY coordinate position of the suction nozzle is calculated by detecting the XY coordinate position of the electronic component by the recognizing means, the correction amount of the XY coordinate position of the suction nozzle is calculated, and the calculated XY coordinate position is calculated. The position of the suction nozzle is corrected according to the correction amount, and the suction nozzle is moved down by the calculated lowering distance. 4. A component suction device which constitutes a part of component mounting equipment for mounting an electronic component on a circuit board, and which picks up the electronic component from a component supply position by suction by a suction nozzle, and is perpendicular to the component supply position. A head unit having a suction nozzle that moves in a direction, and an optical measurement unit that is provided in the head unit and that optically measures a distance between the suction nozzle and the upper surface of the electronic component at the component supply position. Descending distance calculating means for calculating the descending distance down to just before the suction nozzle comes into contact with the upper surface of the electronic component to be sucked based on the distance, and the XY coordinates of the electronic component provided in the head portion. Recognition means for detecting the position and XY of the suction nozzle according to the detected XY coordinate position.
Calculation means for calculating the correction amount of the coordinate position, correction means for correcting the position of the suction nozzle by the calculated correction amount of the XY coordinate position, and the suction nozzle descending by the calculated descending distance. A component suction device having a control unit for controlling. 5. The optical measuring means and the recognizing means linearly reciprocally transmit a laser beam emitted from the optical measuring means, reflected by an electronic component at a component supplying position and returning to the optical measuring means.
The component suction device according to claim 4, wherein a half mirror arranged in a position that reflects reflected illumination light from the electronic component at a right angle toward the recognition unit is used.