JPH07281620A - Display device - Google Patents

Abstract

PURPOSE:To provide a display device which is capable of maintaining display quality in spite of use in a high-temp. environment, substantially prevents leaking of a light transmissive resin outside and does not require a large substrate. CONSTITUTION:This display device has a substrate 1 which is formed with a through-hole 4, an optical semiconductor element 5 which is placed on the surface of this substrate 1, a reflection frame 6 which has reflection window 7 enclosing this optical semiconductor element 5 and communicating with the through-hole and is disposed on the front surface of the substrate 1, a wall part 12 which exists around the through-hole 4 and is disposed on the rear surface of the substrate 1 and the light transmissive resin 13 which is disposed in the region enclosed by the reflection window 7 and the region enclosed by the through-hole 4 and the wall part 12 so as to cover the optical semiconductor element 5. The display device is sealed by the reflection frame 6 so as to fill the spacing between the reflection frame 6 and the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device in which a translucent resin is prevented from leaking to the outside.

[0002]

2. Description of the Related Art Conventionally, a display device using a light emitting diode is disclosed in, for example, Japanese Patent Publication No. 62-13668, which will be described with reference to FIG. FIG. 11A is a side sectional view of the display device, and FIG. 11B is a front view thereof.
In these figures, the lead frame 72,
73, 74, 75, 76, 77 are provided, and the light emitting diodes 78, 79 are placed and wired on the lead frame 76. Then, a reflective frame 82 having reflective windows 80 and 81 surrounding the light emitting diodes 78 and 79 is disposed on each lead frame, and a colored light diffusion film 83 is disposed on the reflective frame 82 to form a display device. There is. Then, on the back surface of the large substrate 84, the lead frames 72, 7 of the display device are formed.
3, 74, 75, 77 are soldered to form a plurality of terminals 85
(Only one is shown in the figure) and each lead frame are electrically connected.

[0003]

As described above, in the above-described display device, the colored light diffusing film 83 is formed on the hollow reflecting windows 80 and 81.
Therefore, when the display device is used in a high temperature atmosphere of 100 ° C., the colored light diffusion film 83 contracts. Therefore, there is a first defect that the light from the light emitting diodes 78 and 79 becomes distorted and the display quality is deteriorated. In order to solve this, the present inventor has tried to fill a region surrounded by the reflection windows 80 and 81 with a certain amount of light-transmissive resin. However, there is a second drawback in that the amount of the translucent resin after curing largely varies and the amount of light emission varies. When the present inventors have clarified the cause, gaps 86, 87, 88, 89, 90 are formed between the lower surface of the reflection frame 82 and the substrate 71, and the light-transmitting resin before curing leaks from the gaps, and This is because the leak amount varies in each gap. When the leak amount is large, the translucent resin is used as the light emitting diodes 78 and 79.
There is a drawback that it does not cover well.

Further, usually, in order to mount a plurality of display devices, each lead frame is connected to the large substrate 84 and the terminals 85 are provided. As described above, the large substrate 84 is required, and the cost increases. There are drawbacks. Therefore, in consideration of such conventional drawbacks, the present invention provides a display device capable of maintaining display quality even when used in a high temperature atmosphere, preventing the translucent resin from leaking to the outside, and requiring no large substrate. To do.

[0005]

In order to solve the above problems, the present invention provides a substrate having a through hole, an optical semiconductor element mounted on the surface of the substrate, and a through hole surrounding the optical semiconductor element. A reflection frame having a reflection window communicating with the front surface of the substrate, a wall portion provided on the back surface of the substrate around the through hole, and a reflection window so as to cover the optical semiconductor element. And a transparent resin provided in a region surrounded by the through hole and the wall portion, and sealed with a reflective frame so as to fill the gap between the reflective frame and the substrate, or a sealing tool. It is provided.

More preferably, the present invention further comprises forming a conductive layer having a predetermined shape on the surface of the substrate, mounting the light emitting diode on the conductive layer, electrically connecting to the conductive layer and separating the conductive layer from the substrate. The terminal part is provided in the.

[0007]

As described above, according to the present invention, the translucent resin can be prevented from leaking because the reflective frame is used to seal or seal the reflective frame so as to fill the gap between the reflective frame and the substrate. Then, since the translucent resin is provided in the area surrounded by the wall portion on the back surface of the substrate, this serves as a resin pool, and the resin also spreads to the area surrounded by the reflection window communicating with this area. It can be fully covered with resin. Further, since the optical semiconductor element is covered with the translucent resin, it is not necessary to use a colored light diffusion film on the hollow, so that the display quality can be maintained even in a high temperature atmosphere.

More preferably, the present invention provides a terminal portion on the substrate which is electrically connected to the conductive layer on the substrate and is separated from the conductive layer, and the terminal portion is connected to an external power source. Is unnecessary.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. FIG. 1A is a plan view of a display device according to this embodiment,
1 (b) is a front view thereof, and FIG. 1 (c) is a detailed sectional view of a portion A of FIG. 1 (b). In these figures, the substrate 1 has a thickness of 0.5 to 2 mm and is made of glass epoxy resin or the like. The conductive layers 2 and 3 are formed on the surface of the substrate 1 in a predetermined shape and are made of copper foil or the like. For example, the conductive layer 2 is a common electrode composed of one vertical line and two horizontal lines intersecting with the vertical line when viewed from a plane, and a plurality of conductive layers 3 are formed so as to be located apart from the conductive layer 2 and in the vicinity thereof. It was done. The through hole 4 is formed in the substrate 1 near the conductive layer 2.

The optical semiconductor element 5 is placed and fixed on the conductive layer 2 via a conductive adhesive (not shown). The optical semiconductor element 5 is, for example, a light emitting diode made of gallium phosphide, is a substantially cubic body with one side of approximately 0.3 mm, and emits red light. Thus, for example, 7 per group
A number of optical semiconductor elements 5 are arranged. Optical semiconductor element 5
Are wired to the conductive layer 3 by thin metal wires.

The reflective frame 6 is disposed on the conductive layers 2 and 3 of the substrate 1 and has a reflective window 7 formed thereon, and is made of, for example, ABS resin, polyvinyl terephthalate or epoxy resin, and its surface is painted black or gray. It has been rubbed. Each reflective window 7
Is in a position communicating with the through hole 4 and surrounding the optical semiconductor element 5, and is formed so that the opening area increases as it goes upward. When the reflection windows 7 are seen from a plane, 7 pieces are used for each group and arranged in the shape of a letter.
Individually formed.

The reflecting frame 6 is formed with step portions 8 and 9 so that the upper area is wide and the lower area is narrow, and a protrusion 10 is formed on the lower portion. The protrusion 10 is inserted into the substrate 1 and its tip end portion is inserted. 11 is fixed to the substrate 1 by heat welding.

The wall portion 12 is located around the through hole 4,
It is provided on the back surface of the substrate 1 and is made of, for example, a sheet with an adhesive, and is fixed to the back surface of the substrate 1 by the adhesive. When the wall portion 12 is viewed from the back side, it is formed in a frame shape, for example.

The transparent resin 13 is formed so as to cover the optical semiconductor element 5 so as to fill the region surrounded by the reflection window 6 and the region surrounded by the through hole 4 and the wall portion 12. Translucent resin 13
Is made of, for example, epoxy resin, polyethylene, acrylic resin or the like, and is mixed with a light scattering agent or a coloring agent as required.

The sealing member 14 is provided on the stepped portion 9 of the reflection frame 6 and is made of, for example, a heat shrink tube. That is, the sealing tool 14 is attached to the four sides of the step portion 9 and fixed to the step portion 9 by applying heat with a soldering iron or the like. Since the tip of the sealing tool 14 is elastic, the gap 15 between the reflection frame 6 and the substrate 1 is sealed by the tip of the sealing tool 14.

Desirably, a reflective frame 6 is formed on the surface of the substrate 1.
The terminal 16 is provided in a portion where is not provided. Each terminal 16 is electrically connected to the conductive layers 2 and 3, is provided on the surface of the substrate 1 apart from the conductive layers 2 and 3, and is connected to an external power supply to each optical semiconductor element 5. . The terminal 15 may be soldered to a power supply line, or may have a connector structure so as to be connected to an external power supply. The display device 17 of this embodiment is configured by these components.

Next, the manufacturing of the display device 17 will be described with reference to the manufacturing process chart of FIG. First, as shown in FIG. 2A, the optical semiconductor element 5 is placed on the conductive layer 2 of the substrate 1 and wiring is performed. Then, the wall portion 12 is fixed to the substrate 1 to complete the substrate set 18.

Then, as shown in FIG. 2B, the reflection frame 6 is arranged so that the projections 10 face upward, and the sheet 1 is placed on the lower surface thereof.
Paste 9. The sealing tool 14 is fixed to the step portions 8 and 9 of the reflection frame 6. Then, the light-transmissive resin 20 is filled in the region surrounded by the sealing tool 14 so as to be slightly deeper than the depth of the reflection window 7, and degassed.

Next, as shown in FIG. 2C, the projection 10 of the reflection frame 6 is inserted into the hole of the substrate 1, and the tip portion 11 is heat-welded,
The substrate set 18 is fixed on the reflection frame 6. After that, in the region surrounded by the wall portion 12 of the substrate set 18, the transparent resin 2
1 is further filled. By doing so, the region surrounded by the wall portion 12 becomes a resin reservoir, and the resin also spreads to the region surrounded by the reflection window 7 communicating with this region, so that the optical semiconductor element 5 is sufficiently translucent. It can be covered with resin 21.

After that, the translucent resin 21 is cured and the sheet 19 is removed, whereby the display device 17 is obtained. As described above, the sealing tool 14 is formed so as to fill the gap between the reflective frame 6 and the substrate 1.
By providing the above, the resin leakage does not occur when the translucent resin 21 is filled. Therefore, the amount of the translucent resin 13 covering the optical semiconductor element 5 can be maintained substantially constant, and variations in the optical characteristics of the optical semiconductor element 5 (light emission amount in the case of a light emitting diode) are reduced. In addition, in this manufacturing process,
The steps described according to (b) are performed first and then FIG.
The process described according to (a) may be performed.

Although this display device 17 displays characters and figures, it can also be used as a flat light source used in a liquid crystal display device or the like, which will be described as a second embodiment of the present invention with reference to FIG. FIG. 3A is a plan view of the display device according to the present embodiment, and FIG. 3B is a cross-sectional view of the main part thereof. In these figures, the optical semiconductor element 5, that is, the light emitting diode, is mounted on the conductive layer 23 of the substrate 22 in an aligned manner and wired. Unlike the first embodiment, the reflecting frame 24 does not have a partition wall for each optical semiconductor element 5, and is formed so as to integrally surround the all-optical semiconductor element 5. Since there is no partition wall in this manner, a substantially uniform brightness can be obtained over the entire surface of this display device.

Next, an integrated structure of the reflecting frames 6 and 24 of the first and second embodiments and the sealing member 14 will be described as a third embodiment of the present invention with reference to FIG. FIG. 4A is a plan view of the display device according to this embodiment, and FIG. 4B is a cross-sectional view of the main part thereof. In these drawings, the reflection frame 25 is made of, for example, a sheet with an adhesive material, and the adhesive portion is fixed on the substrate 26. By configuring the reflection frame 25 in this manner, the reflection frame 25 also plays a role of sealing so as to fill the gap between the reflection frame 25 and the substrate 26.

Next, a device using the present invention for a dot matrix display will be described as a fourth embodiment of the present invention with reference to FIG. FIG. 5A is a plan view of the display device according to the present embodiment,
FIG. 5 (b) is a sectional view thereof, and FIG. 5 (c) is a drawing showing its manufacture. In these figures, when the reflection frame 27 is seen from a plane, the reflection windows 2 are arranged in a matrix of 5 horizontal × 7 vertical.
8 is formed.

The sealing member 29 is fixed to the outer surface of the reflecting frame 27, and the sealing member 30 is fixed to the lower surface of the reflecting frame 27.
The sealing tool 30 may be made of the same material as the translucent resin 31 that covers the optical semiconductor element 5. Such a sealing member 29,
Since the gap between the reflection frame 27 and the substrate 32 is filled with 30, the translucent resin 31 hardly leaks to the outside.

The optical semiconductor element 5 provided on the substrate 32
The lead 3 so that it is electrically connected to the conductive portion on which is mounted and the terminals electrically connected to the conductive portion (neither is shown).
3, 34 are provided. As described above, in the present invention, a lead that is connected to an external power source may be provided if necessary.

Next, a linear light source according to the present invention will be described as a fifth embodiment of the present invention with reference to the sectional view of FIG.
In this figure, an optical semiconductor device such as a light emitting diode 5
Are placed in a straight line on the surface of the substrate 35 at a pitch of 10 mm, for example, and emit light linearly. The reflection frame 36 is fixed on the substrate 35 via a sealing member 37 made of an adhesive or the like, and a cylindrical lens 38 is provided above the reflection frame 36.

A wall portion 39 is provided on the back surface of the substrate 35, and the reflection window 40 and the cylindrical lens 3 are provided so as to cover the optical semiconductor element 5.
A transparent resin 41 is provided in a region surrounded by the lower surface of 8 and a region surrounded by the through hole 4 and the wall portion 39.

Next, the one using the present invention for a collective lamp is
A sixth embodiment of the present invention will be described with reference to the sectional view of FIG. In FIG. 7A, the optical semiconductor element, for example, the light emitting diode 5 is mounted on the surface of the substrate 42, for example, concentrically. The reflection frame 43 is fixed on the substrate 42 via a sealing member 44 made of an adhesive or the like, and a convex portion 45 is formed concentrically above each optical semiconductor element 5. Next in FIG.
In (b), a driving integrated circuit element 46 for supplying a predetermined voltage to each optical semiconductor element 5 is provided on the back surface of the substrate 42. By providing the integrated circuit element 46 in this way, it is possible to use a thin wiring excluding the power supply line and the ground line to the element 46, and therefore the wiring layout becomes easy.

Next, a light receiving module using the present invention will be described as a seventh embodiment of the present invention with reference to FIG. FIG. 8A is a front view of the display device according to the present embodiment, and FIG.
(B) is a side sectional view thereof. In these figures,
An optical semiconductor element 48 is mounted on the surface of the substrate 47. The optical semiconductor element 48 is a light receiving element composed of, for example, a PIN photodiode or a photodiode, and receives infrared light sent from outside the device and having an electric signal modulated.

The integrated circuit element 49 is mounted on the surface of the substrate 47 separated from the optical semiconductor element 48 and wired to the optical semiconductor element 48 to amplify and detect infrared light and output an electric signal. It is a thing. The reflection frame 50 is fixed on the surface of the substrate 47 via a sealing member 51, a convex portion 52 is formed above the optical semiconductor element 48, and is configured to collect infrared light from the outside. .

Next, a further improved version of this light receiving module will be described as an eighth embodiment of the present invention with reference to the sectional view of FIG. A conductive sheet 53 is provided on the inner surface of the reflection frame 50, is electrically connected to the leads 54, and is connected to the ground potential. The conductive sheet 53 is selected from materials that transmit infrared light. The conductive sheet 53 electromagnetically shields the light receiving module against electromagnetic waves other than infrared light including signals, so that it becomes difficult to pick up external noise.

Finally, a photo interrupter according to the present invention will be described as a ninth embodiment of the present invention with reference to FIG. FIG. 10A is a side view of the display device according to this embodiment, and FIG. 10B is a sectional view showing its manufacture. In these figures, the optical semiconductor element 5 is a light emitting diode or a laser element, and is mounted on the surface of the substrate 55.

The reflecting frame 56 is provided on the substrate 55 via the sealing member 57.
Is fixed to the front surface of the substrate 55, and the wall portion 58 is provided on the back surface of the substrate 55. A transparent resin 60 is provided in a region surrounded by the reflection window 59, a region surrounded by the through hole 4, and the wall portion 58. The sheet 61 is used to hold the convex portion 62 of the reflection frame 56.

Next, a light receiving element is used as an optical semiconductor element,
Others are manufactured with the same structure as described above, and a photointerrupter is composed of a pair of these members facing each other.

Although the optical semiconductor element 5 and the like are molded with the transparent resin 13 and the like in the above description, the optical semiconductor element may be covered with the silicone resin and the periphery thereof may be covered with the transparent resin.
Further, in a display device that does not require a large amount of resin, the wall portion on the back surface of the substrate may not be necessary.

[0036]

As described above, according to the present invention, the translucent resin can be prevented from leaking, because the translucent resin is sealed or provided with a sealing member so as to fill the gap between the reflective frame and the substrate. And
Since the translucent resin is provided in the area surrounded by the wall portion on the back surface of the substrate, this serves as a resin reservoir, and the resin also spreads to the area surrounded by the reflection window communicating with this area, so that the optical semiconductor element is sufficiently Can be covered with resin.

Further, since the optical semiconductor element is covered with the translucent resin, it is not necessary to use a colored light diffusing film on the hollow, so that the display quality can be maintained even in a high temperature atmosphere.

More preferably, the present invention provides a terminal portion on the substrate which is electrically connected to the conductive layer on the substrate and is separated from the conductive layer, and the terminal portion is connected to an external power source. Is unnecessary and the cost is reduced.

[Brief description of drawings]

1 (a) is a plan view of a display device according to a first embodiment of the present invention, FIG. 1 (b) is a front view thereof, and FIG. 1 (c) is a portion A of FIG. 1 (b). FIG.

FIG. 2 is a view showing a manufacturing process of the display device according to the first exemplary embodiment of the present invention.

FIG. 3 (a) is a plan view of a display device according to a second embodiment of the present invention, and FIG. 3 (b) is a cross-sectional view of a main part thereof.

FIG. 4 (a) is a plan view of a display device according to a third embodiment of the present invention, and FIG. 4 (b) is a cross-sectional view of an essential part thereof.

5 (a) is a plan view of a display device according to a fourth embodiment of the present invention, FIG. 5 (b) is a cross-sectional view thereof, and FIG. 5 (c) is a drawing showing its manufacture. .

FIG. 6 is a sectional view of a display device according to a fifth exemplary embodiment of the present invention.

FIG. 7A is a sectional view of a display device according to a sixth embodiment of the present invention, and FIG. 7B is a sectional view of the display device provided with an integrated circuit element.

8 (a) is a front view of a display device according to a seventh embodiment of the present invention, and FIG. 8 (b) is a sectional view thereof.

FIG. 9 is a sectional view of a display device according to an eighth embodiment of the present invention.

FIG. 10 (a) is a side view of a display device according to a ninth embodiment of the present invention, and FIG. 10 (b) is a drawing showing its manufacture.

11 (a) is a sectional view of a conventional display device, and FIG. 11 (b) is a front view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2, 3 Conductive layer 4 Through hole 5 Optical semiconductor element 6 Reflective frame 7 Reflective window 12 Wall part 13 Translucent resin 14 Sealing tool 16 Terminal

Claims (2)

[Claims] 1. A substrate surface having a through hole, an optical semiconductor element mounted on the surface of the substrate, a reflection window surrounding the optical semiconductor element and communicating with the through hole, and the surface of the substrate. A reflection frame, a wall portion provided on the back surface of the substrate located around the through hole, a region surrounded by the reflection window so as to cover the optical semiconductor element, and the through hole. A transparent resin provided in a region surrounded by the wall portion, and sealed by the reflection frame or a sealing tool is provided so as to fill a gap between the reflection frame and the substrate. A display device featuring things. 2. A conductive layer having a predetermined shape is formed on a surface of the substrate, the light emitting diode is mounted on the conductive layer, electrically connected to the conductive layer, and separated from the conductive layer. The display device according to claim 1, wherein a terminal portion is provided on the display device.