JPH07176791A - Light emitting display - Google Patents

Light emitting display

Info

Publication number
JPH07176791A
JPH07176791A JP5318090A JP31809093A JPH07176791A JP H07176791 A JPH07176791 A JP H07176791A JP 5318090 A JP5318090 A JP 5318090A JP 31809093 A JP31809093 A JP 31809093A JP H07176791 A JPH07176791 A JP H07176791A
Authority
JP
Japan
Prior art keywords
light emitting
emitting display
display device
light
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5318090A
Other languages
Japanese (ja)
Inventor
Eiji Osawa
英治 大澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP5318090A priority Critical patent/JPH07176791A/en
Publication of JPH07176791A publication Critical patent/JPH07176791A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To efficiently project light in opposite directions by bonding light emitting diode elements to selected surfaces on both sides of split frames, clamped by a reflection case having an opening on both sides. CONSTITUTION:A white resin reflection case 2 has an opening penetrating through it. Split frames 31, 33 having surfaces opposed to each other are placed between the front and rear of the reflection case 2, and clamped by the case 2. Light emitting diodes 5, 5' are bonded to selected surfaces on both sides of the frames 31, 33 using Ag paste or the like. External leads 41, 43, coupled with the frames 31, 33, respectively, are connected to power supply and supplied with driving voltage. The light emitting diodes 5, 5' are thereby driven. This efficiently projects light in opposite directions perpendicular to the frames 31, 33.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、発光表示装置に関し、
特に両面発光が可能な発光表示装置に関するBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting display device,
Particularly, it relates to a light emitting display device capable of emitting light from both sides.

【０００２】。[0002].

【従来の技術】従来の発光表示装置として図３に示す構
成のものが知られている。図３（ａ）に示す発光表示装
置２１は、樹脂製の反射ケース２２と、前記反射ケース
２２の底面に設けられたフレーム２３と、前記フレーム
２３に一体に連結された外部リード２４と、前記フレー
ム２３にボンディングされた発光ダイオード素子２５
と、前記発光ダイオード素子２５の上面電極とフレーム
２３を電気的に接続するボンディングワイヤ２６と、前
記発光ダイオード素子２５を保護するために反射ケース
２２内に充填された透光性の樹脂２７とから構成されて
いる。2. Description of the Related Art A conventional light emitting display device having a structure shown in FIG. 3 is known. The light-emitting display device 21 shown in FIG. 3A includes a reflective case 22 made of resin, a frame 23 provided on the bottom surface of the reflective case 22, external leads 24 integrally connected to the frame 23, and Light emitting diode element 25 bonded to frame 23
A bonding wire 26 for electrically connecting the upper surface electrode of the light emitting diode element 25 and the frame 23, and a translucent resin 27 filled in the reflection case 22 to protect the light emitting diode element 25. It is configured.

【０００３】この発光表示装置２１の外部リード２４間
に電源等を接続し、駆動電圧を印加して発光ダイオード
素子２５を発光させると、内部の光が反射ケース２１で
反射され、光を効率よく外部に取り出すことができる。When a power source or the like is connected between the external leads 24 of the light emitting display device 21 and a drive voltage is applied to cause the light emitting diode element 25 to emit light, the internal light is reflected by the reflection case 21 and the light is efficiently emitted. Can be taken out.

【０００４】[0004]

【発明が解決しようとする課題】しかし、上記の発光表
示装置２１では、図３（ｂ）に示すように発光方向と相
対する面が反射ケース２２で遮光されているため、プリ
ント基板に取り付けた場合、その発光方向が該反射ケー
ス２２の一側方向に限定されてしまい、例えば反対側方
向に効率よく光を放射させるには、少なくとも２個以上
の発光表示装置が必要であった。However, in the light emitting display device 21 described above, since the surface facing the light emitting direction is shielded by the reflection case 22 as shown in FIG. 3B, it is mounted on the printed circuit board. In this case, the light emitting direction is limited to one side direction of the reflection case 22, and for example, at least two light emitting display devices are required to efficiently emit light in the opposite direction.

【０００５】特に、表示機器等のバックライトとして使
用する場合、図４に示すようにハウジング２８内の導光
板２９の両端面に発光面が対向するように発光表示装置
２１を２つ以上を配置しなければならず、部品点数が増
加しコストアップという問題を招いていた。本発明はか
かる問題点に鑑みたもので、一つの発光表示装置で両面
発光が可能な発光表示装置を得ることを目的としてい
る。In particular, when it is used as a backlight of a display device or the like, as shown in FIG. 4, two or more light emitting display devices 21 are arranged so that the light emitting surfaces of the light guide plates 29 in the housing 28 face each other. Therefore, the number of parts is increased and the cost is increased. The present invention has been made in view of the above problems, and an object of the present invention is to obtain a light emitting display device capable of dual-sided light emission with a single light emitting display device.

【０００６】[0006]

【課題を解決するための手段】本発明は、上記の目的を
達成するために次のような構成をとる。すなわち、本発
明の発光表示装置は、両面に開口した反射ケースと、前
記反射ケースに挟持され外部リードを有する導電材から
成る分割状のフレームと、前記フレームの選択された両
面にボンディングされた発光ダイオード素子と、前記発
光ダイオード素子の接続電極と対応するフレームとをそ
れぞれ電気的に接続するボンディングワイヤと、前記反
射ケースの開口に充填された透光性の樹脂とを備えたこ
とを特徴とするものである。The present invention has the following constitution in order to achieve the above object. That is, the light emitting display device of the present invention includes a reflective case having openings on both sides, a divided frame made of a conductive material sandwiched by the reflective case and having external leads, and a light emitting device bonded to both selected sides of the frame. A diode element, a bonding wire for electrically connecting the connection electrode of the light emitting diode element and a corresponding frame, respectively, and a translucent resin filled in the opening of the reflection case. It is a thing.

【０００７】[0007]

【作用】本発明の発光表示装置によれば、両面に開口し
た反射ケースに挟持された分割状のフレームの選択され
た両面に発光ダイオード素子がボンディングされている
ので、プリント基板に取り付けて駆動電圧を印加した場
合、相対する方向に効率よく光を放射させることができ
る。According to the light emitting display device of the present invention, since the light emitting diode elements are bonded to the selected both sides of the divided frame sandwiched between the reflection cases having the openings on both sides, the light emitting diode element is mounted on the printed circuit board to drive the drive voltage. When is applied, light can be efficiently emitted in opposite directions.

【０００８】[0008]

【実施例】以下、本発明の実施例を図面によって説明す
る。図１（ａ）は本発明による発光表示装置の一実施例
を示す平面図、図１（ｂ）は図１（ａ）のＡ−Ａ線に沿
う断面図である。図１（ａ）に示すように、１は本発明
の発光表示装置である。２は表裏面が貫通状に開口した
白色の樹脂の反射ケースで、ガラス成分を含有する反射
率の高いＰＢＴ樹脂等で形成されたものである。３（３
1，３2，３3） は前記反射ケース２の表裏面間に挟持さ
れた導電材、例えば銅，鉄・ニッケル合金，または鉄・
ニッケル・コバルト合金等よりなる分割状のフレームで
あり、該フレームはそれぞれ対向面を有している。Embodiments of the present invention will be described below with reference to the drawings. 1A is a plan view showing an embodiment of a light emitting display device according to the present invention, and FIG. 1B is a sectional view taken along the line AA of FIG. 1A. As shown in FIG. 1A, reference numeral 1 is a light emitting display device of the present invention. Reference numeral 2 denotes a white resin reflection case having front and back surfaces opened in a penetrating manner, which is formed of a PBT resin or the like containing a glass component and having a high reflectance. 3 (3
1 , 3, 2 and 3 3 ) are conductive materials sandwiched between the front and back surfaces of the reflection case 2, such as copper, iron-nickel alloy, or iron-
The frame is a divided frame made of nickel-cobalt alloy or the like, and each frame has a facing surface.

【０００９】４（４1，４2）は前記フレーム３1，３3に
それぞれに連結された外部リードで、反射ケース２から
外部へ導出されている。この外部リード４は図示しない
電源を接続して駆動電圧を供給するためのものである。
５，５’は分割状のフレーム３の選択された両面にＡｇ
ペースト等を介してボンディングされた発光ダイオード
素子で、本実施例では３2，３3面にボンディングされて
いる。Reference numerals 4 (4 1 , 4 2 ) are external leads connected to the frames 3 1 , 3 3 , respectively, and are led out from the reflection case 2 to the outside. The external lead 4 is for connecting a power source (not shown) to supply a drive voltage.
5, 5'are Ag on both sides of the selected frame 3
This is a light emitting diode element bonded through a paste or the like, and in this embodiment, it is bonded to the 3 2 and 3 3 surfaces.

【００１０】前記発光ダイオード素子５，５’の接続電
極と隣接するフレームの対応する面がそれぞれボンディ
ングワイヤ６によって電気的に接続される。７はフレー
ム３ 1，３2，３3 、ボンディングワイヤ６並びに発光ダ
イオード素子５，５’を固定保護するために反射ケース
２内に充填された透光性の樹脂で、例えばエポキシ樹脂
やシリコン樹脂等が使用される。A connection voltage for the light emitting diode elements 5 and 5 '.
The corresponding faces of the frames adjacent to the poles are bondy
It is electrically connected by the connecting wire 6. 7 is flare
Mu 3 1, 32, 33 , Bonding wire 6 and light emitting diode
Reflective case for fixed protection of the ion elements 5 and 5 '
A translucent resin filled in 2, for example, an epoxy resin
Or silicone resin is used.

【００１１】本発明の発光表示装置１は以上のように構
成されており、反射ケース２に挟持されたフレーム
３1，３3にそれぞれ連結された外部リード４1，４2に電
源を接続して駆動電圧を供給することにより、発光ダイ
オード素子５，５’が駆動され、フレーム３に対して垂
直側で相対する方向に効率よく光を放射させることがで
きる（図１（ｂ））。The light emitting display device 1 of the present invention is configured as described above, and the power source is connected to the external leads 4 1 and 4 2 which are respectively connected to the frames 3 1 and 3 3 held by the reflection case 2. By supplying the driving voltage with the light emitting diode elements 5 and 5 ', the light emitting diode elements 5 and 5'can be efficiently emitted in the direction opposite to the frame 3 on the vertical side (Fig. 1 (b)).

【００１２】図２は前述した発光表示装置を表示機器等
のバックライトとして使用した実施例を示す分解斜視図
である。１は本発明の発光表示装置であり、８は前記発
光表示装置１を収納するために中央部に開口を有するア
クリル等からなる導光板である。９は発光表示装置１お
よび導光板８を保持またはカバーするための有底のハウ
ジングで、ハウジング９の表面は光を効率よく反射させ
るよう白色の樹脂が使用される。上記構成のバックライ
トに図示しない電源から発光表示装置１に駆動電圧を供
給すると光が相対する方向に発光され、その光が導光板
８を通して導光板８に対し垂直の方向に放射される。FIG. 2 is an exploded perspective view showing an embodiment in which the above-described light emitting display device is used as a backlight of a display device or the like. Reference numeral 1 is a light emitting display device of the present invention, and 8 is a light guide plate made of acrylic or the like having an opening in a central portion for accommodating the light emitting display device 1. Reference numeral 9 denotes a bottomed housing for holding or covering the light emitting display device 1 and the light guide plate 8. The surface of the housing 9 is made of white resin so as to efficiently reflect light. When a driving voltage is supplied to the light emitting display device 1 from a power source (not shown) to the backlight having the above structure, light is emitted in opposite directions, and the light is emitted through the light guide plate 8 in a direction perpendicular to the light guide plate 8.

【００１３】[0013]

【発明の効果】以上述べたように本発明によれば、プリ
ント基板に取り付けて駆動電圧を印加した場合、相対す
る方向に効率よく光を放射させることができる。また、
本発明の発光表示装置を表示機器等のバックライトとし
て使用した場合、一つの発光表示装置で、二つ発光表示
装置を使用したと同様の効果を得ることができる。As described above, according to the present invention, when a drive voltage is applied to a printed circuit board, light can be efficiently emitted in opposite directions. Also,
When the light emitting display device of the present invention is used as a backlight of a display device or the like, one light emitting display device can achieve the same effect as when two light emitting display devices are used.

【図面の簡単な説明】[Brief description of drawings]

【図１】（ａ）は本発明の発光表示装置を示す平面図。
（ｂ）は（ａ）のＡ−Ａ線に沿う断面図。FIG. 1A is a plan view showing a light emitting display device of the present invention.
(B) is sectional drawing which follows the AA line of (a).

【図２】本発明の発光表示装置を使用したバックライト
の分解斜視図。FIG. 2 is an exploded perspective view of a backlight using the light emitting display device of the present invention.

【図３】（ａ）は従来の発光表示装置を示す平面図。
（ｂ）は（ａ）のＡ−Ａ線に沿うる断面図。FIG. 3A is a plan view showing a conventional light emitting display device.
(B) is sectional drawing which follows the AA line of (a).

【図４】従来の発光表示装置を使用したバックライトの
分解斜視図。FIG. 4 is an exploded perspective view of a backlight using a conventional light emitting display device.

【符号の説明】[Explanation of symbols]

１・・・発光表示装置 ２・・・反射ケース ３1，３2，３3・・・フレーム ４1，４2・・・外部リード ５，５’・・・発光ダイオード素子 ６・・・ボンディングワイヤ ７・・・透光性樹脂 ８・・・導光板 ９・・・ハウジング1 ... Light emitting display device 2 ... Reflection case 3 1 , 3 2 , 3 3 ... Frame 4 1 , 4 2 ... External lead 5, 5 '... Light emitting diode element 6 ... Bonding Wire 7 ... Translucent resin 8 ... Light guide plate 9 ... Housing

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 両面に開口した反射ケースと、前記反射
ケースに挟持され外部リードを有する導電材から成る分
割状のフレームと、前記フレームの選択された両面にボ
ンディングされた発光ダイオード素子と、前記発光ダイ
オード素子の接続電極と対応するフレームとをそれぞれ
電気的に接続するボンディングワイヤと、前記反射ケー
スの開口に充填された透光性の樹脂とを備えたことを特
徴とする発光表示装置。1. A reflective case having openings on both sides, a divided frame made of a conductive material sandwiched by the reflective case and having an external lead, a light emitting diode element bonded to both selected sides of the frame, A light emitting display device comprising: a bonding wire for electrically connecting a connection electrode of a light emitting diode element to a corresponding frame; and a translucent resin filled in an opening of the reflection case.
JP5318090A 1993-12-17 1993-12-17 Light emitting display Pending JPH07176791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5318090A JPH07176791A (en) 1993-12-17 1993-12-17 Light emitting display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5318090A JPH07176791A (en) 1993-12-17 1993-12-17 Light emitting display

Publications (1)

Publication Number Publication Date
JPH07176791A true JPH07176791A (en) 1995-07-14

Family

ID=18095372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5318090A Pending JPH07176791A (en) 1993-12-17 1993-12-17 Light emitting display

Country Status (1)

Country Link
JP (1) JPH07176791A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107326A (en) * 1996-09-30 1998-04-24 Sharp Corp Side-face light-emitting type led lamp
WO2002017401A1 (en) * 2000-08-24 2002-02-28 Osram Opto Semiconductors Gmbh Component comprising a large number of light-emitting-diode chips
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
JP2006100441A (en) * 2004-09-28 2006-04-13 Kyocera Corp Light emitting element housing package, light emitting device, and illumination device
JP2006210627A (en) * 2005-01-27 2006-08-10 Kyocera Corp Light emitting element housing package, light emitting unit, and lighting device
WO2013115379A1 (en) * 2012-02-02 2013-08-08 シチズンホールディングス株式会社 Semiconductor light emitting device and fabrication method for same
KR101374894B1 (en) * 2006-12-29 2014-03-17 서울반도체 주식회사 Double-side emitting type light emitting diode package
CN103855147A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and lamp
US8894240B2 (en) 2012-01-18 2014-11-25 Samsung Electronics Co., Ltd. Illumination device
US10096756B2 (en) 2005-11-25 2018-10-09 Samsung Electronics Co., Ltd. Side view light emitting diode package

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107326A (en) * 1996-09-30 1998-04-24 Sharp Corp Side-face light-emitting type led lamp
WO2002017401A1 (en) * 2000-08-24 2002-02-28 Osram Opto Semiconductors Gmbh Component comprising a large number of light-emitting-diode chips
JP2004517465A (en) * 2000-08-24 2004-06-10 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Optoelectronic components including light-emitting diode chips
US7435997B2 (en) 2000-08-24 2008-10-14 Osram Gmbh Component comprising a large number of light-emitting-diode chips
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
US6869813B2 (en) 2000-12-19 2005-03-22 Sharp Kabushiki Kaisha Chip-type LED and process of manufacturing the same
JP2006100441A (en) * 2004-09-28 2006-04-13 Kyocera Corp Light emitting element housing package, light emitting device, and illumination device
JP2006210627A (en) * 2005-01-27 2006-08-10 Kyocera Corp Light emitting element housing package, light emitting unit, and lighting device
US10096756B2 (en) 2005-11-25 2018-10-09 Samsung Electronics Co., Ltd. Side view light emitting diode package
KR101374894B1 (en) * 2006-12-29 2014-03-17 서울반도체 주식회사 Double-side emitting type light emitting diode package
US8894240B2 (en) 2012-01-18 2014-11-25 Samsung Electronics Co., Ltd. Illumination device
WO2013115379A1 (en) * 2012-02-02 2013-08-08 シチズンホールディングス株式会社 Semiconductor light emitting device and fabrication method for same
JPWO2013115379A1 (en) * 2012-02-02 2015-05-11 シチズンホールディングス株式会社 Semiconductor light emitting device and manufacturing method thereof
US9391050B2 (en) 2012-02-02 2016-07-12 Citizen Holdings Co., Ltd. Semiconductor light emitting device and fabrication method for same
WO2015103813A1 (en) * 2014-01-13 2015-07-16 深圳市瑞丰光电子股份有限公司 Led filament and luminaire
CN103855147A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and lamp

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