JPH07263607A - Semiconductor package with j-lead and bending method of lead frame - Google Patents
Semiconductor package with j-lead and bending method of lead frameInfo
- Publication number
- JPH07263607A JPH07263607A JP7430494A JP7430494A JPH07263607A JP H07263607 A JPH07263607 A JP H07263607A JP 7430494 A JP7430494 A JP 7430494A JP 7430494 A JP7430494 A JP 7430494A JP H07263607 A JPH07263607 A JP H07263607A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tip
- lead frame
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、Ｊリード付半導体パッ
ケージとそのリードフレームの曲げ方法に係り、より詳
細には、パッケージに形成されたポケット部にＪリード
の先端部を挿入した半導体パッケージとそのリードフレ
ームの曲げ方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package with a J-lead and a method for bending a lead frame thereof, and more particularly to a semiconductor package having a J-lead tip inserted in a pocket formed in the package. A method of bending the lead frame.
【０００２】[0002]
【従来の技術】従来、Ｊリード付半導体パッケージは、
図８、図９に示すように、『先端１０１ａが断面角形状
に形成されたリードフレーム１０１を用いて、パッケー
ジ１０２から引き出されたリードフレーム１０１の先端
１０１ａを含む先端部１０１ｂを所定の半径Ｒでカーリ
ングしてＪ字状に曲げ、この先端部１０１ｂの先端１０
１ａをパッケージ１０２に形成された断面くさび状のポ
ケット部１０２ａに挿入するようにした構成』が知られ
ている（特開昭６２−２７７７５６号公報、特開平４−
２９９５５９号公報等参照）。2. Description of the Related Art Conventionally, semiconductor packages with J leads are
As shown in FIGS. 8 and 9, “a tip 101a including a tip 101a of a lead frame 101 extracted from a package 102 is provided with a predetermined radius R by using a lead frame 101 having a tip 101a formed in a rectangular cross section. Curl and bend it into a J-shape.
1a is inserted into a pocket 102a having a wedge-shaped cross section formed on the package 102 "(Japanese Patent Laid-Open No. 62-277756, Japanese Patent Laid-Open No. 4-277756).
299559, etc.).
【０００３】このポケット部を有する半導体パッケージ
にあっては、リードフレーム先端の動き、変形がポケッ
ト部にて拘束されて、Ｊ曲げボトムのコプラナリティー
を小さくするという利点がある。The semiconductor package having the pocket portion has an advantage that the movement and deformation of the tip of the lead frame are restrained by the pocket portion, and the coplanarity of the J-bending bottom is reduced.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述し
た従来のＪリード付半導体パッケージとそのリードフレ
ームの曲げ方法の場合、次のような課題がある。すなわ
ち、 リードフレーム先端をポケット部にて拘束するため
には、リードフレーム先端とポケット部とのクリアラン
スを小さくし、リードフレームの位置とポケット部位置
のずれを小さくし、ポケット部を深くしてリードフレー
ム先端がはずれ難くする必要があるが、該ポケット部を
小さくして深くすると、図１０に示すように、Ｊ曲げ部
先端がＲ形状であるので、曲げ成形でポケット部にリー
ドフレーム先端を挿入する際に、両者の位置ずれや曲げ
精度によってリードフレーム先端がポケット部の壁面に
当たって深く挿入することができなくなる。 リードフレームのＪ曲げ部の先端が、断面角形状に
形成されているので、図１１に示すように、断面くさび
状のポケット部に挿入する際に、ポケット部の壁面に干
渉して深く挿入することができなくなる。等の課題があ
る。However, the above-described conventional semiconductor package with J-lead and the lead frame bending method thereof have the following problems. That is, in order to restrain the lead frame tip with the pocket part, the clearance between the lead frame tip and the pocket part is made small, the deviation between the lead frame position and the pocket part position is made small, and the pocket part is deepened to lead the lead frame. Although it is necessary to make it difficult for the frame tip to come off, if the pocket portion is made smaller and deeper, as shown in FIG. 10, the J bend portion tip has an R shape, so the lead frame tip is inserted into the pocket portion by bending. When doing so, the tip of the lead frame hits the wall surface of the pocket portion and cannot be inserted deeply due to the positional displacement and bending accuracy of the both. Since the tip of the J-bent portion of the lead frame is formed to have a square cross-section, as shown in FIG. 11, when the lead frame is inserted into the pocket portion having a wedge-shaped cross-section, it interferes with the wall surface of the pocket portion and is deeply inserted. Can't do it. There are issues such as.
【０００５】本発明は、上述した課題に対処して創作し
たものであって、その目的とする処は、パッケージのポ
ケット部を小さく、かつ深くしてリードフレームのＪ曲
げ先端部を該ポケット部に深く挿入して、Ｊ曲げボトム
部のコプラナリティーを小さくして、歩留りを向上する
とともに、品質を向上したＪリード付半導体パッケージ
とそのリードフレームの曲げ方法を提供することにあ
る。The present invention has been made in view of the above-mentioned problems, and the object thereof is to make the pocket portion of the package small and deep so that the J-bending tip portion of the lead frame is located in the pocket portion. It is intended to provide a semiconductor package with a J lead and a method of bending the lead frame, which are deeply inserted into the J lead to reduce the coplanarity of the bottom portion of the J bend to improve the yield and improve the quality.
【０００６】[0006]
【課題を解決するための手段】そして、上記目的を達成
するための手段としての本発明のＪリード付半導体パッ
ケージは、パッケージに設けられたポケット部にＪリー
ド先端部を挿入した半導体パッケージにおいて、該Ｊリ
ードの先端部が、リード先端から所定長さだけストレー
トに形成された構成としている。A semiconductor package with a J-lead according to the present invention as a means for achieving the above object is a semiconductor package in which a J-lead tip is inserted into a pocket provided in the package. The tip portion of the J lead is formed straight from the tip of the lead by a predetermined length.
【０００７】また、本発明の別のＪリード付半導体パッ
ケージは、前記発明において、Ｊリードの先端部の先端
が、断面くさび状に形成された構成としている。Further, another semiconductor package with J-lead of the present invention is the same as the above-mentioned invention, wherein the tip of the tip of the J-lead is formed in a wedge shape in cross section.
【０００８】また、本発明のリードフレームの曲げ方法
は、半導体パッケージに設けられたポケット部にＪリー
ドの先端部が挿入されるＪリード付半導体パッケージの
リードフレームの曲げ方法において、該Ｊリードの先端
部を先端面から所定長さだけストレートにしたまま円孤
状に曲げた後、該Ｊリードの先端部を前記半導体パッケ
ージのポケット部に挿入する曲げ工程を有する構成とし
ている。また、本発明のリードフレームの曲げ方法は、
上記曲げ方法において、リードフレームの先端部の先端
が断面くさび状に形成された構成としている。The method of bending a lead frame according to the present invention is the same as the method of bending a lead frame of a semiconductor package with a J lead in which the tip of the J lead is inserted into a pocket portion provided in the semiconductor package. A bending step is performed in which the tip portion of the J lead is inserted into the pocket portion of the semiconductor package after the tip portion is bent in an arc shape while keeping the tip portion straight for a predetermined length. Further, the lead frame bending method of the present invention is
In the above bending method, the tip of the lead frame has a wedge-shaped cross section.
【０００９】[0009]
【作用】本発明のＪリード付半導体パッケージとそのリ
ードフレームの曲げ方法は、リードフレームの先端部を
先端面から所定長さだけストレートにしたまま円孤状に
曲げたＪ字状部が形成されるので、パッケージのポケッ
ト部に深く挿入し易くなり、ポケット部を小さくかつ深
くすることができ、Ｊ曲げボトム部のコプラナリティー
を小さくできるように作用する。また、本発明の別の半
導体パッケージとそのリードフレームの曲げ方法は、リ
ードフレームの先端が断面くさび状に形成されているの
で、くさび状のポケット部に一層深く挿入し易くなり、
よりポケット部を小さくかつ深くすることができ、Ｊ曲
げボトム部のコプラナリティーを小さくできるように作
用する。According to the semiconductor package with a J lead and the method of bending the lead frame of the present invention, a J-shaped portion is formed by bending the tip end portion of the lead frame straight from the tip end surface by a predetermined length in an arc shape. This facilitates deep insertion into the pocket portion of the package, makes the pocket portion small and deep, and acts to reduce the coplanarity of the J-bending bottom portion. Further, another semiconductor package of the present invention and a method for bending the lead frame thereof, since the tip of the lead frame is formed in a wedge-shaped cross-section, it becomes easier to insert it deeper into the wedge-shaped pocket portion,
The pocket portion can be made smaller and deeper, and the coplanarity of the J-bending bottom portion can be reduced.
【００１０】[0010]
【実施例】以下、図面を参照しながら、本発明を具体化
した実施例について説明する。ここに、図１〜図７は、
本発明の一実施例を示し、図１はＪリード付半導体パッ
ケージの要部の断面図、図２はＪリード付半導体パッケ
ージの平面図、図３は図１の底面図、図４は図１の側面
図、図５（ａ）（ｂ）はリードフレームの先端部とパッ
ケージのポケット部との拡大図、図６（ａ）〜（ｅ）は
リードフレームの折り曲げ工程図、図７はリードフレー
ムの成形工程の説明図である。Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG.
1 shows an embodiment of the present invention, FIG. 1 is a cross-sectional view of an essential part of a J-lead semiconductor package, FIG. 2 is a plan view of the J-lead semiconductor package, FIG. 3 is a bottom view of FIG. 1, and FIG. 5 (a) and 5 (b) are enlarged views of the tip portion of the lead frame and the pocket portion of the package, FIGS. 6 (a) to 6 (e) are bending process diagrams of the lead frame, and FIG. 7 is a lead frame. It is explanatory drawing of the shaping | molding process of.
【００１１】本実施例のＪリード付半導体パッケージ
は、パッケージに形成されたポケット部にＪリードの先
端部を挿入したパッケージであって、概略すると、パッ
ケージ１に形成されたポケット部２に多数のリードフレ
ーム３の先端面から所定長さだけストレートに形成され
てＪ字状に曲げられた先端部４が挿入された構成よりな
る。The semiconductor package with J-lead of this embodiment is a package in which the tip of the J-lead is inserted into the pocket formed in the package. The lead frame 3 has a configuration in which a tip portion 4 that is formed straight from the tip surface of the lead frame 3 by a predetermined length and is bent in a J shape is inserted.
【００１２】パッケージ１は、サークワッドタイプのパ
ッケージであって、パッケージ裏面には、各辺の端部に
リードフレーム３の先端部を挿入するポケット部２が設
けられている。そして、ポケット部２は、図１、図５に
示すように、断面くさび状に形成されている。また、リ
ードフレーム３の先端部４は、Ｊ字状に曲げられて、か
つそのリード先端５は所定の長さだけストレートに形成
され、またリード先端５は、少なくとも幅方向がくさび
状に形成されている。ここで、くさび状には、リード先
端がそのまま鋭利になっている形状（図５ａ参照）、そ
の一部が切り落とされた形状（図５ｂ参照）、リード先
端が円孤状になっている形状のいずれをも含む。The package 1 is a squad type package, and the back surface of the package is provided with a pocket 2 into which the tip of the lead frame 3 is inserted at the end of each side. The pocket 2 is formed in a wedge shape in cross section as shown in FIGS. 1 and 5. Further, the tip portion 4 of the lead frame 3 is bent in a J shape, and the lead tip 5 is formed straight for a predetermined length, and the lead tip 5 is formed in a wedge shape at least in the width direction. ing. Here, the wedge shape has a shape in which the tip of the lead is sharp as it is (see FIG. 5a), a shape in which a part thereof is cut off (see FIG. 5b), and a shape in which the lead tip is in an arc shape. Both are included.
【００１３】ところで、本実施例のパッケージにおいて
は、ポケット部２の深さａを、０．３ｍｍ〜０．７ｍｍ
とし、リードフレーム３の先端部４の長さｂと、ポケッ
ト部２の深さａと同じ寸法に形成している（図１参
照）。By the way, in the package of this embodiment, the depth a of the pocket 2 is 0.3 mm to 0.7 mm.
The lead frame 3 is formed to have the same dimension as the length b of the tip portion 4 and the depth a of the pocket portion 2 (see FIG. 1).
【００１４】次に、本実施例のＪリード付半導体パッケ
ージを製作するためのリードフレームの曲げ方法につい
て説明する。まず、リードフレームの曲げ方法は、図６
に示すように、下型１１と上型１２，１３との間に、リ
ードフレーム３付けしたパッケージ１を挟持して、ダイ
１４によってリードフレーム３のタイバー部１０を切り
落として所定の寸法に切断（図６ａ参照）した後、下型
１１と上型１５，１６間でパッケージ１とリードフレー
ム３を挟持して、曲げ型１７を押し上げ、上型１６との
間でリードフレーム３の先端部４をその先端５が所定の
長さだけストレートになるように所定の位置で円孤状に
曲げる（図６ｂ参照）。Next, a method of bending the lead frame for manufacturing the J-leaded semiconductor package of this embodiment will be described. First, the lead frame bending method is shown in FIG.
As shown in, a package 1 attached with a lead frame 3 is sandwiched between a lower mold 11 and upper molds 12 and 13, and a tie bar portion 10 of the lead frame 3 is cut off by a die 14 to be cut into a predetermined size ( 6a), the package 1 and the lead frame 3 are sandwiched between the lower mold 11 and the upper molds 15 and 16, the bending mold 17 is pushed up, and the tip portion 4 of the lead frame 3 is fixed to the upper mold 16. The tip 5 is bent into a circular shape at a predetermined position so that the tip 5 is straight for a predetermined length (see FIG. 6b).
【００１５】そして、下型２０と上型１９を用い、リー
ドフレーム３を所定の位置から所定角度まで曲げ（図６
ｃ参照）、更に下型２２を用いてリードフレーム３を所
定の位置から更に所定角度まで曲げた後（図６ｄ参
照）、下型２３、およびカーリング型２５を用いて、リ
ードフレーム３の先端部４をＪ字状にカーリング加工し
て、先端部４のストレートのままの先端５をセラミック
パッケージ１にポケット部２に挿入する（図６ｅ参
照）。Then, using the lower mold 20 and the upper mold 19, the lead frame 3 is bent from a predetermined position to a predetermined angle (see FIG. 6).
(See FIG. 6c), and after further bending the lead frame 3 from a predetermined position to a predetermined angle using the lower die 22 (see FIG. 6d), using the lower die 23 and the curling die 25, the tip portion of the lead frame 3 4 is curled into a J shape, and the straight tip 5 of the tip 4 is inserted into the pocket 2 of the ceramic package 1 (see FIG. 6e).
【００１６】また、リードフレーム３の先端部４の先端
５をくさび状に形成するには、リードフレームはエッチ
ングで形成する場合は、予め、リードフレームエッチン
グパターンを金型切断位置を考慮して、図７に示すよう
に、細くくびらせておき、また、前記リードフレームを
パンチングで形成する場合は、予め、図７に示すように
細くくびらせて打ち抜き、その後、タイバー部１０を切
断するときにカットラインＣＬで切断することによって
くさび形状に切断して形成する。Further, in order to form the tip 5 of the tip 4 of the lead frame 3 in a wedge shape, when the lead frame is formed by etching, the lead frame etching pattern is previously considered in consideration of the die cutting position, As shown in FIG. 7, if the lead frame is thinly narrowed and the lead frame is formed by punching, as shown in FIG. 7, thinly narrowed and punched, and then the tie bar portion 10 is cut. Sometimes it is formed by cutting in a wedge shape by cutting along the cut line CL.
【００１７】そして、本実施例のＪリード付半導体パッ
ケージは、パッケージ１のポケット部２に挿入されるリ
ードフレーム３の先端部４のリード先端５が、その先端
面から所定の長さだけストレートに形成されているの
で、ポケット部２に挿入するときに、ポケット部２の壁
面に先端５が干渉することが少なくなり、リードフレー
ム３の先端５をポケット部２内に深く挿入することがで
き、ポケット部２を小さく且つ深く形成することができ
て、Ｊ曲げボトム部のコプラナリティーを小さくするこ
とができる。In the J-leaded semiconductor package of this embodiment, the lead tip 5 of the tip portion 4 of the lead frame 3 inserted into the pocket 2 of the package 1 is straightened from the tip surface by a predetermined length. Since it is formed, the tip 5 is less likely to interfere with the wall surface of the pocket 2 when it is inserted into the pocket 2, and the tip 5 of the lead frame 3 can be deeply inserted into the pocket 2. The pocket portion 2 can be formed small and deep, and the coplanarity of the J-bending bottom portion can be reduced.
【００１８】また、本実施例のＪリード付半導体パッケ
ージは、リードフレーム３の先端５がくさび状に形成さ
れているので、ポケット部２に挿入するときに該ポケッ
ト部２の壁面に先端５が干渉することが一層少なくな
り、リードフレーム３の先端５をポケット部２内に深く
挿入することができる。Further, in the semiconductor package with J-lead of this embodiment, since the tip 5 of the lead frame 3 is formed in a wedge shape, the tip 5 is inserted into the pocket portion 2 when it is inserted into the pocket portion 2. The interference is further reduced, and the tip 5 of the lead frame 3 can be deeply inserted into the pocket portion 2.
【００１９】これによって、パッケージのポケット部の
細小化によるＩＣ組立て工程でのＪ曲げボトム部のコプ
ラナリティー精度向上による歩留りの向上を図れ、ＩＣ
組立て工程のリードの変形を修正する作業を廃止するこ
とができ、リードの変形を修正する時に発生するガラス
クラックもなくなって、この点でも歩留りを向上するこ
とができる。As a result, the yield can be improved by improving the coplanarity accuracy of the J-bending bottom portion in the IC assembling process by making the package pocket portion smaller.
The work of correcting the deformation of the lead in the assembling process can be eliminated, and there is no glass crack generated when correcting the deformation of the lead, and the yield can be improved also in this respect.
【００２０】なお、本発明は、上述した実施例に限定さ
れるものではなく、本発明の要旨を変更しない範囲内で
変形実施できる構成を含むものである。因みに、前述し
た実施例においては、パッケージをサークワッドタイプ
で説明したが、ＤＩＰタイプ等のその他の形状のパッケ
ージであっても同様に実施できる。It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope of the present invention. Incidentally, in the above-mentioned embodiment, the package is described as a squad type, but the same can be applied to a package of other shape such as a DIP type.
【００２１】[0021]
【発明の効果】以上の説明より明らかなように、本発明
のＪリード付半導体パッケージとそのリードフレームの
曲げ方法によれば、リードフレームの先端部を先端面か
ら所定長さだけストレートにしたまま円孤状に曲げたＪ
字状部が形成されるので、パッケージのポケット部に深
く挿入し易くなって、ポケット部を小さくかつ深くして
Ｊ曲げボトム部のコプラナリティーを小さくでき、品質
が向上し、歩留が向上するという効果を有する。As is apparent from the above description, according to the semiconductor package with a J lead and the method for bending the lead frame of the present invention, the tip portion of the lead frame is kept straight from the tip surface by a predetermined length. J bent into an arc
Since the letter-shaped portion is formed, it can be easily inserted deeply into the pocket portion of the package, and the pocket portion can be made smaller and deeper to reduce the coplanarity of the J-bending bottom portion, improving quality and improving yield. Has the effect.
【００２２】また、本発明の別のＪリード付半導体素子
パッケージとそのリードフレームの曲げ方法によれば、
リードフレームの先端が断面くさび状に形成されている
ので、くさび状のポケット部に一層深く挿入し易くな
り、よりポケット部を小さくかつ深くすることができて
Ｊ曲げボトム部のコプラナリティーを小さくでき、一層
品質の向上、歩留りの向上を図れるという効果を有す
る。According to another J-leaded semiconductor device package and a lead frame bending method of the present invention,
Since the tip of the lead frame has a wedge-shaped cross section, it is easier to insert it deeper into the wedge-shaped pocket, and the pocket can be made smaller and deeper and the coplanarity of the J-bending bottom can be reduced. Further, it has an effect that the quality can be further improved and the yield can be improved.
【図１】 本発明の一実施例を示すＪリード付半導体パ
ッケージの要部の断面図である。FIG. 1 is a sectional view of an essential part of a J-leaded semiconductor package showing an embodiment of the present invention.
【図２】 Ｊリード付半導体パッケージの平面図であ
る。FIG. 2 is a plan view of a J-leaded semiconductor package.
【図３】 図１の底面図である。FIG. 3 is a bottom view of FIG. 1.
【図４】 図１の側面図である。FIG. 4 is a side view of FIG. 1.
【図５】 リードフレームの先端部とパッケージのポケ
ット部との拡大図である。FIG. 5 is an enlarged view of a tip portion of the lead frame and a pocket portion of the package.
【図６】 リードフレームの折り曲げ工程図である。FIG. 6 is a process drawing of bending the lead frame.
【図７】 リードフレームの成形工程の説明図である。FIG. 7 is an explanatory diagram of a lead frame molding process.
【図８】 従来の半導体パッケージの要部断面図であ
る。FIG. 8 is a sectional view of a main part of a conventional semiconductor package.
【図９】 図８の側断面図である。9 is a side sectional view of FIG.
【図１０】 図８のリードフレーム挿入時の状態を説明
するための断面図である。FIG. 10 is a cross-sectional view for explaining a state when the lead frame in FIG. 8 is inserted.
【図１１】 図８のリードフレーム挿入時の他の状態を
説明するための断面図である。FIG. 11 is a cross-sectional view for explaining another state when the lead frame of FIG. 8 is inserted.
１・・・パッケージ、２・・・ポケット部、３・・・リ
ードフレーム、４・・・先端部、５・・・リード先端、
ａ・・・ポケット部の深さ、ｂ・・・リードフレームの
先端部の長さ1 ... Package, 2 ... Pocket, 3 ... Lead frame, 4 ... Tip, 5 ... Lead tip,
a: pocket depth, b: lead frame tip length
Claims (4)
リード先端部を挿入した半導体パッケージにおいて、該
Ｊリードの先端部が、リード先端から所定長さだけスト
レートに形成されていることを特徴とする半導体パッケ
ージ。1. A J in a pocket provided on the package.
A semiconductor package having a lead tip portion inserted therein, wherein the tip portion of the J lead is formed straight from the lead tip by a predetermined length.
状に形成されている請求項１に記載の半導体パッケー
ジ。2. The semiconductor package according to claim 1, wherein the tip of the tip portion of the J lead is formed in a wedge shape in cross section.
部にＪリードの先端部が挿入されるＪリード付半導体パ
ッケージのリードフレームの曲げ方法において、該Ｊリ
ードの先端部を先端面から所定長さだけストレートにし
たまま円孤状に曲げた後、該Ｊリードの先端部を前記半
導体パッケージのポケット部に挿入する曲げ工程を有す
ること特徴とするリードフレームの曲げ方法。3. A method of bending a lead frame of a semiconductor package with a J lead, wherein a tip portion of a J lead is inserted into a pocket portion provided in a semiconductor package, the tip portion of the J lead being a predetermined length from the tip surface. A method for bending a lead frame, which comprises a bending step of bending the J-lead in a circular arc shape while keeping it straight and then inserting the tip portion of the J lead into the pocket portion of the semiconductor package.
に形成されている請求項３に記載のリードフレームの曲
げ方法。4. The method for bending a lead frame according to claim 3, wherein the tip of the tip portion of the J lead is formed in a wedge shape in cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7430494A JPH07263607A (en) | 1994-03-17 | 1994-03-17 | Semiconductor package with j-lead and bending method of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7430494A JPH07263607A (en) | 1994-03-17 | 1994-03-17 | Semiconductor package with j-lead and bending method of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07263607A true JPH07263607A (en) | 1995-10-13 |
Family
ID=13543263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7430494A Pending JPH07263607A (en) | 1994-03-17 | 1994-03-17 | Semiconductor package with j-lead and bending method of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07263607A (en) |
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