JPH0726239B2 - How to collect the plating solution - Google Patents

How to collect the plating solution

Info

Publication number
JPH0726239B2
JPH0726239B2 JP17335989A JP17335989A JPH0726239B2 JP H0726239 B2 JPH0726239 B2 JP H0726239B2 JP 17335989 A JP17335989 A JP 17335989A JP 17335989 A JP17335989 A JP 17335989A JP H0726239 B2 JPH0726239 B2 JP H0726239B2
Authority
JP
Japan
Prior art keywords
plating
plating solution
recovery
liquid
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17335989A
Other languages
Japanese (ja)
Other versions
JPH0339500A (en
Inventor
浩 下田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17335989A priority Critical patent/JPH0726239B2/en
Publication of JPH0339500A publication Critical patent/JPH0339500A/en
Publication of JPH0726239B2 publication Critical patent/JPH0726239B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Heat Treatment Of Water, Waste Water Or Sewage (AREA)
  • Chemically Coating (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、メッキ処理が施される被処理体の表面にメ
ッキ処理する際に持ち出されるメッキ液を回収し、再利
用するメッキ液の回収方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention collects a plating solution brought out during plating on the surface of an object to be plated and collects a reused plating solution. It is about the method.

〔従来の技術〕[Conventional technology]

従来のこの種の持ち出しメッキ液を回収する装置は、第
2図に模式的に示すように構成され、再利用されてい
た。すなわち、第2図において、1はメッキ装置で、メ
ッキ液2が収容されるメッキ処理槽5,メッキが施される
被処理体に付着して持出しメッキ液3として持ち出され
回収希釈メッキ液4として収容される希釈メッキ液槽6,
回収された水洗水10が収容される水洗水槽7をそれぞれ
備えている。8は前記回収希釈メッキ液4が収容される
第1の回収ストック槽、9は回収装置で、第1の回収ス
トック槽8からの回収希釈メッキ液4が取り込まれて濃
縮され、この際発生する蒸気が回収装置9内のコンデン
サにて水洗水10として回収され使用される。一方、濃縮
されたメッキ液は回収ストック液11として第2の回収ス
トック槽12に収容され、回収リターン液13としてメッキ
処理槽5に回収される。
A conventional apparatus for collecting the taken-out plating liquid of this type has been constructed and reused as schematically shown in FIG. That is, in FIG. 2, reference numeral 1 is a plating apparatus, which is a plating treatment tank 5 in which the plating solution 2 is accommodated, and a recovery dilution plating solution 4 which is taken out as a carry-out plating solution 3 by being attached to an object to be plated. Diluted plating liquid tank to be stored 6,
Each of the wash water tanks 7 stores the collected wash water 10. Reference numeral 8 is a first recovery stock tank in which the recovered diluted plating solution 4 is stored, and 9 is a recovery device, and the recovered diluted plating solution 4 from the first recovery stock tank 8 is taken in and concentrated, and is generated at this time. The steam in the condenser in the recovery device 9 is recovered and used as washing water 10. On the other hand, the concentrated plating solution is stored in the second recovery stock tank 12 as the recovery stock solution 11 and is recovered in the plating treatment tank 5 as the recovery return solution 13.

次に動作について説明する。Next, the operation will be described.

メッキ装置1のメッキ処理槽5のメッキ液2がメッキを
施される被処理体である製品に付着し、持出しメッキ液
3となり、これが回収希釈メッキ液4として第1の回収
ストック槽8に収容され、これを回収装置9を用いて濃
縮し、その時に蒸発する水分を回収装置9内のコンデン
サによって水とし、水洗水10として回収し使用する。
The plating solution 2 in the plating processing tank 5 of the plating apparatus 1 adheres to the product that is the object to be plated and becomes the carry-out plating solution 3, which is stored in the first recovery stock tank 8 as the recovery dilution plating solution 4. The collected water is concentrated by using the collecting device 9, and the water vaporized at that time is converted into water by the condenser in the collecting device 9 and is collected and used as the washing water 10.

一方、回収希釈メッキ液4は、メッキ液濃度まで濃縮さ
れ、回収ストック液11として第2の回収ストック槽12に
回収された後、回収リターン液13となってメッキ処理槽
5に戻され、メッキ液の回収を行っている。
On the other hand, the recovered diluted plating solution 4 is concentrated to the concentration of the plating solution, recovered as the recovered stock solution 11 in the second recovered stock tank 12, and then returned to the plating processing tank 5 as the recovered return solution 13 for plating. Liquid is being collected.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

上記のように構成されたメッキ液の回収方法は、持出し
メッキ液3として持ち出された回収希釈メッキ液4は、
強酸,強アルカリタイプのメッキ液の回収としては回収
可能であるが、中性タイプ等のメッキ液で希釈され変化
しやすいメッキ液は、濃縮回収するとメッキ液の成分が
分解し、メッキ液2として使用できない問題点があっ
た。
The recovery method of the plating solution configured as described above is such that the recovered diluted plating solution 4 carried out as the carried-out plating solution 3 is
Although it is possible to collect the plating solution of strong acid or strong alkali type, the plating solution that is easily diluted and changed by the plating solution of neutral type or the like is decomposed and the components of the plating solution are decomposed when concentrated and collected. There was a problem that it could not be used.

この発明は、上記のような問題点を解決するためになさ
れたもので、変化しやすい回収希釈メッキ液を濃縮回収
できるようにしたメッキ液の回収方法を得ることを目的
とするものである。
The present invention has been made to solve the above problems, and an object of the present invention is to obtain a method of recovering a plating solution that enables concentrated recovery of a recovery diluted plating solution that is likely to change.

〔課題を解決するための手段〕[Means for Solving the Problems]

この発明に係るメッキ液の回収方法は、回収装置に回収
希釈メッキ液を取り込む前に濃縮を行ってもメッキ液の
成分が分解しない高濃度基本液をメッキ液として回収装
置に取り込んだ後、回収希釈メッキ液を取り込み濃縮を
行い回収するものである。
The method of recovering a plating solution according to the present invention is a method of recovering after collecting a high concentration basic solution as a plating solution into which a component of the plating solution is not decomposed even if concentrated before collecting the recovered diluted plating solution into the recovery apparatus. The diluted plating solution is taken in, concentrated and recovered.

〔作用〕[Action]

この発明においては、濃縮してもメッキ液の成分が分解
しない高濃度基本液をメッキ液として用い、このメッキ
液を回収希釈メッキ液を取り込む前に回収装置に取り込
み、その後回収希釈メッキ液を取り込んで濃縮すること
から、メッキ液中に添加してある安定剤の効果が作用
し、加温濃縮を行ってもメッキ液の分解変化はなく、持
出しメッキ液をメッキ液として使用可能な状態で回収で
きる。
In the present invention, a high-concentration basic solution that does not decompose the components of the plating solution even if concentrated is used as the plating solution, and the plating solution is taken into the recovery device before the recovery diluted plating solution is taken in and then the recovery diluted plating solution is taken in. Since it is concentrated in, the effect of the stabilizer added to the plating solution works, there is no decomposition change of the plating solution even if it is heated and concentrated, and the brought-out plating solution is recovered in a state that can be used as the plating solution. it can.

〔実施例〕〔Example〕

以下、この発明の一実施例を第1図に基づいて説明す
る。
An embodiment of the present invention will be described below with reference to FIG.

第1図において、第2図と同一符号は同じものを示し、
14は濃縮を行ってもメッキ液の成分が分解しない高濃度
基本液で、これをメッキ液2としてメッキ処理槽5に収
容する。
In FIG. 1, the same reference numerals as those in FIG.
14 is a high-concentration basic liquid in which the components of the plating liquid are not decomposed even when concentrated, and is stored in the plating treatment tank 5 as the plating liquid 2.

この動作は、回収希釈メッキ液4を回収装置9に取り込
む前に、高濃度基本液14を回収装置9に取り込んで濃縮
動作をスタートし、濃縮時に蒸発する水分を回収装置9
のコンデンサにて水とし、水洗水10として回収する。こ
の後は水洗水10として循環する。一定以上のメッキ液、
例えば倍程度に濃縮された回収ストック液11は、第2の
回収ストック槽12に回収され、回収リターン液13として
取り出され、補給メッキとしてメッキ処理槽5へ戻され
る完全クローズドシステムで回収される。
In this operation, before the collected diluted plating solution 4 is taken into the collecting device 9, the high-concentration basic liquid 14 is taken into the collecting device 9 to start the concentration operation, and the water vaporized at the time of concentration is collected into the collecting device 9.
It is made into water with the condenser of and collected as wash water 10. After this, it is circulated as washing water 10. Plating solution above a certain level,
For example, the recovered stock solution 11 that has been concentrated approximately twice is recovered in the second recovered stock tank 12, taken out as the recovered return solution 13, and returned to the plating processing tank 5 as supplementary plating to be recovered by a completely closed system.

この発明のメッキ液の回収方法を用いると、高濃度基本
液14を濃縮基本液としたことで、メッキ液の分解は全く
ない。これはメッキ液としてある程度の高濃度に保った
液であれば、メッキ液の安定剤として添加してある薬品
の効果作用で真空濃縮にて50℃程度までメッキ液を加温
してもメッキ液の分解はなく、15%濃度を75%まで濃縮
し、また、基準まで希釈し、メッキ液濃度としてメッキ
しても良好なメッキを得ることができた。以下にその具
体例を示す。
When the plating solution recovery method of the present invention is used, the plating solution is not decomposed at all because the high-concentration basic solution 14 is the concentrated basic solution. This is because if the plating solution is kept at a high concentration to some extent, the plating solution can be heated to about 50 ° C by vacuum concentration due to the effect of chemicals added as a stabilizer of the plating solution. There was no decomposition, and even if the concentration of 15% was concentrated to 75%, and it was diluted to the standard and plated as the plating solution concentration, good plating could be obtained. Specific examples are shown below.

なお、濃縮液は十分補給液としても使用可能である。 The concentrated liquid can also be used as a sufficient replenisher.

また、この発明を用いることにより大幅な軽費の低減が
図れる。
Further, the use of the present invention can significantly reduce the cost.

〔発明の効果〕〔The invention's effect〕

以上説明したように、この発明は、回収装置に回収希釈
メッキ液を取り込む前に濃縮を行ってもメッキ液の成分
が分解しない高濃度基本液をメッキ液として回収装置に
取り込み濃縮を行い回収するので、従来回収できなかっ
た持出しメッキ液の回収が容易になり、再生メッキ液
(持ち出しメッキ液100l/日×25日×12ケ月×l/2500円
=75000円/年)として利用できることから、一般的な
メッキラインにおける経費低減効果が顕著であるととも
に、回収再利用のため排水処理も不要となる効果が得ら
れる。
As described above, according to the present invention, a high-concentration basic liquid that does not decompose the components of the plating solution even if it is concentrated before the recovered diluted plating solution is taken into the recovery apparatus is introduced into the recovery apparatus as the plating solution for concentration and recovery. Therefore, it is easy to collect the take-out plating solution that could not be collected before, and it can be used as a recycled plating solution (take-out plating solution 100l / day x 25 days x 12 months x l / 2500 yen = 75000 yen / year). The cost reduction effect in the conventional plating line is remarkable, and the wastewater treatment is unnecessary because it is recovered and reused.

【図面の簡単な説明】[Brief description of drawings]

第1図はこの発明のメッキ液回収方法の一実施例を説明
するための構成図、第2図は従来のメッキ液回収方法を
説明するための構成図である。 図において、1はメッキ装置、2はメッキ液、3は持出
しメッキ液、4は回収希釈メッキ液、5はメッキ処理
槽、6は希釈メッキ液槽、7は水洗水槽、8は第1の回
収ストック槽、9は回収装置、10は水洗水、11は回収ス
トック液、12は第2の回収ストック槽、13は回収リター
ン液、14は高濃度基本液である。 なお、各図中の同一符号は同一または相当部分を示す。
FIG. 1 is a block diagram for explaining an embodiment of a plating liquid recovery method of the present invention, and FIG. 2 is a block diagram for explaining a conventional plating liquid recovery method. In the figure, 1 is a plating device, 2 is a plating solution, 3 is a bring-out plating solution, 4 is a recovery dilution plating solution, 5 is a plating treatment tank, 6 is a dilution plating solution tank, 7 is a washing water tank, and 8 is a first recovery. A stock tank, 9 is a recovery device, 10 is washing water, 11 is a recovery stock solution, 12 is a second recovery stock solution, 13 is a recovery return solution, and 14 is a high-concentration basic solution. The same reference numerals in each drawing indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】メッキ処理が施される被処理体に付着して
メッキ処理槽から持ち出されたメッキ液と、回収された
水洗水とが混合して希釈された回収希釈メッキ液を回収
装置に取り込み、濃縮を行う際発生する蒸気を前記水洗
水として回収するとともに、濃縮された濃縮液を回収リ
ターンメッキ液として前記メッキ処理槽に戻すメッキ液
の回収方法において、前記回収装置に前記回収希釈メッ
キ液を取り込む前に濃縮を行ってもメッキ液の成分が分
解しない高濃度基本液をメッキ液として前記回収装置に
取り込んだ後、前記回収希釈メッキ液を取り込み濃縮を
行い回収することを特徴とするメッキ液の回収方法。
1. A recovery dilution plating solution, which is diluted by mixing the plating solution that has been brought out of the plating processing tank by adhering to the object to be plated and recovered, to a recovery device. In the method of recovering the plating liquid, which collects the steam generated during the intake and concentration as the washing water and returns the concentrated liquid concentrate to the plating treatment tank as the recovery return plating liquid, the recovery dilution plating is performed in the recovery device. It is characterized in that a high-concentration basic liquid that does not decompose the components of the plating liquid even if it is concentrated before taking in the liquid is taken into the recovery device as the plating liquid, and then the recovered diluted plating liquid is taken in and concentrated. How to recover the plating solution.
JP17335989A 1989-07-04 1989-07-04 How to collect the plating solution Expired - Lifetime JPH0726239B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17335989A JPH0726239B2 (en) 1989-07-04 1989-07-04 How to collect the plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17335989A JPH0726239B2 (en) 1989-07-04 1989-07-04 How to collect the plating solution

Publications (2)

Publication Number Publication Date
JPH0339500A JPH0339500A (en) 1991-02-20
JPH0726239B2 true JPH0726239B2 (en) 1995-03-22

Family

ID=15958946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17335989A Expired - Lifetime JPH0726239B2 (en) 1989-07-04 1989-07-04 How to collect the plating solution

Country Status (1)

Country Link
JP (1) JPH0726239B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004061255B4 (en) * 2004-12-20 2007-10-31 Atotech Deutschland Gmbh Process for the continuous operation of acidic or alkaline zinc or zinc alloy baths and apparatus for carrying it out
JP4822268B2 (en) * 2005-04-19 2011-11-24 ユケン工業株式会社 Recovery type electrogalvanizing method and apparatus
JP4756103B1 (en) * 2010-10-29 2011-08-24 田中貴金属工業株式会社 Method for recovering precious metal ions from plating wastewater

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management

Also Published As

Publication number Publication date
JPH0339500A (en) 1991-02-20

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