JPH0339500A - Recovering method for plating liquid - Google Patents
Recovering method for plating liquidInfo
- Publication number
- JPH0339500A JPH0339500A JP17335989A JP17335989A JPH0339500A JP H0339500 A JPH0339500 A JP H0339500A JP 17335989 A JP17335989 A JP 17335989A JP 17335989 A JP17335989 A JP 17335989A JP H0339500 A JPH0339500 A JP H0339500A
- Authority
- JP
- Japan
- Prior art keywords
- recovered
- plating
- plating liquid
- plating solution
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims description 12
- 239000007788 liquid Substances 0.000 title abstract description 29
- 238000011084 recovery Methods 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005406 washing Methods 0.000 claims abstract description 12
- 239000000243 solution Substances 0.000 claims description 72
- 239000003637 basic solution Substances 0.000 claims description 7
- 239000012141 concentrate Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Landscapes
- Heat Treatment Of Water, Waste Water Or Sewage (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、メッキ処理が施されろ被処理体の表面にメ
ッキ処理する際に持ち出されるメッキ液を回収し、再利
用するメッキ液の回収方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention is a method for collecting and reusing the plating solution taken out when plating the surface of an object to be plated. It is about the method.
従来のこの種の持ち出しメッキ液を回収する装置は、第
2図に模式的に示すように構成され、再利用されていた
。すなわち、第2図において、1はメッキ装置で、メッ
キ液2が収容されるメッキ処理槽5.メッキが施される
被処理体に付着して持出しメッキ液3として持ち出され
回収希釈メッキ液4として収容される希釈メッキ液槽6
.回収された水洗水10が収容される水洗水槽7をそれ
ぞれ備えている。8は前記回収希釈メッキ1α4が収容
される第1の回収ストック槽、9は回収装置で、第1の
回収ストック槽8からの回収希釈メッキ液4が取り込ま
れて濃縮され、この際発生する蒸気が回収装置9内のコ
ンデンサにて水洗水10として回収され使用される。一
方、濃縮されたメッキ液は回収ストック液11として第
2の回収ストック槽12に収容され、回収リターン液1
3としてメッキ処理槽5に回収される。A conventional device for recovering plating solution of this type was constructed as schematically shown in FIG. 2 and was reused. That is, in FIG. 2, 1 is a plating apparatus, and a plating treatment tank 5. A diluted plating solution tank 6 that adheres to the object to be plated and is taken out as a plating solution 3 and stored as a recovered diluted plating solution 4
.. Each of them is provided with a washing water tank 7 in which collected washing water 10 is accommodated. 8 is a first recovery stock tank in which the recovered diluted plating 1α4 is stored; 9 is a recovery device in which the recovered diluted plating solution 4 from the first recovery stock tank 8 is taken in and concentrated, and the steam generated at this time is is recovered and used as washing water 10 in a condenser in the recovery device 9. On the other hand, the concentrated plating solution is stored in a second recovery stock tank 12 as a recovery stock liquid 11, and a recovery return liquid 1
3 is recovered in the plating treatment tank 5.
次に動作について説明する。Next, the operation will be explained.
メッキ装置1のメッキ処理槽5のメッキ液濃度がメッキ
を施される被処理体である製品に付着し、持出しメッキ
液3となり、これが回収希釈メッキ液4として第1の回
収ストック槽8に収容され、これを回収装置9を用いて
濃縮し、その時に蒸発する水分全回収装置9内のコンデ
ンサによって水とし、水洗水10として回収し使用する
。The concentration of the plating solution in the plating tank 5 of the plating device 1 adheres to the product, which is the object to be plated, and becomes the plating solution 3 that is carried out, and this is stored in the first recovered stock tank 8 as the recovered diluted plating solution 4. This is concentrated using a recovery device 9, and the water that evaporates at that time is converted into water by a condenser in the recovery device 9, which is recovered and used as washing water 10.
一方、回収希釈メッキ液4は、メッキ液濃度までR縮さ
れ、回収ストック液11として第2の回収ストック槽1
2に回収された後、回収リターン液13となってメッキ
処理槽5に戻され、メッキ液の回収を行っている。On the other hand, the recovered diluted plating solution 4 is reduced to the plating solution concentration and is transferred to the second recovered stock tank 1 as recovered stock solution 11.
2, the plating solution is returned to the plating treatment tank 5 as a recovered return liquid 13, and the plating solution is recovered.
上記のように構成されたメッキ液の回収方法は、持出し
メッキ液3として持ち出された回収希釈メッキ液4は、
強酸2強アルカリタイプのメッキ液の回収としては回収
可能であるが、中性タイプ等のメッキ液で希釈され変化
しやすいメッキ液は、濃縮回収するとメッキ液の成分が
分解し、メッキ液2として使用できない問題点があった
。In the plating solution recovery method configured as described above, the recovered diluted plating solution 4 taken out as the carried-out plating solution 3 is
It is possible to recover strong acid 2 strong alkaline type plating solutions, but plating solutions that are easily diluted with neutral type plating solutions will be decomposed when concentrated and collected, and the plating solution will be recovered as plating solution 2. There was a problem that made it unusable.
この発明は、上記のような問題点を解決するためになさ
れたもので、変化しやすい回収希釈メッキ液を濃縮回収
できろようにしたメッキ液の回収方法を得ることを目的
とするものである。This invention was made in order to solve the above-mentioned problems, and aims to provide a method for recovering a plating solution that enables concentrated recovery of a recovered diluted plating solution that tends to change. .
この発明に係るメッキ液の回収方法は、回収装置に回収
希釈メッキ液を取り込む前にilI縮を行ってもメッキ
液の成分が分解しない高濃度基本液をメッキ液として回
収装置に取り込んだ後、回収希釈メッキ液を取り込み濃
縮を行い回収するものである。In the plating solution recovery method according to the present invention, a highly concentrated basic solution in which the components of the plating solution do not decompose even if IIL reduction is performed before the recovered diluted plating solution is introduced into the recovery device as a plating solution is then introduced into the recovery device. This system takes in the recovered diluted plating solution, concentrates it, and recovers it.
この発明においては、濃縮してもメッキ液の成分が分解
しない高濃度基本液をメッキ液として用い、このメッキ
液を回収希釈メッキ液を取り込む前に回収装置に取り込
み、その後回収希釈メッキ液を取り込んで濃縮すること
から、メッキ液中に添加しである安定剤の効果が作用し
、加温濃縮を行ってもメッキ液の分解変化はなく、持出
しメッキ7夜をメッキ液として使用可能な状態で回収で
きる。In this invention, a highly concentrated basic solution whose components do not decompose even when concentrated is used as the plating solution, and this plating solution is taken into a recovery device before taking in the recovered diluted plating solution, and then the recovered diluted plating solution is taken in. Since the plating solution is concentrated at 100 mL, the effect of the stabilizer added to the plating solution is activated, and there is no decomposition change in the plating solution even if the plating solution is heated and concentrated. It can be recovered.
以下、この発明の一実施例を第1図に基づいて説明する
。An embodiment of the present invention will be described below with reference to FIG.
第1図において、第2図と同一符号は同じものを示し、
14は濃縮を行ってもメッキ液の成分が分解しない高濃
度基本液で、これをメッキ液2としてメッキ処理槽5に
収容する。In Figure 1, the same symbols as in Figure 2 indicate the same things,
Reference numeral 14 denotes a highly concentrated basic solution whose components in the plating solution do not decompose even when concentrated, and this is stored in the plating treatment tank 5 as the plating solution 2.
この動作は、回収希釈メッキ液4を回収装置9に取り込
む前に、高濃度基本液14を回収装置9に取り込んで濃
縮動作をスタートシ、濃縮時に蒸発する水分を回収装置
9のコンデンサにて水とし、水洗水10として回収する
。この後は水洗水10として循環する。−窓以上のメッ
キ液、例えば倍程度に濃縮された回収ストック液11は
、第2の回収ストック槽12に収容され、回収リターン
欣13として取り出され、補給メッキとしてメッキ処理
槽5へ戻される完全クローズドシステムで回収される。In this operation, before the recovered diluted plating solution 4 is introduced into the recovery device 9, the high concentration basic solution 14 is introduced into the recovery device 9 and the concentration operation is started. and recovered as washing water 10. After this, the water is circulated as washing water 10. - The plating solution larger than the window, for example, the recovered stock liquid 11 that has been concentrated to about twice the concentration, is stored in the second recovered stock tank 12, taken out as a recovery return tank 13, and returned to the plating processing tank 5 as a replenishment plating. Collected in a closed system.
この発明のメッキ液の回収方法を用いると、高濃度基本
液14を濃縮基本液としたことで、メッキ液の分解は全
くない。これはメッキ液としである程度の高濃度に保っ
た液であれば、メッキ液の安定剤として添加しである薬
品の効果作用で真空濃縮にて50℃程度までメッキ液を
加温してもメッキ液の分解はなく、15%濃度を75%
まで濃縮し、また、基準まで希釈し、メッキ液濃度とし
てメッキしても良好なメッキを得ることができた。When the plating solution recovery method of the present invention is used, the highly concentrated base solution 14 is made into a concentrated base solution, so that there is no decomposition of the plating solution. If the plating solution is kept at a certain high concentration, the chemical added as a stabilizer to the plating solution will cause plating to occur even if the plating solution is heated to about 50°C by vacuum concentration. No liquid decomposition, 15% concentration to 75%
It was possible to obtain good plating even when the solution was concentrated to 100%, diluted to the standard, and plated at a plating solution concentration.
以下にその具体例を示す。A specific example is shown below.
(高濃度基本液)(濃縮) (希釈メッキ液)、W機酸
100nJ 500nJ 250
mt’ティンコンク 50tnj 250nJ
125−L/lドコンク 6+nj
30rn115−プライドナー 10 mj
50 ml 25 m1PH調整剤 5
0m1250 mj 125 mlなお、濃縮液
は十分補給液としても使用可能である。(Highly concentrated basic solution) (Concentrated) (Diluted plating solution), W machine acid 100nJ 500nJ 250
mt'tinconk 50tnj 250nJ
125-L/l dokonk 6+nj
30rn115-Plidner 10 mj
50 ml 25 ml PH adjuster 5
0m1250mj 125mlThe concentrated liquid can also be used as a sufficient replenishment liquid.
また、この発明を用いることにより大幅な軽質の低減が
図れる。Further, by using this invention, it is possible to achieve a significant reduction in light weight.
以上説明したように、この発明は、回収装置に回収希釈
メッキ液を取り込む前に原綿を行ってもメッキ液の成分
が分解しない高濃度基本液をメッキ液として回収装置に
取り込み濃縮を行い回収するので、従来回収できなかっ
た持出しメッキ液の回収が容易になり、再生メッキ液(
持ち出しメッキン佼10(H’/日×25日×12ケ月
X l /2500円= 75000円/年)として利
用できることから、−殻内なメッキラインにおけろ経費
低減効果が顕著であるとともに、回収再利用のため排水
処理も不要となる効果が得られる。As explained above, in the present invention, before the collected diluted plating solution is taken into the recovery device, a highly concentrated basic solution whose components of the plating solution do not decompose even if the raw cotton is removed is taken into the recovery device as the plating solution, concentrated, and recovered. Therefore, it is now easier to recover the plating solution taken out, which could not be recovered in the past, and recycled plating solution (
Since it can be used as a take-out plating line 10 (H'/day x 25 days x 12 months x 1/2,500 yen = 75,000 yen/year), it has a remarkable cost reduction effect even in an in-shell plating line, and it is also easy to recover. Because it is reused, wastewater treatment is also not necessary.
第1図はこの発明のメッキ液回収方法の一実施例を説明
するための構成図、第2図は従来のメッキ液回収方法を
説明するための構成図である。
図において、1はメッキ装置、2はメッキ液、3は持出
しメッキ液、4は回収希釈メッキ液、5はメッキ処理槽
、6は希釈メッキ液槽、7は水洗水槽、8は第1の回収
ストック槽、9は回収装置、10は水洗水、11は回収
ストック液、12は第2の回収ストック槽、13は回収
リターン液、14は高濃度基本液である。
なお、各図中の同一符号は同一または相当部分を示す。FIG. 1 is a configuration diagram for explaining an embodiment of the plating solution recovery method of the present invention, and FIG. 2 is a configuration diagram for explaining a conventional plating solution recovery method. In the figure, 1 is a plating device, 2 is a plating solution, 3 is a plating solution to be carried out, 4 is a recovered diluted plating solution, 5 is a plating treatment tank, 6 is a diluted plating solution tank, 7 is a washing water tank, and 8 is a first recovery tank. A stock tank, 9 a recovery device, 10 washing water, 11 recovery stock liquid, 12 a second recovery stock tank, 13 recovery return liquid, and 14 high concentration base liquid. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
から持ち出されたメッキ液と、回収された水洗水とが混
合して希釈された回収希釈メッキ液を回収装置に取り込
み、濃縮を行う際発生する蒸気を前記水洗水として回収
するとともに、濃縮された濃縮液を回収リターンメッキ
液として前記メッキ処理槽に戻すメッキ液の回収方法に
おいて、前記回収装置に前記回収希釈メッキ液を取り込
む前に濃縮を行ってもメッキ液の成分が分解しない高濃
度基本液をメッキ液として前記回収装置に取り込んだ後
、前記回収希釈メッキ液を取り込み濃縮を行い回収する
ことを特徴とするメッキ液の回収方法。The plating solution that adheres to the object to be plated and is taken out of the plating tank is mixed with the recovered washing water, and the recovered diluted plating solution is taken into a recovery device and concentrated. In the plating solution recovery method, the steam generated during the plating process is recovered as the washing water, and the concentrated solution is returned to the plating tank as the recovered return plating solution, before the recovered diluted plating solution is taken into the recovery device. A method for recovering a plating solution, characterized in that a highly concentrated basic solution whose components of the plating solution do not decompose even when concentrated is taken into the recovery device as a plating solution, and then the recovered diluted plating solution is taken in, concentrated, and recovered. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17335989A JPH0726239B2 (en) | 1989-07-04 | 1989-07-04 | How to collect the plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17335989A JPH0726239B2 (en) | 1989-07-04 | 1989-07-04 | How to collect the plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0339500A true JPH0339500A (en) | 1991-02-20 |
JPH0726239B2 JPH0726239B2 (en) | 1995-03-22 |
Family
ID=15958946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17335989A Expired - Lifetime JPH0726239B2 (en) | 1989-07-04 | 1989-07-04 | How to collect the plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0726239B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006322069A (en) * | 2005-04-19 | 2006-11-30 | Yuken Industry Co Ltd | Recovery type electrogalvanizing method and device |
JP4756103B1 (en) * | 2010-10-29 | 2011-08-24 | 田中貴金属工業株式会社 | Method for recovering precious metal ions from plating wastewater |
JP4764886B2 (en) * | 2004-12-20 | 2011-09-07 | アトテック・ドイチュラント・ゲーエムベーハー | Continuous operation of acidic or alkaline zinc or zinc alloy bath |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
-
1989
- 1989-07-04 JP JP17335989A patent/JPH0726239B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4764886B2 (en) * | 2004-12-20 | 2011-09-07 | アトテック・ドイチュラント・ゲーエムベーハー | Continuous operation of acidic or alkaline zinc or zinc alloy bath |
KR101237037B1 (en) * | 2004-12-20 | 2013-02-25 | 아토테크더치랜드게엠베하 | Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy baths |
JP2006322069A (en) * | 2005-04-19 | 2006-11-30 | Yuken Industry Co Ltd | Recovery type electrogalvanizing method and device |
JP4756103B1 (en) * | 2010-10-29 | 2011-08-24 | 田中貴金属工業株式会社 | Method for recovering precious metal ions from plating wastewater |
WO2012057242A1 (en) * | 2010-10-29 | 2012-05-03 | 田中貴金属工業株式会社 | Method for recovering precious-metal ions from plating wastewater |
Also Published As
Publication number | Publication date |
---|---|
JPH0726239B2 (en) | 1995-03-22 |
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