JPH07245322A - Method for pressing lead frame for electronic parts - Google Patents

Method for pressing lead frame for electronic parts

Info

Publication number
JPH07245322A
JPH07245322A JP6033707A JP3370794A JPH07245322A JP H07245322 A JPH07245322 A JP H07245322A JP 6033707 A JP6033707 A JP 6033707A JP 3370794 A JP3370794 A JP 3370794A JP H07245322 A JPH07245322 A JP H07245322A
Authority
JP
Japan
Prior art keywords
heater block
lead
lead frame
block body
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6033707A
Other languages
Japanese (ja)
Inventor
Tomomichi Masutani
友道 舛谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP6033707A priority Critical patent/JPH07245322A/en
Publication of JPH07245322A publication Critical patent/JPH07245322A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To stabilize the jointing strength between a lead terminal and wires at the time of wire bonding by making the lower surface of the lead terminal flat and pressing a lead frame against a heater block body so that the flat section can be brought into contact with the heater block body. CONSTITUTION:The lower surface part of each lead terminal A2 corresponding to its upper surface part which is brought into contact with a pressing body 4 is formed in a flat part P from the front end of the terminal A2. Consequently, each lead terminal A2 can be stably pressed against a heater block body 1 so that the flat section P can be brought into contact with the heater block body 1 when the pressing body 4 is lowered towards the heater block body 1. Therefore, the bonding load applied at the time of wire bonding and ultrasonic welding conditions are almost fixed and, as a result, the joining strength between the lead terminal A2 and a wire can be stabilized.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、ＩＣ又はトランジスタ
ー等の電子部品の製造に際して使用するリードフレーム
において、このリードフレームにおける、半導体素子を
搭載したアイランド部と、複数本の各リード端子との間
を、細い金属線にてワイヤーボンディングする等の場合
に、リードフレームにおけるアイランド部及び各リード
端子を、リードフレームを載せたヒータブロック体に対
して押さえ込むための押さえ方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for manufacturing an electronic component such as an IC or a transistor, in which a semiconductor element is mounted on an island portion and a plurality of lead terminals. The present invention relates to a pressing method for pressing the island portion and each lead terminal in the lead frame against the heater block body on which the lead frame is placed when wire bonding is performed with a thin metal wire.

【０００２】[0002]

【従来の技術】一般に、リードフレームにおいて、その
アイランド部に搭載した半導体素子と各リード端子との
間のワイヤーボンディング等を行うに際しては、例え
ば、特開昭５５ー７１０５１号公報等に記載されている
ように、抜き窓を備えた押さえ体にて、リードフレーム
における各リード端子を、当該リードフレームを載せた
ヒータブロック体の上面に対して押さえ込み、この押さ
え込み状態で、前記押さえ体における抜き窓内におい
て、前記ワイヤーボンディングをすることが行われる。2. Description of the Related Art Generally, in a lead frame, a wire bonding between a semiconductor element mounted on an island portion and each lead terminal is generally described in, for example, JP-A-55-71051. As shown in the figure, the lead body in the lead frame is pressed against the upper surface of the heater block body on which the lead frame is mounted by the pressing body having the opening window, and in this holding state, inside the opening window in the holding body. In, the wire bonding is performed.

【０００３】このような方法を用いて、図３および図４
に示すような、半導体素子Ｂを搭載するためのアイラン
ド部Ａ１を各リード端子Ａ２より適宜寸法（図中におい
ては寸法Ｈ）だけ低くするようにしたダウンセット型の
リードフレームＡに対してワイヤーボンディングする際
には、図５に示すように、上面に、リードフレームＡに
おけるダウンセットのアイランド部Ａ１が嵌まる凹所２
１と、前記アイランド部Ａ１に対する少なくとも一対の
吊りリードＡ３が嵌まる凹み溝２２とを設けたヒータブ
ロック体２３を使用し、このヒータブロック体２２の上
面に、前記ダウンセット型リードフレームＡを、そのア
イランド部Ａ１が凹所２１内に、各吊りリードＡ３に凹
み溝２２内に各々嵌まるように載せた後、抜き窓２４を
備えた押さえ体２５の下降動によって、図６に示すよう
に、各吊りリードＡ３を、押さえ体２５にて下向きに押
さえることによって、この吊りリードＡ３にて支持する
アイランド部Ａ１を、ヒータブロック体２３における凹
所２１の底面に対して密着・固定すると同時に、前記リ
ードフレームＡにおける各リード端子Ａ２を前記ヒータ
ブロック体２３の上面に対して押さえ込み固定すること
が行われている。Using such a method, FIG. 3 and FIG.
Wire bonding to the downset type lead frame A in which the island portion A1 for mounting the semiconductor element B is made lower than each lead terminal A2 by an appropriate dimension (dimension H in the drawing) as shown in FIG. In doing so, as shown in FIG. 5, a recess 2 into which the downset island portion A1 of the lead frame A is fitted, as shown in FIG.
1 and a recessed groove 22 into which at least a pair of suspension leads A3 for the island portion A1 are fitted are used, and the downset type lead frame A is provided on the upper surface of the heater block body 22. After the island portion A1 is placed in the recess 21 so as to be fitted in the recessed groove 22 in each suspension lead A3, as shown in FIG. 6, by the downward movement of the pressing body 25 having the cutout window 24. By pressing each suspension lead A3 downward with the pressing body 25, the island portion A1 supported by the suspension lead A3 is brought into close contact with and fixed to the bottom surface of the recess 21 in the heater block body 23, and at the same time, Each lead terminal A2 in the lead frame A is pressed and fixed to the upper surface of the heater block body 23.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、前記リ
ードフレームＡにおける各リード端子Ａ２は、これを打
ち抜き加工により形成される際に生じる塑性変形によ
り、その断面における下面形状が、図７（ａ）および図
８に示すように、先端部分Ａ２１では若干平坦状になる
ものの、それ以外の部分では先端部分Ａ２１よりもその
厚さが大きく、且つ、略中央に頂角部Ａ２２を有する角
状となっているので、前記ヒータブロック体２３の上面
に対して押さえ込み固定される際に、ヒータブロック体
２３との接触部が前記頂角部Ａ２２となり、図９に示す
ように、各リード端子Ａ２が傾いた非常に不安定な状態
で押さえ込まれるため、リード端子Ａ２上にワイヤをボ
ンディングする際にかかるボンディング荷重が一定しな
い外、超音波溶着条件が一定せず、リード端子Ａ２とワ
イヤとの接合強度が著しく低下する箇所ができてしまう
といった問題があった。However, each lead terminal A2 in the lead frame A has a lower surface shape in cross section as shown in FIG. 7 (a) and FIG. 7 (a) due to plastic deformation that occurs when it is formed by punching. As shown in FIG. 8, although the tip end portion A21 is slightly flat, the other portions are thicker than the tip end portion A21, and have a corner shape with an apex angle portion A22 at substantially the center. Therefore, when the heater block body 23 is pressed and fixed to the upper surface, the contact portion with the heater block body 23 becomes the apex angle portion A22, and the lead terminals A2 are inclined as shown in FIG. Since it is pressed in an extremely unstable state, the bonding load applied when bonding the wire on the lead terminal A2 is not constant, and the ultrasonic welding line is used. There not constant, there is a problem bonding strength between the lead terminals A2 and wires she can point to decrease significantly.

【０００５】本発明は、以上のような状況下で考え出さ
れたもので、リードフレームにおける各リード端子を安
定した状態でヒータブロック体に対して押さえ込み、ワ
イヤボンディング時のリード端子とワイヤとの接合強度
を安定させることを目的とする。The present invention has been devised under the above circumstances, and the lead terminals in the lead frame are pressed against the heater block body in a stable state so that the lead terminals and the wires are bonded during wire bonding. The purpose is to stabilize the bonding strength.

【０００６】[0006]

【課題を解決するための手段】本発明は、上記課題を解
決するために、下面に頂角を有し、且つ、該下面の先端
に平坦部を有する複数のリード端子が半導体素子を搭載
するアイランド部に向かい延設されたリードフレーム
を、ヒータブロック体上に載置し、該ヒータブロック体
に対して下動する押さえ体を、前記リード端子の上面に
当接させることにより、前記リードフレームを押さえる
電子部品用リードフレームの押さえ方法であって、前記
リード端子の先端から、前記リード端子の上面における
前記押さえ体に当接する箇所において、前記リード端子
の下面を平坦部とし、前記平坦部が前記ヒータブロック
体に当接するように、前記リードフレームを押さえるこ
とを特徴とする電子部品用リードフレームの押さえ方法
を提供するものである。In order to solve the above problems, the present invention mounts a semiconductor element on a plurality of lead terminals each having a vertical angle on the lower surface and a flat portion at the tip of the lower surface. The lead frame extending toward the island portion is placed on the heater block body, and the pressing body that moves downward with respect to the heater block body is brought into contact with the upper surface of the lead terminal, whereby the lead frame is formed. A method of pressing a lead frame for an electronic component, wherein the lower surface of the lead terminal is a flat portion from the tip of the lead terminal in contact with the pressing body on the upper surface of the lead terminal, and the flat portion is A method for pressing a lead frame for an electronic component, characterized in that the lead frame is pressed so as to come into contact with the heater block body. .

【０００７】[0007]

【作用および効果】従って、本発明によれば、前記リー
ド端子の先端から、前記リード端子の上面における前記
押さえ体に当接する箇所において、前記リード端子の下
面を平坦部としているので、押さえ体をヒータブロック
体に向かって下降動することにより、上記平坦部をヒー
タブロック体に当接するように、各リード端子を安定し
た状態でヒータブロック体に対して押さえ込むことが可
能となるため、ワイヤボンディング時にかかるボンディ
ング荷重や超音波溶着条件が略一定し、リード端子とワ
イヤとの接合強度を安定させることができる。このた
め、ワイヤーボンディング時におけるリード端子とワイ
ヤーとしての金属線とのボンディングミスの発生、およ
びワイヤーボンディング後における断線・ショートの発
生を大幅に低減できるという効果を奏する。Therefore, according to the present invention, since the lower surface of the lead terminal is a flat portion at the position from the tip of the lead terminal to the upper surface of the lead terminal, the lower surface of the lead terminal is flat. By descending toward the heater block body, each lead terminal can be pressed against the heater block body in a stable state so that the flat portion contacts the heater block body. The bonding load and ultrasonic welding conditions are substantially constant, and the bonding strength between the lead terminal and the wire can be stabilized. Therefore, it is possible to significantly reduce the occurrence of a bonding error between the lead terminal and the metal wire as a wire during wire bonding and the occurrence of disconnection or short circuit after wire bonding.

【０００８】[0008]

【実施例】以下、本発明の実施例を、図１乃至図２を参
照しつつ説明する。図１乃至図２は、先述したようなダ
ウンセット型のリードフレームＡ（図３および図４参
照）を用いた場合を例にとった、第一の実施例を示す。
図１は、リードフレームＡをヒータブロック体に対して
押さえる押さえ装置を示す、要部斜視図である。Embodiments of the present invention will be described below with reference to FIGS. FIGS. 1 and 2 show a first embodiment, taking the case of using the downset type lead frame A (see FIGS. 3 and 4) as described above as an example.
FIG. 1 is a perspective view of essential parts showing a holding device that holds the lead frame A against the heater block body.

【０００９】この図において符号１は、内部に加熱ヒー
タ（図示せず）を備えた超硬合金からなるヒータブロッ
ク体を示し、このヒータブロック体１の上面には、当該
上面に前記したダウンセット型のリードフレームＡを載
せたとき、リードフレームＡにおけるアイランド部Ａ１
が嵌まる平面視略正方形状の凹所２と、アイランド部Ａ
１に対する各吊りリードＡ３が嵌まる凹み溝３とが刻設
されている。In the figure, reference numeral 1 denotes a heater block body made of a cemented carbide having a heater (not shown) inside, and the heater block body 1 has an upper surface on which the downset described above is provided. When the lead frame A of the mold is placed, the island portion A1 in the lead frame A
The recess 2 that is substantially square in plan view and the island portion A
A recessed groove 3 into which each suspension lead A3 for 1 is fitted is engraved.

【００１０】また、符号４は、前記ヒータブロック体１
の上方に上下動するように配設した板状の押さえ体を示
し、この押さえ体４には、内部においてワイヤーボンデ
ィング作業を行うための抜き窓５が穿設され、且つ、こ
の押さえ体４の下面には、押さえ突起部６が、前記抜き
窓５の全周囲を囲うように一体的に造形され、押さえ体
４をヒータブロック体１に向かって下降動したとき、こ
の突起部６によって、前記リードフレームＡにおける各
リード端子Ａ２をヒータブロック体１の上面に対して一
斉に押さえ込み固定するように構成されている。Reference numeral 4 indicates the heater block body 1
2 shows a plate-shaped pressing body arranged so as to move up and down above the pressing body 4. A punching window 5 for internally performing wire bonding work is bored in the pressing body 4, and A pressing projection 6 is integrally formed on the lower surface so as to surround the entire periphery of the window 5, and when the pressing body 4 is moved downward toward the heater block body 1, the pressing projection 6 is Each lead terminal A2 of the lead frame A is configured to be pressed and fixed together on the upper surface of the heater block body 1.

【００１１】さらに、本実施例に用いるリードフレーム
Ａは、鉄からなるものであり、リード端子Ａ２の先端部
分Ａ２１から、リード端子Ａ２の上面における押さえ体
４の突起部６に当接する箇所において軽く叩打する、い
わゆるコイニング加工により数mm程度リード端子Ａ２の
下面を平坦部Ｐとし（図７（ｂ）参照）、それ以外の部
分では、前述したように打ち抜き加工により成形する際
に生じる塑性変形により、先端部分Ａ２１よりもその厚
さが大きく、且つ、略中央に頂角部Ａ２２を有する角状
となっている。（図３および図４参照） この構成において、図２に示すように、上記説明したよ
うに、リード端子Ａ２の先端部分Ａ２１から、リード端
子Ａ２の上面における押さえ体４に当接する箇所におい
て、リード端子Ａ２の下面を平坦部Ｐとしているので、
押さえ体４をヒータブロック体１に向かって下降動する
ことにより、上記平坦部Ｐをヒータブロック体１に当接
するように、各リード端子Ａ２を安定した状態でヒータ
ブロック体１に対して押さえ込むことが可能となるた
め、ワイヤボンディング時にかかるボンディング荷重や
超音波溶着条件が略一定し、リード端子Ａ２とワイヤと
の接合強度を安定させることができる。このため、ワイ
ヤーボンディング時におけるリード端子Ａ２とワイヤー
としての金属線とのボンディングミスの発生、およびワ
イヤーボンディング後における断線・ショートの発生を
大幅に低減できるという効果を奏するのである。Further, the lead frame A used in the present embodiment is made of iron, and is light at the portion from the tip end portion A21 of the lead terminal A2 to the protrusion 6 of the pressing body 4 on the upper surface of the lead terminal A2. The lower surface of the lead terminal A2 is made flat by a few mm by so-called coining (see FIG. 7 (b)), and the other parts are formed by the plastic deformation generated during the punching as described above. The tip portion A21 is thicker than the tip portion A21, and has an apex angle portion A22 at substantially the center. (See FIGS. 3 and 4) In this configuration, as shown in FIG. 2, as described above, from the tip end portion A21 of the lead terminal A2 to the lead member A2 at the position where the lead body A2 abuts on the pressing body 4. Since the lower surface of the terminal A2 is the flat portion P,
By pressing down the pressing body 4 toward the heater block body 1, the lead terminals A2 are pressed against the heater block body 1 in a stable state so that the flat portion P contacts the heater block body 1. Therefore, the bonding load applied during wire bonding and the ultrasonic welding conditions are substantially constant, and the bonding strength between the lead terminal A2 and the wire can be stabilized. Therefore, it is possible to significantly reduce the occurrence of a bonding error between the lead terminal A2 and the metal wire as a wire during wire bonding and the occurrence of disconnection and short circuit after wire bonding.

【００１２】本実施例においては、上記のようにコイニ
ング加工によってリード端子Ａ２の下面に平坦部Ｐを先
端より延長して形成しているが、これに限定するもので
なく、押さえ体４の突起部６が、リード端子Ａ２の平坦
な先端部分Ａ２１の上面に当接するように抜き窓５を小
さくすれば、上記コイニング加工を施さなくても済む。In the present embodiment, the flat portion P is formed on the lower surface of the lead terminal A2 by the coining process as described above so as to extend from the tip, but the invention is not limited to this, and the protrusion of the pressing body 4 is not limited to this. If the window 5 is made small so that the portion 6 contacts the upper surface of the flat tip portion A21 of the lead terminal A2, the coining process is not required.

【００１３】また、本実施例においては、鉄からなるリ
ードフレームを用いているが、アルミニウム、銅等の金
属製リードフレームに対して幅広く適用される。Further, although the lead frame made of iron is used in this embodiment, it is widely applied to the lead frame made of metal such as aluminum and copper.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例に用いる押さえ装置を示す要部
斜視図である。FIG. 1 is a perspective view of essential parts showing a pressing device used in an embodiment of the present invention.

【図２】本発明の押さえ方法によりリードフレームを押
さえる様子を説明する説明図である。FIG. 2 is an explanatory diagram illustrating a state in which a lead frame is held by a holding method according to the present invention.

【図３】ダウンセット型リードフレームの要部平面図で
ある。FIG. 3 is a plan view of an essential part of a downset type lead frame.

【図４】ダウンセット型リードフレームの要部側面図で
ある。FIG. 4 is a side view of a main part of a downset type lead frame.

【図５】従来における押さえ装置を示す要部斜視図であ
る。FIG. 5 is a perspective view of a main part of a conventional pressing device.

【図６】従来における押さえ装置を用いてダウンセット
型リードフレームにおける各リード端子を押さえ固定し
ている様子を説明する説明図である。FIG. 6 is an explanatory diagram illustrating a state in which each lead terminal in a downset type lead frame is pressed and fixed by using a conventional pressing device.

【図７】従来におけるダウンセット型リードフレームの
リード端子を示す要部斜視図である。FIG. 7 is a main part perspective view showing a lead terminal of a conventional downset type lead frame.

【図８】従来におけるダウンセット型リードフレームの
リード端子を示す拡大断面図である。FIG. 8 is an enlarged cross-sectional view showing a lead terminal of a conventional downset type lead frame.

【図９】従来における押さえ装置を用いてダウンセット
型リードフレームを押さえ固定した際の各リード端子を
説明する説明図である。FIG. 9 is an explanatory diagram illustrating each lead terminal when a downset type lead frame is pressed and fixed by using a conventional pressing device.

【符号の説明】[Explanation of symbols]

Ａ リードフレーム Ａ１ アイランド部 Ａ２ リード端子 Ａ３ 吊りリード Ｐ 平坦部 １ ヒータブロック体 ２ 凹所 ３ 凹み溝 ４ 押さえ体 ５ 抜き窓 ６ 突起部 A Lead frame A1 Island part A2 Lead terminal A3 Suspended lead P Flat part 1 Heater block body 2 Recessed part 3 Recessed groove 4 Retaining body 5 Vent window 6 Projection part

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 下面に頂角を有し、且つ、該下面の先端
に平坦部を有する複数のリード端子が半導体素子を搭載
するアイランド部に向かい延設されたリードフレーム
を、ヒータブロック体上に載置し、該ヒータブロック体
に対して下動する押さえ体を、前記リード端子の上面に
当接させることにより、前記リードフレームを押さえる
電子部品用リードフレームの押さえ方法であって、 前記リード端子の先端から、前記リード端子の上面にお
ける前記押さえ体に当接する箇所において、前記リード
端子の下面を平坦部とし、前記平坦部が前記ヒータブロ
ック体に当接するように、前記リードフレームを押さえ
ることを特徴とする電子部品用リードフレームの押さえ
方法。1. On a heater block body, a lead frame having a vertical angle on a lower surface and a plurality of lead terminals each having a flat portion at a tip of the lower surface is extended toward an island portion on which a semiconductor element is mounted. A method for holding a lead frame for an electronic component, which holds the lead frame by contacting a pressing body that is placed on the heater block and moves downward with respect to the heater block with the upper surface of the lead terminal. Pressing the lead frame so that the lower surface of the lead terminal is a flat portion at a position on the upper surface of the lead terminal that contacts the pressing body from the tip of the terminal, and the flat portion contacts the heater block body. A method for holding a lead frame for electronic parts, characterized by:
JP6033707A 1994-03-03 1994-03-03 Method for pressing lead frame for electronic parts Pending JPH07245322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6033707A JPH07245322A (en) 1994-03-03 1994-03-03 Method for pressing lead frame for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6033707A JPH07245322A (en) 1994-03-03 1994-03-03 Method for pressing lead frame for electronic parts

Publications (1)

Publication Number Publication Date
JPH07245322A true JPH07245322A (en) 1995-09-19

Family

ID=12393895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6033707A Pending JPH07245322A (en) 1994-03-03 1994-03-03 Method for pressing lead frame for electronic parts

Country Status (1)

Country Link
JP (1) JPH07245322A (en)

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