KR19990029775U - Heater block used in wire bonding of integrated circuit chips - Google Patents

Abstract

The present invention relates to a heater block for clamping an integrated circuit chip on a surface to perform wire bonding of the integrated circuit chip. Grooves are formed on the surface of the heater block to coincide with the rear edge portion of the integrated circuit chip. The groove has a width corresponding to a section between 80% and 120% of the integrated circuit chip size.

Description

Heater block used in wire bonding of integrated circuit chips

The present invention relates to the field of packaging of integrated circuit chips, and more particularly, to a heater block used in wire bonding for electrically connecting an integrated circuit chip with another component such as a lead during packaging of the integrated circuit chip.

In general, integrated circuit chips are packaged for mounting in electronics. For example, in the case of a lead on chip (LOC) type package, the integrated circuit chip sawed and die-attached on the lead frame may be a heater block of a wire bonder for electrical connection with the lead. heater block). Such a loading is performed by raising the heater block in the wire bonding device and lowering the window clamper, and simultaneously applying a vacuum through the vacuum hole of the heater block to clamp the lead frame onto the heater block. However, in such a clamping, the integrated circuit chip attached to the lead frame has a flat surface and directly collides with the surface of the heater block made of a metal component. Therefore, a collision shock is transmitted to the rear edge portion, which is the most vulnerable portion of the integrated circuit chip, so that the chip crack is shown as a in FIG. 1 which is a view showing a state in which the integrated circuit chip is clamped on the heater block. (Chip crack) or chip out may occur and result in a decrease in productivity. In Fig. 1, reference numeral 1 denotes an integrated circuit chip, 2 denotes a heater block, and 3 denotes a vacuum hole.

Therefore, the present invention devised to solve the above problems is to prevent the occurrence of chip crack or chip out phenomenon at the rear edge portion of the integrated circuit chip when the integrated circuit chip clamping to the heater block.

1 is a view showing a state in which an integrated circuit chip is clamped on a heater block according to the related art.

2 is a plan view of a heater block for wire bonding of an integrated circuit chip according to a preferred embodiment of the present invention.

3 is a cross-sectional view illustrating a state in which an integrated circuit chip is clamped to the heater block according to FIG. 2.

* Explanation of symbols for the main parts of the drawings

10: heater block 12: vacuum hole

14: groove 20: integrated circuit chip

In order to achieve the above object of the present invention, the present invention is a heater block for performing wire bonding of an integrated circuit chip by clamping the integrated circuit chip on the surface, so as to coincide with the rear edge portion of the integrated circuit chip, Provided is a heater block, wherein a groove is formed on the surface of the heater block.

According to the present invention, by forming a groove on the surface of the heater block to which the integrated circuit chip is clamped so that the rear edge of the chip is located in the groove without directly contacting the surface of the heater block when clamping the integrated circuit chip, The occurrence of chip crack or chip out at the rear edge portion of the integrated circuit chip can be prevented.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 2 is a rear view of a heater block for wire bonding of an integrated circuit chip according to a preferred embodiment of the present invention, and FIG. 3 is a cross-sectional view illustrating a state in which an integrated circuit chip is clamped to the heater block according to FIG. 2. .

Referring to FIG. 2, the heater block 10 according to the present exemplary embodiment includes a vacuum hole 12 for applying a vacuum to the rear surface of the integrated circuit chip to align the integrated circuit chip. An approximately quadrilateral groove 14 is formed on the surface of the integrated circuit chip 10 around the vacuum hole 12. The groove 14 thus formed is the size of the integrated circuit chip to be clamped according to the package type and the device. Since the width varies, it is preferable to have a width corresponding to a section between 80% and 120% of the general chip size. That is, the groove 14 is formed in the G region between the L region corresponding to 120% of the general chip size and the S region corresponding to 80%, as shown in FIG.

Referring to Figure 3 the operation of the heater block having such a configuration as follows.

In the case where the integrated circuit chip 20 is to be clamped on the heater block 10, the heater block 10 rises in the y-axis direction of the coordinates and passes through the vacuum hole 12 of the heater block 10 in the -y-axis direction. Vacuum acts on the integrated circuit chip 10 on the surface of the heater block 10. At this time, a high clamping force is transmitted to the rear surface of the chip 20 when the chip 20 contacts the surface of the heater block 10 by the vacuum acting in the −y axis direction. However, since the groove 14 is formed on the surface of the heater block 10, the rear edge of the chip 20 does not directly contact the surface of the heater block 10. Therefore, since the clamping force is not directly transmitted to the rear edge of the chip 20, it is possible to prevent the occurrence of chip crack or chip out phenomenon.

As described above, according to the present invention, by forming grooves on the surface of the heater block to coincide with the rear edge of the integrated circuit chip, the chip crack or chip out phenomenon of the integrated circuit chip during clamping of the integrated circuit chip with respect to the heater block. It can prevent occurrence. Therefore, the present invention is a useful design that can greatly contribute to productivity improvement.

Although the present invention has been described and illustrated with reference to the preferred embodiments thereof, those skilled in the art can clearly see that various changes and modifications to the above embodiments can be made without departing from the gist of the present invention.

Claims (2)

A heater block for clamping an integrated circuit chip on a surface to perform wire bonding of the integrated circuit chip, wherein grooves are formed on the surface of the heater block to coincide with a rear edge portion of the integrated circuit chip. Heater block. The heater block of claim 1, wherein the groove has a width corresponding to a section between 80% and 120% of the integrated circuit chip size.